CN103687344A - 电路板制作方法 - Google Patents
电路板制作方法 Download PDFInfo
- Publication number
- CN103687344A CN103687344A CN201210363082.7A CN201210363082A CN103687344A CN 103687344 A CN103687344 A CN 103687344A CN 201210363082 A CN201210363082 A CN 201210363082A CN 103687344 A CN103687344 A CN 103687344A
- Authority
- CN
- China
- Prior art keywords
- layer
- conducting wire
- dielectric layer
- wire layer
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
Abstract
Description
电路板 | 100 |
保护层 | 104 |
切口 | 102 |
凹槽 | 103 |
蚀刻阻挡层 | 1010 |
核心基板 | 110 |
去除区域 | 1101 |
线路区域 | 1102 |
第一导电孔 | 1103 |
第一通孔 | 1104 |
金属导电层 | 1105 |
塞孔材料 | 1106 |
第一介电层 | 112 |
第一铜箔层 | 111 |
第二铜箔层 | 113 |
第一导电线路层 | 120 |
离型金属层 | 121 |
光滑表面 | 122 |
第二导电线路层 | 130 |
第二介电层 | 140 |
第一微孔 | 141 |
第一开孔 | 142 |
第三介电层 | 150 |
第二微孔 | 151 |
第三导电线路层 | 161 |
第一电性连接垫 | 1611 |
第二导电孔 | 162 |
第四导电线路层 | 163 |
第三导电孔 | 164 |
第四介电层 | 171 |
第五介电层 | 172 |
第五导电线路层 | 181 |
第二电性连接垫 | 1811 |
第四导电孔 | 182 |
第六导电线路层 | 183 |
第五导电孔 | 184 |
第一防焊层 | 191 |
第一开口 | 1911 |
第二防焊层 | 192 |
第二开口 | 1921 |
Claims (19)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210363082.7A CN103687344B (zh) | 2012-09-26 | 2012-09-26 | 电路板制作方法 |
TW101137858A TWI465162B (zh) | 2012-09-26 | 2012-10-12 | 電路板及其製作方法 |
US13/949,237 US9439282B2 (en) | 2012-09-26 | 2013-07-24 | Method for manufacturing printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210363082.7A CN103687344B (zh) | 2012-09-26 | 2012-09-26 | 电路板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103687344A true CN103687344A (zh) | 2014-03-26 |
CN103687344B CN103687344B (zh) | 2016-08-24 |
Family
ID=50323224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210363082.7A Active CN103687344B (zh) | 2012-09-26 | 2012-09-26 | 电路板制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9439282B2 (zh) |
CN (1) | CN103687344B (zh) |
TW (1) | TWI465162B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105282995A (zh) * | 2014-06-24 | 2016-01-27 | 健鼎(无锡)电子有限公司 | 移除部分的多层线路结构的方法 |
CN105470144A (zh) * | 2014-09-09 | 2016-04-06 | 欣兴电子股份有限公司 | 无核心层封装基板与其制造方法 |
CN107449948A (zh) * | 2016-05-31 | 2017-12-08 | 巨擘科技股份有限公司 | 探针卡装置 |
CN107949190A (zh) * | 2017-10-20 | 2018-04-20 | 江门崇达电路技术有限公司 | 一种高落差阶梯线路板的制作工艺 |
CN108461405A (zh) * | 2017-02-21 | 2018-08-28 | 碁鼎科技秦皇岛有限公司 | 线路载板及其制造方法 |
CN108882511A (zh) * | 2018-08-27 | 2018-11-23 | 生益电子股份有限公司 | 一种具有多级阶梯槽的pcb |
CN112638639A (zh) * | 2018-08-27 | 2021-04-09 | 塔克托科技有限公司 | 具有嵌入式功能性的多层结构及相关多层结构的制造方法 |
