JP2008527710A - 信号導電効率を上げながら配線パッド用構造支持体を実現する方法及び装置 - Google Patents
信号導電効率を上げながら配線パッド用構造支持体を実現する方法及び装置 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 399
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 27
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
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- 238000005516 engineering process Methods 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
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- 238000007796 conventional method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
当業者であれば、これらの図における構成要素が説明を簡単かつ明瞭にするために示され、そして必ずしも寸法通りには描かれていないことが分かるであろう。例えば、これらの図における幾つかの構成要素の寸法を他の構成要素に対して誇張して描いて本発明の実施形態を理解し易くしている。
Claims (20)
- 配線パッドの構造支持体を形成するための方法であって、
基板を設ける工程と、
複数の開口を有する第1金属層を基板の上方に設ける工程と、
第1電気絶縁層を第1金属層の上方に設ける工程と、
複数の開口を有する第2金属層を第1電気絶縁層の上方に設ける工程と、
配線パッド領域を画定する配線パッドを第2金属層の上方に設ける工程と、
物理レイアウト形状を、第1金属層及び第2金属層に対して論理演算を行なうことにより生成する工程と、
配線パッドの領域内の物理レイアウト形状の金属配線密度である数値Xを決定する工程と、
数値Xを使用して、第1金属層の複数の開口、及び第2金属層の複数の開口の十分高精度な位置整合が、十分な強度の構造支持体に関して行われているか否かを判定する工程とを備える方法。 - 値Xが所定の閾値以下となる条件を満たすように値Xを設定する、請求項1記載の方法。
- 所定の閾値は0.85である、請求項2記載の方法。
- 所定の閾値は0.80〜0.85の範囲の値である、請求項2記載の方法。
- 所定の閾値は0.70〜0.95の範囲の値である、請求項2記載の方法。
- 第2電気絶縁層を第2金属層の上方に設ける工程と、
複数の開口を有する第3金属層を第2電気絶縁層と配線パッドとの間に位置するように設ける工程とをさらに備える、請求項1記載の方法。 - 第1電気絶縁層及び第2電気絶縁層は同じ材料からなる、請求項6記載の方法。
- 第1電気絶縁層は誘電体からなる、請求項1記載の方法。
- 第1電気絶縁層は4未満の誘電率を有する、請求項1記載の方法。
- 第1電気絶縁層は80ギガパスカル未満のモジュラス値を有する、請求項1記載の方法。
- 第1金属層の複数の開口及び第2金属層の複数の開口は、第1電気絶縁層によってほぼ充填されている、請求項1記載の方法。
- 第1金属層及び第2金属層はそれぞれ、20〜80%の範囲の物理的金属配線密度を、第1金属層及び第2金属層の該当する領域に関して有する、請求項1記載の方法。
- 一つ以上のビアを、第1電気絶縁層を貫通するように形成して第1金属層の少なくとも一部分を第2金属層の少なくとも一部分に電気的に接続する工程をさらに備える、請求項1記載の方法。
- パッシベーション層を配線パッドと第2金属層との間に配置する工程をさらに備える、請求項1記載の方法。
- 少なくとも一つの素子が配線パッド下の基板に形成される、請求項1記載の方法。
- 配線パッド領域内に形成される配線パッド構造であって、
半導体素子が基板の中に形成される構成の基板と、
複数の導電層とを備え、各導電層は、配線パッド領域内の基板の上に設けられ、かつ一つ以上の低モジュラスの誘電体材料(群)と接触し、複数の導電層は、複数の開口が配線パッド領域の所定部分の上で垂直方向に位置整合して、これらの導電層が配線パッド構造の十分な強度の機械的支持体となるように形成される、配線パッド構造。 - 複数の導電層の内の最上部の導電層の上に設けられる誘電体層と、
誘電体層の上に設けられる導電配線パッド層と、をさらに備え、
誘電体層は金属配線密度がゼロの領域を誘電体層の領域の内部に含むので、金属が誘電体層のどの開口をも貫通することがなく、前記金属配線密度がゼロの領域は配線パッド領域の少なくとも50%を占める、請求項16記載の配線パッド構造。 - 配線パッド領域内に形成される配線パッド構造であって、
基板、及び基板を機能的に使用する能動回路と、
基板の上に設けられる複数の金属配線層であって、複数の金属配線層が、一つ以上の低モジュラスの誘電体材料と接触し、かつ複数の開口が配線パッド領域の所定部分の内部で垂直方向に位置整合するように形成される構成の複数の金属配線層と、
複数の金属配線層の上に設けられる最上部の金属配線層と、
最上部の金属配線層の上に設けられ、かつ最上部の金属配線層の第1導体を露出させる一つ以上の開口を有する絶縁層と、
絶縁層の上に形成され、かつ第1導体に一つ以上の開口を充填することにより接続される導電パッドと、を備え、最上部の金属配線層の第2導体は、導電パッドから絶縁層によってのみ電気的に絶縁され、そして第2導体は導電パッドに直接接続されることがなく、第1導体及び第2導体は、一つ以上の低モジュラスの誘電体材料のモジュラスよりも大きいモジュラスを有する誘電体材料によって分離される、配線パッド構造。 - 最上部の金属配線層の内、最上部の金属配線層の第1導体を最上部の金属配線層の第2導体から分離する開口は、複数の金属配線層の垂直方向に位置整合した開口と完全に位置整合するということがない、請求項18記載の配線パッド構造。
- 配線パッド領域内の配線パッド構造であって、
能動回路を有する基板と、
基板の上に設けられる複数の金属配線層であって、複数の金属配線層の各々が一つ以上の低モジュラスの誘電体材料と接触し、かつ複数の開口が配線パッド領域の所定部分の内部で垂直方向に位置整合するように形成される構成の複数の金属配線層と、
複数の金属配線層の上に設けられる絶縁層と、
絶縁層の上に形成され、かつ複数の金属配線層の内の最上部の配線層の第1導体に、絶縁層の一つ以上の開口を充填することにより接続される金属パッドと、を備え、複数の金属配線層の内の最上部の配線層の第2導体は、金属パッドから絶縁層によってのみ電気的に絶縁され、そして第2導体は金属パッドに直接接続されることがない、配線パッド構造。
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US11/033,008 US7241636B2 (en) | 2005-01-11 | 2005-01-11 | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance |
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