WO2022162888A1 - コア基板 - Google Patents

コア基板 Download PDF

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Publication number
WO2022162888A1
WO2022162888A1 PCT/JP2021/003321 JP2021003321W WO2022162888A1 WO 2022162888 A1 WO2022162888 A1 WO 2022162888A1 JP 2021003321 W JP2021003321 W JP 2021003321W WO 2022162888 A1 WO2022162888 A1 WO 2022162888A1
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WO
WIPO (PCT)
Prior art keywords
core substrate
magnetic body
conductor
magnetic
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/003321
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English (en)
French (fr)
Japanese (ja)
Inventor
芳嗣 若園
信 谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to PCT/JP2021/003321 priority Critical patent/WO2022162888A1/ja
Priority to PCT/JP2022/002456 priority patent/WO2022163588A1/ja
Priority to JP2022578373A priority patent/JP7555434B2/ja
Publication of WO2022162888A1 publication Critical patent/WO2022162888A1/ja
Priority to US18/342,878 priority patent/US20230343685A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present invention relates to a core substrate, and more particularly to a core substrate with a built-in inductor for configuring an interposer on which a semiconductor element is mounted.
  • an interposer is arranged between a semiconductor element and a motherboard in a semiconductor device.
  • Each of the semiconductor element and the motherboard and the interposer are connected using solder balls.
  • a multi-layer wiring printed board is shown as the interposer, which includes a core board, three conductor circuit layers laminated on the core board so as to face the semiconductor element, and a core board facing the motherboard. and a laminated three-layer conductor circuit layer.
  • the wiring dimension is reduced step by step by passing through the three conductor circuit layers.
  • Efficient power management may be required for semiconductor devices such as integrated circuits (ICs).
  • ICs integrated circuits
  • the supply voltage to each of the plurality of operation cores of a processor chip is controlled by a voltage regulator according to the amount of operation processed by the processor.
  • a voltage regulator typically switches, capacitors and inductors are required.
  • switches, capacitors and inductors are required for each arithmetic core.
  • inductors are difficult to embed in semiconductor devices, and are usually prepared separately from semiconductor devices. In order to secure sufficient inductance while suppressing the footprint of the inductor, it has been proposed to use a magnetic material.
  • Patent Document 2 discloses a package substrate (here, a kind of interposer) arranged between a die (semiconductor element) and a board (motherboard). ing.
  • This package substrate incorporates an inductor for the purpose described above.
  • the package substrate has a substrate core, a conductive through-hole extending therethrough, and a magnetic coating around the conductive through-hole.
  • the magnetic coating may contain magnetic particles.
  • the substrate core may be any substrate on which build-up layers (conductor circuit layers) are to be formed.
  • An organic material is exemplified as the core substrate.
  • the die semiconductor device that will be bonded to the interposer has multiple arithmetic cores.
  • high-performance processors for data servers, etc. have a large number of arithmetic cores in order to increase the arithmetic processing capacity, so the number of arithmetic cores per die area is increasing, and the die area per arithmetic core is becoming smaller. ing.
  • high density inductors with greater inductance per unit area of interposer.
  • a substrate core mainly made of an organic material is provided with a conductive through hole (conductor portion) and a magnetic coating containing magnetic particles provided around the conductor portion. (Magnetic body portion) and are exemplified.
  • the magnetic part must be formed at a temperature equal to or lower than the heat resistance temperature of the organic material of the substrate core.
  • As a method of satisfying this requirement there is typically a method of solidifying a resin in which magnetic particles are dispersed.
  • the magnetic body portion is composed of magnetic particles dispersed in a resin, it is difficult to ensure a high magnetic permeability due to the limitation of the magnetic particle filling rate (ratio of magnetic particles per volume). It is necessary to reduce the size of the inductor built into the interposer in response to the above-mentioned high density of the interposer. As the size of the inductor becomes smaller, it becomes difficult to ensure sufficient inductance.
  • a core substrate is a core substrate containing an inductor for configuring an interposer on which a semiconductor element is mounted, and has a ceramic substrate, a first conductor portion, and a first magnetic portion. ing.
  • the ceramic substrate has a first surface and a second surface opposite to the first surface in the thickness direction, and has a first through hole between the first surface and the second surface.
