JP2002507846A - 異なる保持エンドエフェクタによる基板搬送方法 - Google Patents

異なる保持エンドエフェクタによる基板搬送方法

Info

Publication number
JP2002507846A
JP2002507846A JP2000537681A JP2000537681A JP2002507846A JP 2002507846 A JP2002507846 A JP 2002507846A JP 2000537681 A JP2000537681 A JP 2000537681A JP 2000537681 A JP2000537681 A JP 2000537681A JP 2002507846 A JP2002507846 A JP 2002507846A
Authority
JP
Japan
Prior art keywords
substrate
end effector
substrates
support
cassette
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000537681A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002507846A5 (https=
Inventor
クリストファー エイ． ホフマイスター
Original Assignee
ブルックス オートメーション インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ブルックス オートメーション インコーポレイテッド filed Critical ブルックス オートメーション インコーポレイテッド
Publication of JP2002507846A publication Critical patent/JP2002507846A/ja
Publication of JP2002507846A5 publication Critical patent/JP2002507846A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/044—Cylindrical coordinate type comprising an articulated arm with forearm providing vertical linear movement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2000537681A 1998-03-20 1999-02-17 異なる保持エンドエフェクタによる基板搬送方法 Pending JP2002507846A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/044,820 US6481956B1 (en) 1995-10-27 1998-03-20 Method of transferring substrates with two different substrate holding end effectors
US09/044,820 1998-03-20
PCT/US1999/003331 WO1999048652A1 (en) 1998-03-20 1999-02-17 Transferring substrates with different holding end effectors

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010166098A Division JP6123104B2 (ja) 1998-03-20 2010-07-23 異なる保持エンドエフェクタを有する基板搬送装置

Publications (2)

Publication Number Publication Date
JP2002507846A true JP2002507846A (ja) 2002-03-12
JP2002507846A5 JP2002507846A5 (https=) 2009-08-13

Family

ID=21934515

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2000537681A Pending JP2002507846A (ja) 1998-03-20 1999-02-17 異なる保持エンドエフェクタによる基板搬送方法
JP2010166098A Expired - Lifetime JP6123104B2 (ja) 1998-03-20 2010-07-23 異なる保持エンドエフェクタを有する基板搬送装置
JP2016065678A Expired - Lifetime JP6179910B2 (ja) 1998-03-20 2016-03-29 異なる保持エンドエフェクタを有する基板搬送装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2010166098A Expired - Lifetime JP6123104B2 (ja) 1998-03-20 2010-07-23 異なる保持エンドエフェクタを有する基板搬送装置
JP2016065678A Expired - Lifetime JP6179910B2 (ja) 1998-03-20 2016-03-29 異なる保持エンドエフェクタを有する基板搬送装置

Country Status (7)

Country Link
US (1) US6481956B1 (https=)
EP (1) EP1094921B1 (https=)
JP (3) JP2002507846A (https=)
KR (1) KR20010042075A (https=)
AU (1) AU3295799A (https=)
TW (1) TW575677B (https=)
WO (1) WO1999048652A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005582A (ja) * 2005-06-24 2007-01-11 Asm Japan Kk 基板搬送装置及びそれを搭載した半導体基板製造装置
JP2008141158A (ja) * 2006-11-29 2008-06-19 Samsung Electronics Co Ltd ウエハ移送装置、ウエハ移送方法及びコンピュータ可読記録媒体
JP2010541201A (ja) * 2007-09-22 2010-12-24 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー 複数のウェハを取り扱う能力を備えた受渡し機構
JP2013009007A (ja) * 2012-09-27 2013-01-10 Dainippon Screen Mfg Co Ltd 基板処理装置における基板搬送方法
WO2015020071A1 (ja) * 2013-08-08 2015-02-12 日本電産サンキョー株式会社 産業用ロボット

