JP6123104B2 - 異なる保持エンドエフェクタを有する基板搬送装置 - Google Patents
異なる保持エンドエフェクタを有する基板搬送装置 Download PDFInfo
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- JP6123104B2 JP6123104B2 JP2010166098A JP2010166098A JP6123104B2 JP 6123104 B2 JP6123104 B2 JP 6123104B2 JP 2010166098 A JP2010166098 A JP 2010166098A JP 2010166098 A JP2010166098 A JP 2010166098A JP 6123104 B2 JP6123104 B2 JP 6123104B2
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- Prior art keywords
- substrate
- end effector
- substrates
- transport mechanism
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Links
- 239000000758 substrate Substances 0.000 title claims description 177
- 239000012636 effector Substances 0.000 title claims description 69
- 238000012546 transfer Methods 0.000 title description 9
- 230000007723 transport mechanism Effects 0.000 claims description 13
- 239000000872 buffer Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 28
- 239000002775 capsule Substances 0.000 description 16
- 238000012545 processing Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000032258 transport Effects 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/044—Cylindrical coordinate type comprising an articulated arm with forearm providing vertical linear movement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
11 基板処理部
13 基板搭載部
20 フレーム
32 基板搬送ロボット
B1,B2,B3,B4 バッファカセット
34 カセット
56 制御部
Claims (5)
- 基板搬送機構であって、
第1のアーム部、前記第1のアーム部に枢動自在に接続された第2のアーム部、及び前記第2のアーム部に接続された枢動部を有するスカラアームと、
前記枢動部に設けられて第1の最大数の基板を個別的に支持可能な第1数の支持領域を有する第1のエンドエフェクタと、
前記枢動部に設けられて前記第1の最大数より少ない第2の最大数の基板を個別的に支持可能な第2数の支持領域を有する第2のエンドエフェクタと、を有し、
前記第1数と前記第2数の整数倍数との積と、前記第2数との合計が標準能力の基板保持位置に保持され得る基板最大数に等しくなるように、前記第1のエンドエフェクタの支持領域の前記第1数が前記基板最大数と前記第2数との双方に基づいて決定され、
前記第1のエンドエフェクタと前記第2のエンドエフェクタとが枢動部で互いに接続され、前記枢動部が、前記第1のアーム部及び前記第2のアーム部の互いに対する相対的な移動に基づいて前記第1のエンドエフェクタ及び前記第2のエンドエフェクタを回転させることを特徴とする基板搬送機構。 - 請求項1に記載の基板搬送機構であって、前記基板搬送機構は、基板を第1の位置と第2の位置との間で搬送可能であり、前記第1のエンドエフェクタ及び前記第2のエンドエフェクタは、前記第1の位置の基板の数が前記第1のエンドエフェクタ上にある前記第1数の支持領域よりも少ない場合において、前記第1の位置から前記第2の位置までの基板搬送が前記第2のエンドエフェクタを使用するように構成されていることを特徴とする基板搬送機構。
- 請求項1に記載の基板搬送機構であって、前記第2のエンドエフェクタの前記基板支持領域の第2数が1であることを特徴とする基板搬送機構。
- 請求項1に記載の基板搬送機構であって、前記第1のエンドエフェクタの前記基板支持領域の第1数が6であることを特徴とする基板搬送機構。
- 請求項1に記載の基板搬送機構であって、前記第1のエンドエフェクタ及び前記第2のエンドエフェクタは、前記基板の第1の最大数が以下の式に基づくように構成されていることを特徴とする基板搬送機構:
FEEMAX=(FLMAX−SEEMAX)/WNDSEE
ここで、FEEMAXは、前記第1のエンドエフェクタの第1の基板領域に個別的に支持され得る基板の前記第1の最大数であり、
FLMAXは、第1の基板標準能力保持位置の基板保持数の最大数であり、
SEEMAXは、前記第2のエンドエフェクタの第2の基板領域に個別に支持され得る基板の前記第2の最大数であり、
WNDSEEは、SEEMAXによって割り切れて整数となる整数であり、前記第1のエンドエフェクタの前記第1の基板領域から前記第1の基板標準能力保持位置までの搬送数を表すことを特徴とする基板搬送機構。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/044,820 | 1998-03-20 | ||
US09/044,820 US6481956B1 (en) | 1995-10-27 | 1998-03-20 | Method of transferring substrates with two different substrate holding end effectors |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000537681A Division JP2002507846A (ja) | 1998-03-20 | 1999-02-17 | 異なる保持エンドエフェクタによる基板搬送方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016065678A Division JP6179910B2 (ja) | 1998-03-20 | 2016-03-29 | 異なる保持エンドエフェクタを有する基板搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010287902A JP2010287902A (ja) | 2010-12-24 |
