IL149489A0 - Method and device for producing a soldered joint - Google Patents

Method and device for producing a soldered joint

Info

Publication number
IL149489A0
IL149489A0 IL14948900A IL14948900A IL149489A0 IL 149489 A0 IL149489 A0 IL 149489A0 IL 14948900 A IL14948900 A IL 14948900A IL 14948900 A IL14948900 A IL 14948900A IL 149489 A0 IL149489 A0 IL 149489A0
Authority
IL
Israel
Prior art keywords
component
solder material
producing
soldered joint
cooled
Prior art date
Application number
IL14948900A
Other languages
English (en)
Original Assignee
Pink Gmbh Vakuumtechnik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pink Gmbh Vakuumtechnik filed Critical Pink Gmbh Vakuumtechnik
Publication of IL149489A0 publication Critical patent/IL149489A0/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Heat Treatment Of Articles (AREA)
  • Tunnel Furnaces (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Coating With Molten Metal (AREA)
IL14948900A 1999-11-08 2000-11-02 Method and device for producing a soldered joint IL149489A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19953654A DE19953654A1 (de) 1999-11-08 1999-11-08 Verfahren und Vorrichtung zur Herstellung einer Lotverbindung
PCT/DE2000/003848 WO2001034334A1 (de) 1999-11-08 2000-11-02 Verfahren und vorrichtung zur herstellung einer lotverbindung

Publications (1)

Publication Number Publication Date
IL149489A0 true IL149489A0 (en) 2002-11-10

Family

ID=7928273

Family Applications (2)

Application Number Title Priority Date Filing Date
IL14948900A IL149489A0 (en) 1999-11-08 2000-11-02 Method and device for producing a soldered joint
IL149489A IL149489A (he) 1999-11-08 2002-05-06 שיטה והתקן לייצור חיבור מולחם

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL149489A IL149489A (he) 1999-11-08 2002-05-06 שיטה והתקן לייצור חיבור מולחם

Country Status (19)

Country Link
US (1) US6796483B1 (he)
EP (1) EP1233841B1 (he)
JP (1) JP4727110B2 (he)
KR (1) KR100645984B1 (he)
CN (1) CN1275730C (he)
AT (1) ATE297829T1 (he)
AU (1) AU779191B2 (he)
CA (1) CA2390498C (he)
CZ (1) CZ302495B6 (he)
DE (2) DE19953654A1 (he)
DK (1) DK1233841T3 (he)
ES (1) ES2243338T3 (he)
HU (1) HU225907B1 (he)
IL (2) IL149489A0 (he)
MX (1) MXPA02004579A (he)
NO (1) NO323074B1 (he)
PL (1) PL194904B1 (he)
PT (1) PT1233841E (he)
WO (1) WO2001034334A1 (he)

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JP3770238B2 (ja) * 2002-03-22 2006-04-26 セイコーエプソン株式会社 電子デバイス製造装置および電子デバイスの製造方法
DE10304774B3 (de) * 2003-02-05 2004-07-15 Pink Gmbh Vakuumtechnik Verfahren und Vorrichtung zur Temperaturbeaufschlagung von Werkstücken
JP4537019B2 (ja) * 2003-06-04 2010-09-01 古河スカイ株式会社 アルミニウム材のろう付け方法
DE102004047359B3 (de) * 2004-09-29 2006-01-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Verfahren und Vorrichtung zur Regelung und Überwachung eines Lötprozesses
US7845540B2 (en) * 2005-08-30 2010-12-07 Micron Technology, Inc. Systems and methods for depositing conductive material into openings in microfeature workpieces
DE102006029593A1 (de) * 2006-05-29 2007-12-13 Pink Gmbh Vakuumtechnik Verfahren und Vorrichtung zur Herstellung einer Lotverbindung
JP5488974B2 (ja) 2006-05-29 2014-05-14 キルステン，ソルダリング エージー はんだ付けモジュールと、可動性であり、はんだ付けモジュール内に交換可能に挿入できる、少なくとも１つのはんだ付けステーションを備えるはんだ付け装置、および、はんだ付けステーションを収容する待機ステーション
ES2366237T3 (es) * 2006-05-29 2011-10-18 Pink Gmbh Thermosysteme Procedimiento y dispositivo para el tratamiento térmico, en particular unión por soldadura.
DE102006034600B4 (de) * 2006-07-26 2010-01-14 Infineon Technologies Ag Verfahren zur Herstellung einer Lötverbindung
US7793819B2 (en) 2007-03-19 2010-09-14 Infineon Technologies Ag Apparatus and method for connecting a component with a substrate
US8383429B2 (en) 2007-08-29 2013-02-26 Acm Research (Shanghai) Inc. Method and apparatus for thermal treatment of semiconductor workpieces
DE102008021240B4 (de) * 2008-04-28 2012-11-22 Ersa Gmbh Vorrichtung zur thermischen Behandlung von Werkstücken und Verfahren zur Bestimmung der thermischen Prozessstabilität in einer solchen Vorrichtung
DE102011081606B4 (de) * 2011-08-26 2022-08-04 Infineon Technologies Ag Kühlvorrichtung und Lötanlage
JP5778731B2 (ja) * 2012-09-17 2015-09-16 ピーエスケー・インコーポレーテッド 連続線形熱処理装置の配列
CN102896391B (zh) * 2012-10-15 2015-10-07 泗阳群鑫电子有限公司 一种链式真空炉
DE102014106631B4 (de) 2013-05-10 2021-12-02 Seho Systemtechnik Gmbh Vorrichtung und Verfahren zum Herstellen von Lötverbindungen
US9733130B2 (en) * 2013-05-10 2017-08-15 Illinois Tool Works Inc. Temperature sensor belt
JP2015009262A (ja) * 2013-07-01 2015-01-19 三菱電機株式会社 リフロー装置
HUE041408T2 (hu) * 2014-12-09 2019-05-28 Pink Gmbh Thermosysteme Hõátviteli eszköz elektronikai alkatrészek forrasztásos csatlakozással történõ elõállításához
DE102016103213A1 (de) * 2016-02-24 2017-08-24 Semikron Elektronik Gmbh & Co. Kg Vorrichtung, Verfahren und Anlage zur der inhomogenen Abkühlung eines flächigen Gegenstandes
CN107855623B (zh) * 2017-12-29 2023-07-18 山东才聚电子科技有限公司 一种真空焊接炉控制系统及其控制方法
CN109059543A (zh) * 2018-07-16 2018-12-21 苏州洛特兰新材料科技有限公司 一种用于陶瓷材料生产的工业窑炉
DE102019211212A1 (de) 2019-07-29 2021-02-04 Rehm Thermal Systems Gmbh Mechatronischer Vorhang für eine Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen
CN113543514B (zh) * 2020-04-15 2022-09-23 昆山达菲乐电子产品有限公司 回焊炉
CN115605310A (zh) * 2020-05-15 2023-01-13 平克塞莫系统有限公司（De） 用于连接电子组件的系统
CN115922172B (zh) * 2023-03-14 2023-06-02 无锡昌鼎电子有限公司 一种在线式真空焊接炉组装设备及其组装方法
CN117139941A (zh) * 2023-10-30 2023-12-01 北京中科同志科技股份有限公司 真空系统及其工作方法

