HK1116208A1 - Silicone composition for encapsulating luminescent element and luminescent device - Google Patents

Silicone composition for encapsulating luminescent element and luminescent device

Info

Publication number
HK1116208A1
HK1116208A1 HK08106451A HK08106451A HK1116208A1 HK 1116208 A1 HK1116208 A1 HK 1116208A1 HK 08106451 A HK08106451 A HK 08106451A HK 08106451 A HK08106451 A HK 08106451A HK 1116208 A1 HK1116208 A1 HK 1116208A1
Authority
HK
Hong Kong
Prior art keywords
sio
vinyl group
bonded
silicon atom
amount
Prior art date
Application number
HK08106451A
Other languages
English (en)
Inventor
Kikuo Mochizuki
Nobuo Hirai
Original Assignee
Momentive Performance Mat Jp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36692063&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1116208(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Momentive Performance Mat Jp filed Critical Momentive Performance Mat Jp
Publication of HK1116208A1 publication Critical patent/HK1116208A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK08106451A 2005-01-24 2008-06-11 Silicone composition for encapsulating luminescent element and luminescent device HK1116208A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005015263 2005-01-24
PCT/JP2005/013451 WO2006077667A1 (ja) 2005-01-24 2005-07-22 発光素子封止用シリコーン組成物及び発光装置

Publications (1)

Publication Number Publication Date
HK1116208A1 true HK1116208A1 (en) 2008-12-19

Family

ID=36692063

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08106451A HK1116208A1 (en) 2005-01-24 2008-06-11 Silicone composition for encapsulating luminescent element and luminescent device

Country Status (8)

