WO2015020071A1 - 産業用ロボット - Google Patents
産業用ロボット Download PDFInfo
- Publication number
- WO2015020071A1 WO2015020071A1 PCT/JP2014/070673 JP2014070673W WO2015020071A1 WO 2015020071 A1 WO2015020071 A1 WO 2015020071A1 JP 2014070673 W JP2014070673 W JP 2014070673W WO 2015020071 A1 WO2015020071 A1 WO 2015020071A1
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- WIPO (PCT)
- Prior art keywords
- hand
- arm
- drive motor
- hand part
- industrial robot
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Definitions
- the present invention relates to an industrial robot for transporting a substrate such as a semiconductor wafer.
- an industrial robot that conveys a substrate such as a semiconductor wafer is known (see, for example, Patent Document 1).
- the industrial robot described in Patent Document 1 is installed and used in a semiconductor manufacturing system, for example.
- This industrial robot has one substrate mounting mechanism on which a plurality of substrates are mounted, an arm that rotatably supports the base end side of the substrate mounting mechanism, and a base end side of the arm that can be rotated. And a main body that supports the swing mechanism so as to be movable in the vertical direction.
- the substrate mounting mechanism includes five hand forks arranged so as to overlap in the vertical direction at a predetermined pitch. With this industrial robot, five substrates can be simultaneously mounted on the substrate mounting mechanism. Therefore, this industrial robot can carry five substrates simultaneously.
- a substrate may be cleaned, and an industrial robot may carry a substrate before cleaning into a cleaning device or carry out a substrate after cleaning from the cleaning device.
- an industrial robot may carry a substrate before cleaning into a cleaning device or carry out a substrate after cleaning from the cleaning device.
- dust or the like that has adhered to the substrate before cleaning may adhere to the hand fork on which the substrate before cleaning is mounted.
- the cleaned substrate is mounted on the hand fork on which the substrate before cleaning is mounted, the cleaned substrate mounted on the hand fork may become dirty again. Therefore, it is preferable that the substrate after cleaning is mounted on a hand fork different from the hand fork on which the substrate before cleaning is mounted.
- the industrial robot described in Patent Document 1 since five hand forks are provided in one substrate mounting mechanism, cleaning is performed on a substrate mounting mechanism different from the substrate mounting mechanism on which the substrate before cleaning is mounted. It is difficult to mount a later substrate.
- an object of the present invention is to provide an industrial robot capable of changing the number of substrates that can be simultaneously conveyed. Further, an object of the present invention is to simplify the configuration even if it is possible to mount the substrate after this processing step on a hand different from the hand on which the substrate before the predetermined processing step is mounted. It is to provide a possible industrial robot.
- the industrial robot of the present invention includes a plurality of first robot units arranged in a vertical direction at a predetermined pitch with a first hand unit having one substrate mounting unit on which one substrate is mounted.
- a first hand and a second hand having a second hand portion having a plurality of substrate mounting portions, and a first hand portion and a second hand portion of the first hand that are pivotally connected to the tip side thereof.
- An arm support portion that is movably connected, a column portion that holds the arm support portion so as to be movable in the vertical direction, and a first hand portion rotation that rotates the first hand portion of the first hand relative to the first arm.
- the moving mechanism and the second hand part of the first hand to the first arm The second hand part turning mechanism for turning the second hand part, the third hand part turning mechanism for turning the first hand part of the second hand relative to the second arm, and the second hand part of the second hand.
- a fourth hand rotating mechanism that rotates the two arms, a first arm rotating mechanism that rotates the first arm relative to the arm support, and a second arm that rotates relative to the arm support.
- a second arm rotation mechanism for causing the first hand portion and the second hand portion of the first hand to overlap each other in the vertical direction and the rotation center of the first hand portion of the first hand.
- the second hand portion of the first hand is arranged so as to coincide with the rotation center of the second hand portion, the first hand portion and the second hand portion of the second hand overlap each other in the vertical direction, and the second hand
- the rotation center of the first hand portion of the second hand portion coincides with the rotation center of the second hand portion of the second hand.
- the first arm is attached to the upper surface side of the arm support portion
- the second arm is attached to the lower surface side of the arm support portion
- the first arm and the second arm rotate the first arm.
- the center and the rotation center of the second arm are arranged so as to coincide with each other.
- the first hand includes a first hand portion having one substrate mounting portion and a second hand portion having a plurality of substrate mounting portions. And the 2nd hand part is connected with the 1st arm so that rotation is possible.
- the industrial robot of the present invention includes a first hand rotating mechanism that rotates the first hand of the first hand relative to the first arm, and the second hand of the first hand as the first arm.
- a second hand rotating mechanism that rotates relative to the first hand.
- the first hand of the first hand and the second hand of the first hand overlap each other in the vertical direction and the first hand of the first hand.
- the rotation center of the hand portion and the rotation center of the second hand portion of the first hand are arranged so as to coincide with each other.
- the second hand includes a first hand portion having one substrate mounting portion and a second hand portion having a plurality of substrate mounting portions.
- the second hand portion is rotatably connected to the second arm.
- the industrial robot of the present invention includes a third hand rotating mechanism for rotating the first hand of the second hand relative to the second arm, and the second hand of the second hand as the second arm.
- the substrate mounting portion of the first hand portion and the substrate mounting portion of the second hand portion are arranged so that the substrates can be mounted on both the first hand portion and the second hand portion.
- the first hand portion so that the substrate can be mounted only on the substrate mounting portion of the first hand portion, or the substrate can be mounted only on the substrate mounting portion of the second hand portion. It is possible to dispose the board mounting part of the hand part and the board mounting part of the second hand part in a shifted manner. Therefore, in the present invention, it is possible to change the number of substrates that can be simultaneously conveyed.
- the industrial robot of the present invention includes a first hand, a second hand, a first arm to which the first hand is rotatably connected, and a second arm to which the second hand is rotatably connected. And a first arm rotation mechanism that rotates the first arm relative to the arm support portion, and a second arm rotation mechanism that rotates the second arm relative to the arm support portion. It becomes possible to operate 1 hand and 2nd hand separately. Therefore, in the present invention, for example, a substrate before a predetermined processing step can be mounted on the first hand, and a substrate after this processing step can be mounted on the second hand. It is possible to mount the substrate after this processing step on a hand different from the hand on which the substrate before the step is mounted.
- the configuration of the industrial robot can be simplified. As described above, according to the present invention, the configuration of the industrial robot is simplified even if the substrate after the processing step can be mounted on a hand different from the hand on which the substrate before the predetermined processing step is mounted. It becomes possible to become.
- the industrial robot preferably includes a horizontal movement mechanism that moves the column portion in the horizontal direction. If comprised in this way, it will become possible to convey a board
- the first hand part drive motor constituting the first hand part turning mechanism and the second hand part drive motor constituting the second hand part turning mechanism are arranged inside the first arm
- the third hand part drive motor constituting the third hand part turning mechanism and the fourth hand part drive motor constituting the fourth hand part turning mechanism are disposed inside the second arm.
- the first arm driving motor constituting the first arm turning mechanism and the second arm driving motor constituting the second arm turning mechanism are arranged inside the arm support portion.
- the substrate before the predetermined processing step is mounted on the first hand portion and the second hand portion of the first hand, and the processing step is performed on the first hand portion and the second hand portion of the second hand. It is preferable that a subsequent substrate is mounted.
- the processing step is, for example, a cleaning step for cleaning the substrate. In this case, since the substrate before the cleaning step is mounted on the first hand and the substrate after the cleaning step is mounted on the second hand, it is possible to prevent the substrate after cleaning from becoming dirty again. become.
- the industrial robot of the present invention can change the number of substrates that can be transferred simultaneously. Further, in the industrial robot of the present invention, even if it is possible to mount the substrate after this processing step on a hand different from the hand on which the substrate before the predetermined processing step is mounted, the configuration of the industrial robot Can be simplified.
