JP2001288247A5 - - Google Patents

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Publication number
JP2001288247A5
JP2001288247A5 JP2000104284A JP2000104284A JP2001288247A5 JP 2001288247 A5 JP2001288247 A5 JP 2001288247A5 JP 2000104284 A JP2000104284 A JP 2000104284A JP 2000104284 A JP2000104284 A JP 2000104284A JP 2001288247 A5 JP2001288247 A5 JP 2001288247A5
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JP
Japan
Prior art keywords
weight
reaction
parts
synthesis example
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000104284A
Other languages
English (en)
Japanese (ja)
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JP2001288247A (ja
JP4588834B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2000104284A external-priority patent/JP4588834B2/ja
Priority to JP2000104284A priority Critical patent/JP4588834B2/ja
Priority to TW089121178A priority patent/TW555809B/zh
Priority to US09/688,033 priority patent/US6524709B1/en
Priority to KR1020000069395A priority patent/KR100564814B1/ko
Priority to CNB2005100999100A priority patent/CN100432130C/zh
Priority to CNB001373110A priority patent/CN1240772C/zh
Priority to DE60036856T priority patent/DE60036856T2/de
Priority to AT00126572T priority patent/ATE376565T1/de
Priority to EP00126572A priority patent/EP1142921B1/en
Priority to DK00126572T priority patent/DK1142921T3/da
Publication of JP2001288247A publication Critical patent/JP2001288247A/ja
Priority to HK02101848.0A priority patent/HK1040410B/xx
Priority to US10/359,205 priority patent/US6933050B2/en
Publication of JP2001288247A5 publication Critical patent/JP2001288247A5/ja
Publication of JP4588834B2 publication Critical patent/JP4588834B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000104284A 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板 Expired - Lifetime JP4588834B2 (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板
TW089121178A TW555809B (en) 2000-04-06 2000-10-11 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multilayer board
US09/688,033 US6524709B1 (en) 2000-04-06 2000-10-12 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
KR1020000069395A KR100564814B1 (ko) 2000-04-06 2000-11-22 인 함유 에폭시 수지조성물 및 그 인 함유 에폭시 수지를사용하는 난연성 수지시트, 수지부착 금속박, 프리프레그및 적층판, 다층판
CNB2005100999100A CN100432130C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用
CNB001373110A CN1240772C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用
EP00126572A EP1142921B1 (en) 2000-04-06 2000-12-12 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
AT00126572T ATE376565T1 (de) 2000-04-06 2000-12-12 Phosphor enthaltende epoxidharzzusammensetzung, verbundfolie die diese enthält, mehrschichtwerkstoff aus metall, prepreg und laminierte platte, mehrschichtplatte
DE60036856T DE60036856T2 (de) 2000-04-06 2000-12-12 Phosphor enthaltende Epoxidharzzusammensetzung, Verbundfolie die diese enthält, Mehrschichtwerkstoff aus Metall, Prepreg und laminierte Platte, Mehrschichtplatte
DK00126572T DK1142921T3 (da) 2000-04-06 2000-12-12 Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade
HK02101848.0A HK1040410B (en) 2000-04-06 2002-03-11 Epoxy resin compositions containing phosphorus and the uses thereof
US10/359,205 US6933050B2 (en) 2000-04-06 2003-02-06 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板

Publications (3)

Publication Number Publication Date
JP2001288247A JP2001288247A (ja) 2001-10-16
JP2001288247A5 true JP2001288247A5 (https=) 2007-02-22
JP4588834B2 JP4588834B2 (ja) 2010-12-01

Family

ID=18617859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000104284A Expired - Lifetime JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板

Country Status (9)

Country Link
US (2) US6524709B1 (https=)
EP (1) EP1142921B1 (https=)
JP (1) JP4588834B2 (https=)
KR (1) KR100564814B1 (https=)
CN (2) CN100432130C (https=)
AT (1) ATE376565T1 (https=)
DE (1) DE60036856T2 (https=)
DK (1) DK1142921T3 (https=)
TW (1) TW555809B (https=)

Families Citing this family (47)

