CN106304668A - 一种采用增强型半加成法制作印制线路板的制作方法 - Google Patents
一种采用增强型半加成法制作印制线路板的制作方法 Download PDFInfo
- Publication number
- CN106304668A CN106304668A CN201610930029.9A CN201610930029A CN106304668A CN 106304668 A CN106304668 A CN 106304668A CN 201610930029 A CN201610930029 A CN 201610930029A CN 106304668 A CN106304668 A CN 106304668A
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- copper
- plating
- manufacture method
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- 238000000034 method Methods 0.000 title claims abstract description 94
- 230000008569 process Effects 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000000654 additive Substances 0.000 title claims abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 79
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 77
- 229910052802 copper Inorganic materials 0.000 claims abstract description 73
- 239000010949 copper Substances 0.000 claims abstract description 73
- 238000012546 transfer Methods 0.000 claims abstract description 13
- 230000004888 barrier function Effects 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 12
- 238000013461 design Methods 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 230000007261 regionalization Effects 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 33
- 239000010408 film Substances 0.000 description 22
- 239000000758 substrate Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000003814 drug Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201610930029.9A CN106304668B (zh) | 2016-10-31 | 2016-10-31 | 一种采用增强型半加成法制作印制线路板的制作方法 |
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CN201610930029.9A CN106304668B (zh) | 2016-10-31 | 2016-10-31 | 一种采用增强型半加成法制作印制线路板的制作方法 |
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Publication Number | Publication Date |
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CN106304668A true CN106304668A (zh) | 2017-01-04 |
CN106304668B CN106304668B (zh) | 2019-03-05 |
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CN201610930029.9A Active CN106304668B (zh) | 2016-10-31 | 2016-10-31 | 一种采用增强型半加成法制作印制线路板的制作方法 |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106735922A (zh) * | 2017-01-16 | 2017-05-31 | 深圳顺络电子股份有限公司 | 一种叠层电子元件及其制备方法 |
CN106852003A (zh) * | 2017-04-06 | 2017-06-13 | 宜兴硅谷电子科技有限公司 | 一种无抗蚀层精细线路板的制作方法 |
CN107658117A (zh) * | 2017-09-30 | 2018-02-02 | 麦格磁电科技(珠海)有限公司 | 一种无线充电线圈及其制作方法 |
CN108419376A (zh) * | 2018-05-14 | 2018-08-17 | 星河电路(福建)有限公司 | 一种选择性局部电镀高厚铜pcb板的制作方法 |
CN109152229A (zh) * | 2018-10-22 | 2019-01-04 | 台山市精诚达电路有限公司 | 一种挠性线路板的制作方法 |
CN110402034A (zh) * | 2019-07-29 | 2019-11-01 | 华芯电子(天津)有限责任公司 | 一种提高pcb图形电镀面均性的方法 |
CN111243965A (zh) * | 2020-01-16 | 2020-06-05 | 深圳市志金电子有限公司 | 封装基板制备方法 |
CN111278229A (zh) * | 2020-03-20 | 2020-06-12 | 盐城维信电子有限公司 | 一种音圈马达柔性线路板的制备方法 |
CN112106451A (zh) * | 2018-05-11 | 2020-12-18 | 住友电气工业株式会社 | 印刷配线板及印刷配线板的制造方法 |
CN112752439A (zh) * | 2021-01-20 | 2021-05-04 | 惠州市金百泽电路科技有限公司 | 一种用于制作高密度互连线路板的方法 |
CN113613399A (zh) * | 2021-07-21 | 2021-11-05 | 深圳市景旺电子股份有限公司 | 电路板制作方法及电路板 |
CN114223316A (zh) * | 2020-04-24 | 2022-03-22 | 宏启胜精密电子(秦皇岛)有限公司 | 线路板及其制备方法 |
CN115460781A (zh) * | 2022-09-29 | 2022-12-09 | 苏州浪潮智能科技有限公司 | 一种阻抗控制的pcb设计制作方法及pcb板 |
WO2024067366A1 (zh) * | 2022-09-29 | 2024-04-04 | 华为技术有限公司 | 充电线圈模组及其相关产品、充电线圈模组的制备方法 |
CN112106451B (zh) * | 2018-05-11 | 2024-05-31 | 住友电气工业株式会社 | 印刷配线板及印刷配线板的制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102711385A (zh) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | 一种加成法制作线路板的方法 |
CN104113994A (zh) * | 2013-04-22 | 2014-10-22 | 上海美维科技有限公司 | 一种采用新型改良的半加成法制作印制电路板的方法 |
