HK1052522B - 光固化和熱固化樹脂組合物及製造印刷線路板的方法 - Google Patents

光固化和熱固化樹脂組合物及製造印刷線路板的方法

Info

Publication number
HK1052522B
HK1052522B HK03104878.6A HK03104878A HK1052522B HK 1052522 B HK1052522 B HK 1052522B HK 03104878 A HK03104878 A HK 03104878A HK 1052522 B HK1052522 B HK 1052522B
Authority
HK
Hong Kong
Prior art keywords
plugged
resin composition
printed wiring
photo
wiring board
Prior art date
Application number
HK03104878.6A
Other languages
English (en)
Other versions
HK1052522A1 (en
Inventor
佐藤清
北村和憲
Original Assignee
山榮化學株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山榮化學株式會社 filed Critical 山榮化學株式會社
Publication of HK1052522A1 publication Critical patent/HK1052522A1/xx
Publication of HK1052522B publication Critical patent/HK1052522B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/064—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
HK03104878.6A 2001-09-27 2003-07-08 光固化和熱固化樹脂組合物及製造印刷線路板的方法 HK1052522B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001337180A JP2003105061A (ja) 2001-09-27 2001-09-27 光・熱硬化性樹脂組成物、並びに穴詰プリント配線（基）板の製造方法及び穴詰プリント配線（基）板

Publications (2)

Publication Number Publication Date
HK1052522A1 HK1052522A1 (en) 2003-09-19
HK1052522B true HK1052522B (zh) 2006-06-30

Family

ID=19151870

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03104878.6A HK1052522B (zh) 2001-09-27 2003-07-08 光固化和熱固化樹脂組合物及製造印刷線路板的方法

Country Status (9)