JP6123104B2 true JP6123104B2 (ja) | 2017-05-10 |
Family
ID=21934515
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000537681A Pending JP2002507846A (ja) | 1998-03-20 | 1999-02-17 | 異なる保持エンドエフェクタによる基板搬送方法 |
JP2010166098A Expired - Lifetime JP6123104B2 (ja) | 1998-03-20 | 2010-07-23 | 異なる保持エンドエフェクタを有する基板搬送装置 |
JP2016065678A Expired - Lifetime JP6179910B2 (ja) | 1998-03-20 | 2016-03-29 | 異なる保持エンドエフェクタを有する基板搬送装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000537681A Pending JP2002507846A (ja) | 1998-03-20 | 1999-02-17 | 異なる保持エンドエフェクタによる基板搬送方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016065678A Expired - Lifetime JP6179910B2 (ja) | 1998-03-20 | 2016-03-29 | 異なる保持エンドエフェクタを有する基板搬送装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6481956B1 (ja) |
EP (1) | EP1094921B1 (ja) |
JP (3) | JP2002507846A (ja) |
KR (1) | KR20010042075A (ja) |
AU (1) | AU3295799A (ja) |
TW (1) | TW575677B (ja) |
WO (1) | WO1999048652A1 (ja) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6752584B2 (en) | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
US6749391B2 (en) * | 1996-07-15 | 2004-06-15 | Semitool, Inc. | Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces |
US6749390B2 (en) | 1997-12-15 | 2004-06-15 | Semitool, Inc. | Integrated tools with transfer devices for handling microelectronic workpieces |
US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US6213853B1 (en) * | 1997-09-10 | 2001-04-10 | Speedfam-Ipec Corporation | Integral machine for polishing, cleaning, rinsing and drying workpieces |
EP2099061A3 (en) * | 1997-11-28 | 2013-06-12 | Mattson Technology, Inc. | Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing |
US6450755B1 (en) * | 1998-07-10 | 2002-09-17 | Equipe Technologies | Dual arm substrate handling robot with a batch loader |
US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US6350097B1 (en) * | 1999-04-19 | 2002-02-26 | Applied Materials, Inc. | Method and apparatus for processing wafers |
AU4779600A (en) * | 1999-05-20 | 2000-12-12 | Nikon Corporation | Container for holder exposure apparatus, device manufacturing method, and device manufacturing apparatus |
US6609877B1 (en) | 2000-10-04 | 2003-08-26 | The Boc Group, Inc. | Vacuum chamber load lock structure and article transport mechanism |
JP2002158272A (ja) * | 2000-11-17 | 2002-05-31 | Tatsumo Kk | ダブルアーム基板搬送装置 |
JP4937459B2 (ja) * | 2001-04-06 | 2012-05-23 | 東京エレクトロン株式会社 | クラスタツールおよび搬送制御方法 |
US20030022498A1 (en) * | 2001-07-27 | 2003-01-30 | Jeong In Kwon | CMP system and method for efficiently processing semiconductor wafers |
US7371041B2 (en) * | 2001-08-30 | 2008-05-13 | Seagate Technology Llc | Assembly station with rotatable turret which forms and unloads a completed stack of articles |
US7578649B2 (en) * | 2002-05-29 | 2009-08-25 | Brooks Automation, Inc. | Dual arm substrate transport apparatus |
US20040013503A1 (en) * | 2002-07-22 | 2004-01-22 | Jaswant Sandhu | Robotic hand with multi-wafer end effector |
US6696367B1 (en) * | 2002-09-27 | 2004-02-24 | Asm America, Inc. | System for the improved handling of wafers within a process tool |