- FIG. 5 is a plan view showing a state when the first hand shown in FIG. 4 conveys one semiconductor wafer.
- FIG. 1 is a plan view showing a state in which an industrial robot 1 according to an embodiment of the present invention is incorporated in a semiconductor manufacturing system 3.
- FIG. 2 is a side view of the industrial robot 1 shown in FIG.
- FIG. 3 is an enlarged view of a portion E in FIG.
- FIG. 4 is a view for explaining a connecting portion between the first hand 11 and the first arm 13 and a connecting portion between the first arm 13 and the arm support portion 15 shown in FIG. 2.
- FIG. 5 is an enlarged view of a portion F in FIG.
- FIG. 6 is a plan view of the first hand 11 and the first arm 13 shown in FIG.
- FIG. 7 is a plan view showing a state when the first hand 11 shown in FIG. 4 transports one semiconductor wafer 2.
- the industrial robot 1 (hereinafter referred to as “robot 1”) of this embodiment is a robot for transporting a semiconductor wafer 2 (hereinafter referred to as “wafer 2”) as a substrate.
- the robot 1 is used by being incorporated in a semiconductor manufacturing system 3, and transports a wafer 2 between a cassette 4 and a delivery stage 5.
- the cassette 4 a plurality of wafers 2 are stacked and accommodated at a predetermined pitch.
- a plurality of cassettes 4 can be attached to the manufacturing system 3.
- the delivery stage 5 accommodates a wafer 2 carried into a processing apparatus (not shown) in which a predetermined processing process is performed, or a wafer 2 carried out from the processing apparatus.
- a plurality of wafers 2 are stacked and accommodated at a predetermined pitch.
- one delivery stage 5 is provided in the manufacturing system 3, but two or more delivery stages 5 may be provided in the manufacturing system 3.
- the robot 1 includes two hands, a first hand 11 and a second hand 12 on which the wafer 2 is mounted, a first arm 13 to which the first hand 11 is rotatably connected to the tip end side thereof, and a second hand.
- the robot 1 also includes a horizontal movement mechanism 17 that moves the column part 16 in the horizontal direction.
- the first hand 11 is attached to the upper surface side of the first arm 13 and is disposed on the upper side of the first arm 13.
- the second hand 12 is attached to the lower surface side of the second arm 14 and is disposed below the second arm 14.
- the first arm 13 is attached to the upper surface side of the arm support portion 15 and is disposed on the upper side of the arm support portion 15.
- the second arm 14 is attached to the lower surface side of the arm support portion 15 and is disposed below the arm support portion 15.
- the first arm 13 and the second arm 14 are arranged such that the center of rotation of the first arm 13 relative to the arm support 15 matches the center of rotation of the second arm 14 relative to the arm support 15.
- the first hand 11 has a plurality of first hand portions 21 having one hand fork 20 as a substrate mounting portion on which a single wafer 2 is mounted, and a plurality of hands arranged so as to overlap vertically at a predetermined pitch. And a second hand portion 22 having a hand fork 20.
- the second hand unit 22 of this embodiment includes four hand forks 20.
- the 1st hand part 21 and the 2nd hand part 22 are connected with the tip side of the 1st arm 13 so that rotation is possible.
- the first hand 11 is disposed on the upper side of the first arm 13. That is, the first hand portion 21 and the second hand portion 22 of the first hand 11 are arranged on the upper side of the first arm 13.
- the hand fork 20 is formed in a substantially U shape.
- the first hand unit 21 includes a fork holding unit 23 to which one hand fork 20 is fixed.
- the second hand portion 22 includes a fork holding portion 24 to which the four hand forks 20 are fixed.
- the fork holding part 23 and the fork holding part 24 are formed so as to have the same shape when viewed from above and below.
- the first hand unit 21 and the second hand unit 22 are configured such that the rotation center of the first hand unit 21 with respect to the first arm 13 coincides with the rotation center of the second hand unit 22 with respect to the first arm 13. Has been placed. Further, the first hand unit 21 and the second hand unit 22 are arranged so as to overlap each other in the vertical direction. In the present embodiment, the first hand unit 21 is disposed below the second hand unit 22.