Country Link
US (1) US7396885B2 (zh)
EP (2) EP1553450B1 (zh)
JP (1) JP2003105061A (zh)
KR (1) KR100674349B1 (zh)
CN (1) CN1221611C (zh)
AT (1) ATE299904T1 (zh)
DE (2) DE60236550D1 (zh)
HK (1) HK1052522B (zh)
TW (1) TWI254722B (zh)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200464A (ja) * 2002-12-19 2004-07-15 Anden 金属配線板
JP2005330475A (ja) * 2004-04-20 2005-12-02 Nippon Kayaku Co Ltd 結晶性エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JP4735815B2 (ja) * 2005-04-18 2011-07-27 山栄化学株式会社 穴埋め多層プリント配線板及びその製造方法
JP4634856B2 (ja) * 2005-05-12 2011-02-16 利昌工業株式会社 白色プリプレグ、白色積層板、及び金属箔張り白色積層板
JP4915639B2 (ja) 2005-08-11 2012-04-11 山栄化学株式会社 多層プリント配線板及びその製造方法
JP2008083684A (ja) * 2006-08-30 2008-04-10 Nitto Denko Corp フレキシブル配線回路基板用感光性樹脂組成物およびそれを用いて得られるフレキシブル配線回路基板
DE102008045424B4 (de) 2007-10-01 2018-03-22 San-Ei Kagaku Co. Ltd. Einen anorganischen Füllstoff und einen organischen Füllstoff enthaltende härtbare Kunstharzmischung und Verwendung derselben
TWI455954B (zh) * 2008-05-07 2014-10-11 Taiyo Holdings Co Ltd 填孔用熱硬化性樹脂組成物及該組成物與抗焊層形成用光硬化性熱硬化性樹脂組成物之組合單元、以及印刷電路板
JP5112944B2 (ja) * 2008-05-07 2013-01-09 太陽ホールディングス株式会社 穴埋め用熱硬化性樹脂組成物とソルダーマスク形成用光硬化性・熱硬化性樹脂組成物の組合せユニット及びプリント配線板
JP5344394B2 (ja) 2008-07-10 2013-11-20 山栄化学株式会社 硬化性樹脂組成物、並びにハロゲンフリー樹脂基板及びハロゲンフリービルドアッププリント配線板
CN101587291B (zh) * 2009-07-08 2011-02-16 中电电气（南京）光伏有限公司 基于uv固化工艺在硅片表面丝网印刷精细掩膜的方法
CN101654607B (zh) * 2009-09-08 2013-01-16 烟台德邦科技有限公司 一种高纯度光热-双固化胶粘剂及其制备方法
JP5739631B2 (ja) * 2010-09-27 2015-06-24 太陽ホールディングス株式会社 熱硬化性樹脂充填材
CN102248738A (zh) * 2011-04-25 2011-11-23 衢州威盛精密电子科技有限公司 一种液态填孔真空压合工艺
JP5901923B2 (ja) * 2011-09-30 2016-04-13 太陽インキ製造株式会社 熱硬化性樹脂充填材及びプリント配線板
CN103369871B (zh) * 2012-03-30 2016-12-14 北大方正集团有限公司 多层印刷电路板的制作方法
WO2014014045A1 (ja) * 2012-07-20 2014-01-23 協立化学産業株式会社 ハードディスク装置用硬化性組成物
US10047257B2 (en) 2013-09-27 2018-08-14 Daicel Corporation Adhesive agent composition for multilayer semiconductor
US9955568B2 (en) * 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
US9398703B2 (en) * 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
US9914718B2 (en) 2014-10-14 2018-03-13 Ausio Pharmaceuticals, Llc Anhydrous crystalline form of S-equol
CN104378929B (zh) * 2014-11-28 2017-05-24 广州杰赛科技股份有限公司 一种电路板的制作方法
CN105131533B (zh) * 2015-10-16 2017-05-17 黑龙江省科学院石油化学研究院 一种高伸长率的韧性复合材料表面膜及其制备方法
CN107163478B (zh) * 2017-06-27 2022-03-08 江门盈骅光电科技有限公司 可先热固化、再光照射固化的不饱和树脂组合物及其制备方法和用途
CN113025116A (zh) * 2020-03-13 2021-06-25 深圳市百柔新材料技术有限公司 油墨、印刷电路板内层线路及其制作方法、印刷电路板
CN112739015B (zh) * 2020-12-08 2022-05-24 深圳市祺利电子有限公司 一种电路板阻焊半塞孔的制作方法
KR102591064B1 (ko) * 2022-04-28 2023-10-17 주식회사 현대케피코 도포 대상물 구조
CN115955791A (zh) * 2023-03-15 2023-04-11 深圳明阳电路科技股份有限公司 一种用于mini-led类PCB的制备方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010887A (zh) * 1973-06-05 1975-02-04
US4072592A (en) * 1974-05-20 1978-02-07 Mobil Oil Corporation Radiation curable coating
US4371566A (en) * 1980-09-10 1983-02-01 Panelgraphic Corporation Abrasion resistant coating composition
JPS63154780A (ja) * 1986-12-18 1988-06-28 Ibiden Co Ltd 接着剤組成物及びその接着剤としての使用方法
JPH0268A (ja) * 1987-11-13 1990-01-05 Toshiba Corp ソルダ−レジスト組成物
JP2571800B2 (ja) 1987-11-27 1997-01-16 イビデン株式会社 無電解めっき用感光性接着剤およびプリント配線板
US4900763A (en) * 1988-02-26 1990-02-13 Ciba-Geigy Corporation Ultraviolet radiation curable vehicles