US20140338958A1 (en) * | 2009-07-17 | 2014-11-20 | Nitto Denko Corporation | Printed circuit board and method of manufacturing the same |
CN105430929A (zh) * | 2015-11-19 | 2016-03-23 | 东莞森玛仕格里菲电路有限公司 | 一种局部厚铜pcb的制作方法 |
-
2016
- 2016-10-31 CN CN201610930029.9A patent/CN106304668B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140338958A1 (en) * | 2009-07-17 | 2014-11-20 | Nitto Denko Corporation | Printed circuit board and method of manufacturing the same |
CN102711385A (zh) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | 一种加成法制作线路板的方法 |
CN104113994A (zh) * | 2013-04-22 | 2014-10-22 | 上海美维科技有限公司 | 一种采用新型改良的半加成法制作印制电路板的方法 |
CN105430929A (zh) * | 2015-11-19 | 2016-03-23 | 东莞森玛仕格里菲电路有限公司 | 一种局部厚铜pcb的制作方法 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106735922A (zh) * | 2017-01-16 | 2017-05-31 | 深圳顺络电子股份有限公司 | 一种叠层电子元件及其制备方法 |
CN106852003A (zh) * | 2017-04-06 | 2017-06-13 | 宜兴硅谷电子科技有限公司 | 一种无抗蚀层精细线路板的制作方法 |
CN107658117A (zh) * | 2017-09-30 | 2018-02-02 | 麦格磁电科技(珠海)有限公司 | 一种无线充电线圈及其制作方法 |
CN112106451A (zh) * | 2018-05-11 | 2020-12-18 | 住友电气工业株式会社 | 印刷配线板及印刷配线板的制造方法 |
CN112106451B (zh) * | 2018-05-11 | 2024-05-31 | 住友电气工业株式会社 | 印刷配线板及印刷配线板的制造方法 |
CN108419376A (zh) * | 2018-05-14 | 2018-08-17 | 星河电路(福建)有限公司 | 一种选择性局部电镀高厚铜pcb板的制作方法 |
CN109152229A (zh) * | 2018-10-22 | 2019-01-04 | 台山市精诚达电路有限公司 | 一种挠性线路板的制作方法 |
CN110402034A (zh) * | 2019-07-29 | 2019-11-01 | 华芯电子(天津)有限责任公司 | 一种提高pcb图形电镀面均性的方法 |
CN111243965A (zh) * | 2020-01-16 | 2020-06-05 | 深圳市志金电子有限公司 | 封装基板制备方法 |
CN111278229A (zh) * | 2020-03-20 | 2020-06-12 | 盐城维信电子有限公司 | 一种音圈马达柔性线路板的制备方法 |
CN111278229B (zh) * | 2020-03-20 | 2023-07-04 | 盐城维信电子有限公司 | 一种音圈马达柔性线路板的制备方法 |
CN114223316A (zh) * | 2020-04-24 | 2022-03-22 | 宏启胜精密电子(秦皇岛)有限公司 | 线路板及其制备方法 |
CN114223316B (zh) * | 2020-04-24 | 2024-04-12 | 宏启胜精密电子(秦皇岛)有限公司 | 线路板及其制备方法 |
CN112752439A (zh) * | 2021-01-20 | 2021-05-04 | 惠州市金百泽电路科技有限公司 | 一种用于制作高密度互连线路板的方法 |
WO2022156321A1 (zh) * | 2021-01-20 | 2022-07-28 | 惠州市金百泽电路科技有限公司 | 一种用于制作高密度互连线路板的方法 |
CN113613399A (zh) * | 2021-07-21 | 2021-11-05 | 深圳市景旺电子股份有限公司 | 电路板制作方法及电路板 |
CN115460781A (zh) * | 2022-09-29 | 2022-12-09 | 苏州浪潮智能科技有限公司 | 一种阻抗控制的pcb设计制作方法及pcb板 |
WO2024067366A1 (zh) * | 2022-09-29 | 2024-04-04 | 华为技术有限公司 | 充电线圈模组及其相关产品、充电线圈模组的制备方法 |
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Effective date of registration: 20190125 Address after: 511458 East Second Ladder, Second Floor, South 63 Huanshi Avenue, Nansha District, Guangzhou City, Guangdong Province Applicant after: NEW CAREER GUANGZHOU ELECTRONICS CO.,LTD. Address before: 215129 No. 188 Lushan Road, Suzhou High-tech Zone, Jiangsu Province Applicant before: AKM ELECTRONICS TECHNOLOGY (SUZHOU) Co.,Ltd. |
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Effective date of registration: 20191128 Address after: Room A107, research building a, high tech think tank center, Nanhai software technology park, Shishan town, Nanhai District, Foshan City, Guangdong Province Patentee after: Guangdong fozhixin microelectronics technology research Co.,Ltd. Address before: 511458, Guangdong, Nansha District, Guangzhou Ring Road No. 63, south two, east two ladder Patentee before: NEW CAREER GUANGZHOU ELECTRONICS CO.,LTD. |
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Denomination of invention: A manufacturing method of printed circuit board using enhanced semi additive method Effective date of registration: 20201224 Granted publication date: 20190305 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |
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Granted publication date: 20190305 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong Xinhua Microelectronics Technology Co.,Ltd.|Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |