CN106304668B - 一种采用增强型半加成法制作印制线路板的制作方法 - Google Patents
一种采用增强型半加成法制作印制线路板的制作方法 Download PDFInfo
- Publication number
- CN106304668B CN106304668B CN201610930029.9A CN201610930029A CN106304668B CN 106304668 B CN106304668 B CN 106304668B CN 201610930029 A CN201610930029 A CN 201610930029A CN 106304668 B CN106304668 B CN 106304668B
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- CN
- China
- Prior art keywords
- copper
- plating
- clad plate
- line
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 230000008569 process Effects 0.000 title claims abstract description 30
- 239000000654 additive Substances 0.000 title claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 77
- 229910052802 copper Inorganic materials 0.000 claims abstract description 73
- 239000010949 copper Substances 0.000 claims abstract description 73
- 238000007747 plating Methods 0.000 claims abstract description 67
- 238000012546 transfer Methods 0.000 claims abstract description 15
- 230000004888 barrier function Effects 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 238000013461 design Methods 0.000 claims abstract description 5
- 230000015572 biosynthetic process Effects 0.000 claims abstract 2
- 239000000126 substance Substances 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003814 drug Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610930029.9A CN106304668B (zh) | 2016-10-31 | 2016-10-31 | 一种采用增强型半加成法制作印制线路板的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610930029.9A CN106304668B (zh) | 2016-10-31 | 2016-10-31 | 一种采用增强型半加成法制作印制线路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106304668A CN106304668A (zh) | 2017-01-04 |
CN106304668B true CN106304668B (zh) | 2019-03-05 |
Family
ID=57719116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610930029.9A Active CN106304668B (zh) | 2016-10-31 | 2016-10-31 | 一种采用增强型半加成法制作印制线路板的制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN106304668B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106735922B (zh) * | 2017-01-16 | 2018-10-09 | 深圳顺络电子股份有限公司 | 一种叠层电子元件及其制备方法 |
CN106852003A (zh) * | 2017-04-06 | 2017-06-13 | 宜兴硅谷电子科技有限公司 | 一种无抗蚀层精细线路板的制作方法 |
CN107658117A (zh) * | 2017-09-30 | 2018-02-02 | 麦格磁电科技(珠海)有限公司 | 一种无线充电线圈及其制作方法 |
JP7063101B2 (ja) * | 2018-05-11 | 2022-05-09 | 住友電気工業株式会社 | プリント配線板及びプリント配線板の製造方法 |
CN108419376B (zh) * | 2018-05-14 | 2022-02-18 | 星河电路(福建)有限公司 | 一种选择性局部电镀高厚铜pcb板的制作方法 |
CN109152229A (zh) * | 2018-10-22 | 2019-01-04 | 台山市精诚达电路有限公司 | 一种挠性线路板的制作方法 |
CN110402034B (zh) * | 2019-07-29 | 2023-01-24 | 吴大伟 | 一种提高pcb图形电镀面均性的方法 |
CN111243965B (zh) * | 2020-01-16 | 2023-02-03 | 深圳市志金电子有限公司 | 封装基板制备方法 |
CN111278229B (zh) * | 2020-03-20 | 2023-07-04 | 盐城维信电子有限公司 | 一种音圈马达柔性线路板的制备方法 |
US20220322530A1 (en) * | 2020-04-24 | 2022-10-06 | HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | Circuit board and preparation method thereof |
CN112752439A (zh) * | 2021-01-20 | 2021-05-04 | 惠州市金百泽电路科技有限公司 | 一种用于制作高密度互连线路板的方法 |
CN113613399A (zh) * | 2021-07-21 | 2021-11-05 | 深圳市景旺电子股份有限公司 | 电路板制作方法及电路板 |
CN117833497A (zh) * | 2022-09-29 | 2024-04-05 | 华为技术有限公司 | 充电线圈模组及其相关产品、充电线圈模组的制备方法 |
CN115460781A (zh) * | 2022-09-29 | 2022-12-09 | 苏州浪潮智能科技有限公司 | 一种阻抗控制的pcb设计制作方法及pcb板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102711385A (zh) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | 一种加成法制作线路板的方法 |
CN104113994A (zh) * | 2013-04-22 | 2014-10-22 | 上海美维科技有限公司 | 一种采用新型改良的半加成法制作印制电路板的方法 |
CN105430929A (zh) * | 2015-11-19 | 2016-03-23 | 东莞森玛仕格里菲电路有限公司 | 一种局部厚铜pcb的制作方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5249870B2 (ja) * | 2009-07-17 | 2013-07-31 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
-
2016
- 2016-10-31 CN CN201610930029.9A patent/CN106304668B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102711385A (zh) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | 一种加成法制作线路板的方法 |
CN104113994A (zh) * | 2013-04-22 | 2014-10-22 | 上海美维科技有限公司 | 一种采用新型改良的半加成法制作印制电路板的方法 |
CN105430929A (zh) * | 2015-11-19 | 2016-03-23 | 东莞森玛仕格里菲电路有限公司 | 一种局部厚铜pcb的制作方法 |
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CN106304668A (zh) | 2017-01-04 |
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SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
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Effective date of registration: 20190125 Address after: 511458 East Second Ladder, Second Floor, South 63 Huanshi Avenue, Nansha District, Guangzhou City, Guangdong Province Applicant after: NEW CAREER GUANGZHOU ELECTRONICS CO.,LTD. Address before: 215129 No. 188 Lushan Road, Suzhou High-tech Zone, Jiangsu Province Applicant before: AKM ELECTRONICS TECHNOLOGY (SUZHOU) Co.,Ltd. |
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Effective date of registration: 20191128 Address after: Room A107, research building a, high tech think tank center, Nanhai software technology park, Shishan town, Nanhai District, Foshan City, Guangdong Province Patentee after: Guangdong fozhixin microelectronics technology research Co.,Ltd. Address before: 511458, Guangdong, Nansha District, Guangzhou Ring Road No. 63, south two, east two ladder Patentee before: NEW CAREER GUANGZHOU ELECTRONICS CO.,LTD. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A manufacturing method of printed circuit board using enhanced semi additive method Effective date of registration: 20201224 Granted publication date: 20190305 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20190305 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong Xinhua Microelectronics Technology Co.,Ltd.|Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |