HK1134312A1 - Resin composition, prepreg and laminate using the same - Google Patents

Resin composition, prepreg and laminate using the same

Info

Publication number
HK1134312A1
HK1134312A1 HK10101514A HK10101514A HK1134312A1 HK 1134312 A1 HK1134312 A1 HK 1134312A1 HK 10101514 A HK10101514 A HK 10101514A HK 10101514 A HK10101514 A HK 10101514A HK 1134312 A1 HK1134312 A1 HK 1134312A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
compound
prepreg
resin
multilayer
Prior art date
Application number
HK10101514A
Other languages
English (en)
Inventor
Kenichi Mori
Syouichi Itoh
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of HK1134312A1 publication Critical patent/HK1134312A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/44—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols by oxidation of phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C08G65/485—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2926—Coated or impregnated inorganic fiber fabric
    • Y10T442/2934—Coating or impregnation contains vinyl polymer or copolymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y10T442/3423—Plural metallic films or foils or sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
HK10101514A 2008-02-12 2010-02-10 Resin composition, prepreg and laminate using the same HK1134312A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008030116 2008-02-12
JP2008290803 2008-11-13

Publications (1)

Publication Number Publication Date
HK1134312A1 true HK1134312A1 (en) 2010-04-23

Family

ID=40622167

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10101514A HK1134312A1 (en) 2008-02-12 2010-02-10 Resin composition, prepreg and laminate using the same

Country Status (9)