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JP4837175B2 (ja) * 2001-02-23 2011-12-14 新日鐵化学株式会社 リン含有エポキシ樹脂組成物
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AU2003226414A1 (en) * 2002-05-30 2003-12-19 Dow Global Technologies, Inc. Halogen free ignition resistant thermoplastic resin compositions
US7141627B2 (en) * 2002-10-31 2006-11-28 Dainippon Ink And Chemicals, Inc. Epoxy resin composition
SG110189A1 (en) * 2003-09-26 2005-04-28 Japan Epoxy Resins Co Ltd Epoxy compound, preparation method thereof, and use thereof
TWI346111B (en) * 2004-02-09 2011-08-01 Nippon Kayaku Kk Photosensitive resin composition and products of cured product thereof
TWI285297B (en) * 2004-02-09 2007-08-11 Chi Mei Corp Light-sensitive resin composition for black matrix
CN100384932C (zh) * 2004-10-11 2008-04-30 广东生益科技股份有限公司 一种热固性树脂组合物以及使用它的预浸料、印刷电路用层压板
EP1814949B1 (en) * 2004-11-26 2009-11-04 LG Chem, Ltd. Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
KR100587483B1 (ko) * 2005-03-11 2006-06-09 국도화학 주식회사 난연성 고내열 에폭시수지 조성물
JP2006342217A (ja) * 2005-06-07 2006-12-21 Sanko Kk リン含有難燃性ビスフェノール型エポキシ樹脂の製造方法並びにリン含有難燃性ビスフェノール型エポキシ樹脂及びリン含有難燃性ビスフェノール型エポキシ樹脂組成物
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JP4244975B2 (ja) * 2005-08-26 2009-03-25 パナソニック電工株式会社 プリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板
KR20080078848A (ko) * 2005-12-22 2008-08-28 다우 글로벌 테크놀로지스 인크. 혼합 촉매 시스템을 함유하는 경화성 에폭시 수지 조성물및 이로부터 제조된 적층물
JP2007291227A (ja) * 2006-04-25 2007-11-08 Toto Kasei Co Ltd 難燃性炭素繊維強化複合材料
JP5334373B2 (ja) * 2007-03-05 2013-11-06 新日鉄住金化学株式会社 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物
TWI342322B (en) * 2007-03-28 2011-05-21 Grand Tek Advance Material Science Co Ltd Halogen-free flame retardant epoxy resin composition, prepreg, and copper clad laminate
TWI347330B (en) * 2007-04-23 2011-08-21 Ind Tech Res Inst Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphor
CN101679602B (zh) * 2007-05-18 2013-04-17 新日铁住金化学株式会社 阻燃性环氧树脂、以该环氧树脂作为必要组分的环氧树脂组合物及其固化物
KR100877342B1 (ko) * 2007-09-13 2009-01-07 삼성전기주식회사 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
CN102203176A (zh) * 2008-10-29 2011-09-28 Icl-Ip美国公司 含磷阻燃环氧树脂组合物、其预浸料和层压板
JP5399733B2 (ja) * 2009-02-16 2014-01-29 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
RU2420547C2 (ru) * 2009-03-26 2011-06-10 Общество с ограниченной ответственностью "Научно-технологический испытательный центр АпАТэК-Дубна" (ООО "НТИЦ АпАТэК-Дубна") Способ получения связующего для препрега (варианты), связующее для препрега (варианты), препрег и изделие
WO2010109948A1 (ja) * 2009-03-26 2010-09-30 パナソニック電工株式会社 エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔、樹脂シート、積層板、および多層板
JP5441477B2 (ja) * 2009-04-01 2014-03-12 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
KR101803115B1 (ko) * 2010-05-31 2017-11-29 히타치가세이가부시끼가이샤 프리프레그, 금속 피복 적층판 및 인쇄 배선판
JP5579008B2 (ja) * 2010-09-29 2014-08-27 新日鉄住金化学株式会社 リン含有エポキシ樹脂
TWI408143B (zh) * 2010-11-03 2013-09-11 Univ Nat Chunghsing 具有不對稱磷系雙酚結構之化合物、其環氧樹脂半固化物衍生物及其一鍋化製造方法
CA2826672A1 (en) * 2011-02-16 2012-08-23 Mitsubishi Rayon Co., Ltd. Epoxy resin composition, prepreg, and fiber-reinforced composite material
KR102038173B1 (ko) 2012-06-15 2019-10-29 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 인 함유 에폭시 수지 및 그 에폭시 수지를 필수성분으로 하는 조성물, 경화물
JP5786839B2 (ja) * 2012-12-05 2015-09-30 株式会社デンソー エポキシ樹脂組成物および接着構造体の製造方法
CN103059265A (zh) * 2013-01-20 2013-04-24 安徽善孚新材料科技有限公司 一种含萘环结构无卤阻燃环氧树脂及其制备方法
CN105358624B (zh) * 2013-07-04 2017-06-06 松下知识产权经营株式会社 树脂组合物、预浸料和层压板
TWI667276B (zh) 2014-05-29 2019-08-01 美商羅傑斯公司 具改良耐燃劑系統之電路物質及由其形成之物件
JPWO2016121758A1 (ja) * 2015-01-29 2017-11-09 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、樹脂シート及びプリプレグ
CN104987664B (zh) * 2015-06-26 2018-02-09 四川东材科技集团股份有限公司 一种特高压直流输变电用绝缘层、模压结构件及其制备方法
US10233365B2 (en) 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
JP6793517B2 (ja) * 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ
JP2019178233A (ja) 2018-03-30 2019-10-17 日鉄ケミカル＆マテリアル株式会社 リン含有ビニル樹脂を含む低誘電難燃性組成物
JP2020122034A (ja) 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
WO2021044946A1 (ja) 2019-09-06 2021-03-11 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
TW202340312A (zh) 2022-02-22 2023-10-16 日商松下知識產權經營股份有限公司 樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板
KR20250160125A (ko) 2023-03-22 2025-11-11 파나소닉 아이피 매니지먼트 가부시키가이샤 수지 조성물, 프리프레그, 수지 부가 필름, 수지 부가 금속박, 금속 클래드 적층판, 및 프린트 배선판

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