JP2004509190A5 - - Google Patents
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- JP2004509190A5 JP2004509190A5 JP2002526952A JP2002526952A JP2004509190A5 JP 2004509190 A5 JP2004509190 A5 JP 2004509190A5 JP 2002526952 A JP2002526952 A JP 2002526952A JP 2002526952 A JP2002526952 A JP 2002526952A JP 2004509190 A5 JP2004509190 A5 JP 2004509190A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- oligomer
- carbon atoms
- end cap
- oligomer mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 238000000034 method Methods 0.000 claims 20
- 125000004432 carbon atom Chemical group C* 0.000 claims 16
- 239000000203 mixture Substances 0.000 claims 15
- 125000003118 aryl group Chemical group 0.000 claims 7
- 229920000642 polymer Polymers 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 4
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 4
- 125000003545 alkoxy group Chemical group 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 125000004104 aryloxy group Chemical group 0.000 claims 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 4
- 229910052794 bromium Inorganic materials 0.000 claims 4
- 229910052801 chlorine Inorganic materials 0.000 claims 4
- 239000000460 chlorine Substances 0.000 claims 4
- 229910052731 fluorine Inorganic materials 0.000 claims 4
- 239000011737 fluorine Substances 0.000 claims 4
- 229910052739 hydrogen Inorganic materials 0.000 claims 4
- 239000001257 hydrogen Substances 0.000 claims 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 4
- 238000001746 injection moulding Methods 0.000 claims 4
- 229910052740 iodine Inorganic materials 0.000 claims 4
- 239000011630 iodine Substances 0.000 claims 4
- 238000000465 moulding Methods 0.000 claims 4
- -1 aliphatic dicarboxylic acids Chemical class 0.000 claims 3
- 125000000623 heterocyclic group Chemical group 0.000 claims 3
- 239000004973 liquid crystal related substance Substances 0.000 claims 3
- 150000008065 acid anhydrides Chemical class 0.000 claims 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims 2
- 235000010233 benzoic acid Nutrition 0.000 claims 2
- 238000000071 blow moulding Methods 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 150000004985 diamines Chemical class 0.000 claims 2
- 150000002009 diols Chemical class 0.000 claims 2
- 239000000835 fiber Substances 0.000 claims 2
- 239000000155 melt Substances 0.000 claims 2
- 238000010128 melt processing Methods 0.000 claims 2
- 238000007750 plasma spraying Methods 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 238000009987 spinning Methods 0.000 claims 2
- 238000003856 thermoforming Methods 0.000 claims 2
- 238000001721 transfer moulding Methods 0.000 claims 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims 1
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 claims 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims 1
- 239000005711 Benzoic acid Substances 0.000 claims 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- 229960004050 aminobenzoic acid Drugs 0.000 claims 1
- 150000001559 benzoic acids Chemical class 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 238000005470 impregnation Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000003786 synthesis reaction Methods 0.000 claims 1
- 230000002194 synthesizing effect Effects 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23250400P | 2000-09-13 | 2000-09-13 | |
| US09/757,398 US6939940B2 (en) | 2000-09-13 | 2001-01-05 | Liquid crystalline thermosets from ester, ester-imide, and ester-amide oligomers |
| PCT/US2001/008301 WO2002022706A1 (en) | 2000-09-13 | 2001-03-15 | Liquid crystalline thermosets from ester, ester-imide, and ester-amide oligomers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004509190A JP2004509190A (ja) | 2004-03-25 |
