JPWO2022224866A5 - - Google Patents

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Publication number
JPWO2022224866A5
JPWO2022224866A5 JP2023516454A JP2023516454A JPWO2022224866A5 JP WO2022224866 A5 JPWO2022224866 A5 JP WO2022224866A5 JP 2023516454 A JP2023516454 A JP 2023516454A JP 2023516454 A JP2023516454 A JP 2023516454A JP WO2022224866 A5 JPWO2022224866 A5 JP WO2022224866A5
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JP
Japan
Prior art keywords
layer
land
forming
wiring
thickness
Prior art date
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Application number
JP2023516454A
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English (en)
Japanese (ja)
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JP7544965B2 (ja
JPWO2022224866A1 (https=
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Priority claimed from PCT/JP2022/017552 external-priority patent/WO2022224866A1/ja
Publication of JPWO2022224866A1 publication Critical patent/JPWO2022224866A1/ja
Publication of JPWO2022224866A5 publication Critical patent/JPWO2022224866A5/ja
Application granted granted Critical
Publication of JP7544965B2 publication Critical patent/JP7544965B2/ja
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JP2023516454A 2021-04-22 2022-04-12 フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法 Active JP7544965B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021072660 2021-04-22
JP2021072660 2021-04-22
PCT/JP2022/017552 WO2022224866A1 (ja) 2021-04-22 2022-04-12 フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022224866A1 JPWO2022224866A1 (https=) 2022-10-27
JPWO2022224866A5 true JPWO2022224866A5 (https=) 2023-06-28
JP7544965B2 JP7544965B2 (ja) 2024-09-03

Family

ID=83722990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023516454A Active JP7544965B2 (ja) 2021-04-22 2022-04-12 フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法

Country Status (4)

Country Link
US (1) US20230413451A1 (https=)
JP (1) JP7544965B2 (https=)
CN (1) CN116530222A (https=)
WO (1) WO2022224866A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7680647B1 (ja) * 2024-10-22 2025-05-20 住友電気工業株式会社 プリント配線板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3506482A (en) * 1967-04-25 1970-04-14 Matsushita Electric Industrial Co Ltd Method of making printed circuits
JPS5686964A (en) * 1979-12-13 1981-07-15 Kollmorgen Tech Corp High resolving power screen printable resist
FR2759528B1 (fr) * 1997-02-11 2006-12-22 Thomson Csf Procede de realisation de circuits imprimes a double epargne
BR0114436A (pt) * 2000-10-06 2003-07-01 Tanabe Seiyaku Co Composto com anel de cinco elementos contendo nitrogênio alifático
US7317245B1 (en) * 2006-04-07 2008-01-08 Amkor Technology, Inc. Method for manufacturing a semiconductor device substrate
CN102686052A (zh) * 2011-03-16 2012-09-19 钒创科技股份有限公司 软性印刷电路板及其制造方法
JP6061470B2 (ja) * 2012-01-20 2017-01-18 旭化成株式会社 フレキシブル配線板
KR101555014B1 (ko) 2014-04-07 2015-09-22 (주) 화인켐 미세배선용 인쇄회로기판 및 이의 제조방법
JP6601814B2 (ja) * 2014-05-21 2019-11-06 住友電工プリントサーキット株式会社 プリント配線板及びプリント配線板の製造方法
KR102014462B1 (ko) * 2015-10-23 2019-08-26 주식회사 엘지화학 이차 전지용 카트리지 및 이를 포함하는 배터리 모듈
JP6943681B2 (ja) * 2017-08-24 2021-10-06 住友電気工業株式会社 プリント配線板

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