- the vertical pitch between the hand fork 20 arranged at the lowermost side of the second hand part 22 and the hand fork 20 of the first hand part 21 is the vertical direction of the four hand forks 20 of the second hand part 22. It is equal to the pitch.
- the first arm 13 is formed in a hollow shape. Inside the first arm 13, there is a motor 26 for rotating the first hand part 21 relative to the first arm 13 and a motor for rotating the second hand part 22 relative to the first arm 13. 27 are arranged. The motor 26 and the motor 27 are arranged so that the axial direction of the output shaft coincides with the vertical direction. A pulley 28 is fixed to the output shaft of the motor 26, and a pulley 29 is fixed to the output shaft of the motor 27. The pulley 28 is disposed above the pulley 29.
- the motor 26 of this embodiment is a first hand part drive motor, and the motor 27 is a second hand part drive motor.
- the upper end surface of the annular pulley holding member 30 is fixed to the lower surface on the base end side of the first hand portion 21 (that is, the lower surface on the base end side of the fork holding portion 23).
- a pulley 31 is fixed to the lower end surface of the pulley holding member 30.
- the pulley holding member 30 and the pulley 31 are rotatably held on the distal end side of the first arm 13.
- a belt 32 is stretched between the pulley 28 and the pulley 31.
- the upper end surface of the substantially cylindrical pulley holding member 33 is fixed to the lower surface on the proximal end side of the second hand portion 22 (that is, the lower surface on the proximal end side of the fork holding portion 24). Yes.
- the lower end side of the pulley holding member 33 is disposed on the inner peripheral side of the pulley holding member 30 and the pulley 31.
- a pulley 34 is fixed to the lower end surface of the pulley holding member 33.
- the pulley 34 is disposed below the pulley 31.
- the pulley holding member 33 and the pulley 34 are rotatably held by the pulley 31.
- a belt 35 is stretched between the pulley 29 and the pulley 34.
- the motor 26, the pulleys 28 and 31, the belt 32, the pulley holding member 30, and the like constitute a first hand portion rotating mechanism 36 that rotates the first hand portion 21 with respect to the first arm 13.
- the motor 27, the pulleys 29 and 34, the belt 35, the pulley holding member 33, and the like constitute a second hand portion rotating mechanism 37 that rotates the second hand portion 22 with respect to the first arm 13.
- the second hand 12 is configured by turning the components of the first hand 11 upside down. That is, the second hand 12 includes a first hand unit 21 and a second hand unit 22 disposed below the first hand unit 21.
- the first hand portion 21 and the second hand portion 22 of the second hand 12 are disposed below the second arm 14 and are rotatably connected to the distal end side of the second arm 14.
- the first hand portion 21 and the second hand portion 22 of the second hand 12 overlap each other in the vertical direction, and the center of rotation of the first hand portion 21 relative to the second arm 14 and the second arm 14 is arranged so that the rotation center of the second hand portion 22 with respect to 14 coincides.
- the second arm 14 is configured by inverting the components of the first arm 13 upside down.
- the robot 1 also includes a third hand rotating mechanism (not shown) that rotates the first hand 21 of the second hand 12 with respect to the second arm 14, and the second hand 22 of the second hand 12.
- a fourth hand rotating mechanism (not shown) that rotates the second arm 14 with respect to the second arm 14.
- the third hand part rotation mechanism is configured by turning the components of the first hand part rotation mechanism 36 upside down, and rotates the first hand part 21 of the second hand 12 relative to the second arm 14.
- a third hand drive motor is provided for movement.
- the fourth hand part rotation mechanism is configured by vertically inverting the components of the second hand part rotation mechanism 37, and the second hand part 22 of the second hand 12 with respect to the second arm 14. Is provided with a fourth hand portion drive motor.
- the third hand unit driving motor and the fourth hand unit driving motor are arranged inside the second arm 14 formed in a hollow shape.