Country Link
US (2) US8748541B2 (fr)
EP (1) EP2090612B1 (fr)
JP (1) JP5233710B2 (fr)
KR (1) KR101576108B1 (fr)
CN (1) CN101508844B (fr)
DE (1) DE602009000317D1 (fr)
HK (1) HK1134312A1 (fr)
MY (1) MY143997A (fr)
TW (1) TWI448509B (fr)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5276389B2 (ja) * 2008-09-05 2013-08-28 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
KR101668327B1 (ko) * 2009-03-27 2016-10-21 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 수지 용액의 보존방법, 프리프레그 및 적층판의 제조방법
CN101643570B (zh) * 2009-08-24 2011-08-10 广东生益科技股份有限公司 无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板
CN109535926B (zh) * 2010-02-24 2021-06-22 昭和电工材料株式会社 清漆、预浸料片、含有树脂的膜、被覆金属箔的层叠板、印制电路布线板
JP5426477B2 (ja) * 2010-05-24 2014-02-26 パナソニック株式会社 難燃性樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
US10017660B2 (en) * 2010-06-02 2018-07-10 Mitsubishi Gas Chemical Company, Inc. Resin composition, and prepreg and laminated sheet using the same
TWI564341B (zh) * 2010-07-26 2017-01-01 三菱麗陽股份有限公司 樹脂組成物、使用其的預浸體及纖維強化複合材料
US20130260155A1 (en) * 2010-10-29 2013-10-03 Air Water Inc Resin composition, and prepreg and laminate using same
KR20140003453A (ko) * 2010-12-27 2014-01-09 미츠비시 가스 가가쿠 가부시키가이샤 열경화성 수지 조성물
US9318402B2 (en) 2011-03-24 2016-04-19 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and resin sheet and metal foil-clad laminate
CN102250349B (zh) * 2011-04-10 2012-11-21 苏州大学 一种改性双马来酰亚胺/氰酸酯树脂及其制备方法
KR101877088B1 (ko) * 2011-05-31 2018-07-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그 및 적층판
KR101900125B1 (ko) * 2011-07-14 2018-09-18 미츠비시 가스 가가쿠 가부시키가이샤 프린트 배선판용 수지 조성물
US8598281B2 (en) 2011-09-01 2013-12-03 Sabic Innovative Plastics Ip B.V. Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same
CN103013110B (zh) * 2011-09-27 2014-12-17 台光电子材料股份有限公司 无卤素树脂组成物及应用其的铜箔基板及印刷电路板
WO2013047041A1 (fr) 2011-09-30 2013-04-04 三菱瓦斯化学株式会社 Composition de résine, préimprégné et stratifié plaqué par une feuille métallique
CN102443138A (zh) * 2011-10-18 2012-05-09 广东生益科技股份有限公司 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板
CN102516530B (zh) * 2011-12-08 2014-03-12 中山台光电子材料有限公司 一种环氧基改质聚苯醚树脂、树脂组合物及其应用
EP2810971B1 (fr) * 2012-01-31 2018-09-19 Mitsubishi Gas Chemical Company, Inc. Stratifié plaqué par une feuille de métal et carte de circuit imprimé utilisant une composition de résine
CN104070737B (zh) * 2012-03-19 2016-08-17 旭化成株式会社 层压板
CN104169343B (zh) * 2012-03-23 2018-09-14 三菱瓦斯化学株式会社 预浸料和层压板
TWI468465B (zh) 2012-03-23 2015-01-11 Taiwan Union Technology Corp 樹脂組合物及其應用
CN104271671B (zh) * 2012-03-29 2016-11-09 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片和覆金属箔层叠板
CN103509329B (zh) * 2012-06-28 2016-01-20 中山台光电子材料有限公司 低介电树脂组成物及应用其的铜箔基板及印刷电路板
WO2014034103A1 (fr) * 2012-08-29 2014-03-06 パナソニック株式会社 Éther de polyphénylène modifié, procédé pour le préparer, composition de résine d'éther de polyphénylène, vernis de résine, pré-imprégné, stratifié recouvert de métal et carte de circuits imprimés
CN102911502A (zh) * 2012-10-19 2013-02-06 广东生益科技股份有限公司 氰酸酯树脂组合物及使用其制作的预浸料、层压材料与覆金属箔层压材料
JP6022893B2 (ja) * 2012-10-24 2016-11-09 ナミックス株式会社 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
KR101477353B1 (ko) * 2012-11-09 2014-12-29 주식회사 두산 수지 조성물 및 이를 포함하는 인쇄 회로 기판용 적층체
US9455067B2 (en) 2013-03-18 2016-09-27 Iteq Corporation Low dielectric materials
US9245667B2 (en) * 2013-03-18 2016-01-26 Iteq Corporation Circuit board
TWI491671B (zh) * 2013-05-21 2015-07-11 Elite Material Co Ltd Low dielectric halogen-free resin compositions and circuit boards for which they are used
JP2015024945A (ja) * 2013-07-29 2015-02-05 サムソン エレクトロ−メカニックス カンパニーリミテッド． 無機フィラー、およびこれを含む絶縁樹脂組成物、絶縁フィルム、プリプレグ、並びに印刷回路基板
JP6307236B2 (ja) * 2013-09-30 2018-04-04 新日鉄住金化学株式会社 硬化性樹脂組成物、硬化物、電気・電子部品及び回路基板材料
JP6230363B2 (ja) * 2013-10-08 2017-11-15 ナミックス株式会社 フィルム用樹脂組成物、絶縁フィルムおよび半導体装置
KR102136518B1 (ko) * 2013-10-25 2020-07-22 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 적층 시트 및 금속박 피복 적층판
CN110437601B (zh) * 2013-10-31 2022-07-26 松下知识产权经营株式会社 热固性树脂组合物、预浸渍体、覆金属箔层叠板、以及印刷电路板
CN104629341B (zh) * 2013-11-08 2017-01-04 中山台光电子材料有限公司 低介电树脂组合物，应用其的半固化胶片、覆铜箔基板、电路板
KR101556658B1 (ko) * 2013-11-26 2015-10-01 주식회사 두산 내열성 및 저유전 손실 특성을 가진 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
EP3115418B1 (fr) * 2014-03-06 2018-05-23 Mitsubishi Gas Chemical Company, Inc. Composition de résine, préimprégné, feuille de résine, plaque laminée revêtue d'une feuille métallique, et circuit imprimé
WO2015152427A1 (fr) * 2014-04-04 2015-10-08 日立化成株式会社 Dérivé d'éther de polyphénylène comprenant un groupe maléimide n-substitué, et composition de résine thermodurcissable, vernis de résine, préimprégné, stratifié à revêtement métallique, et carte de câblage imprimé multicouche utilisant ledit dérivé d'éther de polyphénylène comprenant un groupe maléimide n-substitué
US20170226302A1 (en) * 2014-09-09 2017-08-10 Panasonic Intellectual Property Management Co., Ltd. Curable composition, prepreg, metal foil with resin, metal-clad laminate and printed wiring board
CN104725828B (zh) 2015-03-04 2017-11-21 广东生益科技股份有限公司 一种树脂组合物以及使用它的预浸料和层压板
TWI591123B (zh) 2015-03-27 2017-07-11 台燿科技股份有限公司 樹脂組合物及其應用
SG11201708808SA (en) * 2015-04-30 2017-12-28 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
CN105038225A (zh) * 2015-07-28 2015-11-11 苏州科淼新材料有限公司 一种高硬度复合板的制备方法
JP6098908B2 (ja) * 2016-01-19 2017-03-22 Dic株式会社 硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及び、ビルドアップフィルム
JP6631834B2 (ja) * 2016-01-26 2020-01-15 パナソニックＩｐマネジメント株式会社 金属張積層板、樹脂付き金属部材、及び配線板
TW201800437A (zh) * 2016-03-01 2018-01-01 新日鐵住金化學股份有限公司 聚（乙烯基芐基）醚化合物與其用途
DE102016207075A1 (de) * 2016-04-26 2017-10-26 Tesa Se Repositionierbares feuchtigkeitshärtendes Klebeband
US10844164B2 (en) 2016-05-24 2020-11-24 Industrial Technology Research Institute Oligomer, composition and composite material employing the same
JP6910590B2 (ja) * 2016-10-12 2021-07-28 三菱瓦斯化学株式会社 プリント配線板用樹脂組成物、プリプレグ、金属箔張積層板、積層樹脂シート、樹脂シート、及びプリント配線板
CN106700475B (zh) * 2016-12-28 2019-03-19 广东生益科技股份有限公司 一种阻燃的聚苯醚树脂组合物
MY195223A (en) * 2017-07-27 2023-01-11 Mitsui Mining & Smelting Co Ltd Resin Composition, Insulating Layer for Wiring Board, and Laminate
JP7054840B2 (ja) * 2017-08-31 2022-04-15 パナソニックＩｐマネジメント株式会社 ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、金属張積層板及び配線基板
JP6998739B2 (ja) * 2017-11-16 2022-02-10 群栄化学工業株式会社 アリル基含有カーボネート樹脂、その製造方法、樹脂ワニス、および積層板の製造方法
US11008420B2 (en) 2018-01-09 2021-05-18 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
CN110066392B (zh) 2018-01-23 2021-10-08 高新特殊工程塑料全球技术有限公司 封端的聚(亚芳基醚)共聚物，其制备方法，以及由其制备的可固化组合物和固化组合物
JP7137950B2 (ja) * 2018-03-28 2022-09-15 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法
WO2019188332A1 (fr) * 2018-03-29 2019-10-03 Dic株式会社 Composition durcissable et produit durci associé
CN112004886A (zh) 2018-04-27 2020-11-27 三菱瓦斯化学株式会社 热固性组合物、预浸料、覆金属箔层叠板、树脂片及印刷布线板
CN108676344A (zh) * 2018-05-16 2018-10-19 江苏兆鋆新材料股份有限公司 一种改性聚碳酸酯、其制成的聚碳酸酯热塑性预浸料及制备方法
EP3805316A4 (fr) * 2018-06-01 2022-04-06 Mitsubishi Gas Chemical Company, Inc. Composition de résine, préimprégné, stratifié revêtu d'une feuille métallique, feuille de résine et carte imprimée
KR20210025526A (ko) 2018-06-27 2021-03-09 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물 및 그 응용
TW202012481A (zh) * 2018-07-20 2020-04-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、以及印刷配線板
US11059938B2 (en) 2018-10-05 2021-07-13 Industrial Technology Research Institute Film composition and a film prepared thereby
TWI745627B (zh) * 2018-10-23 2021-11-11 台燿科技股份有限公司 熱固性樹脂組合物，使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板