  • the first conductor passes through the first through hole.
  • the first magnetic body portion surrounds the first conductor portion in the first through hole, and is made of ceramics.
  • the first magnetic body part may have a circular inner edge and a circular outer edge in a cross-sectional view perpendicular to the thickness direction.
  • the first magnetic body part may have a density of 70% or more.
  • the ceramic substrate may have a thermal expansion coefficient of 4 ppm/°C or more and 16 ppm/°C or less.
  • the first magnetic body part may be made of an insulator.
  • the first magnetic body part may be in direct contact with the first conductor part.
  • the core substrate may have a first insulating ceramic film that separates the first magnetic portion from the first conductor portion.
  • the core substrate may have an insulator layer that at least partially covers the first magnetic portion along a plane including the first surface of the ceramic substrate.
  • the ceramic substrate may have a second through hole between the first surface and the second surface.
  • the core substrate may have a second conductor portion and a second magnetic portion.
  • the second conductor passes through the second through hole.
  • the second magnetic body portion surrounds the second conductor portion in the second through hole, and is made of ceramics.
  • the core substrate may have a connecting portion that electrically connects one end of the first conductor and one end of the second conductor on the first surface of the ceramic substrate.
  • the other end of the first conductor and the other end of the second conductor may be electrically separated from each other.
  • the first magnetic body part is made of ceramics, not made of resin in which magnetic particles are dispersed.
  • the magnetic permeability of the first magnetic body part can be sufficiently increased by densely sintering the ceramics. Therefore, the core substrate can incorporate an inductor having a large inductance per unit area.
  • the first magnetic body part When the first magnetic body part has a circular inner edge and a circular outer edge in a cross-sectional view perpendicular to the thickness direction, the first magnetic body part is positioned with respect to the first conductor part in the cross-sectional view. can be arranged isotropically in
  • the magnetic permeability of the first magnetic body part can be sufficiently increased.
  • the thermal expansion coefficient of the ceramic substrate is the thermal expansion coefficient of the semiconductor element to be mounted on the interposer including the core substrate, and the coefficient of thermal expansion of a typical board on which the interposer will be mounted.
  • the first magnetic body part is made of an insulator, even if the first magnetic body part is in direct contact with the first conductor part, diffusion of current from the first conductor part to the first magnetic body part can be avoided.
  • the first magnetic body part When the first magnetic body part is in direct contact with the first conductor part, it becomes easier to secure a sufficient area for arranging the first magnetic body part.
  • the first insulating ceramic film separates the first magnetic body part from the first conductor part, it is possible to avoid adverse effects caused by direct contact between the first conductor part and the first magnetic body part.
  • the insulator layer at least partially covers the first magnetic body part along a plane containing the first surface of the ceramic substrate, the influence between the first magnetic body part and the configuration on the first surface is suppressed. can do.
  • the core substrate When the core substrate has an inductor composed of the first conductor and the first magnetic body and an inductor composed of the second conductor and the second magnetic body, the core substrate includes a plurality of inductors. of inductors can be built in.
  • connection portion electrically connects one end of the first conductor portion and one end of the second conductor portion to each other on the first surface of the ceramic substrate, the first conductor portion and the first magnetic portion
  • the configured inductor and the inductor configured by the second conductor portion and the second magnetic body portion can be electrically connected to each other.
  • the inductor L1 configured by the first conductor and the first magnetic body, the second conductor and The inductor L2 configured by the second magnetic body part is connected in series instead of in parallel. This can increase the combined inductance.
  • FIG. 1 is a cross-sectional view schematically showing the configuration of an electronic device according to Embodiment 1;
  • FIG. 2 is a cross-sectional view showing an electronic device of a modification of FIG. 1;
  • FIG. FIG. 2 is a schematic diagram showing the configuration of an inductor incorporated in the core substrate according to Embodiment 1 of the present invention;
  • 4 is a circuit diagram showing an example of electrical connection of the first inductor and the second inductor shown in FIG. 3;
  • FIG. FIG. 7 is a diagram schematically showing the configuration of the core substrate in Embodiment 1, and is a partial cross-sectional view taken along line VV in FIG. 6; 6 is a partial cross-sectional view along line VI-VI of FIG. 5;
  • FIG. 4 is a partial cross-sectional view showing the configuration of a core substrate of a comparative example
  • FIG. 10 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 2
  • FIG. 11 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 3
  • FIG. 14 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 4
  • FIG. 11 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 5
  • FIG. 20 is a partial cross-sectional view schematically showing the structure of a core substrate in Embodiment 6
  • FIG. 21 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 7;
  • FIG. 21 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 8;
  • FIG. 22 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 9;
  • FIG. 20 is a partial cross-sectional view schematically showing the configuration of a core substrate in the tenth embodiment;
  • FIG. 1 is a cross-sectional view schematically showing the configuration of electronic device 901 according to the first embodiment.