- the arm support 15 is formed in a hollow shape.
- a first arm drive motor (not shown) for rotating the first arm 13 with respect to the arm support 15 is disposed inside the arm support 15.
- a pulley 41 is fixed to the lower surface on the proximal end side of the first arm 13 via a predetermined member.
- the pulley 41 is rotatably held by the arm support portion 15.
- a belt 42 is bridged between a pulley fixed to the output shaft of the first arm drive motor and the pulley 41.
- a first arm rotation mechanism that rotates the first arm 13 relative to the arm support portion 15 is configured by the first arm drive motor, the pulley 41, the belt 42, and the like.
- the robot 1 also includes a second arm rotation mechanism (not shown) that rotates the second arm 14 with respect to the arm support portion 15.
- the second arm rotation mechanism is configured by vertically inverting components of the first arm rotation mechanism, and a second arm drive motor for rotating the second arm 14 with respect to the arm support portion 15. It has.
- the 2nd arm drive motor is arrange
- the column portion 16 is formed in a column shape elongated in the vertical direction.
- the column part 16 is formed with a guide part (not shown) for guiding the arm support part 15 in the vertical direction.
- the robot 1 also includes a vertical drive mechanism (not shown) that moves the arm support 15 up and down along the pillars 16.
- the arm support 15 is movable in the vertical direction.
- the horizontal movement mechanism 17 includes a fixing member (not shown) to which the lower end side of the column part 16 is fixed, a guide part (not shown) for guiding the fixing member in the horizontal direction, and a drive mechanism for moving the fixing member in the horizontal direction. (Not shown). As shown in FIG. 1, the horizontal movement mechanism 17 moves the column part 16 in the arrangement direction of the plurality of cassettes 4 arranged in a predetermined direction.
- the first hand 11 is obtained by a combination of the rotation of the first hand 11, the rotation of the first arm 13, the vertical movement of the arm support portion 15, and the horizontal movement of the column portion 16. Transports the wafer 2 between the cassette 4 and the delivery stage 5. Further, the combination of the rotation of the second hand 12, the rotation of the second arm 14, the vertical movement of the arm support portion 15, and the horizontal movement of the column portion 16 allows the second hand 12 to move between the cassette 4 and the delivery stage 5. The wafer 2 is transferred between them.
- the first hand 11 and the second hand 12 can simultaneously convey the five wafers 2 and can convey only one wafer 2.
- the hand fork 20 of the first hand unit 21 and the four hand forks 20 of the second hand unit 22 overlap in the vertical direction.
- the robot 1 operates in the arranged state. Then, five wafers 2 are transferred by one hand fork 20 of the first hand unit 21 and four hand forks 20 of the second hand unit 22.
- the hand fork 20 of the first hand unit 21 and the four hand forks 20 of the second hand unit 22 are shifted as shown in FIG.
- the robot 1 operates. Then, only one wafer 2 is transferred by one hand fork 20 of the first hand unit 21.
- the wafer 2 before the predetermined processing step is transferred by the first hand 11, and the wafer 2 after the processing step is transferred by the second hand 12. That is, the first hand unit 21 and the second hand unit 22 of the first hand 11 are loaded with the wafer 2 before a predetermined processing step, and the first hand unit 21 and the second hand unit 22 of the second hand 12 are mounted. The wafer 2 after this processing step is mounted. Specifically, the first hand unit 21 and the second hand unit 22 of the first hand 11 are loaded with the wafer 2 before the cleaning process, and the first hand unit 21 and the second hand unit of the second hand 12 are mounted. A wafer 2 after the cleaning process is mounted on 22.
- the first hand unit 21 and the second hand unit 22 of the second hand 12 are loaded with the wafer 2 before a predetermined processing step, and the first hand unit 21 and the second hand unit 22 of the first hand 11 are loaded.
- the wafer 2 after this processing step may be mounted. That is, the wafer 2 before the cleaning process is mounted on the first hand unit 21 and the second hand unit 22 of the second hand 12, and the first hand unit 21 and the second hand unit 22 of the first hand 11 are cleaned.
