JP2005524100A5 - - Google Patents
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- Publication number
- JP2005524100A5 JP2005524100A5 JP2004500109A JP2004500109A JP2005524100A5 JP 2005524100 A5 JP2005524100 A5 JP 2005524100A5 JP 2004500109 A JP2004500109 A JP 2004500109A JP 2004500109 A JP2004500109 A JP 2004500109A JP 2005524100 A5 JP2005524100 A5 JP 2005524100A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- conductive thin
- substrate
- forming
- film structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 claims 117
- 239000000758 substrate Substances 0.000 claims 100
- 239000000463 material Substances 0.000 claims 79
- 238000000034 method Methods 0.000 claims 67
- 239000004020 conductor Substances 0.000 claims 21
- 238000007639 printing Methods 0.000 claims 18
- 238000000151 deposition Methods 0.000 claims 13
- 239000012790 adhesive layer Substances 0.000 claims 12
- 239000000853 adhesive Substances 0.000 claims 10
- 230000001070 adhesive effect Effects 0.000 claims 10
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 239000010410 layer Substances 0.000 claims 6
- 239000002904 solvent Substances 0.000 claims 6
- 230000001737 promoting effect Effects 0.000 claims 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims 3
- 239000004033 plastic Substances 0.000 claims 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 2
- 230000001680 brushing effect Effects 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000001962 electrophoresis Methods 0.000 claims 2
- 239000010408 film Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000007921 spray Substances 0.000 claims 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- MUBKMWFYVHYZAI-UHFFFAOYSA-N [Al].[Cu].[Zn] Chemical compound [Al].[Cu].[Zn] MUBKMWFYVHYZAI-UHFFFAOYSA-N 0.000 claims 1
- 150000004996 alkyl benzenes Chemical class 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 claims 1
- 230000009977 dual effect Effects 0.000 claims 1
- 238000005323 electroforming Methods 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 238000004049 embossing Methods 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- GGHJPYSCFMCCFG-UHFFFAOYSA-N gadolinium(3+) indium(3+) oxygen(2-) Chemical compound [O--].[O--].[O--].[In+3].[Gd+3] GGHJPYSCFMCCFG-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000007646 gravure printing Methods 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910003437 indium oxide Inorganic materials 0.000 claims 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 1
- 238000007641 inkjet printing Methods 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000000873 masking effect Effects 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 239000011185 multilayer composite material Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000000049 pigment Substances 0.000 claims 1
- 239000004014 plasticizer Substances 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000002987 primer (paints) Substances 0.000 claims 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- 239000010948 rhodium Substances 0.000 claims 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 150000003457 sulfones Chemical class 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052716 thallium Inorganic materials 0.000 claims 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims 1
- 238000007651 thermal printing Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 1
- 229910001887 tin oxide Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 238000001771 vacuum deposition Methods 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37590202P | 2002-04-24 | 2002-04-24 | |