  • the electronic device 901 has an interposer 700 , a semiconductor element 811 (die), a motherboard 812 and a package substrate 813 .
  • the interposer 700 has a core substrate 601 , wiring layers 791 and wiring layers 792 .
  • Each of the wiring layer 791 and the wiring layer 792 is directly or indirectly formed on one surface and the other surface of the core substrate 601 (specifically, on a first surface SF1 and a second surface SF2 described later). ) are laminated.
  • Each of wiring layer 791 and wiring layer 792 may be laminated on core substrate 601 by a build-up method, a sputtering method, or the like, or may be joined as a separate wiring board.
  • the wiring layer 791 is a multilayer wiring configured such that the wiring dimension (for example, line and space (L/S) dimension) is reduced from the side facing the core substrate 601 to the side facing the semiconductor element 811 . Layers are preferred. As a result, even if the wiring dimension (L/S) of the core substrate 601 is not so high, the interposer 700 capable of mounting the semiconductor element 811 having a small terminal pitch can be configured.
  • the wiring layer 791 may be a laminate of a normal wiring layer facing the core substrate 601 and a fine wiring layer facing the semiconductor element 811 .
  • the wiring layer is provided with a wiring structure on a plate-like organic material (e.g., epoxy-based member) or inorganic material (e.g., low-temperature co-fired ceramics (LTCC: Low Temperature Co-fired Ceramics) material or non-magnetic ferrite material).
  • a plate-like organic material e.g., epoxy-based member
  • inorganic material e.g., low-temperature co-fired ceramics (LTCC: Low Temperature Co-fired Ceramics) material or non-magnetic ferrite material.
  • LTCC Low Temperature Co-fired Ceramics
  • the fine wiring layer is preferably formed by providing a wiring structure on a plate-like organic material (for example, an epoxy-based or polyimide-based member).
  • a plate-like organic material for example, an epoxy-based or polyimide-based member.
  • Cu plating for example, is used to form a wiring structure on this organic material.
  • the semiconductor element 811 is mounted on the wiring layer 791 of the interposer 700 .
  • the semiconductor element 811 is connected to the wiring layer 791 of the interposer 700 by solder balls 821, for example.
  • the semiconductor element 811 may be an IC (Integrated Circuit) chip.
  • the IC chip is a processor chip having a plurality of arithmetic cores, the voltage regulator described above can be configured using an inductor described later.
  • the interposer 700 is mounted on the package substrate 813 by bonding the wiring layer 792 to the package substrate 813 . This joining is performed by solder balls 823, for example.
  • the package substrate 813 is mounted on the motherboard 812 by bonding using solder balls 822, for example.
  • the element side of the interposer 700 (the side facing the semiconductor element 811) is composed of the wiring layer 791, and the substrate side of the interposer 700 (the side facing the package substrate 813 and the motherboard 812) is the wiring layer 792. It is composed by A plurality of terminals (not shown) are provided on each of the device side and substrate side of the interposer 700 .
  • the element-side terminal pitch may be smaller than the substrate-side terminal pitch, and in this case, the interposer 700 has a function of converting the terminal pitch.
  • either or both of the wiring layer 791 and the wiring layer 792 may be omitted depending on the application of the interposer.
  • FIG. 2 is a cross-sectional view showing an electronic device 902 that is a modification of the electronic device 901 (FIG. 1).
  • the interposer 700 is bonded to the motherboard 812 without the package substrate 813 (FIG. 1) interposed therebetween, and this bonding is performed by solder balls 822, for example.
  • FIG. 3 is a schematic diagram showing the configuration of an inductor incorporated in core substrate 601 according to Embodiment 1 of the present invention.