- the wafer 2 after the process may be mounted.
- the delivery stage 5 defines a portion where the wafer 2 before the processing step is mounted and a portion where the wafer 2 after the processing step is mounted.
- the first hand 11 includes the first hand portion 21 having one hand fork 20 and the second hand portion 22 having four hand forks 20, The 1st hand part 21 and the 2nd hand part 22 are connected with the 1st arm 13 so that rotation is possible.
- the first hand portion 21 and the second hand portion 22 of the first hand 11 overlap with each other in the vertical direction, and the rotation center of the first hand portion 21 with respect to the first arm 13 The center of rotation of the second hand portion 22 with respect to the first arm 13 is arranged to coincide.
- the robot 1 includes a first hand part rotation mechanism 36 that rotates the first hand part 21 of the first hand 11 with respect to the first arm 13, and the second hand part 22 of the first hand 11. And a second hand rotating mechanism 37 that rotates the first arm 13 with respect to the first arm 13.
- the second hand 12 includes a first hand unit 21 and a second hand unit 22, and the first hand unit 21 and the second hand unit 22 rotate around the second arm 14. Connected as possible.
- the first hand portion 21 and the second hand portion 22 of the second hand 12 overlap with each other in the vertical direction, and the rotation center of the first hand portion 21 with respect to the second arm 14 The center of rotation of the second hand portion 22 with respect to the second arm 14 is arranged to coincide.
- the robot 1 of the present embodiment includes a third hand rotating mechanism that rotates the first hand portion 21 of the second hand 12 with respect to the second arm 14 and a second hand portion 22 of the second hand 12. And a fourth hand rotating mechanism that rotates with respect to the second arm.
- the robot 1 includes a first hand 11, a second hand 12, a first arm 13 to which the first hand 11 is rotatably connected, and a second hand 12 that is rotatably connected.
- Second arm 14 first arm rotation mechanism for rotating first arm 13 relative to arm support portion 15, and second arm rotation mechanism for rotating second arm 14 relative to arm support portion 15 And. Therefore, in this embodiment, the first hand 11 and the second hand 12 can be operated individually. Therefore, in this embodiment, as described above, the wafer 2 before a predetermined processing step is mounted on the first hand unit 21 and the second hand unit 22 of the first hand 11 and the first hand of the second hand 12 is loaded. The wafer 2 after this processing step can be mounted on the part 21 and the second hand part 22.
- the wafer 2 before the cleaning process is mounted on the first hand unit 21 and the second hand unit 22 of the first hand 11, and the first hand unit 21 and the second hand unit 22 of the second hand 12 are cleaned.
- the wafer 2 after the process can be mounted. As a result, in this embodiment, it becomes possible to prevent the cleaned wafer 2 from becoming dirty again.
- the robot 1 since the first arm 13 and the second arm 14 are attached to the common arm support portion 15, the arm support portion to which the proximal end side of the first arm 13 is rotatably connected,
- the configuration of the robot 1 can be simplified as compared with a case in which an arm support portion to which the base end side of the two arms 14 is rotatably connected is provided individually. That is, in this embodiment, even if it is possible to mount the wafer 2 after this processing step on the second hand 12 different from the first hand 11 on which the wafer 2 before the predetermined processing step is mounted, the robot 1 can be simplified.
- the wafer 2 before the cleaning process is mounted on the first hand unit 21 and the second hand unit 22 of the first hand 11, and the first hand unit 21 and the second hand unit 22 of the second hand 12 are mounted.
- the wafer 2 after the cleaning process is mounted.
- the low-temperature wafer 2 before the heat treatment step is mounted on the first hand unit 21 and the second hand unit 22 of the first hand 11, and the first hand unit 21 and the second hand unit 12 of the second hand 12 are mounted.
- the wafer 2 having a high temperature after the heat treatment process may be mounted on the two-hand unit 22.
