JP2002353588A - 配線基板及び配線基板の製造方法 - Google Patents

配線基板及び配線基板の製造方法

Info

Publication number
JP2002353588A
JP2002353588A JP2001160417A JP2001160417A JP2002353588A JP 2002353588 A JP2002353588 A JP 2002353588A JP 2001160417 A JP2001160417 A JP 2001160417A JP 2001160417 A JP2001160417 A JP 2001160417A JP 2002353588 A JP2002353588 A JP 2002353588A
Authority
JP
Japan
Prior art keywords
hole
insulator
pair
holes
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001160417A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002353588A5 (https=
Inventor
Yoshiaki Uematsu
吉晃 植松
Shinji Manabe
晋司 真鍋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2001160417A priority Critical patent/JP2002353588A/ja
Priority to US09/986,282 priority patent/US6787710B2/en
Publication of JP2002353588A publication Critical patent/JP2002353588A/ja
Publication of JP2002353588A5 publication Critical patent/JP2002353588A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09636—Details of adjacent, not connected vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2001160417A 2001-05-29 2001-05-29 配線基板及び配線基板の製造方法 Pending JP2002353588A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001160417A JP2002353588A (ja) 2001-05-29 2001-05-29 配線基板及び配線基板の製造方法
US09/986,282 US6787710B2 (en) 2001-05-29 2001-11-08 Wiring board and a method for manufacturing the wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001160417A JP2002353588A (ja) 2001-05-29 2001-05-29 配線基板及び配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2002353588A true JP2002353588A (ja) 2002-12-06
JP2002353588A5 JP2002353588A5 (https=) 2005-06-16

Family

ID=19003838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001160417A Pending JP2002353588A (ja) 2001-05-29 2001-05-29 配線基板及び配線基板の製造方法

Country Status (2)

Country Link
US (1) US6787710B2 (https=)
JP (1) JP2002353588A (https=)

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JP2007220849A (ja) * 2006-02-16 2007-08-30 Nec Corp 多層プリント基板
JP2007234715A (ja) * 2006-02-28 2007-09-13 Nec Corp 多層プリント回路基板
US7317166B2 (en) 2004-05-10 2008-01-08 Fujitsu Limited Wiring base board, method of producing thereof, and electronic device
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WO2011018938A1 (ja) * 2009-08-12 2011-02-17 日本電気株式会社 多層プリント配線板
JP2011521439A (ja) * 2008-05-26 2011-07-21 日本電気株式会社 多層基板
JP2011251415A (ja) * 2010-05-31 2011-12-15 Canon Inc インクジェット記録ヘッド、および該インクジェット記録ヘッドを備えたインクジェット記録装置
KR101252999B1 (ko) 2011-12-01 2013-04-09 삼성전기주식회사 기생 커패시턴스가 감소된 내층 비아 구조를 구비하는 다층 인쇄 회로 기판
JP2013513976A (ja) * 2009-12-14 2013-04-22 クアルコム，インコーポレイテッド 電子基板に組み込まれたビア構造
JP2014038972A (ja) * 2012-08-18 2014-02-27 Kyocer Slc Technologies Corp 配線基板
US9565750B2 (en) 2012-08-18 2017-02-07 Kyocera Corporation Wiring board for mounting a semiconductor element
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US7317166B2 (en) 2004-05-10 2008-01-08 Fujitsu Limited Wiring base board, method of producing thereof, and electronic device
US7549222B2 (en) 2004-05-10 2009-06-23 Fujitsu Limited Method of producing wiring board
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JP2011521439A (ja) * 2008-05-26 2011-07-21 日本電気株式会社 多層基板
US8604357B2 (en) 2008-07-15 2013-12-10 Nec Corporation Wiring board having via and method forming a via in a wiring board
JP2010027654A (ja) * 2008-07-15 2010-02-04 Nec Corp 配線基板、配線基板のビア形成方法、及び配線基板の製造方法
WO2011018938A1 (ja) * 2009-08-12 2011-02-17 日本電気株式会社 多層プリント配線板
JP2013513976A (ja) * 2009-12-14 2013-04-22 クアルコム，インコーポレイテッド 電子基板に組み込まれたビア構造
JP2011251415A (ja) * 2010-05-31 2011-12-15 Canon Inc インクジェット記録ヘッド、および該インクジェット記録ヘッドを備えたインクジェット記録装置
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JP2014038972A (ja) * 2012-08-18 2014-02-27 Kyocer Slc Technologies Corp 配線基板
US9565750B2 (en) 2012-08-18 2017-02-07 Kyocera Corporation Wiring board for mounting a semiconductor element
WO2025070312A1 (ja) * 2023-09-28 2025-04-03 京セラ株式会社 配線基板およびそれを用いた実装構造体

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