  • Core substrate 601 incorporates a plurality of inductors L1 and L2, and may further incorporate inductors L3 to L6, etc., and the number of inductors is arbitrary. Although the configurations of inductors L1 and L2 will be described in detail below, inductors L3 to L6 may have similar configurations.
  • FIG. 4 is a circuit diagram showing an example of electrical connection of inductors L1 and L2 shown in FIG.
  • the inductor L1 and the inductor L2 are connected in series to form an inductor having a combined inductance greater than the inductance of each of these inductors, and both ends of the inductor are connected to the semiconductor element 811 (FIG. 1). It is arranged on the second surface SF2 that is to be formed. Thereby, an inductor having a sufficiently large inductance can be easily connected to semiconductor element 811 .
  • the electrical connections between the multiple inductors built in the core substrate are not limited to those shown in FIG. 4, and may be appropriately designed according to the application of the core substrate. This may create any number of inductors in series, any number of inductors in parallel, or a combination thereof.
  • FIG. 5 is a diagram schematically showing the configuration of core substrate 601 according to Embodiment 1 of the present invention, and is a partial cross-sectional view taken along line VV in FIG.
  • FIG. 6 is a partial cross-sectional view along line VI-VI of FIG.
  • core substrate 601 constitutes interposer 700 and incorporates inductors L1 and L2.
  • the core substrate 601 includes a ceramic substrate 100, a first conductor portion 201, a second conductor portion 202, a first magnetic body portion 301, a second magnetic body portion 302, a connection portion 450, a terminal portion 401, and a terminal portion 402 .
  • the first conductor portion 201 and the second conductor portion 202 are also collectively referred to as the conductor portion 200 .
  • the first magnetic body portion 301 and the second magnetic body portion 302 are also collectively referred to as the magnetic body portion 300 .
  • the ceramic substrate 100 has a first surface SF1 and a second surface SF2 opposite to the first surface SF1 in the thickness direction.
  • the ceramic substrate 100 is a substrate made of a ceramic sintered body.
  • the ceramic sintered body does not substantially contain an organic component and may contain a glass component.
  • the ceramic substrate 100 may be made of glass ceramics.
  • the ceramic substrate 100 is made of LTCC.
  • LTCC is a ceramic that can be sintered at about 900° C. or less, and can be sintered at a temperature sufficiently lower than the melting point of Ag or Cu.
  • the ceramic substrate 100 has a first through hole HL1 and a second through hole HL2 between the first surface SF1 and the second surface SF2.
  • the ceramic substrate 100 preferably has a thermal expansion coefficient of 4 ppm/°C or more and 16 ppm/°C or less.
  • the first conductor portion 201 and the second conductor portion 202 respectively penetrate the first through hole HL1 and the second through hole HL2.
  • These conductor portions 200 are made of Ag or Cu, for example.
  • the first magnetic body portion 301 surrounds the first conductor portion 201 in the first through hole HL1.
  • the second magnetic body portion 302 surrounds the second conductor portion 202 in the second through hole HL2.
  • the first magnetic body part 301 and the second magnetic body part 302 may be in direct contact with the first conductor part 201 and the second conductor part 202, respectively.
  • Each of these magnetic parts 300 may have a circular inner edge and a circular outer edge in a cross-sectional view (FIG. 6) perpendicular to the thickness direction. Note that these inner and outer edges may have other shapes instead of circular shapes, for example, elliptical shapes or polygonal shapes such as square shapes. The polygonal corners may be chamfered. Similarly, in a cross-sectional view, the first through hole HL1, the second through hole HL2, and each conductor portion 200 may also have other shapes instead of the circular shape shown in FIG.
  • the magnetic body part 300 is made of ceramics (ceramic sintered body) and does not contain an organic component.
  • the magnetic body part 300 preferably has a density of 70% or more.
  • the magnetic body part 300 may be made of an insulator.
  • the magnetic body portion 300 is preferably made of a ferrite-based material, and the crystal structure of the material is preferably a spinel structure from the viewpoint of ease of manufacture. It is preferably a hexagonal crystal structure having a c-axis orientation along the longitudinal direction in.
  • the manufacturing method of the core substrate 601 includes a firing process.
