CN103369871B - 多层印刷电路板的制作方法 - Google Patents
多层印刷电路板的制作方法 Download PDFInfo
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- CN103369871B CN103369871B CN201210092833.6A CN201210092833A CN103369871B CN 103369871 B CN103369871 B CN 103369871B CN 201210092833 A CN201210092833 A CN 201210092833A CN 103369871 B CN103369871 B CN 103369871B
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 238000007731 hot pressing Methods 0.000 claims abstract description 10
- 238000002360 preparation method Methods 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 description 7
- 238000002203 pretreatment Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000009172 bursting Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
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Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210092833.6A CN103369871B (zh) | 2012-03-30 | 2012-03-30 | 多层印刷电路板的制作方法 |
Applications Claiming Priority (1)
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CN201210092833.6A CN103369871B (zh) | 2012-03-30 | 2012-03-30 | 多层印刷电路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN103369871A CN103369871A (zh) | 2013-10-23 |
CN103369871B true CN103369871B (zh) | 2016-12-14 |
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CN201210092833.6A Expired - Fee Related CN103369871B (zh) | 2012-03-30 | 2012-03-30 | 多层印刷电路板的制作方法 |
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CN (1) | CN103369871B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105101643A (zh) * | 2015-07-17 | 2015-11-25 | 昆山旭发电子有限公司 | 树脂塞孔工艺 |
CN105555033A (zh) * | 2016-01-25 | 2016-05-04 | 深圳市通为信电路科技有限公司 | 一种led铝基板的过孔方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1553450A1 (en) * | 2001-09-27 | 2005-07-13 | San-Ei Kagaku Co. Ltd. | Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board |
CN101626666A (zh) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | 蚀刻线路后树脂塞孔工艺流程 |
CN101720167A (zh) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | 内层芯板树脂塞孔的线路板制作方法 |
CN102244987A (zh) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | 高厚径比背板树脂塞孔方法 |
CN102248738A (zh) * | 2011-04-25 | 2011-11-23 | 衢州威盛精密电子科技有限公司 | 一种液态填孔真空压合工艺 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05110254A (ja) * | 1991-10-18 | 1993-04-30 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
JPH0918141A (ja) * | 1995-06-27 | 1997-01-17 | Matsushita Electric Works Ltd | 積層板の製造方法 |
JP2000091744A (ja) * | 1998-09-07 | 2000-03-31 | Ibiden Co Ltd | 多層プリント配線板及びその製造方法 |
JP3739600B2 (ja) * | 1999-07-06 | 2006-01-25 | 太陽インキ製造株式会社 | 液状熱硬化性樹脂組成物及びそれを用いたプリント配線板の永久穴埋め方法 |
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2012
- 2012-03-30 CN CN201210092833.6A patent/CN103369871B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1553450A1 (en) * | 2001-09-27 | 2005-07-13 | San-Ei Kagaku Co. Ltd. | Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board |
CN101626666A (zh) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | 蚀刻线路后树脂塞孔工艺流程 |
CN101720167A (zh) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | 内层芯板树脂塞孔的线路板制作方法 |
CN102244987A (zh) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | 高厚径比背板树脂塞孔方法 |
CN102248738A (zh) * | 2011-04-25 | 2011-11-23 | 衢州威盛精密电子科技有限公司 | 一种液态填孔真空压合工艺 |
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CN103369871A (zh) | 2013-10-23 |
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Effective date of registration: 20220617 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20161214 |