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6749391B2 (en) * 1996-07-15 2004-06-15 Semitool, Inc. Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
US6752584B2 (en) 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US6213853B1 (en) * 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
WO1999028951A2 (en) * 1997-11-28 1999-06-10 Mattson Technology, Inc. Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6450755B1 (en) * 1998-07-10 2002-09-17 Equipe Technologies Dual arm substrate handling robot with a batch loader
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
TW527444B (en) 1999-04-13 2003-04-11 Semitool Inc System for electrochemically processing a workpiece
US6350097B1 (en) * 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
WO2000072375A1 (en) * 1999-05-20 2000-11-30 Nikon Corporation Container for holder exposure apparatus, device manufacturing method, and device manufacturing apparatus
US6609877B1 (en) * 2000-10-04 2003-08-26 The Boc Group, Inc. Vacuum chamber load lock structure and article transport mechanism
JP2002158272A (ja) * 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
JP4937459B2 (ja) * 2001-04-06 2012-05-23 東京エレクトロン株式会社 クラスタツールおよび搬送制御方法
US20030022498A1 (en) * 2001-07-27 2003-01-30 Jeong In Kwon CMP system and method for efficiently processing semiconductor wafers
US7371041B2 (en) * 2001-08-30 2008-05-13 Seagate Technology Llc Assembly station with rotatable turret which forms and unloads a completed stack of articles
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
US20040013503A1 (en) * 2002-07-22 2004-01-22 Jaswant Sandhu Robotic hand with multi-wafer end effector
US6696367B1 (en) * 2002-09-27 2004-02-24 Asm America, Inc. System for the improved handling of wafers within a process tool
KR100382245B1 (en) * 2002-12-12 2003-05-01 Psk Inc Asher equipment for semiconductor device manufacturing including cluster method
US6748293B1 (en) * 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
KR100553685B1 (ko) * 2003-05-14 2006-02-24 삼성전자주식회사 반도체 기판을 컨테이너로부터 언로딩하는 이송장치 및이송방법
US7010388B2 (en) * 2003-05-22 2006-03-07 Axcelis Technologies, Inc. Work-piece treatment system having load lock and buffer
US7214027B2 (en) * 2003-10-16 2007-05-08 Varian Semiconductor Equipment Associates, Inc. Wafer handler method and system
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US7467916B2 (en) * 2005-03-08 2008-12-23 Asm Japan K.K. Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same
DE102005026961B4 (de) * 2005-06-10 2007-08-30 Singulus Technologies Ag Vorrichtung zum Behandeln von Substraten
TWI342597B (en) * 2005-11-21 2011-05-21 Applied Materials Inc Methods and apparatus for transferring substrates during electronic device manufacturing
US9117859B2 (en) * 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US8950998B2 (en) * 2007-02-27 2015-02-10 Brooks Automation, Inc. Batch substrate handling
JP2011119468A (ja) * 2009-12-03 2011-06-16 Tokyo Electron Ltd 被処理体の搬送方法および被処理体処理装置
TW201222715A (en) * 2010-07-02 2012-06-01 Fortrend Engineering Corp Thin substrate, mass-transfer bernoulli end-effector
US8731718B2 (en) * 2010-10-22 2014-05-20 Lam Research Corporation Dual sensing end effector with single sensor
US20120237329A1 (en) * 2011-03-18 2012-09-20 Galle Lin Thin Wafer Gripper Using High Pressure Air
US9076829B2 (en) 2011-08-08 2015-07-07 Applied Materials, Inc. Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
JP5885528B2 (ja) 2012-02-14 2016-03-15 株式会社安川電機 搬送装置
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
JP6314157B2 (ja) * 2013-12-26 2018-04-18 川崎重工業株式会社 エンドエフェクタおよび基板搬送ロボット
KR101863475B1 (ko) * 2014-01-28 2018-05-31 가와사끼 쥬고교 가부시끼 가이샤 기판 반송 시스템 및 방법
US10406562B2 (en) * 2017-07-21 2019-09-10 Applied Materials, Inc. Automation for rotary sorters
US12036680B2 (en) * 2018-07-06 2024-07-16 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and method of controlling the same
CN112956010B (zh) * 2018-11-14 2024-07-23 东京毅力科创株式会社 基板处理装置和基板输送方法
JP6734435B1 (ja) * 2019-04-26 2020-08-05 東芝エレベータ株式会社 エレベータレール用治具
US12522949B2 (en) 2019-10-03 2026-01-13 Lpe S.P.A. Treating arrangement with storage chamber and epitaxial reactor
US11335578B2 (en) * 2020-02-13 2022-05-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer apparatus and method of measuring positional deviation of substrate
US20210407837A1 (en) * 2020-06-30 2021-12-30 Applied Materials, Inc. Robot apparatus and systems, and methods for transporting substrates in electronic device manufacturing
WO2023147022A1 (en) 2022-01-27 2023-08-03 Persimmon Technologies Corporation Traversing robot with multiple end effectors