  • the conductor portion (first conductor portion 201 and second conductor portion 202) and the magnetic body portion (first magnetic body portion 301 and second magnetic body portion 302) are fired simultaneously with the ceramic substrate 100. .
  • the connecting portion 450 electrically connects one end of the first conductor portion 201 and one end of the second conductor portion 202 on the first surface SF1 of the ceramic substrate 100 .
  • the terminal portion 401 is connected to the other end of the first conductor portion 201 and the terminal portion 402 is connected to the other end of the second conductor portion 202 .
  • Terminal portion 401 and terminal portion 402 are separated from each other. Therefore, one end of the first conductor portion 201 and one end of the second conductor portion 202 are electrically connected to each other, and the other end of the first conductor portion 201 and the other end of the second conductor portion 202 are electrically connected to each other. are electrically isolated from each other.
  • the circuit shown in FIG. 4 is constructed.
  • the ceramic substrate 100 has a square shape with sides of 50 mm in the in-plane direction and a dimension of 550 ⁇ m in the thickness direction.
  • a plurality of through-holes (first through-hole HL1, second through-hole HL2, etc.) are arranged at a pitch of 450 ⁇ m.
  • Each of the magnetic parts 300 (FIG. 6) has an outer diameter of 350 ⁇ m and an inner diameter of 100 ⁇ m.
  • Each conductor portion 200 has an outer diameter of 100 ⁇ m.
  • the conductor portion 200 is formed by sintering Ag powder.
  • the magnetic body part 300 is made of a ferrite sintered body, and its relative magnetic permeability is estimated to be 16. In this case, the inductance of one inductor (eg, inductor L1) is approximately 2 nH at 140 MHz, according to the inventor's estimate.
  • FIG. 7 is a partial cross-sectional view showing the configuration of a core substrate 690 of a comparative example.
  • first through hole HL1 and second through hole are formed in resin substrate 190 made of glass epoxy resin.
  • a first magnetic body portion 391 and a first conductor portion 291 are formed in this order on the side wall of the first through hole HL1, and the first conductor portion 291 has a hollow structure filled with a resin material 281.
  • a second magnetic body portion 392 and a second conductor portion 292 are formed in this order on the side wall of the second through hole HL2, and the second conductor portion 292 has a hollow structure filled with a resin material 282.
  • the first conductor portion 291 and the second conductor portion 292 are also collectively referred to as the conductor portion 290 .
  • the first magnetic body portion 391 and the second magnetic body portion 392 are formed within the resin substrate 190. Therefore, the step of forming the magnetic body portion 390 needs to be performed at a temperature equal to or lower than the heat resistance temperature of the resin substrate 190 . Due to this restriction, the magnetic body portion 390 is made of resin in which magnetic particles are dispersed, instead of a ceramic sintered body. In this case, the gaps between the magnetic particles in the magnetic body portion 390 are filled with resin, and it is usually difficult to increase the filling rate to 70% or more.
  • the resin substrate 190 has a square shape with sides of 50 mm in the in-plane direction and a dimension of 1000 ⁇ m in the thickness direction.
  • a plurality of through holes (first through hole HL1, second through hole HL2, etc.) are arranged at a pitch of 500 ⁇ m.
  • Each magnetic body portion 390 has an outer diameter of 400 ⁇ m and an inner diameter of 200 ⁇ m.
  • Each conductor portion 200 has an outer diameter of 200 ⁇ m.
  • the conductor portion 200 is formed by Cu plating.
  • the magnetic body part 390 is made of a resin in which magnetic particles are dispersed, and its relative magnetic permeability is estimated to be 6.
  • the inductance of one inductor (eg, inductor L1) in this case is about 1 nH at 140 MHz according to the inventor's estimate. This value is half of the approximately 2nH estimated in the present case.
  • the magnetic body portion 300 (FIG. 5) is made of a ceramic sintered body, unlike the magnetic body portion 390 (FIG. 7) made of resin in which magnetic particles are dispersed.
  • the magnetic permeability of the magnetic body portion 300 can be sufficiently increased by densely sintering the ceramics. Therefore, core substrate 601 can incorporate an inductor having a large inductance per unit area.
