JPWO2021140664A5 - - Google Patents
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- Publication number
- JPWO2021140664A5 JPWO2021140664A5 JP2021569704A JP2021569704A JPWO2021140664A5 JP WO2021140664 A5 JPWO2021140664 A5 JP WO2021140664A5 JP 2021569704 A JP2021569704 A JP 2021569704A JP 2021569704 A JP2021569704 A JP 2021569704A JP WO2021140664 A5 JPWO2021140664 A5 JP WO2021140664A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- wiring board
- silicon substrate
- central
- outer conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 11
- 229910052710 silicon Inorganic materials 0.000 claims 11
- 239000010703 silicon Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 9
- 238000007747 plating Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023000961A JP7424520B2 (ja) | 2020-01-10 | 2023-01-06 | 配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/000733 WO2021140664A1 (ja) | 2020-01-10 | 2020-01-10 | 配線基板及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023000961A Division JP7424520B2 (ja) | 2020-01-10 | 2023-01-06 | 配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021140664A1 JPWO2021140664A1 (https=) | 2021-07-15 |
| JPWO2021140664A5 true JPWO2021140664A5 (https=) | 2022-08-09 |
| JP7211540B2 JP7211540B2 (ja) | 2023-01-24 |
Family
ID=76787807
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021569704A Active JP7211540B2 (ja) | 2020-01-10 | 2020-01-10 | 配線基板及びその製造方法 |
| JP2023000961A Active JP7424520B2 (ja) | 2020-01-10 | 2023-01-06 | 配線基板及びその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023000961A Active JP7424520B2 (ja) | 2020-01-10 | 2023-01-06 | 配線基板及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20230034867A1 (https=) |
| JP (2) | JP7211540B2 (https=) |
| WO (1) | WO2021140664A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4227862A4 (en) * | 2020-12-31 | 2024-04-24 | Origin Quantum Computing Technology (Hefei) Co., Ltd | Superconducting quantum chip structure and superconducting quantum chip preparation method |
| US20230262906A1 (en) * | 2022-02-11 | 2023-08-17 | Alibaba (China) Co., Ltd. | Substrate, chip, circuit package and fabrication process |
| CN116261392B (zh) * | 2023-01-17 | 2024-09-20 | 深圳量旋科技有限公司 | 超导量子芯片及其基底、及基底的制作方法 |
| CN115955906B (zh) * | 2023-01-20 | 2025-05-30 | 深圳量旋科技有限公司 | 超导量子芯片及其基底、及基底的制作方法 |
| US20250098549A1 (en) * | 2023-09-15 | 2025-03-20 | Imec Vzw | Fabrication of Through-Silicon Vias |
| TWI889233B (zh) * | 2024-03-11 | 2025-07-01 | 欣興電子股份有限公司 | 電路板裝置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002334956A (ja) * | 2001-05-09 | 2002-11-22 | Fujitsu Ltd | 半導体装置の支持体及びその製造方法 |
| JP4192035B2 (ja) * | 2003-05-27 | 2008-12-03 | 大日本印刷株式会社 | 配線基板の製造方法 |
| JP2006019455A (ja) * | 2004-06-30 | 2006-01-19 | Nec Electronics Corp | 半導体装置およびその製造方法 |
| DE102005039068A1 (de) * | 2005-08-11 | 2007-02-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Halbleitersubstrat und Verfahren zur Herstellung |
| US20110241185A1 (en) * | 2010-04-05 | 2011-10-06 | International Business Machines Corporation | Signal shielding through-substrate vias for 3d integration |
| US9079761B2 (en) * | 2013-03-14 | 2015-07-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stacked semiconductor device and method of forming the same related cases |
| CN103311141B (zh) * | 2013-07-05 | 2016-01-20 | 北京理工大学 | 一种同轴垂直互连导电体的制作方法 |
| JP2016066770A (ja) * | 2014-09-25 | 2016-04-28 | 京セラサーキットソリューションズ株式会社 | 配線基板およびその製造方法 |
| CN106158835B (zh) * | 2016-07-08 | 2018-09-28 | 西安理工大学 | 一种基于硅通孔技术的低通滤波器 |
| US11569428B2 (en) * | 2016-12-27 | 2023-01-31 | Santa Clara | Superconducting qubit device packages |
| CN109461699B (zh) * | 2018-10-22 | 2020-08-14 | 中国电子科技集团公司第三十八研究所 | 一种同轴tsv结构转接板及其制作方法 |
-
2020
- 2020-01-10 WO PCT/JP2020/000733 patent/WO2021140664A1/ja not_active Ceased
- 2020-01-10 US US17/789,308 patent/US20230034867A1/en active Pending
- 2020-01-10 JP JP2021569704A patent/JP7211540B2/ja active Active
-
2023
- 2023-01-06 JP JP2023000961A patent/JP7424520B2/ja active Active
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