JPWO2022163588A5 - - Google Patents

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Publication number
JPWO2022163588A5
JPWO2022163588A5 JP2022578373A JP2022578373A JPWO2022163588A5 JP WO2022163588 A5 JPWO2022163588 A5 JP WO2022163588A5 JP 2022578373 A JP2022578373 A JP 2022578373A JP 2022578373 A JP2022578373 A JP 2022578373A JP WO2022163588 A5 JPWO2022163588 A5 JP WO2022163588A5
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JP
Japan
Prior art keywords
core board
configuration
core
magnetic body
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022578373A
Other languages
English (en)
Japanese (ja)
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JPWO2022163588A1 (https=
JP7555434B2 (ja
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Publication date
Priority claimed from PCT/JP2021/003321 external-priority patent/WO2022162888A1/ja
Application filed filed Critical
Publication of JPWO2022163588A1 publication Critical patent/JPWO2022163588A1/ja
Publication of JPWO2022163588A5 publication Critical patent/JPWO2022163588A5/ja
Application granted granted Critical
Publication of JP7555434B2 publication Critical patent/JP7555434B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022578373A 2021-01-29 2022-01-24 コア基板およびインターポーザ Active JP7555434B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2021/003321 2021-01-29
PCT/JP2021/003321 WO2022162888A1 (ja) 2021-01-29 2021-01-29 コア基板
PCT/JP2022/002456 WO2022163588A1 (ja) 2021-01-29 2022-01-24 コア基板およびインターポーザ

Publications (3)

Publication Number Publication Date
JPWO2022163588A1 JPWO2022163588A1 (https=) 2022-08-04
JPWO2022163588A5 true JPWO2022163588A5 (https=) 2023-09-22
JP7555434B2 JP7555434B2 (ja) 2024-09-24

Family

ID=82654315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022578373A Active JP7555434B2 (ja) 2021-01-29 2022-01-24 コア基板およびインターポーザ

Country Status (3)

Country Link
US (1) US20230343685A1 (https=)
JP (1) JP7555434B2 (https=)
WO (2) WO2022162888A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12170252B2 (en) * 2021-09-29 2024-12-17 International Business Machines Corporation Electronic substrate stacking
WO2025164623A1 (ja) * 2024-02-01 2025-08-07 日本碍子株式会社 コア基板
EP4701352A1 (en) * 2024-07-12 2026-02-25 Samsung Electronics Co., Ltd Electronic device including printed circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164417A (ja) * 1997-12-26 2000-06-16 Murata Mfg Co Ltd 磁性体磁器組成物およびそれを用いたインダクタ部品
JP3687484B2 (ja) * 1999-06-16 2005-08-24 株式会社村田製作所 セラミック基板の製造方法および未焼成セラミック基板
US7843302B2 (en) * 2006-05-08 2010-11-30 Ibiden Co., Ltd. Inductor and electric power supply using it
JP5761609B2 (ja) * 2011-09-02 2015-08-12 株式会社村田製作所 セラミック電子部品、及びセラミック電子部品の製造方法
JP2013054369A (ja) * 2012-10-23 2013-03-21 Ngk Spark Plug Co Ltd 光導波路付き配線基板
JP2015135870A (ja) * 2014-01-16 2015-07-27 富士通株式会社 インダクタ装置及びインダクタ装置の製造方法

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