|
US6941649B2
(en)
*
|
2002-02-05 |
2005-09-13 |
Force10 Networks, Inc. |
Method of fabricating a high-layer-count backplane
|
|
US6700181B1
(en)
*
|
2002-11-19 |
2004-03-02 |
Inphi Corporation |
Method and system for broadband transition from IC package to motherboard
|
|
KR100499004B1
(ko)
*
|
2002-12-18 |
2005-07-01 |
삼성전기주식회사 |
광비아홀을 구비하는 인쇄회로기판 및 가공 공정
|
|
US7038917B2
(en)
*
|
2002-12-27 |
2006-05-02 |
Vlt, Inc. |
Low loss, high density array interconnection
|
|
JP4059085B2
(ja)
*
|
2003-01-14 |
2008-03-12 |
松下電器産業株式会社 |
高周波積層部品およびその製造方法
|
|
JP4349827B2
(ja)
*
|
2003-01-15 |
2009-10-21 |
京セラ株式会社 |
配線基板
|
|
US7047628B2
(en)
*
|
2003-01-31 |
2006-05-23 |
Brocade Communications Systems, Inc. |
Impedance matching of differential pair signal traces on printed wiring boards
|
|
US20050009415A1
(en)
*
|
2003-02-27 |
2005-01-13 |
Johnson Morgan T. |
Cable and connector assemblies and methods of making same
|
|
US7242592B2
(en)
*
|
2003-06-24 |
2007-07-10 |
Amphenol Corporation |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics
|
|
US7217889B1
(en)
*
|
2003-12-04 |
2007-05-15 |
Cisco Technology, Inc. |
System and method for reducing crosstalk between vias in a printed circuit board
|
|
US7448909B2
(en)
*
|
2004-02-13 |
2008-11-11 |
Molex Incorporated |
Preferential via exit structures with triad configuration for printed circuit boards
|
|
KR100651414B1
(ko)
|
2004-02-13 |
2006-11-29 |
삼성전기주식회사 |
동축 비아홀을 구비한 인쇄회로기판
|
|
US20050201065A1
(en)
*
|
2004-02-13 |
2005-09-15 |
Regnier Kent E. |
Preferential ground and via exit structures for printed circuit boards
|
|
EP1841298A3
(en)
*
|
2004-02-13 |
2008-05-07 |
Molex Incorporated |
Plated vias exit structure for printed circuit board
|
|
US7470864B2
(en)
*
|
2004-03-02 |
2008-12-30 |
Via Technologies, Inc. |
Multi-conducting through hole structure
|
|
JP4430976B2
(ja)
|
2004-05-10 |
2010-03-10 |
富士通株式会社 |
配線基板及びその製造方法
|
|
TWI249978B
(en)
*
|
2004-05-11 |
2006-02-21 |
Via Tech Inc |
Circuit substrate and manufacturing method of plated through slot thereof
|
|
US7382629B2
(en)
*
|
2004-05-11 |
2008-06-03 |
Via Technologies, Inc. |
Circuit substrate and method of manufacturing plated through slot thereon
|
|
US7129567B2
(en)
*
|
2004-08-31 |
2006-10-31 |
Micron Technology, Inc. |
Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
|
|
SG135065A1
(en)
|
2006-02-20 |
2007-09-28 |
Micron Technology Inc |
Conductive vias having two or more elements for providing communication between traces in different substrate planes, semiconductor device assemblies including such vias, and accompanying methods
|
|
US7388158B2
(en)
*
|
2004-09-17 |
2008-06-17 |
Terdyne, Inc. |
Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
|
|
EP1810552A1
(en)
*
|
2004-10-29 |
2007-07-25 |
Molex Incorporated |
Printed circuit board for high-speed electrical connectors
|
|
TWI264257B
(en)
*
|
2004-11-24 |
2006-10-11 |
Via Tech Inc |
Signal transmission structure and circuit substrate thereof
|
|
US20060151869A1
(en)
*
|
2005-01-10 |
2006-07-13 |
Franz Gisin |
Printed circuit boards and the like with improved signal integrity for differential signal pairs