US4954304A (en) * 1988-04-04 1990-09-04 Dainippon Ink And Chemical, Inc. Process for producing prepreg and laminated sheet
JPH0823694B2 (ja) * 1988-08-04 1996-03-06 富士写真フイルム株式会社 液状感光性樹脂組成物
JPH0436308A (ja) * 1990-05-31 1992-02-06 Somar Corp 紫外線硬化性樹脂組成物
EP0423713A3 (en) * 1989-10-18 1991-12-18 Takeda Chemical Industries, Ltd. Photocurable adhesive and production of laminated articles using the same
JPH04184443A (ja) * 1990-11-20 1992-07-01 Yokohama Rubber Co Ltd:The 光硬化性樹脂組成物
JP2598346B2 (ja) 1991-07-02 1997-04-09 太陽インキ製造株式会社 プリント配線板の製造方法
JPH05243728A (ja) * 1991-12-27 1993-09-21 Tokuyama Soda Co Ltd 回路基板の製造方法
JPH06232560A (ja) * 1992-04-27 1994-08-19 Tokuyama Soda Co Ltd 多層回路基板及びその製造方法
US5473120A (en) * 1992-04-27 1995-12-05 Tokuyama Corporation Multilayer board and fabrication method thereof
JP3308403B2 (ja) 1994-09-06 2002-07-29 住友ベークライト株式会社 樹脂組成物及びプリプレグ用樹脂組成物
JP2908258B2 (ja) * 1994-12-07 1999-06-21 住友ベークライト株式会社 光・熱硬化型アンダーコート材及び多層プリント配線板の製造方法
JPH0971637A (ja) * 1995-06-27 1997-03-18 Toppan Printing Co Ltd 感光性樹脂組成物及びそれを用いた半導体装置
JP2820648B2 (ja) * 1995-10-13 1998-11-05 住友ベークライト株式会社 多層プリント配線板の製造方法
JP2707495B2 (ja) 1996-03-11 1998-01-28 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物
JP2891675B2 (ja) 1996-07-15 1999-05-17 株式会社野田スクリーン 液状樹脂内の気泡除去方法
JPH10245431A (ja) 1997-03-04 1998-09-14 Nagase Chiba Kk 非接触ｉｃカード用モジュール封止剤及びそれを用いたモジュールの予備封止体
JPH1149847A (ja) * 1997-05-15 1999-02-23 Hitachi Ltd 感光性樹脂組成物とそれを用いた絶縁フィルム及び多層配線板
JPH1143465A (ja) * 1997-05-26 1999-02-16 Daicel Chem Ind Ltd アクリル酸系誘導体及び活性エネルギー線硬化型組成物
JPH11147285A (ja) * 1997-09-11 1999-06-02 Sumitomo Bakelite Co Ltd 銅張積層板の製造方法
JP3247091B2 (ja) * 1997-11-28 2002-01-15 日立化成工業株式会社 光硬化性樹脂組成物及びこれを用いた感光性エレメント
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
JP3548691B2 (ja) * 1998-01-07 2004-07-28 太陽インキ製造株式会社 液状熱硬化性充填用組成物及びそれを用いたプリント配線板の永久穴埋め方法
US6090474A (en) * 1998-09-01 2000-07-18 International Business Machines Corporation Flowable compositions and use in filling vias and plated through-holes
JP2000294930A (ja) * 1999-04-06 2000-10-20 Mitsubishi Electric Corp 多層プリント基板の製造方法およびこの多層プリント基板を用いた半導体装置
JP3739600B2 (ja) * 1999-07-06 2006-01-25 太陽インキ製造株式会社 液状熱硬化性樹脂組成物及びそれを用いたプリント配線板の永久穴埋め方法
JP2001342230A (ja) * 1999-09-24 2001-12-11 Sumitomo Bakelite Co Ltd 感光性樹脂組成物、多層プリント配線板及びその製造方法
JP2001181482A (ja) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2001192554A (ja) * 2000-01-13 2001-07-17 Mitsubishi Gas Chem Co Inc スルーホール充填用インク及びそれを用いたプリント配線板
JP2001207021A (ja) * 2000-01-28 2001-07-31 Hitachi Chem Co Ltd 液状エポキシ樹脂組成物及び電子部品装置
JP3648704B2 (ja) * 2000-02-14 2005-05-18 タムラ化研株式会社 活性エネルギー線硬化性組成物及びプリント配線板
JP3911690B2 (ja) * 2001-07-19 2007-05-09 山栄化学株式会社 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板

Also Published As

Publication number Publication date
JP2003105061A (ja) 2003-04-09
CN1408764A (zh) 2003-04-09
EP1553450A1 (en) 2005-07-13
HK1052522A1 (en) 2003-09-19
EP1298155A1 (en) 2003-04-02
US20030215567A1 (en) 2003-11-20
EP1553450B1 (en) 2010-05-26
KR20030028387A (ko) 2003-04-08
DE60205072T2 (de) 2006-04-20
DE60205072D1 (de) 2005-08-25
US7396885B2 (en) 2008-07-08
CN1221611C (zh) 2005-10-05
EP1298155B1 (en) 2005-07-20
DE60236550D1 (de) 2010-07-08
ATE299904T1 (de) 2005-08-15
TWI254722B (en) 2006-05-11
KR100674349B1 (ko) 2007-01-24

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