| PCT/US2003/012692 WO2003091788A2 (en) | 2002-04-24 | 2003-04-23 | Process for forming a patterned thin film conductive structure on a substrate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005524100A JP2005524100A (ja) | 2005-08-11 |
| JP2005524100A5 true JP2005524100A5 (https=) | 2006-06-15 |
| JP4508863B2 JP4508863B2 (ja) | 2010-07-21 |
Family
ID=29270720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004500109A Expired - Lifetime JP4508863B2 (ja) | 2002-04-24 | 2003-04-23 | パターン形成された薄膜導体を基材上に形成する方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20030203101A1 (https=) |
| EP (1) | EP1497692A2 (https=) |
| JP (1) | JP4508863B2 (https=) |
| CN (2) | CN1256620C (https=) |
| AU (1) | AU2003231077A1 (https=) |
| TW (1) | TWI268813B (https=) |
| WO (1) | WO2003091788A2 (https=) |
Families Citing this family (97)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8002948B2 (en) * | 2002-04-24 | 2011-08-23 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
| US7261920B2 (en) | 2002-04-24 | 2007-08-28 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
| US7156945B2 (en) * | 2002-04-24 | 2007-01-02 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure for in-mold decoration |
| US6900876B2 (en) * | 2003-02-13 | 2005-05-31 | Eastman Kodak Company | Process and structures for selective deposition of liquid-crystal emulsion |
| WO2005002305A2 (en) * | 2003-06-06 | 2005-01-06 | Sipix Imaging, Inc. | In mold manufacture of an object with embedded display panel |
| US7175876B2 (en) * | 2003-06-27 | 2007-02-13 | 3M Innovative Properties Company | Patterned coating method employing polymeric coatings |
| US8068186B2 (en) * | 2003-10-15 | 2011-11-29 | 3M Innovative Properties Company | Patterned conductor touch screen having improved optics |
| CA2551957A1 (en) * | 2003-12-30 | 2005-08-18 | 3M Innovative Properties Company | Acousto-mechanical detection systems and methods of use |
| JP4880478B2 (ja) * | 2003-12-30 | 2012-02-22 | スリーエム イノベイティブ プロパティズ カンパニー | 弾性表面波センサアセンブリ |
| US7575979B2 (en) * | 2004-06-22 | 2009-08-18 | Hewlett-Packard Development Company, L.P. | Method to form a film |
| US20060033676A1 (en) * | 2004-08-10 | 2006-02-16 | Kenneth Faase | Display device |
| US7301693B2 (en) | 2004-08-13 | 2007-11-27 | Sipix Imaging, Inc. | Direct drive display with a multi-layer backplane and process for its manufacture |
| US7042614B1 (en) | 2004-11-17 | 2006-05-09 | Hewlett-Packard Development Company, L.P. | Spatial light modulator |
| US7304780B2 (en) * | 2004-12-17 | 2007-12-04 | Sipix Imaging, Inc. | Backplane design for display panels and processes for their manufacture |
| JP2006269599A (ja) * | 2005-03-23 | 2006-10-05 | Sony Corp | パターン形成方法、有機電界効果型トランジスタの製造方法、及び、フレキシブルプリント回路板の製造方法 |
| JP2007011227A (ja) * | 2005-07-04 | 2007-01-18 | Bridgestone Corp | 情報表示用パネルの製造方法 |
| US7767126B2 (en) * | 2005-08-22 | 2010-08-03 | Sipix Imaging, Inc. | Embossing assembly and methods of preparation |
| US20070069418A1 (en) * | 2005-09-28 | 2007-03-29 | Chih-Yuan Liao | In mold manufacturing of an object comprising a functional element |
| US8264466B2 (en) * | 2006-03-31 | 2012-09-11 | 3M Innovative Properties Company | Touch screen having reduced visibility transparent conductor pattern |
| US8830561B2 (en) | 2006-07-18 | 2014-09-09 | E Ink California, Llc | Electrophoretic display |
| US20150005720A1 (en) | 2006-07-18 | 2015-01-01 | E Ink California, Llc | Electrophoretic display |
| TWI491953B (zh) * | 2006-07-18 | 2015-07-11 | 希畢克斯幻像有限公司 | 電泳顯示器 |
