JP2005123583A - 基板ホルダ内に基板支持体をローディングするための方法およびシステム - Google Patents

基板ホルダ内に基板支持体をローディングするための方法およびシステム Download PDF

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JP2005123583A
JP2005123583A JP2004239311A JP2004239311A JP2005123583A JP 2005123583 A JP2005123583 A JP 2005123583A JP 2004239311 A JP2004239311 A JP 2004239311A JP 2004239311 A JP2004239311 A JP 2004239311A JP 2005123583 A JP2005123583 A JP 2005123583A
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Prior art keywords
wafer
support
substrate
end effector
wafer support
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JP2005123583A5 (enExample
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Ridder Christianus Gerardus Maria De
ゲラルダス マリア デ リダー クリスティアヌス
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ASM International NV
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ASM International NV
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004239311A 2003-08-20 2004-08-19 基板ホルダ内に基板支持体をローディングするための方法およびシステム Pending JP2005123583A (ja)

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JP2005123583A5 JP2005123583A5 (enExample) 2007-09-20

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007008698A (ja) * 2005-07-01 2007-01-18 Ishikawajima Harima Heavy Ind Co Ltd 基板吸着方法、基板ホルダ及び基板吸着装置
WO2016117095A1 (ja) * 2015-01-22 2016-07-28 株式会社島津製作所 基板移載システム

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US7727588B2 (en) * 2003-09-05 2010-06-01 Yield Engineering Systems, Inc. Apparatus for the efficient coating of substrates
US9612215B2 (en) * 2004-07-22 2017-04-04 Toyo Tanso Co., Ltd. Susceptor
US20090269933A1 (en) * 2005-10-04 2009-10-29 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus and Semiconductor Device Manufacturing Method
US7576653B2 (en) * 2006-03-15 2009-08-18 Angel Secure Networks, Inc. Secure panel with remotely controlled embedded devices
JP4313401B2 (ja) * 2007-04-24 2009-08-12 東京エレクトロン株式会社 縦型熱処理装置及び被処理基板移載方法
US8344885B2 (en) * 2008-01-22 2013-01-01 Angel Secure Networks Inc. Container with interior enclosure of composite material having embedded security element
KR20110007434A (ko) * 2009-07-16 2011-01-24 주식회사 아이피에스 반도체 제조 장치
EP2360720A1 (de) * 2010-02-23 2011-08-24 Saint-Gobain Glass France Vorrichtung zum Positionieren von mindestens zwei Gegenständen, Anordnungen, insbesondere Mehrschichtkörperanordnungen, Anlage zum Prozessieren, insbesondere zum Selenisieren, von Gegenständen, Verfahren zum Positionieren von mindestens zwei Gegenständen
JP2012151433A (ja) * 2010-12-28 2012-08-09 Tokyo Electron Ltd 熱処理装置
JP5243569B2 (ja) * 2011-03-07 2013-07-24 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
JP5797176B2 (ja) * 2012-09-14 2015-10-21 東京エレクトロン株式会社 スペーサ、スペーサの搬送方法、処理方法、及び、処理装置
DE102016113924B4 (de) 2016-07-28 2024-06-13 Infineon Technologies Ag Waferbox und Verfahren zum Anordnen von Wafern in einer Waferbox
TWI803597B (zh) * 2018-03-19 2023-06-01 日商東京威力科創股份有限公司 用於形狀度量之基板固持設備和方法
NL2022185B1 (nl) * 2018-12-12 2020-07-02 Suss Microtec Lithography Gmbh Substratkassette
CN110673019A (zh) * 2018-12-19 2020-01-10 上海华力微电子有限公司 一种晶圆级自动测试系统
CN112786500A (zh) * 2019-11-11 2021-05-11 夏泰鑫半导体(青岛)有限公司 晶圆架及具有晶圆架的垂直晶舟
CN113707586B (zh) * 2021-08-30 2024-04-16 北京北方华创微电子装备有限公司 半导体工艺设备及其片舟存储装置

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JP2003031647A (ja) * 2001-07-19 2003-01-31 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2003209153A (ja) * 2002-01-11 2003-07-25 Hitachi Kokusai Electric Inc 基板処理装置、及び半導体デバイスの製造方法
JP2003282388A (ja) * 2002-03-26 2003-10-03 Hitachi Kokusai Electric Inc 基板処理装置、及び半導体装置の製造方法

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Publication number Priority date Publication date Assignee Title
JP2007008698A (ja) * 2005-07-01 2007-01-18 Ishikawajima Harima Heavy Ind Co Ltd 基板吸着方法、基板ホルダ及び基板吸着装置
WO2016117095A1 (ja) * 2015-01-22 2016-07-28 株式会社島津製作所 基板移載システム
JPWO2016117095A1 (ja) * 2015-01-22 2017-06-15 株式会社島津製作所 基板移載システム

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