| JP2004509190A5 true JP2004509190A5 (enExample) | 2005-04-07 |
Family
ID=26926055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002526952A Withdrawn JP2004509190A (ja) | 2000-09-13 | 2001-03-15 | エステル、エステル−イミド及びエステル−アミドオリゴマーからなる液晶熱硬化物 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US6939940B2 (enExample) |
| EP (1) | EP1320567B1 (enExample) |
| JP (1) | JP2004509190A (enExample) |
| KR (1) | KR100786659B1 (enExample) |
| CN (1) | CN100448914C (enExample) |
| AT (1) | ATE417879T1 (enExample) |
| AU (1) | AU2001252905A1 (enExample) |
| CA (1) | CA2422251A1 (enExample) |
| DE (1) | DE60137059D1 (enExample) |
| WO (1) | WO2002022706A1 (enExample) |
Families Citing this family (100)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6939940B2 (en) * | 2000-09-13 | 2005-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Liquid crystalline thermosets from ester, ester-imide, and ester-amide oligomers |
| US7227179B2 (en) * | 2002-09-30 | 2007-06-05 | World Properties, Inc. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
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| US10277290B2 (en) | 2004-04-02 | 2019-04-30 | Rearden, Llc | Systems and methods to exploit areas of coherence in wireless systems |
| US9826537B2 (en) | 2004-04-02 | 2017-11-21 | Rearden, Llc | System and method for managing inter-cluster handoff of clients which traverse multiple DIDO clusters |
| US8654815B1 (en) | 2004-04-02 | 2014-02-18 | Rearden, Llc | System and method for distributed antenna wireless communications |
| CN100376534C (zh) * | 2004-12-23 | 2008-03-26 | 吉林大学 | 含侧基苯乙炔的双官能团单体的制备及其应用 |
| US8545986B2 (en) * | 2007-03-13 | 2013-10-01 | United States of America as represented by the Administrator of the National Aeronautics and Spacing Administration | Composite insulated conductor |
| JP2009108036A (ja) * | 2007-09-28 | 2009-05-21 | Fujifilm Corp | 新規アセチレン化合物、その製造方法、それを構成単位として含むポリマー、該化合物及び／又は該ポリマーを含む組成物、該組成物を硬化させてなる硬化物 |
| KR101445871B1 (ko) * | 2007-10-25 | 2014-09-30 | 삼성전기주식회사 | 액정 폴리에스터 수지 조성물 및 그를 이용한 인쇄회로기판 |
| JP5231174B2 (ja) * | 2007-11-02 | 2013-07-10 | 三星電子株式会社 | 基板形成用組成物、プリプレグ、基板および熱硬化性芳香族オリゴマー |
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| KR101148384B1 (ko) * | 2009-11-26 | 2012-05-21 | 삼성전기주식회사 | 기판 형성용 조성물, 및 이를 이용한 프리프레그 및 기판 |
| KR101136407B1 (ko) * | 2009-12-31 | 2012-04-18 | 삼성전기주식회사 | 열경화성 액정 올리고머 및 음의 열팽창 계수의 무기 필러를 포함하는 기판용 복합재료 |
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| CN112250848B (zh) * | 2020-09-28 | 2022-08-12 | 浙江恒逸石化研究院有限公司 | 一种热致性阻燃抗熔滴芳香族液晶共聚酯材料及其制备方法 |
| CN113717360A (zh) * | 2021-09-08 | 2021-11-30 | 宁夏清研高分子新材料有限公司 | 一种易于成型加工的高耐热lcp材料及其制备方法 |
| CN116120534B (zh) * | 2022-12-26 | 2025-07-08 | 广东省科学院化工研究所 | 一种液晶共聚酯及其制备方法和应用 |
| CN116871525A (zh) * | 2023-07-07 | 2023-10-13 | 江苏汉卿科技研究院有限公司 | 一种使用离子型tlcp生产金属注射成型喂料粘接剂的方法 |
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- 2001-03-15 JP JP2002526952A patent/JP2004509190A/ja not_active Withdrawn
- 2001-03-15 AT AT01926364T patent/ATE417879T1/de not_active IP Right Cessation
- 2001-03-15 EP EP01926364A patent/EP1320567B1/en not_active Expired - Lifetime
- 2001-03-15 AU AU2001252905A patent/AU2001252905A1/en not_active Abandoned
- 2001-03-15 KR KR1020037003704A patent/KR100786659B1/ko not_active Expired - Fee Related
- 2001-03-15 WO PCT/US2001/008301 patent/WO2002022706A1/en not_active Ceased
- 2001-03-15 CN CNB018155626A patent/CN100448914C/zh not_active Expired - Fee Related
- 2001-03-15 DE DE60137059T patent/DE60137059D1/de not_active Expired - Fee Related
- 2001-03-15 CA CA002422251A patent/CA2422251A1/en not_active Abandoned
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- 2005-04-29 US US11/124,508 patent/US7507784B2/en not_active Expired - Lifetime
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