JP2005181222A5 - - Google Patents

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Publication number
JP2005181222A5
JP2005181222A5 JP2003425616A JP2003425616A JP2005181222A5 JP 2005181222 A5 JP2005181222 A5 JP 2005181222A5 JP 2003425616 A JP2003425616 A JP 2003425616A JP 2003425616 A JP2003425616 A JP 2003425616A JP 2005181222 A5 JP2005181222 A5 JP 2005181222A5
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JP
Japan
Prior art keywords
semiconductor device
manufacturing
test
test board
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003425616A
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English (en)
Japanese (ja)
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JP2005181222A (ja
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Publication date
Application filed filed Critical
Priority to JP2003425616A priority Critical patent/JP2005181222A/ja
Priority claimed from JP2003425616A external-priority patent/JP2005181222A/ja
Priority to TW093133685A priority patent/TW200529337A/zh
Priority to US11/012,225 priority patent/US7306957B2/en
Priority to CNB2004100970381A priority patent/CN100440473C/zh
Publication of JP2005181222A publication Critical patent/JP2005181222A/ja
Publication of JP2005181222A5 publication Critical patent/JP2005181222A5/ja
Priority to US11/936,358 priority patent/US7422914B2/en
Priority to US12/184,563 priority patent/US20080293167A1/en
Pending legal-status Critical Current

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JP2003425616A 2003-12-22 2003-12-22 半導体装置の製造方法 Pending JP2005181222A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003425616A JP2005181222A (ja) 2003-12-22 2003-12-22 半導体装置の製造方法
TW093133685A TW200529337A (en) 2003-12-22 2004-11-04 Fabrication method of semiconductor device
US11/012,225 US7306957B2 (en) 2003-12-22 2004-12-16 Fabrication method of semiconductor integrated circuit device
CNB2004100970381A CN100440473C (zh) 2003-12-22 2004-12-21 半导体集成电路器件的制造方法
US11/936,358 US7422914B2 (en) 2003-12-22 2007-11-07 Fabrication method of semiconductor integrated circuit device
US12/184,563 US20080293167A1 (en) 2003-12-22 2008-08-01 Fabrication method of semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003425616A JP2005181222A (ja) 2003-12-22 2003-12-22 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006329282A Division JP2007127660A (ja) 2006-12-06 2006-12-06 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2005181222A JP2005181222A (ja) 2005-07-07
JP2005181222A5 true JP2005181222A5 (enExample) 2007-02-01

Family

ID=34736236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003425616A Pending JP2005181222A (ja) 2003-12-22 2003-12-22 半導体装置の製造方法

Country Status (4)

Country Link
US (3) US7306957B2 (enExample)
JP (1) JP2005181222A (enExample)
CN (1) CN100440473C (enExample)
TW (1) TW200529337A (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4445299B2 (ja) * 2004-03-18 2010-04-07 富士通株式会社 不揮発性メモリ評価方法
US7301242B2 (en) 2004-11-04 2007-11-27 Tabula, Inc. Programmable system in package
US8201124B1 (en) 2005-03-15 2012-06-12 Tabula, Inc. System in package and method of creating system in package
US7139630B1 (en) * 2005-04-28 2006-11-21 International Business Machines Corporation Allocating manufactured devices according to customer specifications
US20070279079A1 (en) * 2006-05-31 2007-12-06 Jianxiang Chang Multiple chip package test program and programming architecture
US8232176B2 (en) * 2006-06-22 2012-07-31 Applied Materials, Inc. Dielectric deposition and etch back processes for bottom up gapfill
US7901955B2 (en) * 2007-06-25 2011-03-08 Spansion Llc Method of constructing a stacked-die semiconductor structure
TWI365524B (en) * 2007-10-04 2012-06-01 Unimicron Technology Corp Stackable semiconductor device and fabrication method thereof
JP5061860B2 (ja) * 2007-11-19 2012-10-31 横河電機株式会社 実装回路及び半導体試験装置
KR101384358B1 (ko) 2008-03-18 2014-04-21 삼성전자주식회사 반도체 모듈 핸들링 시스템
KR101138201B1 (ko) * 2008-06-02 2012-05-10 가부시키가이샤 어드밴티스트 시험용 웨이퍼, 시험 시스템, 및, 반도체 웨이퍼
US20100123477A1 (en) * 2008-11-20 2010-05-20 Shih-Wei Sun Programmable array module
CN101873679B (zh) * 2009-04-23 2016-07-06 瑞昱半导体股份有限公司 具有省电功能的网络系统的装置及相关方法
CN101901633A (zh) * 2009-05-27 2010-12-01 深圳芯邦科技股份有限公司 一种移动存储设备生产方案
KR20110099556A (ko) * 2010-03-02 2011-09-08 삼성전자주식회사 반도체 패키지 테스트장치
KR101734364B1 (ko) * 2010-12-13 2017-05-12 삼성전자 주식회사 반도체 장치 동시 연속 테스트 방법 및 테스트 장비
KR20120069404A (ko) 2010-12-20 2012-06-28 삼성전자주식회사 테스터 및 이를 포함하는 테스트 시스템
US9224659B2 (en) 2013-03-14 2015-12-29 Microchip Technology Incorporated Method and apparatus for semiconductor testing at low temperature
CN104239177A (zh) * 2013-06-19 2014-12-24 鸿富锦精密工业（深圳）有限公司 串行接口信号测试治具
CN105891703B (zh) * 2014-12-22 2020-06-30 恩智浦美国有限公司 用于集成电路的非常低电压和偏置的扫描测试的测试电路
CN106887255A (zh) * 2015-12-15 2017-06-23 西安富成防务科技有限公司 一种双口ram测试设备的处理板结构
CN108535556B (zh) * 2017-03-02 2021-01-22 台达电子工业股份有限公司 复合式产品测试系统及其测试方法
KR102471500B1 (ko) * 2018-03-12 2022-11-28 에스케이하이닉스 주식회사 반도체 장치 및 이를 포함하는 테스트 시스템
JP2020004070A (ja) * 2018-06-28 2020-01-09 ルネサスエレクトロニクス株式会社 半導体製品品質管理サーバ、半導体装置、および半導体製品品質管理システム
US11169203B1 (en) * 2018-09-26 2021-11-09 Teradyne, Inc. Determining a configuration of a test system
CN111370054B (zh) * 2018-12-26 2024-07-05 华为技术有限公司 一种存储卡的测试系统
CN114424331B (zh) * 2019-11-15 2025-07-11 铠侠股份有限公司 存储器设备以及控制方法
KR102467416B1 (ko) * 2020-12-24 2022-11-16 주식회사 엑시콘 이종의 피검사 디바이스를 테스트하는 테스트 시스템
EP4383082A4 (en) * 2021-09-02 2025-04-09 Kioxia Corporation STORAGE SYSTEM
CN116068380B (zh) * 2023-03-01 2023-07-07 上海聚跃检测技术有限公司 一种芯片封装测试方法及装置
EP4585936A1 (en) * 2024-01-09 2025-07-16 2Bits S.r.l. Testing system for electronic devices

