MY195223A - Resin Composition, Insulating Layer for Wiring Board, and Laminate - Google Patents

Resin Composition, Insulating Layer for Wiring Board, and Laminate

Info

Publication number
MY195223A
MY195223A MYPI2020000925A MYPI2020000925A MY195223A MY 195223 A MY195223 A MY 195223A MY PI2020000925 A MYPI2020000925 A MY PI2020000925A MY PI2020000925 A MYPI2020000925 A MY PI2020000925A MY 195223 A MY195223 A MY 195223A
Authority
MY
Malaysia
Prior art keywords
resin composition
viscosity
laminate
insulating layer
wiring board
Prior art date
Application number
MYPI2020000925A
Inventor
Toshifumi Matsushima
Kazuhiro Oosawa
Takahiro Hongo
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY195223A publication Critical patent/MY195223A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Abstract

A resin composition is provided that is superior in properties such as flame retardance, circuit embeddability and handleability (flexibility), and exhibits a significantly low dielectric dissipation factor. The resin composition contains: a predetermined high-viscosity resin, A, having a viscosity of 8000 Pa?s or more at 120?C; a low-viscosity resin, B, having a viscosity of less than 8000 Pa?s at 120?C; a phosphorus compound, C, represented by the following formula: [Chem. 1] where n is 3 or 4; and a filler, D, which is an organic filler or an inorganic filler.
MYPI2020000925A 2017-07-27 2018-07-13 Resin Composition, Insulating Layer for Wiring Board, and Laminate MY195223A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017145841 2017-07-27
PCT/JP2018/026513 WO2019021862A1 (en) 2017-07-27 2018-07-13 Resin composition, insulating layer for wiring board, and laminate

Publications (1)

Publication Number Publication Date
MY195223A true MY195223A (en) 2023-01-11

Family

ID=65039633

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020000925A MY195223A (en) 2017-07-27 2018-07-13 Resin Composition, Insulating Layer for Wiring Board, and Laminate

Country Status (6)

Country Link
JP (1) JP7219216B2 (en)
KR (1) KR102254544B1 (en)
CN (1) CN110709476A (en)
MY (1) MY195223A (en)
TW (1) TWI739017B (en)
WO (1) WO2019021862A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022054303A1 (en) * 2020-09-11 2022-03-17 パナソニックＩｐマネジメント株式会社 Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
JP2022099778A (en) * 2020-12-23 2022-07-05 日鉄ケミカル＆マテリアル株式会社 Polyimide composition, resin film, laminate, cover lay film, copper foil with resin, metal-clad laminate, and circuit board
CN112795169B (en) * 2020-12-31 2022-07-19 广东生益科技股份有限公司 Resin composition, resin film containing resin composition, prepreg, laminated board, copper-clad plate and printed circuit board