Country Link
US (2) US8293849B2 (xx)
EP (2) EP2955206A1 (xx)
JP (2) JP5705396B2 (xx)
KR (1) KR101158955B1 (xx)
CN (1) CN101107324B (xx)
HK (1) HK1116208A1 (xx)
TW (1) TWI277635B (xx)
WO (1) WO2006077667A1 (xx)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5247979B2 (ja) * 2005-06-01 2013-07-24 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 透明な硬化物を与えるポリオルガノシロキサン組成物
JP2007063538A (ja) * 2005-08-03 2007-03-15 Shin Etsu Chem Co Ltd 発光ダイオード用付加硬化型シリコーン樹脂組成物
JP2007246880A (ja) * 2006-02-20 2007-09-27 Matsushita Electric Works Ltd 半導体光装置及び透明光学部材
EP2083049B1 (en) * 2006-10-19 2013-09-11 Momentive Performance Materials Japan LLC Curable polyorganosiloxane composition
JP2008115302A (ja) * 2006-11-06 2008-05-22 Kaneka Corp シリコーン系重合体粒子を含有する光学材料用シリコーン系組成物
WO2008065787A1 (en) * 2006-11-27 2008-06-05 Panasonic Electric Works Co., Ltd. Optical semiconductor device and transparent optical member
JP5210881B2 (ja) * 2006-11-27 2013-06-12 パナソニック株式会社 半導体光装置及び透明光学部材
WO2008065786A1 (fr) * 2006-11-27 2008-06-05 Panasonic Electric Works Co., Ltd. Dispositif optique à semiconducteur et élément optique transparent
JP5210880B2 (ja) * 2006-11-27 2013-06-12 パナソニック株式会社 半導体光装置及び透明光学部材
ATE513879T1 (de) * 2007-02-07 2011-07-15 Dow Corning Toray Co Ltd Flüssige silikon-gummi-zusammensetzung zur formung eines schwamms und daraus hergestellter silikon-gummi-schwamm
JP2008222828A (ja) * 2007-03-12 2008-09-25 Momentive Performance Materials Japan Kk 凸レンズ形成用シリコーンゴム組成物及びそれを用いた光半導体装置
TWI458780B (zh) * 2007-07-31 2014-11-01 Dow Corning Toray Co Ltd 提供高透明矽酮硬化物之硬化性矽酮組合物
JP5211059B2 (ja) * 2007-08-17 2013-06-12 パナソニック株式会社 半導体光装置及び透明光学部材
CN101230197B (zh) * 2007-12-20 2011-01-19 宁波安迪光电科技有限公司 用于制造发光二极管封装用胶水的有机硅组合物
JP5149022B2 (ja) * 2008-01-25 2013-02-20 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体封止用シリコーン組成物及びそれを用いた光半導体装置
EP2311912B1 (en) * 2008-07-31 2017-11-15 Dow Corning Toray Co., Ltd. Multi-component sponge-forming liquid silicone rubber composition and silicone rubber sponge manufacturing method
JP5475296B2 (ja) 2009-02-02 2014-04-16 東レ・ダウコーニング株式会社 高透明のシリコーン硬化物を与える硬化性シリコーン組成物
JP5475295B2 (ja) 2009-02-02 2014-04-16 東レ・ダウコーニング株式会社 高透明のシリコーン硬化物を与える硬化性シリコーン組成物
JP5568240B2 (ja) * 2009-02-02 2014-08-06 東レ・ダウコーニング株式会社 硬化性シリコーンゴム組成物
US20100289055A1 (en) * 2009-05-14 2010-11-18 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Silicone leaded chip carrier
CN101712800B (zh) * 2009-11-06 2012-10-03 陈俊光 大功率led的有机硅树脂封装料及其制备方法
CN101717584B (zh) * 2009-11-20 2012-01-25 陈俊光 大功率led的有机硅凝胶封装料及其制备方法
JP5549568B2 (ja) 2009-12-15 2014-07-16 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び当該組成物で封止した光半導体装置
ES2529616T3 (es) * 2009-12-29 2015-02-23 Dow Corning Toray Co., Ltd. Composición de caucho de silicona líquida endurecible para conformar un elemento de sellado y elemento de sellado
JP5519774B2 (ja) * 2010-03-23 2014-06-11 株式会社朝日ラバー シリコーン樹脂製反射基材、その製造方法、及びその反射基材に用いる原材料組成物
WO2011136302A1 (ja) * 2010-04-28 2011-11-03 三菱化学株式会社 半導体発光装置用パッケージ及び発光装置
