TW575677B - Method of transferring substrates with two different substrate holding end effectors - Google Patents

Method of transferring substrates with two different substrate holding end effectors Download PDF

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Publication number
TW575677B
TW575677B TW88102703A TW88102703A TW575677B TW 575677 B TW575677 B TW 575677B TW 88102703 A TW88102703 A TW 88102703A TW 88102703 A TW88102703 A TW 88102703A TW 575677 B TW575677 B TW 575677B
Authority
TW
Taiwan
Prior art keywords
substrate
end effector
substrates
support areas
patent application
Prior art date
Application number
TW88102703A
Other languages
English (en)
Chinese (zh)
Inventor
Christopher A Hofmeister
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Application granted granted Critical
Publication of TW575677B publication Critical patent/TW575677B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/044—Cylindrical coordinate type comprising an articulated arm with forearm providing vertical linear movement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW88102703A 1998-03-20 1999-02-24 Method of transferring substrates with two different substrate holding end effectors TW575677B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/044,820 US6481956B1 (en) 1995-10-27 1998-03-20 Method of transferring substrates with two different substrate holding end effectors

Publications (1)

Publication Number Publication Date
TW575677B true TW575677B (en) 2004-02-11

Family

ID=21934515

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88102703A TW575677B (en) 1998-03-20 1999-02-24 Method of transferring substrates with two different substrate holding end effectors

Country Status (7)

Country Link
US (1) US6481956B1 (https=)
EP (1) EP1094921B1 (https=)
JP (3) JP2002507846A (https=)
KR (1) KR20010042075A (https=)
AU (1) AU3295799A (https=)
TW (1) TW575677B (https=)
WO (1) WO1999048652A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106104786A (zh) * 2014-01-28 2016-11-09 川崎重工业株式会社 基板搬送系统及方法

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106104786A (zh) * 2014-01-28 2016-11-09 川崎重工业株式会社 基板搬送系统及方法
CN106104786B (zh) * 2014-01-28 2019-04-05 川崎重工业株式会社 基板搬送系统及方法
TWI656003B (zh) * 2014-01-28 2019-04-11 Kawasaki Jukogyo Kabushiki Kaisha 基板搬送系統及方法

Also Published As

Publication number Publication date
JP6123104B2 (ja) 2017-05-10
JP6179910B2 (ja) 2017-08-16
JP2010287902A (ja) 2010-12-24
US6481956B1 (en) 2002-11-19
EP1094921B1 (en) 2012-04-11
AU3295799A (en) 1999-10-18
KR20010042075A (ko) 2001-05-25
JP2002507846A (ja) 2002-03-12
WO1999048652A1 (en) 1999-09-30
EP1094921A1 (en) 2001-05-02
EP1094921A4 (en) 2007-11-07
JP2016154248A (ja) 2016-08-25

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