CN109749440B (zh) * 2018-12-29 2021-08-27 广东生益科技股份有限公司 氰酸酯树脂组合物及其用途
KR102400111B1 (ko) * 2019-02-08 2022-05-19 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물, 프리프레그 및 금속박 적층판
JP7513587B2 (ja) 2019-02-28 2024-07-09 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
WO2020175537A1 (fr) 2019-02-28 2020-09-03 三菱瓦斯化学株式会社 Composition de résine, préimprégné, carte stratifiée plaquée de feuille métallique, feuille composite de résine, et carte de circuit imprimé
CN111019346B (zh) * 2019-12-26 2022-08-12 艾蒙特成都新材料科技有限公司 一种阻燃高耐热树脂组合物、覆铜板及其制备方法
WO2021172316A1 (fr) 2020-02-25 2021-09-02 三菱瓦斯化学株式会社 Composition de résine, produit durci, préimprégné, carte stratifiée plaquée de feuille métallique, feuille de résine et carte de circuit imprimé
US20230106050A1 (en) 2020-02-25 2023-04-06 Mitsubishi Gas Chemical Company, Inc Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
JP7298518B2 (ja) * 2020-03-06 2023-06-27 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
JP7409262B2 (ja) * 2020-08-24 2024-01-09 味の素株式会社 樹脂組成物
CN112094480B (zh) * 2020-09-22 2023-04-11 苏州生益科技有限公司 一种树脂组合物及使用其制作的半固化片及层压板
WO2022266951A1 (fr) * 2021-06-24 2022-12-29 穗晔实业股份有限公司 Composition de résine thermodurcissable et préimprégné
TWI792365B (zh) 2021-06-24 2023-02-11 穗曄實業股份有限公司 熱固性樹脂組成物以及預浸漬片
CN117836341A (zh) 2021-08-25 2024-04-05 三菱瓦斯化学株式会社 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂片、及印刷电路板
TW202321372A (zh) 2021-11-26 2023-06-01 南亞塑膠工業股份有限公司 樹脂組成物
CN116589900B (zh) * 2022-11-30 2024-03-29 成都虹润制漆有限公司 一种耐高温水性绝缘涂料及其制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956442A (en) * 1987-09-23 1990-09-11 The Dow Chemical Company Process for preparing poly (vinylbenzyl ethers) of polyphenols
JPH10237162A (ja) 1997-02-25 1998-09-08 Nippon Kayaku Co Ltd エポキシ樹脂組成物及び硬化物
KR100486443B1 (ko) * 1997-10-15 2005-04-29 오오쓰까가가꾸가부시끼가이샤 가교 페녹시포스파젠 화합물, 난연제, 난연성 수지 조성물 및 난연성 수지 성형체
JP4544496B2 (ja) 2000-12-14 2010-09-15 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2005089636A (ja) * 2003-09-18 2005-04-07 Mitsubishi Gas Chem Co Inc 積層板用プリプレグ及び積層板
JP2005112981A (ja) 2003-10-07 2005-04-28 Hitachi Chem Co Ltd 低誘電率樹脂組成物およびそれを用いたプリプレグ、金属張積層板、印刷配線板
JP2005120173A (ja) * 2003-10-15 2005-05-12 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物。
US7193019B2 (en) * 2003-10-22 2007-03-20 Mitsubishi Gas Chemical Company, Inc. Process for the production of vinyl compound
US20050182203A1 (en) * 2004-02-18 2005-08-18 Yuuichi Sugano Novel cyanate ester compound, flame-retardant resin composition, and cured product thereof
US20060038324A1 (en) 2004-08-20 2006-02-23 Yeager Gary W Molding method for curable poly(arylene ether) composition and article thereby
JP2006131743A (ja) * 2004-11-05 2006-05-25 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、プリント配線板
JP2007224162A (ja) 2006-02-23 2007-09-06 Matsushita Electric Works Ltd 難燃性樹脂組成物、プリプレグ、樹脂シート、成形品
CN101384638B (zh) 2006-03-07 2012-05-30 住友电木株式会社 密封半导体用环氧树脂组合物及半导体装置
JP5135705B2 (ja) * 2006-04-04 2013-02-06 三菱瓦斯化学株式会社 プリプレグ、金属箔張積層板、プリント配線板
US7601429B2 (en) * 2007-02-07 2009-10-13 Mitsubishi Gas Chemical Company, Inc. Prepreg and laminate
JP5263705B2 (ja) * 2007-02-07 2013-08-14 三菱瓦斯化学株式会社 プリプレグ及び積層板
EP2006318B1 (fr) * 2007-06-18 2014-04-30 Mitsubishi Gas Chemical Company, Inc. Procédé de production de composé de vinyl
JP5384809B2 (ja) * 2007-07-18 2014-01-08 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP5206600B2 (ja) * 2008-06-30 2013-06-12 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、多層プリント配線板、及び半導体装置
JP5276389B2 (ja) * 2008-09-05 2013-08-28 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
JP2010090300A (ja) * 2008-10-09 2010-04-22 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP5749922B2 (ja) * 2010-11-29 2015-07-15 ナミックス株式会社 ウェハレベルアンダーフィル組成物およびそれを用いた半導体装置製造方法