- the first hand portion 21 and the second hand portion 22 of the second hand 12 must be formed of a heat resistant material, but the first hand portion 21 and the second hand portion 22 of the first hand 11 are heat resistant. It is not necessary to form with material. Therefore, the cost of the robot 1 can be reduced.
- the robot 1 is operated in a state where one hand fork 20 of the first hand unit 21 and four hand forks 20 of the second hand unit 22 are displaced, and the first hand unit 21 Only one wafer 2 is transferred by one hand fork 20.
- the robot 1 is operated in a state where one hand fork 20 of the first hand unit 21 and four hand forks 20 of the second hand unit 22 are displaced, and the second hand unit 22 is operated.
- the four wafers 2 may be transferred by the four hand forks 20.
- the second hand unit 22 includes four hand forks 20.
- the number of hand forks 20 included in the second hand unit 22 may be two or three, or may be five or more.
- the 1st arm 13 and the 2nd arm 14 may be provided with the joint part. That is, the 1st arm 13 and the 2nd arm 14 may be constituted by a plurality of arm parts connected via a joint part.
- the arm support portion 15 may be rotatable with respect to the column portion 16 with the vertical direction as the axial direction of rotation.
- the substrate transferred by the robot 1 is the wafer 2, but the substrate transferred by the robot 1 may be a glass substrate for a liquid crystal display.
Abstract
Description
図1は、本発明の実施の形態にかかる産業用ロボット1が半導体の製造システム3に組み込まれた状態を示す平面図である。図2は、図1に示す産業用ロボット1の側面図である。図3は、図1のE部の拡大図である。図4は、図2に示す第1ハンド11と第1アーム13との連結部分および第1アーム13とアーム支持部15との連結部分を説明するための図である。図5は、図4のF部の拡大図である。図6は、図4に示す第1ハンド11および第1アーム13の平面図である。図7は、図4に示す第1ハンド11が1枚の半導体ウエハ2を搬送するときの状態を示す平面図である。
以上説明したように、本形態では、第1ハンド11は、1個のハンドフォーク20を有する第1ハンド部21と、4個のハンドフォーク20を有する第2ハンド部22とを備えており、第1ハンド部21および第2ハンド部22は、第1アーム13に回動可能に連結されている。また、本形態では、第1ハンド11の第1ハンド部21と第2ハンド部22とは、互いに上下方向で重なるように、かつ、第1アーム13に対する第1ハンド部21の回動中心と、第1アーム13に対する第2ハンド部22の回動中心とが一致するように配置されている。さらに、本形態のロボット1は、第1ハンド11の第1ハンド部21を第1アーム13に対して回動させる第1ハンド部回動機構36と、第1ハンド11の第2ハンド部22を第1アーム13に対して回動させる第2ハンド部回動機構37とを備えている。
上述した形態は、本発明の好適な形態の一例ではあるが、これに限定されるものではなく本発明の要旨を変更しない範囲において種々変形実施が可能である。
