KR20010042075A - 상이한 지지 단부 작동기를 사용하는 기판 이송 방법 - Google Patents

상이한 지지 단부 작동기를 사용하는 기판 이송 방법 Download PDF

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Publication number
KR20010042075A
KR20010042075A KR1020007010427A KR20007010427A KR20010042075A KR 20010042075 A KR20010042075 A KR 20010042075A KR 1020007010427 A KR1020007010427 A KR 1020007010427A KR 20007010427 A KR20007010427 A KR 20007010427A KR 20010042075 A KR20010042075 A KR 20010042075A
Authority
KR
South Korea
Prior art keywords
substrate
end actuator
support
substrates
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020007010427A
Other languages
English (en)
Korean (ko)
Inventor
크리스토퍼 에이. 호프메이스터
Original Assignee
스탠리 디. 피에코스
브룩스 오토메이션 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스탠리 디. 피에코스, 브룩스 오토메이션 인코퍼레이티드 filed Critical 스탠리 디. 피에코스
Publication of KR20010042075A publication Critical patent/KR20010042075A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/044—Cylindrical coordinate type comprising an articulated arm with forearm providing vertical linear movement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020007010427A 1998-03-20 1999-02-17 상이한 지지 단부 작동기를 사용하는 기판 이송 방법 Withdrawn KR20010042075A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/044,820 US6481956B1 (en) 1995-10-27 1998-03-20 Method of transferring substrates with two different substrate holding end effectors
US9/044,820 1998-03-20
PCT/US1999/003331 WO1999048652A1 (en) 1998-03-20 1999-02-17 Transferring substrates with different holding end effectors

Publications (1)

Publication Number Publication Date
KR20010042075A true KR20010042075A (ko) 2001-05-25

Family

ID=21934515

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007010427A Withdrawn KR20010042075A (ko) 1998-03-20 1999-02-17 상이한 지지 단부 작동기를 사용하는 기판 이송 방법

Country Status (7)

Country Link
US (1) US6481956B1 (https=)
EP (1) EP1094921B1 (https=)
JP (3) JP2002507846A (https=)
KR (1) KR20010042075A (https=)
AU (1) AU3295799A (https=)
TW (1) TW575677B (https=)
WO (1) WO1999048652A1 (https=)

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Also Published As

Publication number Publication date
JP6123104B2 (ja) 2017-05-10
JP6179910B2 (ja) 2017-08-16
JP2010287902A (ja) 2010-12-24
US6481956B1 (en) 2002-11-19
EP1094921B1 (en) 2012-04-11
AU3295799A (en) 1999-10-18
JP2002507846A (ja) 2002-03-12
TW575677B (en) 2004-02-11
WO1999048652A1 (en) 1999-09-30
EP1094921A1 (en) 2001-05-02
EP1094921A4 (en) 2007-11-07
JP2016154248A (ja) 2016-08-25

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