  • the ceramic substrate 100 (Fig. 5) has higher rigidity than the resin substrate 190 (Fig. 7). Therefore, even after another member is added to the ceramic substrate 100, the ceramic substrate 100 is less likely to warp. Therefore, a core substrate 601 with small warpage can be obtained.
  • the formation yield of the wiring layers 791 and 792 (FIG. 1), especially the yield of the wiring layer 791 having a high density wiring structure, is improved.
  • the mounting yield of the semiconductor element 811 (FIG. 1) is improved.
  • the magnetic body part 300 When the magnetic body part 300 has a circular inner edge and a circular outer edge in a cross-sectional view ( FIG. 6 ) perpendicular to the thickness direction, the magnetic body part 300 is arranged with respect to the conductor part 200 in the cross section. It can be arranged isotropically in view.
  • the magnetic body part 300 has a density of 70% or more, the magnetic permeability of the magnetic body part 300 can be sufficiently increased.
  • the thermal expansion coefficient of the ceramic substrate 100 is set to the semiconductor element 811 ( 1) and that of a typical motherboard 812 (FIG. 1) on which interposer 700 will be mounted.
  • the electronic device 901 (FIG. 1) or the electronic device 902 (FIG. 2) can be prevented from warping due to thermal expansion and contraction.
  • the magnetic body part 300 is made of an insulator, even if the magnetic body part 300 is in direct contact with the conductor part 200 as shown in FIGS. Diffusion can be avoided.
  • the magnetic body part 300 When the magnetic body part 300 is in direct contact with the conductor part 200, it becomes easier to secure a sufficient area for arranging the magnetic body part 300.
  • the core substrate 601 has an inductor L1 composed of the first conductor portion 201 and the first magnetic body portion 301, and an inductor L2 composed of the second conductor portion 202 and the second magnetic body portion 302. . Thereby, a plurality of inductors can be embedded in the core substrate 601 .
  • connection portion 450 electrically connects one end of the first conductor portion 201 (lower end in FIG. 5) and one end of the second conductor portion 202 (lower end in FIG. 5) on the first surface SF1 of the ceramic substrate 100 to each other. Connected. As a result, the inductor L1 composed of the first conductor portion 201 and the first magnetic body portion 301 and the inductor L2 composed of the second conductor portion 202 and the second magnetic body portion 302 are electrically connected to each other. be able to.
  • the inductor L1 composed of the first conductor portion 201 and the first magnetic body portion 301 and the inductor L2 composed of the second conductor portion 202 and the second magnetic body portion 302 are connected in series instead of in parallel. . This can increase the combined inductance.
  • FIG. 8 is a partial cross-sectional view schematically showing the configuration of core substrate 602 according to the second embodiment.
  • the core substrate 602 does not have the connecting portion 450 (FIG. 5: Embodiment 1).
  • Core substrate 602 does not have terminal portion 401 and terminal portion 402 (FIG. 5: Embodiment 1). Since the configuration other than these is substantially the same as the configuration of the first embodiment described above, the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
  • the configuration is simplified as compared with the core substrate 601 while incorporating the inductor L1 and the inductor L2 like the core substrate 601 (FIG. 5: Embodiment 1). can be done.
  • FIG. 9 is a partial cross-sectional view schematically showing the configuration of core substrate 603 according to the third embodiment.
  • the core substrate 603 does not have the second magnetic body portion 302 (FIG. 5: Embodiment 1). Since the configuration other than this is substantially the same as the configuration of the first embodiment described above, the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
  • an inductor can be arranged between the terminal portion 401 and the terminal portion 402 similarly to the core substrate 601 (FIG. 5: Embodiment 1). Note that the inductor includes the inductor L1 as in the first embodiment, but does not include the inductor L2 (FIG. 5) unlike the first embodiment.
  • FIG. 10 is a partial cross-sectional view schematically showing the configuration of core substrate 604 according to the fourth embodiment.
  • Core substrate 604 does not have connection portion 450 (FIG. 9: Embodiment 3).
  • Core substrate 603 does not have terminal portion 401 and terminal portion 402 (FIG. 9: Embodiment 3). Since the configuration other than these is substantially the same as the configuration of the third embodiment described above, the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
  • the configuration can be simplified as compared with the core substrate 603 while incorporating the inductor L1 like the core substrate 603 (FIG. 9: Embodiment 3).