| CN100479102C (zh) * | 2006-08-29 | 2009-04-15 | 中国科学院声学研究所 | 一种图形化铂/钛金属薄膜的剥离制备方法 |
| EP2100130A1 (en) * | 2006-12-29 | 2009-09-16 | 3M Innovative Properties Company | Method of detection of bioanalytes by acousto-mechanical detection systems comprising the addition of liposomes |
| JP2009049136A (ja) * | 2007-08-17 | 2009-03-05 | Fujitsu Ltd | 配線基板、配線パターン形成方法および配線基板の製造方法 |
| GB0716266D0 (en) * | 2007-08-21 | 2007-09-26 | Eastman Kodak Co | Method of patterning vapour deposition by printing |
| CN101418462B (zh) * | 2007-10-24 | 2011-03-30 | 比亚迪股份有限公司 | 在导电基材的表面形成图案的方法 |
| CN101547574B (zh) * | 2008-03-28 | 2011-03-30 | 富葵精密组件(深圳)有限公司 | 电路板基板及具有断差结构的电路板的制作方法 |
| TWI353808B (en) * | 2008-04-28 | 2011-12-01 | Ind Tech Res Inst | Method for fabricating conductive pattern on flexi |
| US20110186420A1 (en) * | 2008-06-09 | 2011-08-04 | Nanofilm Technologies International Pte Ltd | Method for rapid deposition of a coating on a substrate |
| KR100991105B1 (ko) * | 2009-10-23 | 2010-11-01 | 한국기계연구원 | 자기패턴된 전도성 패턴과 도금을 이용한 고전도도 미세패턴 형성방법 |
| EP2319630A1 (de) * | 2009-11-05 | 2011-05-11 | Heidelberger Druckmaschinen AG | Verfahren zum mehrfarbigen, permanenten Lackieren eines Produkts |
| CN102118679B (zh) * | 2009-12-31 | 2013-11-06 | 财团法人工业技术研究院 | 扬声器的制造方法与装置 |
| CN102285298A (zh) * | 2010-06-21 | 2011-12-21 | 圣维可福斯(广州)电子科技有限公司 | 一种物体表面金属化装饰方法 |
| CN101922029A (zh) * | 2010-07-22 | 2010-12-22 | 中兴通讯股份有限公司 | 一种镜面字符处理工艺及设备 |
| CN102453933B (zh) * | 2010-10-25 | 2016-05-04 | 深圳市国人射频通信有限公司 | 铝材局部电镀方法 |
| CN102026490A (zh) * | 2010-12-14 | 2011-04-20 | 叶逸仁 | Ito镀膜电路板的制备方法 |
| TWI409011B (zh) * | 2011-04-14 | 2013-09-11 | Polychem Uv Eb Internat Corp | Construction and Manufacturing Method of Transparent Conductive Line |
| CN102762026B (zh) * | 2011-04-27 | 2015-03-18 | 瑞化股份有限公司 | 透明导电线路的构造及制造方法 |
| WO2012170415A2 (en) * | 2011-06-09 | 2012-12-13 | 3M Innovative Properties Company | Method of making touch sensitive device with multilayer electrode and underlayer |
| TWI444743B (zh) * | 2011-08-16 | 2014-07-11 | E Ink Holdings Inc | 顯示裝置及其製造方法 |
| US8635761B2 (en) * | 2011-09-19 | 2014-01-28 | Xerox Corporation | System and method for formation of electrical conductors on a substrate |
| CN102427058B (zh) * | 2011-11-09 | 2015-07-22 | 深南电路有限公司 | 通过溅射工艺制作线路图形的方法和芯片的重新布线方法 |
| JP2013143563A (ja) * | 2012-01-10 | 2013-07-22 | Hzo Inc | 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム |
| US10401668B2 (en) | 2012-05-30 | 2019-09-03 | E Ink California, Llc | Display device with visually-distinguishable watermark area and non-watermark area |
| KR101450859B1 (ko) * | 2012-10-10 | 2014-10-15 | 한국과학기술연구원 | 염증 억제용 약물을 구비한 신경 전극 및 그 제조 방법 |
| SG11201504125UA (en) * | 2012-12-07 | 2015-06-29 | 3M Innovative Properties Co | Method of making transparent conductors on a substrate |
| JP6083233B2 (ja) | 2012-12-19 | 2017-02-22 | Jnc株式会社 | インモールド成形用転写フィルム、インモールド成形体の製造方法および成形体 |
| US20150362501A1 (en) * | 2013-01-17 | 2015-12-17 | Tanaka Kikinzoku Kogyo K.K. | Biosensor and process for producing same |
| FR3003722A1 (fr) * | 2013-03-19 | 2014-09-26 | Linxens Holding | Procede de fabrication d'un circuit imprime flexible, circuit imprime flexible obtenu par ce procede et module de carte a puce comportant un tel circuit imprime flexible |
| US9066425B2 (en) * | 2013-04-01 | 2015-06-23 | Rohm And Haas Electronic Materials Llc | Method of manufacturing a patterned transparent conductor |
| EP2989237B1 (de) * | 2013-04-24 | 2021-03-17 | Automobile Patentverwaltungs- und Verwertungs- gesellschaft mbH | Verfahren zum beschichten von funktions-bauteilen aus kunststoff |