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227036A (ja) * 1990-01-31 1991-10-08 Nec Yamagata Ltd ウェーハ移載方法
JPH0461146A (ja) * 1990-06-22 1992-02-27 Mitsubishi Electric Corp 半導体ウエハ移替装置
JPH0479253A (ja) * 1990-07-20 1992-03-12 Seiko Epson Corp 搬送装置
JPH05190646A (ja) * 1992-01-10 1993-07-30 Shinko Electric Co Ltd ウエハ移載装置
JPH06349930A (ja) * 1993-06-11 1994-12-22 Shinko Electric Co Ltd ウエ−ハ移載ロボットのフィンガ衝突検知装置
JPH0870033A (ja) * 1994-08-26 1996-03-12 Kokusai Electric Co Ltd 半導体製造装置のウェーハ移載機
JPH09270450A (ja) * 1996-03-29 1997-10-14 Shibaura Eng Works Co Ltd 真空処理装置

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1190215A (en) 1913-06-17 1916-07-04 Joseph Becker Linkage.
US2282608A (en) 1940-04-17 1942-05-12 Sun Rubber Co Hoist
US3272350A (en) 1964-09-25 1966-09-13 Westinghouse Electric Corp Method and apparatus for semiconductor wafer handling
US3768714A (en) 1969-10-06 1973-10-30 Memorex Corp Microfilm printer
US3730595A (en) 1971-11-30 1973-05-01 Ibm Linear carrier sender and receiver
US3823836A (en) 1973-05-22 1974-07-16 Plat General Inc Vacuum apparatus for handling sheets
US3874525A (en) 1973-06-29 1975-04-01 Ibm Method and apparatus for handling workpieces
JPS5920267B2 (ja) 1975-10-22 1984-05-11 株式会社日立製作所 周波数発電機付電動機
JPS5291650A (en) 1976-01-29 1977-08-02 Toshiba Corp Continuous gas plasma etching apparatus
US4062463A (en) 1976-05-11 1977-12-13 Machine Technology, Inc. Automated single cassette load mechanism for scrubber
US4208159A (en) 1977-07-18 1980-06-17 Tokyo Ohka Kogyo Kabushiki Kaisha Apparatus for the treatment of a wafer by plasma reaction
US4381965A (en) 1982-01-06 1983-05-03 Drytek, Inc. Multi-planar electrode plasma etching
US4909701A (en) 1983-02-14 1990-03-20 Brooks Automation Inc. Articulated arm transfer device
US4666366A (en) 1983-02-14 1987-05-19 Canon Kabushiki Kaisha Articulated arm transfer device
JPS6052574A (ja) 1983-09-02 1985-03-25 Hitachi Ltd 連続スパツタ装置
JPS61244475A (ja) 1985-04-22 1986-10-30 株式会社東芝 産業用ロボツト
US4721971A (en) 1986-04-07 1988-01-26 Scott Joel E Photograph logging apparatus and method
US4775281A (en) * 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
JPS63162176A (ja) 1986-12-24 1988-07-05 フアナツク株式会社 水平関節型ロボツトの第１ア−ム構造
JP2531261B2 (ja) 1988-07-08 1996-09-04 富士電機株式会社 搬送装置
US4923584A (en) * 1988-10-31 1990-05-08 Eaton Corporation Sealing apparatus for a vacuum processing system
US5217340A (en) * 1989-01-28 1993-06-08 Kokusai Electric Co., Ltd. Wafer transfer mechanism in vertical CVD diffusion apparatus
JPH07105357B2 (ja) * 1989-01-28 1995-11-13 国際電気株式会社 縦型ｃｖｄ拡散装置に於けるウェーハ移載方法及び装置
US5046909A (en) 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US5447409A (en) 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
DE69027273T2 (de) 1989-10-20 1997-01-23 Applied Materials Inc Biaxialer Roboter mit magnetischer Kupplung
FR2656599B1 (fr) 1989-12-29 1992-03-27 Commissariat Energie Atomique Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires.
JP2808826B2 (ja) 1990-05-25 1998-10-08 松下電器産業株式会社 基板の移し換え装置
JP2889657B2 (ja) 1990-05-28 1999-05-10 東京エレクトロン株式会社 板状体搬送装置
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
JPH04106952A (ja) * 1990-08-27 1992-04-08 Kokusai Electric Co Ltd 半導体製造装置
KR0155172B1 (ko) * 1990-10-31 1998-12-01 이노우에 다케시 판형상체 반송장치
US5180276A (en) 1991-04-18 1993-01-19 Brooks Automation, Inc. Articulated arm transfer device
EP0512516B1 (en) 1991-05-08 1995-12-20 Koyo Seiko Co., Ltd. Magnetic drive device
JP3030667B2 (ja) 1991-07-29 2000-04-10 東京エレクトロン株式会社 搬送装置
JPH06127621A (ja) * 1992-03-29 1994-05-10 Tokyo Electron Tohoku Ltd 基板移載装置
US5404894A (en) 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
ES2090893T3 (es) 1993-01-28 1996-10-16 Applied Materials Inc Aparato de tratamiento en vacio que tiene una capacidad de produccion mejorada.
JPH07106402A (ja) * 1993-10-04 1995-04-21 Tokyo Electron Ltd 板状体搬送装置
KR100280947B1 (ko) * 1993-10-04 2001-02-01 마쓰바 구니유키 판 형상체 반송장치
JPH08139160A (ja) * 1994-11-14 1996-05-31 Shinko Electric Co Ltd 半導体製造装置におけるウェーハの移載装置
JP2952748B2 (ja) * 1994-11-24 1999-09-27 光洋リンドバーグ株式会社 熱処理装置
US5765444A (en) * 1995-07-10 1998-06-16 Kensington Laboratories, Inc. Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities
JP3150620B2 (ja) * 1995-08-05 2001-03-26 株式会社日立国際電気 基板処理装置
US5647724A (en) 1995-10-27 1997-07-15 Brooks Automation Inc. Substrate transport apparatus with dual substrate holders