KR101277722B1 (ko) 2010-07-14 2013-06-24 제일모직주식회사 하이브리드 실록산 중합체, 상기 하이브리드 실록산 중합체로부터 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자
JP2012049519A (ja) * 2010-07-26 2012-03-08 Mitsubishi Chemicals Corp 半導体発光装置用パッケージ及び発光装置
CN101974228B (zh) * 2010-10-11 2012-12-05 广州亿锘有机硅技术有限公司 一种发光元件封装用有机硅胶材料及其制备方法
CN102115605B (zh) * 2010-12-23 2013-12-04 东莞市良展有机硅科技有限公司 一种封装硅胶的制备方法、制品及其应用
JP6300218B2 (ja) 2010-12-31 2018-03-28 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. 封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子
CN103547632A (zh) * 2011-07-14 2014-01-29 积水化学工业株式会社 光半导体装置用密封剂及光半导体装置
JP5839880B2 (ja) * 2011-08-04 2016-01-06 日東電工株式会社 シリコーン樹脂組成物、封止材料および発光ダイオード装置
JP6057503B2 (ja) * 2011-09-21 2017-01-11 東レ・ダウコーニング株式会社 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子
EP2752459B1 (en) * 2011-12-08 2017-11-15 Momentive Performance Materials Japan LLC Hydrosilylation-curable silicone rubber composition
KR101946914B1 (ko) 2012-06-08 2019-02-12 엘지이노텍 주식회사 발광소자, 발광소자 패키지 및 라이트 유닛
CN104662068A (zh) 2012-08-02 2015-05-27 汉高股份有限公司 聚碳硅烷和包含其的用于led封装剂的可固化组合物
EP2880095B1 (en) 2012-08-02 2017-03-29 Henkel AG & Co. KGaA Curable compositions for led encapsulants comprising a polycarbosilane and a hydrosilicone
CN104662100B (zh) * 2012-09-27 2017-06-30 迈图高新材料日本合同公司 光半导体元件密封用有机硅组合物以及光半导体装置
JP5851970B2 (ja) * 2012-10-29 2016-02-03 信越化学工業株式会社 シリコーン樹脂組成物、並びにこれを用いたシリコーン積層基板とその製造方法、及びｌｅｄ装置
WO2014084624A1 (ko) * 2012-11-30 2014-06-05 코오롱생명과학 주식회사 광디바이스용 경화형 투명 실리콘 조성물
WO2014088451A1 (ru) * 2012-12-06 2014-06-12 Vishnyakov Anatoly Vasilyevich Способ получения модифицированных трехцветных светодиодных источников белого света
CN103013433B (zh) * 2012-12-27 2014-04-09 广州天赐有机硅科技有限公司 一种高透明、高折光、自粘结的有机硅材料及其制备方法
KR20140103696A (ko) * 2013-02-19 2014-08-27 한국다우코닝(주) 인광체-함유 경화성 실리콘 조성물 및 이로부터 제조된 경화성 핫멜트 필름
JP6010503B2 (ja) * 2013-05-14 2016-10-19 信越化学工業株式会社 硬化性樹脂組成物、その硬化物及び光半導体デバイス
CN103320087A (zh) * 2013-06-03 2013-09-25 曹坚林 一种液体光学透明有机硅材料及其制备方法
CN105440694B (zh) * 2014-08-27 2018-01-23 广州慧谷化学有限公司 有机聚硅氧烷组合物及其制备方法及半导体器件
EP3213006B1 (en) * 2014-10-28 2020-06-24 Maxheat Hot Water Pty Ltd. Hot water storage device
CN107001803B (zh) * 2014-12-18 2021-02-26 迈图高新材料日本合同公司 阻燃性聚有机硅氧烷组合物、阻燃性固化物、光学用部件、光源用透镜或盖子以及成型方法
CN105778515A (zh) 2014-12-26 2016-07-20 广东生益科技股份有限公司 一种无卤无磷硅树脂组合物以及使用它的预浸料、层压板、覆铜板以及印制电路板
JP6544962B2 (ja) * 2015-03-27 2019-07-17 東レエンジニアリング株式会社 Ｌｅｄモジュールおよびｌｅｄモジュールの製造方法
JP2017206622A (ja) * 2016-05-19 2017-11-24 株式会社オートネットワーク技術研究所 止水用シリコーンゴム組成物、止水用シリコーンゴム成形体およびワイヤーハーネス
CN106147602A (zh) * 2016-07-27 2016-11-23 天津凯华绝缘材料股份有限公司 一种电子元件封装用有机硅组合物及其制备方法
KR20180034937A (ko) 2016-09-28 2018-04-05 모멘티브퍼포먼스머티리얼스코리아 주식회사 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재
JP6969675B2 (ja) * 2018-04-16 2021-11-24 信越化学工業株式会社 有機ｅｌ用透明乾燥剤及びその使用方法
TW201946976A (zh) * 2018-05-11 2019-12-16 美商陶氏有機矽公司 可固化聚矽氧組成物及其固化產物
TW201946975A (zh) * 2018-05-11 2019-12-16 美商陶氏有機矽公司 用於可撓式顯示器之聚矽氧背板
JP7014745B2 (ja) * 2019-01-29 2022-02-01 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物及び光学素子