| CN103272747B (zh) * | 2013-05-29 | 2015-07-22 | 苏州汉纳材料科技有限公司 | 图案化碳纳米管透明导电薄膜的生产方法及系统 |
| GB2519587A (en) * | 2013-10-28 | 2015-04-29 | Barco Nv | Tiled Display and method for assembling same |
| FR3013739B1 (fr) * | 2013-11-28 | 2016-01-01 | Valeo Vision | Procede et dispositif de revetement de piece automobile |
| CN103774145A (zh) * | 2014-03-01 | 2014-05-07 | 陈廷 | 一种在覆铜板上覆盖金属箔的方法 |
| KR102399443B1 (ko) * | 2014-06-20 | 2022-05-19 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 후속 처리 동안 정밀 정합을 달성하기 위한 다수의 잉크들의 인쇄 |
| CN104159408B (zh) * | 2014-08-05 | 2017-07-28 | 上海蓝沛信泰光电科技有限公司 | 一种双面铜软性线路板的制作方法 |
| CN104244596A (zh) * | 2014-09-09 | 2014-12-24 | 浙江经立五金机械有限公司 | 一种pcb板的制作工艺 |
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| CN104897759A (zh) * | 2015-06-26 | 2015-09-09 | 彭梓 | 氧化铟锡电化学发光反应电极的修饰方法 |
| KR101750361B1 (ko) * | 2015-09-17 | 2017-06-23 | 한국기계연구원 | 미세패턴을 갖는 제판 제작방법 |
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| CN109972128A (zh) * | 2019-03-29 | 2019-07-05 | 南昌大学 | 喷墨打印结合无电镀工艺制备超薄金属网格柔性透明电极的方法 |
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| CN112410729B (zh) * | 2020-11-09 | 2022-12-06 | 中国科学院宁波材料技术与工程研究所 | 一种超薄液态金属薄膜及制备方法和应用 |
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| CN112592575B (zh) * | 2020-12-15 | 2022-09-23 | 江西省萍乡市轩品塑胶制品有限公司 | 一种生物降解改性树脂的制备方法 |
| CN113151769B (zh) * | 2021-04-01 | 2022-08-05 | 西安交通大学 | 微孔与微裂纹复合增韧毫米级厚质陶瓷涂层及制备方法 |
| WO2022221500A1 (en) | 2021-04-16 | 2022-10-20 | E Ink Corporation | Electrophoretic display with low-profile edge seal |
| CN113427921A (zh) * | 2021-06-01 | 2021-09-24 | Tcl华星光电技术有限公司 | 银浆转印方法、Micro-LED移印方法及Micro-LED |
| WO2023044281A1 (en) | 2021-09-16 | 2023-03-23 | E Ink California, Llc | Switchable light-collimating layer with improved transmittance |
| CN114023915B (zh) | 2021-10-19 | 2023-09-05 | Tcl华星光电技术有限公司 | 用于显示装置的基板的线路制作方法 |
| CN114427077B (zh) * | 2021-12-23 | 2023-08-15 | 青岛歌尔智能传感器有限公司 | 选择性溅镀方法及其电子产品 |
| WO2025147410A2 (en) | 2024-01-02 | 2025-07-10 | E Ink Corporation | Electrophoretic media comprising a cationic charge control agent |
| WO2025147504A1 (en) | 2024-01-05 | 2025-07-10 | E Ink Corporation | An electrophoretic medium comprising particles having a pigment core and a polymeric shell |
| US20250224646A1 (en) | 2024-01-08 | 2025-07-10 | E Ink Corporation | Adhesive Layer Comprising Conductive Filler Particles and a Polymeric Dispersant |
| US20250334848A1 (en) | 2024-04-30 | 2025-10-30 | E Ink Corporation | Variable light transmission device comprising microcells |
| US20250370306A1 (en) | 2024-05-30 | 2025-12-04 | E Ink Corporation | Chemically-Resistant Multi-Layered Electro-Optic Device and a Method of Making the Same |
| US20260003242A1 (en) | 2024-06-26 | 2026-01-01 | E Ink Corporation | A variable light transmission device comprising microcells |
| US20260003241A1 (en) | 2024-06-26 | 2026-01-01 | E Ink Corporation | Variable light transmission device comprising microcells |
| WO2026006234A1 (en) | 2024-06-26 | 2026-01-02 | E Ink Corporation | A variable light transmission device comprising microcells |
Family Cites Families (84)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3612758A (en) * | 1969-10-03 | 1971-10-12 | Xerox Corp | Color display device |
| US3668106A (en) * | 1970-04-09 | 1972-06-06 | Matsushita Electric Industrial Co Ltd | Electrophoretic display device |
| US3697679A (en) * | 1970-07-01 | 1972-10-10 | Ampex | Automatic threading video recorder |
| GB1423952A (en) * | 1973-06-26 | 1976-02-04 | Oike & Co | Process for preparing a metallized resin film for condenser element |
| IT1031474B (it) * | 1974-02-12 | 1979-04-30 | Plessey Handel Investment Ag | Fluido di lavoro per dispositivi elettroforetici di prese ntazione visuale delle immagini |
| US4078935A (en) * | 1974-04-30 | 1978-03-14 | Fuji Photo Film Co., Ltd. | Support member |
| US4119483A (en) * | 1974-07-30 | 1978-10-10 | U.S. Philips Corporation | Method of structuring thin layers |
| US4022927A (en) * | 1975-06-30 | 1977-05-10 | International Business Machines Corporation | Methods for forming thick self-supporting masks |
| US4071430A (en) * | 1976-12-06 | 1978-01-31 | North American Philips Corporation | Electrophoretic image display having an improved switching time |
| US4217182A (en) * | 1978-06-07 | 1980-08-12 | Litton Systems, Inc. | Semi-additive process of manufacturing a printed circuit |
| US4285801A (en) * | 1979-09-20 | 1981-08-25 | Xerox Corporation | Electrophoretic display composition |
| US4345000A (en) * | 1979-12-15 | 1982-08-17 | Nitto Electric Industrial Co., Ltd. | Transparent electrically conductive film |
| US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
| JPS57126971A (en) * | 1981-01-29 | 1982-08-06 | Susumu Hosaka | Method for precisely processing metal wafer |
| US4420515A (en) * | 1981-08-21 | 1983-12-13 | Sicpa Holding, S.A. | Metallization process for protecting documents of value |
| JPS5978987A (ja) * | 1982-10-29 | 1984-05-08 | マルイ工業株式会社 | 金属被膜上へのパタ−ン形成方法 |
| JPS60150508A (ja) * | 1984-01-18 | 1985-08-08 | 日本写真印刷株式会社 | 透明電極基板の製造方法 |
| JPS60173842A (ja) * | 1984-02-20 | 1985-09-07 | Canon Inc | パタ−ン形成方法 |
| US4655897A (en) * | 1984-11-13 | 1987-04-07 | Copytele, Inc. | Electrophoretic display panels and associated methods |
| US4741988A (en) * | 1985-05-08 | 1988-05-03 | U.S. Philips Corp. | Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell |
| US4714631A (en) * | 1985-08-28 | 1987-12-22 | W. H. Brady Co. | Rapidly removable undercoating for vacuum deposition of patterned layers onto substrates |
| JPH0680606B2 (ja) * | 1985-12-18 | 1994-10-12 | 松下電器産業株式会社 | マンガン−アルミニウム−炭素系合金磁石の製造法 |
| US4680103A (en) * | 1986-01-24 | 1987-07-14 | Epid. Inc. | Positive particles in electrophoretic display device composition |
| DE3743780A1 (de) * | 1987-12-23 | 1989-07-06 | Bayer Ag | Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen |
| US4977013A (en) * | 1988-06-03 | 1990-12-11 | Andus Corporation | Tranparent conductive coatings |
| JPH0295893A (ja) * | 1988-09-30 | 1990-04-06 | Nissha Printing Co Ltd | 金属光沢模様転写材 |
| JPH02253692A (ja) * | 1989-03-27 | 1990-10-12 | Matsushita Electric Ind Co Ltd | パターン形成方法およびパネル基板の製造方法 |
| US5059454A (en) * | 1989-04-26 | 1991-10-22 | Flex Products, Inc. | Method for making patterned thin film |
| JPH0384521A (ja) * | 1989-08-29 | 1991-04-10 | Mitsumura Genshiyokuban Insatsujiyo:Kk | パターニング法 |
| US4995718A (en) * | 1989-11-15 | 1991-02-26 | Honeywell Inc. | Full color three-dimensional projection display |
| US5177476A (en) * | 1989-11-24 | 1993-01-05 | Copytele, Inc. | Methods of fabricating dual anode, flat panel electrophoretic displays |
| US5495981A (en) * | 1994-02-04 | 1996-03-05 | Warther; Richard O. | Transaction card mailer and method of making |
| US5326865A (en) * | 1990-06-08 | 1994-07-05 | Hercules Incorporated | Arylazo and poly(arylazo) dyes having at least one core radical selected from naphthyl or anthracyl and having at least one 2,3-dihydro-1,3-dialkyl perimidine substituent |
| US5221967A (en) * | 1991-05-08 | 1993-06-22 | The University Of British Columbia | Signal quality monitoring system |
| DE69124707T2 (de) * | 1991-08-29 | 1997-05-28 | Copytele Inc | Elektrophoretische anzeigetafel mit internem netzartigem hintergrundsschirm |
| DE4209708A1 (de) * | 1992-03-25 | 1993-09-30 | Bayer Ag | Verfahren zur Verbesserung der Haftfestigkeit von stromlos abgeschiedenen Metallschichten |
| US5279511A (en) * | 1992-10-21 | 1994-01-18 | Copytele, Inc. | Method of filling an electrophoretic display |
| US5395740A (en) * | 1993-01-27 | 1995-03-07 | Motorola, Inc. | Method for fabricating electrode patterns |
| CA2162874A1 (en) * | 1993-05-21 | 1994-12-08 | Wei-Hsin Hou | Methods of preparing electrophoretic dispersions containing two types of particles with different colors and opposite charges |
| US5380362A (en) * | 1993-07-16 | 1995-01-10 | Copytele, Inc. | Suspension for use in electrophoretic image display systems |
| US5411628A (en) * | 1993-10-21 | 1995-05-02 | E. I. Du Pont De Nemours And Company | Diffusion patterning process and screen therefor |
| US6111598A (en) * | 1993-11-12 | 2000-08-29 | Peveo, Inc. | System and method for producing and displaying spectrally-multiplexed images of three-dimensional imagery for use in flicker-free stereoscopic viewing thereof |
| US5403518A (en) * | 1993-12-02 | 1995-04-04 | Copytele, Inc. | Formulations for improved electrophoretic display suspensions and related methods |
| US5699097A (en) * | 1994-04-22 | 1997-12-16 | Kabushiki Kaisha Toshiba | Display medium and method for display therewith |
| US5795527A (en) * | 1994-04-29 | 1998-08-18 | Nissha Printing Co., Ltd. | Method of manufacturing decorated article using a transfer material |
| EP0760872A4 (en) * | 1994-05-26 | 1997-12-10 | Copytele Inc | FLUORINATED DIELECTRIC SUSPENSIONS FOR ELECTROPHORETIC IMAGE DISPLAY AND METHOD |
| US6120588A (en) * | 1996-07-19 | 2000-09-19 | E Ink Corporation | Electronically addressable microencapsulated ink and display thereof |
| US6017584A (en) * | 1995-07-20 | 2000-01-25 | E Ink Corporation | Multi-color electrophoretic displays and materials for making the same |
| US6120839A (en) * | 1995-07-20 | 2000-09-19 | E Ink Corporation | Electro-osmotic displays and materials for making the same |
| US6037058A (en) * | 1995-10-12 | 2000-03-14 | Rohms And Haas Company | Particles and droplets containing liquid domains and method for forming in an acueous medium |
| US5835174A (en) * | 1995-10-12 | 1998-11-10 | Rohm And Haas Company | Droplets and particles containing liquid crystal and films and apparatus containing the same |
| JP3488012B2 (ja) * | 1996-03-23 | 2004-01-19 | 藤森工業株式会社 | プラスチックス基板 |
| US6080606A (en) * | 1996-03-26 | 2000-06-27 | The Trustees Of Princeton University | Electrophotographic patterning of thin film circuits |
| US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
| DE19624071A1 (de) * | 1996-06-17 | 1997-12-18 | Bayer Ag | Verfahren zur Herstellung von bahnförmigen metallbeschichteten Folien |
| US5930026A (en) * | 1996-10-25 | 1999-07-27 | Massachusetts Institute Of Technology | Nonemissive displays and piezoelectric power supplies therefor |
| US5837609A (en) * | 1997-01-16 | 1998-11-17 | Ford Motor Company | Fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part |
| US5961804A (en) * | 1997-03-18 | 1999-10-05 | Massachusetts Institute Of Technology | Microencapsulated electrophoretic display |
| US6252624B1 (en) * | 1997-07-18 | 2001-06-26 | Idemitsu Kosan Co., Ltd. | Three dimensional display |
| US6067185A (en) * | 1997-08-28 | 2000-05-23 | E Ink Corporation | Process for creating an encapsulated electrophoretic display |
