JP2003100894A - 集積回路チップ及びマルチチップパッケージ - Google Patents

集積回路チップ及びマルチチップパッケージ

Info

Publication number
JP2003100894A
JP2003100894A JP2002201571A JP2002201571A JP2003100894A JP 2003100894 A JP2003100894 A JP 2003100894A JP 2002201571 A JP2002201571 A JP 2002201571A JP 2002201571 A JP2002201571 A JP 2002201571A JP 2003100894 A JP2003100894 A JP 2003100894A
Authority
JP
Japan
Prior art keywords
chip
pad
integrated circuit
insulating film
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002201571A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003100894A5 (enExample
Inventor
Young-Hee Song
永僖 栄
Ichiko Sai
一興 崔
Jeong-Jin Kim
正鎭 金
Hai-Jeong Sohn
海鼎 孫
Chung-Woo Lee
忠雨 李
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020020003030A external-priority patent/KR100567225B1/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2003100894A publication Critical patent/JP2003100894A/ja
Publication of JP2003100894A5 publication Critical patent/JP2003100894A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W20/49—
    • H10W70/415—
    • H10W72/019—
    • H10W72/90—
    • H10W74/117—
    • H10W90/00—
    • H10W90/811—
    • H10W70/05—
    • H10W70/614—
    • H10W72/01—
    • H10W72/07551—
    • H10W72/29—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5473—
    • H10W72/59—
    • H10W72/865—
    • H10W72/884—
    • H10W72/923—
    • H10W72/932—
    • H10W72/934—
    • H10W72/952—
    • H10W72/983—
    • H10W74/00—
    • H10W90/20—
    • H10W90/231—
    • H10W90/271—
    • H10W90/291—
    • H10W90/732—
    • H10W90/734—
    • H10W90/736—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP2002201571A 2001-07-10 2002-07-10 集積回路チップ及びマルチチップパッケージ Pending JP2003100894A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20010041154 2001-07-10
KR2001-41154 2001-07-10
KR2002-3030 2002-01-18
KR1020020003030A KR100567225B1 (ko) 2001-07-10 2002-01-18 칩 패드가 셀 영역 위에 형성된 집적회로 칩과 그 제조방법 및 멀티 칩 패키지

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2008096255A Division JP2008219028A (ja) 2001-07-10 2008-04-02 集積回路チップ及びマルチチップパッケージ
JP2008096267A Division JP2008235914A (ja) 2001-07-10 2008-04-02 半導体パッケージおよびその製造方法
JP2008096281A Division JP4945501B2 (ja) 2001-07-10 2008-04-02 半導体パッケージ、マルチチップパッケージ及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003100894A true JP2003100894A (ja) 2003-04-04
JP2003100894A5 JP2003100894A5 (enExample) 2007-05-31

Family

ID=26639226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002201571A Pending JP2003100894A (ja) 2001-07-10 2002-07-10 集積回路チップ及びマルチチップパッケージ

Country Status (3)

Country Link
US (7) US6642627B2 (enExample)
JP (1) JP2003100894A (enExample)
DE (1) DE10231385B4 (enExample)

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JP2006286688A (ja) * 2005-03-31 2006-10-19 Elpida Memory Inc 半導体装置
JP2006318987A (ja) * 2005-05-10 2006-11-24 Rohm Co Ltd 半導体チップの電極構造およびその形成方法ならびに半導体チップ
US7843089B2 (en) 2006-07-19 2010-11-30 Kabushiki Kaisha Toshiba Semiconductor device