2 ウエハ(半導体ウエハ、基板)
11 第1ハンド
12 第2ハンド
13 第1アーム
14 第2アーム
15 アーム支持部
16 柱部
17 水平移動機構
20 ハンドフォーク(基板搭載部)
21 第1ハンド部
22 第2ハンド部
26 モータ(第1ハンド部駆動モータ)
27 モータ(第2ハンド部駆動モータ)
36 第1ハンド部回動機構
37 第2ハンド部回動機構
Claims (10)
- 1枚の基板が搭載される基板搭載部を1個有する第1ハンド部と所定のピッチで上下方向に重なるように配置される複数個の前記基板搭載部を有する第2ハンド部とを具備する第1ハンドおよび第2ハンドと、前記第1ハンドの前記第1ハンド部および前記第2ハンド部がその先端側に回動可能に連結される第1アームと、前記第2ハンドの前記第1ハンド部および前記第2ハンド部がその先端側に回動可能に連結される第2アームと、前記第1アームの基端側および前記第2アームの基端側が回動可能に連結されるアーム支持部と、前記アーム支持部を上下方向へ移動可能に保持する柱部と、前記第1ハンドの前記第1ハンド部を前記第1アームに対して回動させる第1ハンド部回動機構と、前記第1ハンドの前記第2ハンド部を前記第1アームに対して回動させる第2ハンド部回動機構と、前記第2ハンドの前記第1ハンド部を前記第2アームに対して回動させる第3ハンド部回動機構と、前記第2ハンドの前記第2ハンド部を前記第2アームに対して回動させる第4ハンド部回動機構と、前記第1アームを前記アーム支持部に対して回動させる第1アーム回動機構と、前記第2アームを前記アーム支持部に対して回動させる第2アーム回動機構とを備え、
前記第1ハンドの前記第1ハンド部と前記第2ハンド部とは、互いに上下方向で重なるように、かつ、前記第1ハンドの前記第1ハンド部の回動中心と前記第1ハンドの前記第2ハンド部の回動中心とが一致するように配置され、
前記第2ハンドの前記第1ハンド部と前記第2ハンド部とは、互いに上下方向で重なるように、かつ、前記第2ハンドの前記第1ハンド部の回動中心と前記第2ハンドの前記第2ハンド部の回動中心とが一致するように配置され、
前記第1アームは、前記アーム支持部の上面側に取り付けられ、
前記第2アームは、前記アーム支持部の下面側に取り付けられ、
前記第1アームおよび前記第2アームは、前記第1アームの回動中心と前記第2アームの回動中心とが一致するように配置されていることを特徴とする産業用ロボット。 - 前記柱部を水平方向へ移動させる水平移動機構を備えることを特徴とする請求項1記載の産業用ロボット。
- 前記第1ハンド部回動機構を構成する第1ハンド部駆動モータおよび前記第2ハンド部回動機構を構成する第2ハンド部駆動モータは、前記第1アームの内部に配置され、
前記第3ハンド部回動機構を構成する第3ハンド部駆動モータおよび前記第4ハンド部回動機構を構成する第4ハンド部駆動モータは、前記第2アームの内部に配置されていることを特徴とする請求項1記載の産業用ロボット。 - 前記第1ハンド部回動機構を構成する第1ハンド部駆動モータおよび前記第2ハンド部回動機構を構成する第2ハンド部駆動モータは、前記第1アームの内部に配置され、
前記第3ハンド部回動機構を構成する第3ハンド部駆動モータおよび前記第4ハンド部回動機構を構成する第4ハンド部駆動モータは、前記第2アームの内部に配置されていることを特徴とする請求項2記載の産業用ロボット。 - 前記第1アーム回動機構を構成する第1アーム駆動モータおよび前記第2アーム回動機構を構成する第2アーム駆動モータは、前記アーム支持部の内部に配置されていることを特徴とする請求項1記載の産業用ロボット。
- 前記第1アーム回動機構を構成する第1アーム駆動モータおよび前記第2アーム回動機構を構成する第2アーム駆動モータは、前記アーム支持部の内部に配置されていることを特徴とする請求項2記載の産業用ロボット。
- 前記第1アーム回動機構を構成する第1アーム駆動モータおよび前記第2アーム回動機構を構成する第2アーム駆動モータは、前記アーム支持部の内部に配置されていることを特徴とする請求項3記載の産業用ロボット。
- 前記第1アーム回動機構を構成する第1アーム駆動モータおよび前記第2アーム回動機構を構成する第2アーム駆動モータは、前記アーム支持部の内部に配置されていることを特徴とする請求項4記載の産業用ロボット。
- 前記第1ハンドの前記第1ハンド部および前記第2ハンド部には、所定の処理工程の前の前記基板が搭載され、
前記第2ハンドの前記第1ハンド部および前記第2ハンド部には、前記処理工程の後の前記基板が搭載されることを特徴とする請求項1から8のいずれかに記載の産業用ロボット。 - 前記処理工程は、前記基板を洗浄する洗浄工程であることを特徴とする請求項9記載の産業用ロボット。
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