JP7544965B2 - フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法 - Google Patents

フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法 Download PDF

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Publication number
JP7544965B2
JP7544965B2 JP2023516454A JP2023516454A JP7544965B2 JP 7544965 B2 JP7544965 B2 JP 7544965B2 JP 2023516454 A JP2023516454 A JP 2023516454A JP 2023516454 A JP2023516454 A JP 2023516454A JP 7544965 B2 JP7544965 B2 JP 7544965B2
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JP
Japan
Prior art keywords
layer
land
wiring
thickness
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023516454A
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English (en)
Japanese (ja)
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JPWO2022224866A1 (https=
JPWO2022224866A5 (https=
Inventor
真悟 永田
将一郎 酒井
大介 佐藤
隼一 本村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of JPWO2022224866A1 publication Critical patent/JPWO2022224866A1/ja
Publication of JPWO2022224866A5 publication Critical patent/JPWO2022224866A5/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2023516454A 2021-04-22 2022-04-12 フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法 Active JP7544965B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021072660 2021-04-22
JP2021072660 2021-04-22
PCT/JP2022/017552 WO2022224866A1 (ja) 2021-04-22 2022-04-12 フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022224866A1 JPWO2022224866A1 (https=) 2022-10-27
JPWO2022224866A5 JPWO2022224866A5 (https=) 2023-06-28
JP7544965B2 true JP7544965B2 (ja) 2024-09-03

Family

ID=83722990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023516454A Active JP7544965B2 (ja) 2021-04-22 2022-04-12 フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法

Country Status (4)

Country Link
US (1) US20230413451A1 (https=)
JP (1) JP7544965B2 (https=)
CN (1) CN116530222A (https=)
WO (1) WO2022224866A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7680647B1 (ja) * 2024-10-22 2025-05-20 住友電気工業株式会社 プリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102686052A (zh) 2011-03-16 2012-09-19 钒创科技股份有限公司 软性印刷电路板及其制造方法
JP2013149871A (ja) 2012-01-20 2013-08-01 Asahi Kasei E-Materials Corp フレキシブル配線板
KR101555014B1 (ko) 2014-04-07 2015-09-22 (주) 화인켐 미세배선용 인쇄회로기판 및 이의 제조방법
JP2018526774A (ja) 2015-10-23 2018-09-13 エルジー・ケム・リミテッド 二次電池用カートリッジ及びこれを含むバッテリーモジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3506482A (en) * 1967-04-25 1970-04-14 Matsushita Electric Industrial Co Ltd Method of making printed circuits
JPS5686964A (en) * 1979-12-13 1981-07-15 Kollmorgen Tech Corp High resolving power screen printable resist
FR2759528B1 (fr) * 1997-02-11 2006-12-22 Thomson Csf Procede de realisation de circuits imprimes a double epargne
US7138397B2 (en) * 2000-10-06 2006-11-21 Tanabe Seiyaku Co., Ltd. Nitrogenous 5-membered ring compounds
US7317245B1 (en) * 2006-04-07 2008-01-08 Amkor Technology, Inc. Method for manufacturing a semiconductor device substrate
JP6601814B2 (ja) * 2014-05-21 2019-11-06 住友電工プリントサーキット株式会社 プリント配線板及びプリント配線板の製造方法
JP6943681B2 (ja) * 2017-08-24 2021-10-06 住友電気工業株式会社 プリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102686052A (zh) 2011-03-16 2012-09-19 钒创科技股份有限公司 软性印刷电路板及其制造方法
JP2013149871A (ja) 2012-01-20 2013-08-01 Asahi Kasei E-Materials Corp フレキシブル配線板
KR101555014B1 (ko) 2014-04-07 2015-09-22 (주) 화인켐 미세배선용 인쇄회로기판 및 이의 제조방법
JP2018526774A (ja) 2015-10-23 2018-09-13 エルジー・ケム・リミテッド 二次電池用カートリッジ及びこれを含むバッテリーモジュール

Also Published As

Publication number Publication date
WO2022224866A1 (ja) 2022-10-27
CN116530222A (zh) 2023-08-01
US20230413451A1 (en) 2023-12-21
JPWO2022224866A1 (https=) 2022-10-27

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