|
|
US20060185890A1
(en)
*
|
2005-02-22 |
2006-08-24 |
Litton Uk Limited |
Air void via tuning
|
|
EP1851833B1
(en)
*
|
2005-02-22 |
2012-09-12 |
Molex Incorporated |
Differential signal connector with wafer-style construction
|
|
US20060237227A1
(en)
*
|
2005-04-26 |
2006-10-26 |
Shiyou Zhao |
Circuit board via structure for high speed signaling
|
|
CN100531511C
(zh)
*
|
2005-05-28 |
2009-08-19 |
鸿富锦精密工业（深圳）有限公司 |
具有改良差分过孔的印刷电路板
|
|
US7271681B2
(en)
*
|
2005-07-08 |
2007-09-18 |
International Business Machines Corporation |
Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boards
|
|
JP2007059803A
(ja)
*
|
2005-08-26 |
2007-03-08 |
Fuji Xerox Co Ltd |
プリント基板、電子基板及び電子機器
|
|
CN101292393B
(zh)
*
|
2005-10-18 |
2013-04-17 |
日本电气株式会社 |
垂直信号路径、印刷电路板、半导体封装以及半导体芯片
|
|
US20070230150A1
(en)
*
|
2005-11-29 |
2007-10-04 |
International Business Machines Corporation |
Power supply structure for high power circuit packages
|
|
JP4835188B2
(ja)
*
|
2006-02-16 |
2011-12-14 |
日本電気株式会社 |
多層プリント基板
|
|
JP4830539B2
(ja)
*
|
2006-02-28 |
2011-12-07 |
日本電気株式会社 |
多層プリント回路基板
|
|
CN200969706Y
(zh)
*
|
2006-07-28 |
2007-10-31 |
鸿富锦精密工业（深圳）有限公司 |
设有过孔的印刷电路板
|
|
US20080067665A1
(en)
*
|
2006-09-20 |
2008-03-20 |
Azniza Binti Abd Aziz |
Via structure
|
|
US7450396B2
(en)
*
|
2006-09-28 |
2008-11-11 |
Intel Corporation |
Skew compensation by changing ground parasitic for traces
|
|
CN101282614A
(zh)
*
|
2007-04-04 |
2008-10-08 |
鸿富锦精密工业（深圳）有限公司 |
具有改良过孔的印刷电路板
|
|
CN101420818B
(zh)
*
|
2007-10-25 |
2011-03-30 |
鸿富锦精密工业（深圳）有限公司 |
差分布线架构
|
|
US20090201654A1
(en)
*
|
2008-02-08 |
2009-08-13 |
Lambert Simonovich |
Method and system for improving electrical performance of vias for high data rate transmission
|
|
KR20090096174A
(ko)
*
|
2008-03-07 |
2009-09-10 |
주식회사 하이닉스반도체 |
회로 기판 및 이를 이용한 반도체 패키지
|
|
JP5201206B2
(ja)
*
|
2008-03-28 |
2013-06-05 |
日本電気株式会社 |
多層プリント配線基板
|
|
TWI405314B
(zh)
*
|
2008-05-16 |
2013-08-11 |
矽品精密工業股份有限公司 |
具有無墊式導電跡線之封裝用基板
|
|
JP5168361B2
(ja)
*
|
2008-05-26 |
2013-03-21 |
日本電気株式会社 |
多層基板
|
|
JP2010027654A
(ja)
|
2008-07-15 |
2010-02-04 |
Nec Corp |
配線基板、配線基板のビア形成方法、及び配線基板の製造方法
|
|
KR101031134B1
(ko)
*
|
2008-09-11 |
2011-04-27 |
주식회사 동부하이텍 |
반도체 소자의 컨택 및 그 제조 방법
|
|
KR20100037387A
(ko)
*
|
2008-10-01 |
2010-04-09 |
삼성전자주식회사 |
메모리 모듈 및 회로 기판의 토폴로지
|
|
TWI393490B
(zh)
*
|
2008-12-31 |
2013-04-11 |
Ind Tech Res Inst |
多組同軸導線於基材之單一通孔中之結構與其製作方法
|
|
CN101877935B
(zh)
*
|
2009-04-29 |
2012-06-20 |
鸿富锦精密工业（深圳）有限公司 |
主板布局布线方法及利用该方法布局布线的主板
|
|
JP2011034317A
(ja)
*
|
2009-07-31 |
2011-02-17 |
Toshiba Corp |
ストレージ装置
|
|
WO2011018938A1
(ja)
*
|
2009-08-12 |
2011-02-17 |
日本電気株式会社 |
多層プリント配線板
|
|
JP4982596B2
(ja)
*
|
2009-09-08 |
2012-07-25 |
株式会社東芝 |
モジュールの接続構造
|
|
CN102065631B
(zh)
*
|
2009-11-13 |
2014-06-25 |
鸿富锦精密工业（深圳）有限公司 |
具有高速差分信号布线结构的印刷电路板
|
|
US8227708B2
(en)
*
|
2009-12-14 |
2012-07-24 |
Qualcomm Incorporated |
Via structure integrated in electronic substrate
|
|
JP5393596B2
(ja)
|
2010-05-31 |
2014-01-22 |
キヤノン株式会社 |
インクジェット記録装置
|
|
US9831540B2
(en)
*
|
2010-09-30 |
2017-11-28 |
Aviat U.S., Inc. |
Systems and methods for improved chip device performance