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DE10231385B4 (de) * 2001-07-10 2007-02-22 Samsung Electronics Co., Ltd., Suwon Halbleiterchip mit Bondkontaktstellen und zugehörige Mehrchippackung
KR100475740B1 (ko) * 2003-02-25 2005-03-10 삼성전자주식회사 신호 완결성 개선 및 칩 사이즈 감소를 위한 패드배치구조를 갖는 반도체 집적 회로장치
US6984881B2 (en) * 2003-06-16 2006-01-10 Sandisk Corporation Stackable integrated circuit package and method therefor
US7309923B2 (en) * 2003-06-16 2007-12-18 Sandisk Corporation Integrated circuit package having stacked integrated circuits and method therefor
DE10333465B4 (de) * 2003-07-22 2008-07-24 Infineon Technologies Ag Elektronisches Bauteil mit Halbleiterchip, Verfahren zur Herstellung desselben sowie Verfahren zur Herstellung eines Halbleiterwafers mit Kontaktflecken
KR100547354B1 (ko) * 2003-09-04 2006-01-26 삼성전기주식회사 에지 본딩용 메탈 패턴이 형성된 반도체 칩을 구비한ｂｇａ 패키지 및 그 제조 방법
US7422930B2 (en) * 2004-03-02 2008-09-09 Infineon Technologies Ag Integrated circuit with re-route layer and stacked die assembly
KR100583966B1 (ko) * 2004-06-08 2006-05-26 삼성전자주식회사 재배치된 금속 배선들을 갖는 집적회로 패키지들 및 그제조방법들
WO2006016198A1 (en) * 2004-08-02 2006-02-16 Infineon Technologies Ag Electronic component with stacked semiconductor chips and heat dissipating means
US7348210B2 (en) * 2005-04-27 2008-03-25 International Business Machines Corporation Post bump passivation for soft error protection
US20060267173A1 (en) * 2005-05-26 2006-11-30 Sandisk Corporation Integrated circuit package having stacked integrated circuits and method therefor
US7466013B2 (en) * 2005-12-15 2008-12-16 Etron Technology, Inc. Semiconductor die structure featuring a triple pad organization
KR100780691B1 (ko) * 2006-03-29 2007-11-30 주식회사 하이닉스반도체 폴딩 칩 플래나 스택 패키지
KR100713931B1 (ko) * 2006-03-29 2007-05-07 주식회사 하이닉스반도체 고속 및 고성능의 반도체 패키지
US9202776B2 (en) * 2006-06-01 2015-12-01 Stats Chippac Ltd. Stackable multi-chip package system
TWI301663B (en) * 2006-08-02 2008-10-01 Phoenix Prec Technology Corp Circuit board structure with embedded semiconductor chip and fabrication method thereof
US7719122B2 (en) * 2007-01-11 2010-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. System-in-package packaging for minimizing bond wire contamination and yield loss
US8174127B2 (en) * 2007-06-21 2012-05-08 Stats Chippac Ltd. Integrated circuit package system employing device stacking
US7830020B2 (en) * 2007-06-21 2010-11-09 Stats Chippac Ltd. Integrated circuit package system employing device stacking
US7972902B2 (en) * 2007-07-23 2011-07-05 Samsung Electronics Co., Ltd. Method of manufacturing a wafer including providing electrical conductors isolated from circuitry
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CN101933047B (zh) * 2008-02-01 2012-09-05 惠普开发有限公司 数字图像中的牙齿定位与白化
US9059074B2 (en) * 2008-03-26 2015-06-16 Stats Chippac Ltd. Integrated circuit package system with planar interconnect
US7786557B2 (en) * 2008-05-19 2010-08-31 Mediatek Inc. QFN Semiconductor package
US20110042794A1 (en) * 2008-05-19 2011-02-24 Tung-Hsien Hsieh Qfn semiconductor package and circuit board structure adapted for the same
TWI372453B (en) * 2008-09-01 2012-09-11 Advanced Semiconductor Eng Copper bonding wire, wire bonding structure and method for processing and bonding a wire
US8043894B2 (en) * 2008-08-26 2011-10-25 Stats Chippac Ltd. Integrated circuit package system with redistribution layer
US8115286B2 (en) * 2008-10-22 2012-02-14 Honeywell International Inc. Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
KR101539402B1 (ko) * 2008-10-23 2015-07-27 삼성전자주식회사 반도체 패키지
US20100148218A1 (en) * 2008-12-10 2010-06-17 Panasonic Corporation Semiconductor integrated circuit device and method for designing the same
TW201030916A (en) * 2009-02-11 2010-08-16 Advanced Semiconductor Eng Pad and package structure using the same
US7994615B2 (en) * 2009-08-28 2011-08-09 International Rectifier Corporation Direct contact leadless package for high current devices
US8093695B2 (en) * 2009-09-04 2012-01-10 International Rectifier Corporation Direct contact leadless flip chip package for high current devices
US8222722B2 (en) * 2009-09-11 2012-07-17 St-Ericsson Sa Integrated circuit package and device
KR101563630B1 (ko) * 2009-09-17 2015-10-28 에스케이하이닉스 주식회사 반도체 패키지
US8895440B2 (en) * 2010-08-06 2014-11-25 Stats Chippac, Ltd. Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV
KR20120062366A (ko) * 2010-12-06 2012-06-14 삼성전자주식회사 멀티칩 패키지의 제조 방법
CN103151316B (zh) * 2011-12-06 2017-10-20 北京大学深圳研究生院 一种基于mcp封装形式的可重构算子阵列结构的规模扩展方法
KR20130113032A (ko) * 2012-04-05 2013-10-15 에스케이하이닉스 주식회사 반도체 기판, 이를 갖는 반도체 칩 및 적층 반도체 패키지
US8698323B2 (en) * 2012-06-18 2014-04-15 Invensas Corporation Microelectronic assembly tolerant to misplacement of microelectronic elements therein
KR102053349B1 (ko) 2013-05-16 2019-12-06 삼성전자주식회사 반도체 패키지
US9134193B2 (en) * 2013-12-06 2015-09-15 Freescale Semiconductor, Inc. Stacked die sensor package
US9960135B2 (en) * 2015-03-23 2018-05-01 Texas Instruments Incorporated Metal bond pad with cobalt interconnect layer and solder thereon
JP6672812B2 (ja) * 2016-01-14 2020-03-25 三菱電機株式会社 半導体装置及びその製造方法
KR101973446B1 (ko) 2017-11-28 2019-04-29 삼성전기주식회사 팬-아웃 반도체 패키지
KR20200047845A (ko) * 2018-10-24 2020-05-08 삼성전자주식회사 반도체 패키지
KR102879321B1 (ko) * 2020-04-17 2025-10-31 에스케이하이닉스 주식회사 저항 소자를 구비하는 반도체 장치
US11676920B2 (en) 2021-01-26 2023-06-13 United Microelectronics Corp. Semiconductor device and method for fabricating the same