Also Published As

Publication number Publication date
TWI448509B (zh) 2014-08-11
TW200942578A (en) 2009-10-16
US9199434B2 (en) 2015-12-01
MY143997A (en) 2011-07-29
EP2090612A1 (fr) 2009-08-19
US20140235126A1 (en) 2014-08-21
KR101576108B1 (ko) 2015-12-10
US20090203279A1 (en) 2009-08-13
EP2090612B1 (fr) 2010-11-10
JP5233710B2 (ja) 2013-07-10
JP2010138364A (ja) 2010-06-24
CN101508844B (zh) 2013-05-01
CN101508844A (zh) 2009-08-19
KR20090087425A (ko) 2009-08-17
US8748541B2 (en) 2014-06-10
DE602009000317D1 (de) 2010-12-23

Similar Documents

Publication Publication Date Title
HK1134312A1 (en) Resin composition, prepreg and laminate using the same
EP1985654A4 (fr) Composition de résine thermodurcissable comprenant un complexe de type semi-ipn et vernis, préimprégné et feuille de stratifié métallisé utilisant celle-ci
TW200742520A (en) Resin composition, resin film, coverlay film, interlayer adhesive, metal clad laminate, and multilayer printer circuit board
EP2194098A4 (fr) Composition de résine époxy, préimprégné utilisant la composition de résine époxy, stratifié plaqué de métal et carte imprimée
EP3919566A4 (fr) Composition de résine thermodurcissable, préimprégné contenant celle-ci, stratifié revêtu d'une feuille métallique et carte de circuit imprimé
HK1165816A1 (en) Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
EP2070963A4 (fr) Composition de résine époxy pour tableau de connexions imprimé, vernis de composition de résine, pré-imprégné, feuilleté à revêtement métallique, tableau de connexions imprimé et tableau de connexions imprimé multicouche
EP1731554A4 (fr) Pré-imprégné, panneau stratifié métallisé et carte de circuit imprimé les utilisant
EP2662425A3 (fr) Composition de résine époxy, préimprégné et stratifié revêtu de cuivre fabriqués à partir de ceux-ci
EP1473329A4 (fr) Composition de resine
WO2008111489A1 (fr) Composition de résine adhésive ignifuge, et film adhésif utilisant cette composition
MY164127A (en) Resin composition, prepreg and metal foil-clad laminate
EP2412740A4 (fr) Composition de résine époxy, pré-imprégné, feuille métallique avec résine, feuille de résine, stratifié et carte multicouche
EP1300444A4 (fr) Composition de resine epoxy et objet reticule fabrique a partir de ladite composition
AU2003235203A1 (en) Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards
TW200635985A (en) Modified phenolic resin and its manufacturing method, epoxy resin composition containing the same, and prepreg impregnated with the composition
EP4112294A4 (fr) Composition de résine, produit durci, préimprégné, carte stratifiée revêtue d'un film métallique, feuille de résine et carte de circuit imprimé
MY200914A (en) Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board
EP2562195A4 (fr) Composition de résine époxyde, préimprégné, stratifié à revêtement métallique et carte imprimée
TW200635975A (en) Thermosetting composition for solder resist and cured product thereof
TW200631991A (en) Polyimide resin, polyimide film and polyimide laminate
WO2009072534A1 (fr) Résine naphtalène formaldéhyde modifiée, composé naphtol contenant un squelette tricyclodécane et composé ester
WO2009095347A3 (fr) Procédé de collage de cartes de circuits imprimés flexible avec des matériaux polymères en vue d'obtenir une rigidification partielle ou complète
TW200709923A (en) Double-sided flexible printed circuit board and manufacturing method thereof
EP4112298A4 (fr) Composition de résine, produit durci, préimprégné, carte stratifiée plaquée de feuille métallique, feuille de résine et carte de circuit imprimé

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180212