KR100382245B1 (en) * | 2002-12-12 | 2003-05-01 | Psk Inc | Asher equipment for semiconductor device manufacturing including cluster method |
US6748293B1 (en) * | 2003-03-24 | 2004-06-08 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for high speed object handling |
KR100553685B1 (ko) * | 2003-05-14 | 2006-02-24 | 삼성전자주식회사 | 반도체 기판을 컨테이너로부터 언로딩하는 이송장치 및이송방법 |
US7010388B2 (en) * | 2003-05-22 | 2006-03-07 | Axcelis Technologies, Inc. | Work-piece treatment system having load lock and buffer |
US7214027B2 (en) * | 2003-10-16 | 2007-05-08 | Varian Semiconductor Equipment Associates, Inc. | Wafer handler method and system |
US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
US7467916B2 (en) * | 2005-03-08 | 2008-12-23 | Asm Japan K.K. | Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same |
DE102005026961B4 (de) * | 2005-06-10 | 2007-08-30 | Singulus Technologies Ag | Vorrichtung zum Behandeln von Substraten |
JP2007005582A (ja) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | 基板搬送装置及びそれを搭載した半導体基板製造装置 |
US7927062B2 (en) * | 2005-11-21 | 2011-04-19 | Applied Materials, Inc. | Methods and apparatus for transferring substrates during electronic device manufacturing |
US9117859B2 (en) * | 2006-08-31 | 2015-08-25 | Brooks Automation, Inc. | Compact processing apparatus |
KR101312621B1 (ko) * | 2006-11-29 | 2013-10-07 | 삼성전자주식회사 | 웨이퍼이송장치 |
US8950998B2 (en) * | 2007-02-27 | 2015-02-10 | Brooks Automation, Inc. | Batch substrate handling |
US8277165B2 (en) * | 2007-09-22 | 2012-10-02 | Dynamic Micro System Semiconductor Equipment GmbH | Transfer mechanism with multiple wafer handling capability |
JP2011119468A (ja) * | 2009-12-03 | 2011-06-16 | Tokyo Electron Ltd | 被処理体の搬送方法および被処理体処理装置 |
TW201222715A (en) * | 2010-07-02 | 2012-06-01 | Fortrend Engineering Corp | Thin substrate, mass-transfer bernoulli end-effector |
US8731718B2 (en) * | 2010-10-22 | 2014-05-20 | Lam Research Corporation | Dual sensing end effector with single sensor |
US20120237329A1 (en) * | 2011-03-18 | 2012-09-20 | Galle Lin | Thin Wafer Gripper Using High Pressure Air |
US9076829B2 (en) | 2011-08-08 | 2015-07-07 | Applied Materials, Inc. | Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing |
JP5885528B2 (ja) | 2012-02-14 | 2016-03-15 | 株式会社安川電機 | 搬送装置 |
JP5524304B2 (ja) * | 2012-09-27 | 2014-06-18 | 大日本スクリーン製造株式会社 | 基板処理装置における基板搬送方法 |
JP6295037B2 (ja) * | 2013-08-08 | 2018-03-14 | 日本電産サンキョー株式会社 | 産業用ロボット |
US10424498B2 (en) * | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
US10483143B2 (en) * | 2013-12-26 | 2019-11-19 | Kawasaki Jukogyo Kabushiki Kaisha | End effector and substrate conveying robot |
CN106104786B (zh) * | 2014-01-28 | 2019-04-05 | 川崎重工业株式会社 | 基板搬送系统及方法 |
CN112005360A (zh) * | 2018-07-06 | 2020-11-27 | 川崎重工业株式会社 | 基板搬送机器人及其控制方法 |
JP6734435B1 (ja) * | 2019-04-26 | 2020-08-05 | 東芝エレベータ株式会社 | エレベータレール用治具 |
US20220333272A1 (en) * | 2019-10-03 | 2022-10-20 | Lpe S.P.A. | Treating arrangement with storage chamber and epitaxial reactor |
US11335578B2 (en) * | 2020-02-13 | 2022-05-17 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer apparatus and method of measuring positional deviation of substrate |