| US6232950B1 (en) * | 1997-08-28 | 2001-05-15 | E Ink Corporation | Rear electrode structures for displays |
| JP3993691B2 (ja) * | 1997-09-24 | 2007-10-17 | 関西ペイント株式会社 | レジストパターン形成方法 |
| US6222136B1 (en) * | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
| US6131512A (en) * | 1998-02-03 | 2000-10-17 | Agfa-Gevaert, N.V. | Printing master comprising strain gauges |
| US5914806A (en) * | 1998-02-11 | 1999-06-22 | International Business Machines Corporation | Stable electrophoretic particles for displays |
| DE19812880A1 (de) * | 1998-03-24 | 1999-09-30 | Bayer Ag | Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung |
| EP1075670B1 (en) * | 1998-04-27 | 2008-12-17 | E-Ink Corporation | Shutter mode microencapsulated electrophoretic display |
| JP4053136B2 (ja) * | 1998-06-17 | 2008-02-27 | 株式会社半導体エネルギー研究所 | 反射型半導体表示装置 |
| DE19828846C2 (de) * | 1998-06-27 | 2001-01-18 | Micronas Gmbh | Verfahren zum Beschichten eines Substrats |
| US6184856B1 (en) * | 1998-09-16 | 2001-02-06 | International Business Machines Corporation | Transmissive electrophoretic display with laterally adjacent color cells |
| US6312304B1 (en) * | 1998-12-15 | 2001-11-06 | E Ink Corporation | Assembly of microencapsulated electronic displays |
| WO2000060410A1 (en) * | 1999-04-06 | 2000-10-12 | E Ink Corporation | Microcell electrophoretic displays |
| AU5779200A (en) * | 1999-07-01 | 2001-01-22 | E-Ink Corporation | Electrophoretic medium provided with spacers |
| US6337761B1 (en) * | 1999-10-01 | 2002-01-08 | Lucent Technologies Inc. | Electrophoretic display and method of making the same |
| DE19955214B4 (de) * | 1999-11-17 | 2006-05-11 | Stork Gmbh | Verfahren zum Herstellen von Leiterstrukturen |
| US6933098B2 (en) * | 2000-01-11 | 2005-08-23 | Sipix Imaging Inc. | Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web |
| US6672921B1 (en) * | 2000-03-03 | 2004-01-06 | Sipix Imaging, Inc. | Manufacturing process for electrophoretic display |
| US6930818B1 (en) * | 2000-03-03 | 2005-08-16 | Sipix Imaging, Inc. | Electrophoretic display and novel process for its manufacture |
| AU6317001A (en) * | 2000-05-15 | 2001-11-26 | Univ Pennsylvania | Spontaneous pattern formation of functional materials |
| US6507376B2 (en) * | 2000-12-25 | 2003-01-14 | Kawasaki Microelectronics, Inc. | Display device formed on semiconductor substrate and display system using the same |
| US6795138B2 (en) * | 2001-01-11 | 2004-09-21 | Sipix Imaging, Inc. | Transmissive or reflective liquid crystal display and novel process for its manufacture |
| CN1307480C (zh) * | 2001-08-23 | 2007-03-28 | 皇家飞利浦电子股份有限公司 | 电泳显示设备 |
| US7261920B2 (en) * | 2002-04-24 | 2007-08-28 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
| US7156945B2 (en) * | 2002-04-24 | 2007-01-02 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure for in-mold decoration |
-
2003
- 2003-04-08 TW TW092107973A patent/TWI268813B/zh not_active IP Right Cessation
- 2003-04-23 JP JP2004500109A patent/JP4508863B2/ja not_active Expired - Lifetime
- 2003-04-23 AU AU2003231077A patent/AU2003231077A1/en not_active Abandoned
- 2003-04-23 US US10/422,557 patent/US20030203101A1/en not_active Abandoned
- 2003-04-23 EP EP03724202A patent/EP1497692A2/en not_active Withdrawn
- 2003-04-23 WO PCT/US2003/012692 patent/WO2003091788A2/en not_active Ceased
- 2003-04-24 CN CN03122267.6A patent/CN1256620C/zh not_active Expired - Lifetime
- 2003-04-24 CN CNB2005100775152A patent/CN100430810C/zh not_active Expired - Lifetime
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