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62232460A (ja) 1986-04-01 1987-10-12 Toray Silicone Co Ltd 熱硬化性樹脂組成物
JP3270489B2 (ja) 1991-01-30 2002-04-02 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
US5717010A (en) * 1992-01-23 1998-02-10 General Electric Company Low compression set silicone elastomers
AU5131793A (en) 1992-09-21 1994-04-12 Thermoset Plastics, Inc. Thermoplastic modified, thermosetting polyester encapsulants for microelectronics
GB9317813D0 (en) * 1993-08-27 1993-10-13 Dow Corning Sa Silicone emulsion compositions
JP3553632B2 (ja) * 1994-03-16 2004-08-11 ダウ コーニング アジア株式会社 硬化性オルガノポリシロキサン組成物
JP3615784B2 (ja) * 1994-04-21 2005-02-02 ダウ コーニング アジア株式会社 光学素子用樹脂組成物及び光学素子
JPH1112470A (ja) * 1997-06-25 1999-01-19 Toray Dow Corning Silicone Co Ltd 高電圧電気絶縁部品用液状シリコーンゴム組成物
US6124407A (en) * 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
US6262188B1 (en) 1998-12-23 2001-07-17 General Electric Company Functionalized MQ resin as an adhesion enhancing additive
JP3523098B2 (ja) 1998-12-28 2004-04-26 信越化学工業株式会社 付加硬化型シリコーン組成物
JP3595731B2 (ja) 1999-06-21 2004-12-02 信越化学工業株式会社 半導体装置封止用付加硬化型シリコーン組成物及び半導体装置
CA2385740A1 (en) * 1999-11-30 2001-06-07 Corning O.T.I. Spa Method of fixing a fibre-optic component in an optical device, the optical device so obtained and the polymer composition used therein
CA2406534A1 (en) * 2000-04-21 2002-10-17 Kaneka Corporation Curable composition, composition for optical material, optical material, liquid-crystal display, transparent conductive film, and process for producing the same
JP3910080B2 (ja) * 2001-02-23 2007-04-25 株式会社カネカ 発光ダイオード
JP4880837B2 (ja) * 2001-09-05 2012-02-22 株式会社カネカ 硬化性組成物および硬化物
JP2004002810A (ja) * 2002-04-18 2004-01-08 Kanegafuchi Chem Ind Co Ltd 光学材料用硬化性組成物、光学用材料、光学用材料の製造方法および光学材料を用いた発光ダイオード
JP4360595B2 (ja) * 2002-10-18 2009-11-11 ペルノックス株式会社 光電変換装置
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
US20040138396A1 (en) 2003-01-13 2004-07-15 Gabriel Karim M. Resins and diluents for use in single component low volatile organic
US7160972B2 (en) * 2003-02-19 2007-01-09 Nusil Technology Llc Optically clear high temperature resistant silicone polymers of high refractive index
TW200427111A (en) * 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
JP4766222B2 (ja) 2003-03-12 2011-09-07 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
JP2004323764A (ja) 2003-04-28 2004-11-18 Ge Toshiba Silicones Co Ltd 接着性ポリオルガノシロキサン組成物
JP2004359756A (ja) 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
JP2005008657A (ja) * 2003-06-16 2005-01-13 Ge Toshiba Silicones Co Ltd 低透湿性ポリオルガノシロキサン組成物
TWI373150B (en) * 2003-07-09 2012-09-21 Shinetsu Chemical Co Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
JP4586967B2 (ja) 2003-07-09 2010-11-24 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
US7287573B2 (en) * 2003-09-30 2007-10-30 General Electric Company Silicone binders for investment casting
KR100603247B1 (ko) * 2003-12-31 2006-07-20 동부일렉트로닉스 주식회사 시모스 이미지 센서 및 그 제조방법
JP2006137895A (ja) * 2004-11-15 2006-06-01 Ge Toshiba Silicones Co Ltd 光学材料用ポリオルガノシロキサン組成物

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US8293849B2 (en) 2012-10-23
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EP1845133A4 (en) 2011-11-30
TW200626677A (en) 2006-08-01
EP1845133A1 (en) 2007-10-17
TWI277635B (en) 2007-04-01
US20080160322A1 (en) 2008-07-03
JPWO2006077667A1 (ja) 2008-06-19
JP2014168060A (ja) 2014-09-11
JP5705396B2 (ja) 2015-04-22
KR101158955B1 (ko) 2012-06-21
EP2955206A1 (en) 2015-12-16
CN101107324A (zh) 2008-01-16
WO2006077667A1 (ja) 2006-07-27
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EP1845133B1 (en) 2015-10-14
KR20070097075A (ko) 2007-10-02

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