US20210407837A1 (en) * | 2020-06-30 | 2021-12-30 | Applied Materials, Inc. | Robot apparatus and systems, and methods for transporting substrates in electronic device manufacturing |
Family Cites Families (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1190215A (en) | 1913-06-17 | 1916-07-04 | Joseph Becker | Linkage. |
US2282608A (en) | 1940-04-17 | 1942-05-12 | Sun Rubber Co | Hoist |
US3272350A (en) | 1964-09-25 | 1966-09-13 | Westinghouse Electric Corp | Method and apparatus for semiconductor wafer handling |
US3768714A (en) | 1969-10-06 | 1973-10-30 | Memorex Corp | Microfilm printer |
US3730595A (en) | 1971-11-30 | 1973-05-01 | Ibm | Linear carrier sender and receiver |
US3823836A (en) | 1973-05-22 | 1974-07-16 | Plat General Inc | Vacuum apparatus for handling sheets |
US3874525A (en) | 1973-06-29 | 1975-04-01 | Ibm | Method and apparatus for handling workpieces |
JPS5920267B2 (ja) | 1975-10-22 | 1984-05-11 | 株式会社日立製作所 | 周波数発電機付電動機 |
JPS5291650A (en) | 1976-01-29 | 1977-08-02 | Toshiba Corp | Continuous gas plasma etching apparatus |
US4062463A (en) | 1976-05-11 | 1977-12-13 | Machine Technology, Inc. | Automated single cassette load mechanism for scrubber |
US4208159A (en) | 1977-07-18 | 1980-06-17 | Tokyo Ohka Kogyo Kabushiki Kaisha | Apparatus for the treatment of a wafer by plasma reaction |
US4381965A (en) | 1982-01-06 | 1983-05-03 | Drytek, Inc. | Multi-planar electrode plasma etching |
US4909701A (en) | 1983-02-14 | 1990-03-20 | Brooks Automation Inc. | Articulated arm transfer device |
US4666366A (en) | 1983-02-14 | 1987-05-19 | Canon Kabushiki Kaisha | Articulated arm transfer device |
JPS6052574A (ja) | 1983-09-02 | 1985-03-25 | Hitachi Ltd | 連続スパツタ装置 |
JPS61244475A (ja) | 1985-04-22 | 1986-10-30 | 株式会社東芝 | 産業用ロボツト |
US4721971A (en) | 1986-04-07 | 1988-01-26 | Scott Joel E | Photograph logging apparatus and method |
US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
US4951601A (en) | 1986-12-19 | 1990-08-28 | Applied Materials, Inc. | Multi-chamber integrated process system |
JPS63162176A (ja) | 1986-12-24 | 1988-07-05 | フアナツク株式会社 | 水平関節型ロボツトの第1ア−ム構造 |
JP2531261B2 (ja) | 1988-07-08 | 1996-09-04 | 富士電機株式会社 | 搬送装置 |
US4923584A (en) * | 1988-10-31 | 1990-05-08 | Eaton Corporation | Sealing apparatus for a vacuum processing system |
US5217340A (en) * | 1989-01-28 | 1993-06-08 | Kokusai Electric Co., Ltd. | Wafer transfer mechanism in vertical CVD diffusion apparatus |
JPH07105357B2 (ja) * | 1989-01-28 | 1995-11-13 | 国際電気株式会社 | 縦型cvd拡散装置に於けるウェーハ移載方法及び装置 |
US5046909A (en) | 1989-06-29 | 1991-09-10 | Applied Materials, Inc. | Method and apparatus for handling semiconductor wafers |
EP0858867A3 (en) | 1989-10-20 | 1999-03-17 | Applied Materials, Inc. | Robot apparatus |
US5447409A (en) | 1989-10-20 | 1995-09-05 | Applied Materials, Inc. | Robot assembly |
FR2656599B1 (fr) * | 1989-12-29 | 1992-03-27 | Commissariat Energie Atomique | Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires. |
JP2654217B2 (ja) * | 1990-01-31 | 1997-09-17 | 山形日本電気株式会社 | ウェーハ移載方法 |
JP2808826B2 (ja) | 1990-05-25 | 1998-10-08 | 松下電器産業株式会社 | 基板の移し換え装置 |
JP2889657B2 (ja) | 1990-05-28 | 1999-05-10 | 東京エレクトロン株式会社 | 板状体搬送装置 |