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JPS5091031A (he) * 1973-12-17 1975-07-21
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JPH0714353Y2 (ja) * 1988-07-08 1995-04-05 中外炉工業株式会社 ローラハース型熱処理炉
JP2858009B2 (ja) * 1988-08-02 1999-02-17 利光 武者 ゆらぎ照明装置
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DE3843191C2 (de) * 1988-12-22 1994-09-15 Broadcast Television Syst Vorrichtung zum Löten
JP2750747B2 (ja) * 1989-09-20 1998-05-13 日本真空技術株式会社 連続式真空ろう付炉
DE3934103A1 (de) * 1989-10-12 1991-04-25 Ipsen Ind Int Gmbh Ofen zur partiellen waermebehandlung von werkzeugen
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US5128506A (en) * 1990-10-30 1992-07-07 Westinghouse Electric Corp. Method and apparatus for selective infrared soldering using shielding fixtures
CS609090A3 (en) * 1990-12-07 1992-06-17 Vyzk Ustav Zvaracsky Process of cladding metallic materials with a solder foil
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US5147083A (en) * 1991-09-25 1992-09-15 General Motors Corporation Method and apparatus for convection brazing of aluminum heat exchangers
JPH05308186A (ja) * 1991-11-06 1993-11-19 Sanden Corp ろう付加熱装置
JPH05161961A (ja) * 1991-11-14 1993-06-29 Tamura Seisakusho Co Ltd リフロー炉
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JPH07115169B2 (ja) * 1992-08-11 1995-12-13 株式会社サーマル ろう付け連続装置
US5439160A (en) * 1993-03-31 1995-08-08 Siemens Corporate Research, Inc. Method and apparatus for obtaining reflow oven settings for soldering a PCB
US5341978A (en) 1993-08-16 1994-08-30 General Motors Corporation Braze furnace with improved inert gas system
DE4432730A1 (de) 1994-09-14 1996-03-21 Emitec Emissionstechnologie Verfahren zur Herstellung einer metallischen Struktur
JPH08125099A (ja) * 1994-10-28 1996-05-17 Toshiba Corp 半導体装置の製造方法
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JP2793528B2 (ja) 1995-09-22 1998-09-03 インターナショナル・ビジネス・マシーンズ・コーポレイション ハンダ付け方法、ハンダ付け装置
JPH10339377A (ja) * 1997-06-06 1998-12-22 Nec Corp ゲートバルブ
US6039236A (en) * 1997-06-11 2000-03-21 Soltec B.V. Reflow soldering apparatus with improved cooling
JPH1177294A (ja) * 1997-08-28 1999-03-23 Toyota Motor Corp 減圧ロウ付け方法

Also Published As

Publication number Publication date
CZ302495B6 (cs) 2011-06-15
CZ20021603A3 (cs) 2003-05-14
CA2390498C (en) 2009-06-30
CN1275730C (zh) 2006-09-20
DE19953654A1 (de) 2001-05-23
ES2243338T3 (es) 2005-12-01
IL149489A (he) 2006-10-31
ATE297829T1 (de) 2005-07-15
NO20022132L (no) 2002-05-03
PT1233841E (pt) 2005-09-30
CN1387468A (zh) 2002-12-25
NO20022132D0 (no) 2002-05-03
DE50010577D1 (de) 2005-07-21
KR100645984B1 (ko) 2006-11-13
AU779191B2 (en) 2005-01-13
JP2003517376A (ja) 2003-05-27
KR20020062935A (ko) 2002-07-31
WO2001034334A1 (de) 2001-05-17
DK1233841T3 (da) 2005-10-10
CA2390498A1 (en) 2001-05-17
EP1233841B1 (de) 2005-06-15
US6796483B1 (en) 2004-09-28
JP4727110B2 (ja) 2011-07-20
HU225907B1 (en) 2007-12-28
MXPA02004579A (es) 2004-09-10
EP1233841A1 (de) 2002-08-28
NO323074B1 (no) 2006-12-27
PL194904B1 (pl) 2007-07-31
HUP0203145A2 (en) 2002-12-28
AU2501001A (en) 2001-06-06
PL355529A1 (en) 2004-05-04

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