|
|
TW201223347A
(en)
*
|
2010-11-23 |
2012-06-01 |
Hon Hai Prec Ind Co Ltd |
Printed circuit board with compound-via
|
|
TWI479956B
(zh)
*
|
2010-12-09 |
2015-04-01 |
Hon Hai Prec Ind Co Ltd |
具有高速差分訊號佈線結構的印刷電路板
|
|
CN102573270B
(zh)
*
|
2010-12-10 |
2016-08-03 |
国网山东省电力公司烟台供电公司 |
具有高速差分信号布线结构的印刷电路板
|
|
US9159625B1
(en)
*
|
2011-01-27 |
2015-10-13 |
Amkor Technology, Inc. |
Semiconductor device
|
|
US8654541B2
(en)
*
|
2011-03-24 |
2014-02-18 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Three-dimensional power electronics packages
|
|
CN102711362A
(zh)
*
|
2011-03-28 |
2012-10-03 |
鸿富锦精密工业（深圳）有限公司 |
印刷电路板
|
|
US8541884B2
(en)
*
|
2011-07-06 |
2013-09-24 |
Research Triangle Institute |
Through-substrate via having a strip-shaped through-hole signal conductor
|
|
US20130021739A1
(en)
*
|
2011-07-20 |
2013-01-24 |
International Business Machines Corporation |
Multi-layer Printed Circuit Board With Power Plane Islands To Isolate Noise Coupling
|
|
CN102933022B
(zh)
*
|
2011-08-11 |
2017-04-05 |
诚亿电子（嘉兴）有限公司 |
具有高速差分信号布线结构的印刷电路板
|
|
US9035197B2
(en)
|
2011-11-04 |
2015-05-19 |
International Business Machines Corporation |
Circuit boards with vias exhibiting reduced via capacitance
|
|
US8918991B2
(en)
*
|
2011-11-04 |
2014-12-30 |
Lenovo Enterprise Solutions (Singapore) Pte. Ltd. |
Process for providing electrical connections with reduced via capacitance on circuit boards
|
|
KR101252999B1
(ko)
|
2011-12-01 |
2013-04-09 |
삼성전기주식회사 |
기생 커패시턴스가 감소된 내층 비아 구조를 구비하는 다층 인쇄 회로 기판
|
|
US9013891B2
(en)
*
|
2012-03-09 |
2015-04-21 |
Finisar Corporation |
3-D integrated package
|
|
US9185793B2
(en)
*
|
2012-05-30 |
2015-11-10 |
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. |
Multilayer electronic structure with through thickness coaxial structures
|
|
JP5655818B2
(ja)
*
|
2012-06-12 |
2015-01-21 |
株式会社村田製作所 |
チップ部品構造体
|
|
US9565750B2
(en)
|
2012-08-18 |
2017-02-07 |
Kyocera Corporation |
Wiring board for mounting a semiconductor element
|
|
JP5981265B2
(ja)
*
|
2012-08-18 |
2016-08-31 |
京セラ株式会社 |
配線基板
|
|
JP5758548B2
(ja)
*
|
2012-09-07 |
2015-08-05 |
株式会社フジクラ |
配線基板
|
|
US9480141B1
(en)
*
|
2012-09-20 |
2016-10-25 |
Junis Hamadeh |
Heat sink device or heat sink assembly
|
|
CN103050474A
(zh)
*
|
2012-12-05 |
2013-04-17 |
日月光半导体制造股份有限公司 |
具耦合线路的封装基板构造
|
|
US9860985B1
(en)
*
|
2012-12-17 |
2018-01-02 |
Lockheed Martin Corporation |
System and method for improving isolation in high-density laminated printed circuit boards
|
|
US8957325B2
(en)
|
2013-01-15 |
2015-02-17 |
Fujitsu Limited |
Optimized via cutouts with ground references
|
|
CN103179782B
(zh)
*
|
2013-02-21 |
2016-04-13 |
广州兴森快捷电路科技有限公司 |
阻抗受控、低损耗的单端过孔结构
|
|
TWI484876B
(zh)
|
2013-12-20 |
2015-05-11 |
Ind Tech Res Inst |
具傳輸孔之電路板及其製造方法
|
|
US9801275B2
(en)
|
2014-02-17 |
2017-10-24 |
Lg Innotek Co., Ltd. |
Printed circuit board and method of manufacturing the same
|
|
JP6190345B2
(ja)
*
|
2014-09-22 |
2017-08-30 |
株式会社フジクラ |
プリント配線板
|
|
US9807869B2
(en)
|
2014-11-21 |
2017-10-31 |
Amphenol Corporation |
Mating backplane for high speed, high density electrical connector
|
|
US9571059B2
(en)
*
|