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JPH0637250A (ja) * 1992-05-22 1994-02-10 Natl Semiconductor Corp <Ns> 積層マルチチップモジュール及び製造方法
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006286688A (ja) * 2005-03-31 2006-10-19 Elpida Memory Inc 半導体装置
JP2006318987A (ja) * 2005-05-10 2006-11-24 Rohm Co Ltd 半導体チップの電極構造およびその形成方法ならびに半導体チップ
US7843089B2 (en) 2006-07-19 2010-11-30 Kabushiki Kaisha Toshiba Semiconductor device

Also Published As

Publication number Publication date
US7547977B2 (en) 2009-06-16
US20040041258A1 (en) 2004-03-04
US7148578B2 (en) 2006-12-12
US7541682B2 (en) 2009-06-02
US7453159B2 (en) 2008-11-18
DE10231385B4 (de) 2007-02-22
US20070108632A1 (en) 2007-05-17
DE10231385A1 (de) 2003-01-30
US7576440B2 (en) 2009-08-18
US20070108633A1 (en) 2007-05-17
US7825523B2 (en) 2010-11-02
US6642627B2 (en) 2003-11-04
US20030011068A1 (en) 2003-01-16
US20070057383A1 (en) 2007-03-15
US20070108562A1 (en) 2007-05-17
US20070057367A1 (en) 2007-03-15

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