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227036A (ja) * 1990-01-31 1991-10-08 Nec Yamagata Ltd ウェーハ移載方法
JPH0461146A (ja) * 1990-06-22 1992-02-27 Mitsubishi Electric Corp 半導体ウエハ移替装置
JPH0479253A (ja) * 1990-07-20 1992-03-12 Seiko Epson Corp 搬送装置
JPH05190646A (ja) * 1992-01-10 1993-07-30 Shinko Electric Co Ltd ウエハ移載装置
JPH06349930A (ja) * 1993-06-11 1994-12-22 Shinko Electric Co Ltd ウエ−ハ移載ロボットのフィンガ衝突検知装置
JPH0870033A (ja) * 1994-08-26 1996-03-12 Kokusai Electric Co Ltd 半導体製造装置のウェーハ移載機
JPH09270450A (ja) * 1996-03-29 1997-10-14 Shibaura Eng Works Co Ltd 真空処理装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005582A (ja) * 2005-06-24 2007-01-11 Asm Japan Kk 基板搬送装置及びそれを搭載した半導体基板製造装置
JP2008141158A (ja) * 2006-11-29 2008-06-19 Samsung Electronics Co Ltd ウエハ移送装置、ウエハ移送方法及びコンピュータ可読記録媒体
JP2010541201A (ja) * 2007-09-22 2010-12-24 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー 複数のウェハを取り扱う能力を備えた受渡し機構
JP2013009007A (ja) * 2012-09-27 2013-01-10 Dainippon Screen Mfg Co Ltd 基板処理装置における基板搬送方法
WO2015020071A1 (ja) * 2013-08-08 2015-02-12 日本電産サンキョー株式会社 産業用ロボット
US10276416B2 (en) 2013-08-08 2019-04-30 Nidec Sankyo Corporation Industrial robot

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US6481956B1 (en) 2002-11-19
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AU3295799A (en) 1999-10-18
KR20010042075A (ko) 2001-05-25
TW575677B (en) 2004-02-11
WO1999048652A1 (en) 1999-09-30
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EP1094921A4 (en) 2007-11-07
JP2016154248A (ja) 2016-08-25

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