2015-03-28 |
2017-02-14 |
Intel Corporation |
Parallel via to improve the impedance match for embedded common mode filter design
|
|
JP2017011093A
(ja)
*
|
2015-06-22 |
2017-01-12 |
イビデン株式会社 |
プリント配線板
|
|
US10249924B2
(en)
|
2015-06-26 |
2019-04-02 |
Intel Corporation |
Compact via structures and method of making same
|
|
TWI576026B
(zh)
*
|
2015-07-17 |
2017-03-21 |
財團法人工業技術研究院 |
電路結構
|
|
CN105578714A
(zh)
*
|
2015-12-11 |
2016-05-11 |
广东顺德中山大学卡内基梅隆大学国际联合研究院 |
一种多层高速pcb的新型叠层结构及信号过孔优化方法
|
|
US9807867B2
(en)
*
|
2016-02-04 |
2017-10-31 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Interconnect structure and method of manufacturing the same
|
|
CN109076700B
(zh)
|
2016-03-08 |
2021-07-30 |
安费诺公司 |
用于高速、高密度电连接器的背板占板区
|
|
US10201074B2
(en)
|
2016-03-08 |
2019-02-05 |
Amphenol Corporation |
Backplane footprint for high speed, high density electrical connectors
|
|
US10405418B2
(en)
*
|
2016-12-21 |
2019-09-03 |
Industrial Technology Research Institute |
Differential signal transmitting circuit board
|
|
US10091873B1
(en)
*
|
2017-06-22 |
2018-10-02 |
Innovium, Inc. |
Printed circuit board and integrated circuit package
|
|
CN107318221A
(zh)
*
|
2017-08-25 |
2017-11-03 |
郑州云海信息技术有限公司 |
一种过孔及其制造方法和印制电路板
|
|
US11229115B2
(en)
*
|
2017-12-13 |
2022-01-18 |
Hitachi, Ltd. |
Wiring board and electronic device
|
|
US10477672B2
(en)
*
|
2018-01-29 |
2019-11-12 |
Hewlett Packard Enterprise Development Lp |
Single ended vias with shared voids
|
|
WO2019241107A1
(en)
|
2018-06-11 |
2019-12-19 |
Amphenol Corporation |
Backplane footprint for high speed, high density electrical connectors
|
|
TWI855075B
(zh)
|
2019-05-20 |
2024-09-11 |
美商安芬諾股份有限公司 |
連接器模組、連接器、電子組件、電連接器以及連接器模組的薄片
|
|
US10856408B1
(en)
*
|
2019-07-03 |
2020-12-01 |
City University Of Hong Kong |
Substrate-integrated device and method for making the same
|
|
CN120566112A
(zh)
|
2020-01-27 |
2025-08-29 |
安费诺有限公司 |
具有高速安装接口的电连接器
|
|
US11637389B2
(en)
|
2020-01-27 |
2023-04-25 |
Amphenol Corporation |
Electrical connector with high speed mounting interface
|
|
CN113573460A
(zh)
*
|
2020-04-29 |
2021-10-29 |
南宁富桂精密工业有限公司 |
差分过孔结构
|
|
WO2022052121A1
(en)
*
|
2020-09-14 |
2022-03-17 |
Hongfujin Precision Industry (Wuhan) Co., Ltd. |
Circuit board having complementary signal conducting patterns
|
|
US11324119B1
(en)
*
|
2020-10-23 |
2022-05-03 |
Achronix Semiconductor Corporation |
Capacitive compensation for vertical interconnect accesses
|
|
USD1068685S1
(en)
|
2021-12-14 |
2025-04-01 |
Amphenol Corporation |
Electrical connector
|
|
USD1067191S1
(en)
|
2021-12-14 |
2025-03-18 |
Amphenol Corporation |
Electrical connector
|
|
US20230343687A1
(en)
*
|
2022-04-25 |
2023-10-26 |
Chipletz, Inc. |
Through Package Vertical Interconnect and Method of Making Same
|
|
US20240006289A1
(en)
*
|
2022-06-29 |
2024-01-04 |
Intel Corporation |
Low insertion loss coaxial through-hole for highspeed input-ouput
|
|
WO2024159345A1
(en)
*
|
2023-01-30 |
2024-08-08 |
Google Llc |
Printed circuit board (pcb) miniaturization by an embedded via-in-via design
|
|
WO2025070312A1
(ja)
*
|
2023-09-28 |
2025-04-03 |
京セラ株式会社 |
配線基板およびそれを用いた実装構造体
|