  • FIG. 11 is a partial cross-sectional view schematically showing the structure of core substrate 605 according to the fifth embodiment.
  • Core substrate 605 does not have connection portion 450 and second conductor portion 202 (FIG. 9: Embodiment 3).
  • the core substrate 605 has a terminal portion 403 connected to one end of the first conductor portion 201 on the first surface instead of the terminal portion 402 on the second surface SF2. Since the configuration other than these is substantially the same as the configuration of the third embodiment described above, the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
  • the configuration can be simplified as compared with the core substrate 603 while incorporating the inductor L1 like the core substrate 603 (FIG. 9: Embodiment 1).
  • FIG. 12 is a partial cross-sectional view schematically showing the configuration of core substrate 606 according to the sixth embodiment.
  • Core substrate 606 does not have terminal portion 401 and terminal portion 403 (FIG. 11: Embodiment 5). Since the configuration other than these is substantially the same as the configuration of the fifth embodiment described above, the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
  • the configuration can be simplified as compared with the core substrate 605 while incorporating the inductor L1 like the core substrate 605 (FIG. 11: Embodiment 5).
  • FIG. 13 is a partial cross-sectional view schematically showing the configuration of core substrate 607 according to the seventh embodiment.
  • the core substrate 607 has a plurality of insulator ceramic films 550 including a first insulator ceramic film 551 and a second insulator ceramic film 552 .
  • the first insulator ceramic film 551 separates the first magnetic body part 301 from the first conductor part 201 .
  • the second insulator ceramic film 552 separates the second magnetic body portion 302 from the second conductor portion 202 .
  • Core substrate 607 has insulator layer 511 along a plane including first surface SF1 of ceramic substrate 100 and at least partially covering each of first magnetic body portion 301 and second magnetic body portion 302. .
  • Insulator layer 511 separates each of first magnetic body portion 301 and second magnetic body portion 302 from connecting portion 450 .
  • the insulator layer 511 may partially cover each of the first magnetic section 301 and the second magnetic section 302 as shown.
  • the core substrate 607 has an insulator layer 512 along a plane including the second surface SF2 of the ceramic substrate 100 and at least partially covering each of the first magnetic body portion 301 and the second magnetic body portion 302. .
  • the insulator layer 512 separates the first magnetic section 301 and the terminal section 401 and separates the second magnetic section 302 and the terminal section 402 .
  • the insulator layer 512 may entirely cover each of the first magnetic section 301 and the second magnetic section 302 as shown.
  • the insulator layer 511 and the insulator layer 512 may be made of a non-magnetic material.
  • Insulator layer 511 and insulator layer 512 are made of an inorganic material, an organic material, or a mixture thereof.
  • the inorganic material may be the same as the material of the ceramic substrate 100 or may be different.
  • the insulator ceramic film 550 may be made of a non-magnetic material.
  • the material of the insulator ceramic film 550 may be the same as the material of the ceramic substrate 100, or may be different.
  • the material of the insulator layer 511, the material of the insulator layer 512, and the material of the insulator ceramic film 550 may be different from each other, but are preferably the same material. This common material may be the same as the material of the ceramic substrate 100 or may be different.
  • the insulating ceramic film 550 separates the magnetic section 300 from the conductor section 200 .
  • adverse effects caused by direct contact between the conductor portion 200 and the magnetic portion 300 can be avoided.
  • the magnetic body part 300 has non-negligible conductivity (especially when the magnetic body part 300 is a conductor)
  • current diffusion from the conductor part 200 to the magnetic body part 300 can be prevented. .
  • FIG. 14 is a partial cross-sectional view schematically showing the structure of core substrate 608 according to the eighth embodiment.
  • the core substrate 608 has an insulator layer 501 that at least partially covers each of the first magnetic portion 301 and the second magnetic portion 302 along a plane including the first surface SF1 of the ceramic substrate 100 .
  • Insulator layer 501 separates each of first magnetic body portion 301 and second magnetic body portion 302 from connecting portion 450 . As illustrated, the insulator layer 501 may entirely cover the first magnetic body portion 301 and the second magnetic body portion 302 along a plane including the first surface SF1.