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002114981A (en) * 1997-02-14 2002-04-16 Otsuka Chem Co Ltd Flame-retardant, flame-retardant resin composition and flame-retardant resin molded product
JP2005112981A (en) * 2003-10-07 2005-04-28 Hitachi Chem Co Ltd Low-permittivity resin composition, prepreg using the same, metal-clad laminate, and printed circuit board
JP2007030326A (en) * 2005-07-26 2007-02-08 Matsushita Electric Works Ltd Copper foil with resin, laminate for producing printed wiring boad, and multilayer printed wiring board
JP2007224162A (en) * 2006-02-23 2007-09-06 Matsushita Electric Works Ltd Flame-retardant resin composition, prepreg, resin sheet, and molded product
JP2009078209A (en) * 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd Metal foil bearing resin, method for manufacturing the same, and metal-coated flexible laminated sheet
JP5493347B2 (en) 2008-01-17 2014-05-14 東洋インキＳｃホールディングス株式会社 Flame retardant resin composition
JP5233710B2 (en) * 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 Resin composition, prepreg and metal foil-clad laminate
JP5093059B2 (en) * 2008-11-06 2012-12-05 日立化成工業株式会社 Resin composition, prepreg, laminate and printed circuit board
JP2010168487A (en) * 2009-01-23 2010-08-05 Nippon Zeon Co Ltd Polymerizable composition, crosslinked body, and crosslinked resin composite object
WO2011093079A1 (en) * 2010-01-28 2011-08-04 三井化学株式会社 Metal-resin composite
JP2011162615A (en) * 2010-02-05 2011-08-25 Kyocera Chemical Corp Prepreg and metal-clad laminated plate
JP5791983B2 (en) * 2011-07-07 2015-10-07 三井化学株式会社 Resin composition, polyimide metal laminate using the same, and substrate for electronic circuit
WO2013105650A1 (en) * 2012-01-11 2013-07-18 三井金属鉱業株式会社 Copper foil with adhesive layer, copper-clad laminate and printed wiring board
JP5901066B2 (en) * 2012-04-27 2016-04-06 三井金属鉱業株式会社 Resin composition, metal foil with resin layer, metal-clad laminate and printed wiring board
JP6062667B2 (en) * 2012-06-15 2017-01-18 旭化成株式会社 Curable resin composition
JP6364202B2 (en) * 2014-02-24 2018-07-25 矢崎総業株式会社 Molding machine and molding method
WO2015133292A1 (en) 2014-03-06 2015-09-11 三菱瓦斯化学株式会社 Resin composition, prepreg, resin sheet, metal-foil-clad laminated plate, and printed wiring board
JP6379675B2 (en) * 2014-05-28 2018-08-29 日立化成株式会社 Thermosetting resin composition, prepreg, film with resin, laminate, multilayer printed wiring board, and semiconductor package
KR101676804B1 (en) * 2014-06-03 2016-11-17 미쓰이금속광업주식회사 Metal foil with releasing resin layer, and printed wiring board
WO2016147984A1 (en) * 2015-03-13 2016-09-22 京セラ株式会社 Resin composition, prepreg, metal-clad laminate, and wiring board
JP2016191029A (en) * 2015-03-31 2016-11-10 新日鉄住金化学株式会社 Polyamide acid composition, polyimide, resin film, and metal-clad laminate
CN107849429B (en) * 2015-08-19 2021-06-25 东洋纺株式会社 Low dielectric adhesive composition
JP6675183B2 (en) * 2015-11-30 2020-04-01 ナミックス株式会社 Thermosetting resin composition, thermosetting resin film, printed wiring board, and semiconductor device
WO2017098969A1 (en) * 2015-12-07 2017-06-15 三井金属鉱業株式会社 Method for manufacturing layered body, and metal foil provided with resin layer

Also Published As

Publication number Publication date
JPWO2019021862A1 (en) 2020-05-28
TW201910411A (en) 2019-03-16
WO2019021862A1 (en) 2019-01-31
KR20190133787A (en) 2019-12-03
TWI739017B (en) 2021-09-11
KR102254544B1 (en) 2021-05-24
JP7219216B2 (en) 2023-02-07
CN110709476A (en) 2020-01-17

Similar Documents

Publication Publication Date Title
MY195223A (en) Resin Composition, Insulating Layer for Wiring Board, and Laminate
MY145442A (en) Fire retardant compositions using siloxanes
MY176105A (en) Thermosetting resin composition, cured product obtained therefrom, and active ester resin for use therein
SG10201903484XA (en) Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
MX2016000309A (en) Intumescent composition.
WO2009041137A1 (en) Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
MY161045A (en) Resin composition for forming adhesive layer of multilayer flexible printed wiring board, resin varnish, resin coated copper foil, method for manufacturing resin coated copper foil for manufacturing multilayer flexible printed wiring board, and multilayer flexible printed wiring board
ATE549378T1 (en) HALOGEN-FREE FLAME RETARDANT RESIN COMPOSITION AND PREPREG, LAMINATE AND CIRCUIT BOARD LAMINATE THEREOF
TW200641034A (en) Composition
MY150635A (en) Resin composition and resin coated copper foil obtained by using the resin composition
WO2010114279A3 (en) Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition
MY167826A (en) Prepreg and laminated board
MY169978A (en) Low dielectric loss thermoset resin system at high frequency for use in electrical components
MX2015016482A (en) Formulated polyurethane resin compositions for flood coating electronic circuit assemblies.
EP2662395A3 (en) Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
WO2007100724A3 (en) A halogen-free phosphorous epoxy resin composition
WO2012044029A3 (en) Laminate comprising an epoxy resin and having superior formability, and method for producing same
TW201612143A (en) Composition for forming electrically conductive film, electrically conductive film, organic thin-film transistor, electronic paper, display device and wiring board
MY191021A (en) Epoxy resin, epoxy resin composition, cured product and electrical or electronic component
TW200736292A (en) Epoxy resin composition
BR112022004434A2 (en) Fire-retardant aqueous composition comprising particles dispersed in aqueous phase, fire-retardant aqueous coating composition, and substrate
WO2005033161A3 (en) Epoxy resin compositions, processes utilzing same and articles made therefrom
EP3412722A4 (en) Halogen-free thermosetting resin composition, prepreg containing same, laminate, and printed circuit board
SA519400944B1 (en) An insulating resin composition for a DC power cable
EP3395874A3 (en) Coated conductor with voltage-stabilized inner layer