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03206639A (ja) * 1990-01-08 1991-09-10 Mitsubishi Electric Corp 半導体検査ハンドリング装置
JPH0555328A (ja) 1991-08-28 1993-03-05 Nippon Steel Corp 半導体デバイスの信頼性評価試験装置
JPH06283657A (ja) 1993-03-30 1994-10-07 Hitachi Ltd 半導体装置の製造方法および半導体装置組立モジュールならびに半導体装置用試験装置
JPH0783996A (ja) * 1993-06-30 1995-03-31 Ando Electric Co Ltd 加熱ブロックを熱媒体とするバーンインチェンバ
JP3547471B2 (ja) * 1994-03-09 2004-07-28 富士通株式会社 誘電体膜の気相成長方法
EP0682366A3 (en) * 1994-05-12 1996-03-06 Texas Instruments Inc Assembly of integrated circuit components.
BE1008808A3 (nl) * 1994-10-19 1996-08-06 Imec Inter Uni Micro Electr Inrichting en werkwijze voor het evalueren van de thermische weerstand van een halfgeleider-component.
JP2876106B2 (ja) * 1995-01-31 1999-03-31 タバイエスペック株式会社 バーンイン用複合体及び複合体使用バーンイン装置
US5899987A (en) * 1995-10-03 1999-05-04 Memco Software Ltd. Apparatus for and method of providing user exits on an operating system platform
US5903269A (en) * 1995-10-10 1999-05-11 Anysoft Ltd. Apparatus for and method of acquiring processing and routing data contained in a GUI window
US5990907A (en) * 1995-12-15 1999-11-23 Colletti; John C. Automatic font management within an operating system environment
US6097200A (en) * 1996-10-07 2000-08-01 Aetrium Incorporated Modular, semiconductor reliability test system
JPH10239388A (ja) * 1997-02-28 1998-09-11 Ando Electric Co Ltd 挿抜装置
JP3344548B2 (ja) * 1997-04-16 2002-11-11 株式会社アドバンテスト Ｉｃ試験装置
JPH1123651A (ja) * 1997-06-30 1999-01-29 Ando Electric Co Ltd バーンイン試験装置
US6314470B1 (en) * 1997-07-25 2001-11-06 Hewlett Packard Company System and method for asynchronously accessing a graphics system for graphics application evaluation and control
US6119255A (en) * 1998-01-21 2000-09-12 Micron Technology, Inc. Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit
JPH11248786A (ja) * 1998-02-26 1999-09-17 Ando Electric Co Ltd バーンイン試験システム
US6304881B1 (en) * 1998-03-03 2001-10-16 Pumatech, Inc. Remote data access and synchronization
JP2000040390A (ja) 1998-07-23 2000-02-08 Ono Sokki Co Ltd バーンイン装置
US6463583B1 (en) * 1999-04-08 2002-10-08 Novadigm, Inc. Dynamic injection of execution logic into main dynamic link library function of the original kernel of a windowed operating system
IL132915A (en) * 1999-11-14 2004-05-12 Networks Assoc Tech Inc Method for secure function execution by calling address validation
TW518733B (en) * 2000-04-08 2003-01-21 Advanced Semiconductor Eng Attaching method of heat sink for chip package
JP4570208B2 (ja) * 2000-06-13 2010-10-27 株式会社アドバンテスト 試験済み電子部品の分類制御方法
US20030221313A1 (en) * 2001-01-26 2003-12-04 Gann Keith D. Method for making stacked integrated circuits (ICs) using prepackaged parts
JP2002280414A (ja) * 2001-03-22 2002-09-27 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2003057292A (ja) 2001-08-17 2003-02-26 Ando Electric Co Ltd 半導体集積回路試験装置及び試験用ボード並びに半導体集積回路試験方法
JP3901570B2 (ja) * 2002-04-23 2007-04-04 スパンション エルエルシー 電子冷却素子を利用した半導体装置の低温試験装置
US6707142B2 (en) * 2002-04-24 2004-03-16 Barun Electronics Co., Ltd. Package stacked semiconductor device having pin linking means
KR100843737B1 (ko) * 2002-05-10 2008-07-04 페어차일드코리아반도체 주식회사 솔더 조인트의 신뢰성이 개선된 반도체 패키지
JP2005140572A (ja) * 2003-11-05 2005-06-02 Hitachi High-Tech Electronics Engineering Co Ltd 半導体装置の試験装置および試験方法

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