  • the core substrate 608 has an insulator layer 502 that at least partially covers each of the first magnetic portion 301 and the second magnetic portion 302 along a plane including the second surface SF2 of the ceramic substrate 100 .
  • the insulator layer 502 separates the first magnetic section 301 and the terminal section 401 and separates the second magnetic section 302 and the terminal section 402 .
  • the insulator layer 502 may entirely cover the first magnetic section 301 and the second magnetic section 302 along a plane including the second surface SF2.
  • the insulator layer 501 and the insulator layer 502 may be made of a non-magnetic material.
  • Insulator layer 501 and insulator layer 502 are made of an inorganic material, an organic material, or a mixture thereof.
  • the inorganic material may be the same as the material of the ceramic substrate 100 or may be different.
  • the material of the insulator layer 501 and the material of the insulator layer 502 may be different from each other, but preferably they are the same material. This common material may be the same as the material of the ceramic substrate 100 or may be different.
  • the insulator layer 501 at least partially covers the magnetic section 300 along the plane including the first surface SF1 of the ceramic substrate 100 . This can suppress the influence between the magnetic body portion 300 and the structure on the first surface SF1.
  • the insulator layer 502 at least partially covers the magnetic body portion 300 along the plane including the second surface SF2 of the ceramic substrate 100 . This can suppress the influence between the magnetic body portion 300 and the configuration on the second surface SF2.
  • FIG. 15 is a partial cross-sectional view schematically showing the configuration of core substrate 609 according to the ninth embodiment.
  • the core substrate 609 has an insulating ceramic film 550 (FIG. 13: Embodiment 7) in addition to the configuration of the core substrate 608 (FIG. 14: Embodiment 8).
  • the material of insulator layer 501 and insulator layer 502 may be the same as the material of ceramic substrate 100 or may be different. In each of the former and latter cases, the material of the insulator ceramic film 550 may be the same as or different from the material of the ceramic substrate 100 .
  • FIG. 16 is a partial cross-sectional view schematically showing the configuration of core substrate 610 in the tenth embodiment.
  • core substrate 610 the interface between conductor portion 200 and connection portion 450 substantially coincides with first surface SF ⁇ b>1 of ceramic substrate 100 .
  • each of the boundary surface between the terminal portion 401 and the first conductor portion 201 and the boundary surface between the terminal portion 402 and the second conductor portion 202 substantially coincides with the second surface SF2 of the ceramic substrate 100 .
  • the surface may be a microscopic interface, or alternatively a virtual interface.
  • a virtual interface may be assumed independently of a microscopically observable interface.
  • Reference Signs List 100 ceramic substrate 200: conductor portion 201: first conductor portion 202: second conductor portion 300: magnetic body portion 301: first magnetic body portion 302: second magnetic body portion 401 to 403: terminal portion 450: connection portion 501 , 511: insulator layer 550: insulator ceramic film 551: first insulator ceramic film 552: second insulator ceramic film 601 to 610: core substrate 700: interposer 791, 792: wiring layer 811: semiconductor element 812: mother board 813: Package substrate 821-823: Solder balls 901, 902: Electronic device HL1: First through-hole HL2: Second through-hole L1-L6: Inductor SF1: First surface SF2: Second surface

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WO2007129526A1 (ja) * 2006-05-08 2007-11-15 Ibiden Co., Ltd. インダクタ及びこれを利用した電源回路
JP2015135870A (ja) * 2014-01-16 2015-07-27 富士通株式会社 インダクタ装置及びインダクタ装置の製造方法

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JP2000164417A (ja) * 1997-12-26 2000-06-16 Murata Mfg Co Ltd 磁性体磁器組成物およびそれを用いたインダクタ部品
JP3687484B2 (ja) * 1999-06-16 2005-08-24 株式会社村田製作所 セラミック基板の製造方法および未焼成セラミック基板
JP5761609B2 (ja) * 2011-09-02 2015-08-12 株式会社村田製作所 セラミック電子部品、及びセラミック電子部品の製造方法
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WO2007129526A1 (ja) * 2006-05-08 2007-11-15 Ibiden Co., Ltd. インダクタ及びこれを利用した電源回路
JP2015135870A (ja) * 2014-01-16 2015-07-27 富士通株式会社 インダクタ装置及びインダクタ装置の製造方法

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