JPH0461146A (ja) * | 1990-06-22 | 1992-02-27 | Mitsubishi Electric Corp | 半導体ウエハ移替装置 |
JPH0479253A (ja) * | 1990-07-20 | 1992-03-12 | Seiko Epson Corp | 搬送装置 |
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
JPH04106952A (ja) * | 1990-08-27 | 1992-04-08 | Kokusai Electric Co Ltd | 半導体製造装置 |
US5273244A (en) * | 1990-10-31 | 1993-12-28 | Tokyo Electron Sagami Limited | Plate-like member conveying apparatus |
US5180276A (en) | 1991-04-18 | 1993-01-19 | Brooks Automation, Inc. | Articulated arm transfer device |
DE69206872T2 (de) | 1991-05-08 | 1996-07-25 | Koyo Seiko Co | Magnetische Antriebsvorrichtung |
JP3030667B2 (ja) | 1991-07-29 | 2000-04-10 | 東京エレクトロン株式会社 | 搬送装置 |
JPH05190646A (ja) * | 1992-01-10 | 1993-07-30 | Shinko Electric Co Ltd | ウエハ移載装置 |
JPH06127621A (ja) * | 1992-03-29 | 1994-05-10 | Tokyo Electron Tohoku Ltd | 基板移載装置 |
US5404894A (en) | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
EP0608620B1 (en) | 1993-01-28 | 1996-08-14 | Applied Materials, Inc. | Vacuum Processing apparatus having improved throughput |
JPH06349930A (ja) * | 1993-06-11 | 1994-12-22 | Shinko Electric Co Ltd | ウエ−ハ移載ロボットのフィンガ衝突検知装置 |
JPH07106402A (ja) * | 1993-10-04 | 1995-04-21 | Tokyo Electron Ltd | 板状体搬送装置 |
KR100280947B1 (ko) * | 1993-10-04 | 2001-02-01 | 마쓰바 구니유키 | 판 형상체 반송장치 |
JPH0870033A (ja) * | 1994-08-26 | 1996-03-12 | Kokusai Electric Co Ltd | 半導体製造装置のウェーハ移載機 |
JPH08139160A (ja) * | 1994-11-14 | 1996-05-31 | Shinko Electric Co Ltd | 半導体製造装置におけるウェーハの移載装置 |
JP2952748B2 (ja) * | 1994-11-24 | 1999-09-27 | 光洋リンドバーグ株式会社 | 熱処理装置 |
US5765444A (en) * | 1995-07-10 | 1998-06-16 | Kensington Laboratories, Inc. | Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities |
JP3150620B2 (ja) * | 1995-08-05 | 2001-03-26 | 株式会社日立国際電気 | 基板処理装置 |
US5647724A (en) | 1995-10-27 | 1997-07-15 | Brooks Automation Inc. | Substrate transport apparatus with dual substrate holders |
JP2857097B2 (ja) * | 1996-03-29 | 1999-02-10 | 芝浦メカトロニクス株式会社 | 真空処理装置 |
-
1998
- 1998-03-20 US US09/044,820 patent/US6481956B1/en not_active Expired - Lifetime
-
1999
- 1999-02-17 KR KR1020007010427A patent/KR20010042075A/ko not_active Application Discontinuation
- 1999-02-17 JP JP2000537681A patent/JP2002507846A/ja active Pending
- 1999-02-17 AU AU32957/99A patent/AU3295799A/en not_active Abandoned
- 1999-02-17 WO PCT/US1999/003331 patent/WO1999048652A1/en not_active Application Discontinuation
- 1999-02-17 EP EP99942580A patent/EP1094921B1/en not_active Expired - Lifetime
- 1999-02-24 TW TW88102703A patent/TW575677B/zh active
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2010
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Also Published As
Publication number | Publication date |
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JP6179910B2 (ja) | 2017-08-16 |
EP1094921A4 (en) | 2007-11-07 |
JP2002507846A (ja) | 2002-03-12 |
TW575677B (en) | 2004-02-11 |
JP2010287902A (ja) | 2010-12-24 |
EP1094921B1 (en) | 2012-04-11 |
EP1094921A1 (en) | 2001-05-02 |
KR20010042075A (ko) | 2001-05-25 |
US6481956B1 (en) | 2002-11-19 |
AU3295799A (en) | 1999-10-18 |
JP2016154248A (ja) | 2016-08-25 |
WO1999048652A1 (en) | 1999-09-30 |
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