CN112951797A (zh) * | 2021-01-27 | 2021-06-11 | 维沃移动通信有限公司 | 指纹模组、电子设备及指纹模组加工方法 |
CN114828456A (zh) * | 2022-04-21 | 2022-07-29 | 东山精密新加坡有限公司 | 线路板制作方法及线路板 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI624018B (zh) * | 2014-08-04 | 2018-05-11 | 恆勁科技股份有限公司 | 封裝結構及其製法 |
JP2016058509A (ja) * | 2014-09-09 | 2016-04-21 | 株式会社東芝 | 補強板付きフレキシブルプリント配線板の製造方法およびフレキシブルプリント配線板中間体 |
TWI624205B (zh) * | 2016-06-16 | 2018-05-11 | 欣興電子股份有限公司 | 電路板及其製造方法 |
TWI595607B (zh) | 2016-06-30 | 2017-08-11 | 欣興電子股份有限公司 | 封裝載板及封裝載板的製造方法 |
EP3781373A4 (en) * | 2018-04-20 | 2022-03-16 | PostProcess Technologies Inc. | FINISHING MEDIA AND FINISHING SUSPENSIONS |
WO2020077617A1 (zh) * | 2018-10-19 | 2020-04-23 | 华为技术有限公司 | 一种天线封装结构及其制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM397681U (en) * | 2010-06-04 | 2011-02-01 | Unimicron Technology Corp | Circuit board with a removing area |
TW201204202A (en) * | 2010-02-09 | 2012-01-16 | Ngk Spark Plug Co | Method for manufacturing a wiring substrate |
US20120181074A1 (en) * | 2011-01-13 | 2012-07-19 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
-
2012
- 2012-09-26 CN CN201210363082.7A patent/CN103687344B/zh active Active
- 2012-10-12 TW TW101137858A patent/TWI465162B/zh active
-
2013
- 2013-07-24 US US13/949,237 patent/US9439282B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201204202A (en) * | 2010-02-09 | 2012-01-16 | Ngk Spark Plug Co | Method for manufacturing a wiring substrate |
TWM397681U (en) * | 2010-06-04 | 2011-02-01 | Unimicron Technology Corp | Circuit board with a removing area |
US20120181074A1 (en) * | 2011-01-13 | 2012-07-19 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105282995A (zh) * | 2014-06-24 | 2016-01-27 | 健鼎(无锡)电子有限公司 | 移除部分的多层线路结构的方法 |
CN105282995B (zh) * | 2014-06-24 | 2018-04-06 | 健鼎(无锡)电子有限公司 | 移除部分的多层线路结构的方法 |
CN105470144A (zh) * | 2014-09-09 | 2016-04-06 | 欣兴电子股份有限公司 | 无核心层封装基板与其制造方法 |
CN105470144B (zh) * | 2014-09-09 | 2018-01-02 | 欣兴电子股份有限公司 | 无核心层封装基板与其制造方法 |
CN107449948A (zh) * | 2016-05-31 | 2017-12-08 | 巨擘科技股份有限公司 | 探针卡装置 |
CN108461405A (zh) * | 2017-02-21 | 2018-08-28 | 碁鼎科技秦皇岛有限公司 | 线路载板及其制造方法 |
CN108461405B (zh) * | 2017-02-21 | 2020-04-10 | 碁鼎科技秦皇岛有限公司 | 线路载板及其制造方法 |
CN107949190A (zh) * | 2017-10-20 | 2018-04-20 | 江门崇达电路技术有限公司 | 一种高落差阶梯线路板的制作工艺 |
CN108882511A (zh) * | 2018-08-27 | 2018-11-23 | 生益电子股份有限公司 | 一种具有多级阶梯槽的pcb |
CN108882511B (zh) * | 2018-08-27 | 2020-11-13 | 生益电子股份有限公司 | 一种具有多级阶梯槽的pcb |
CN112638639A (zh) * | 2018-08-27 | 2021-04-09 | 塔克托科技有限公司 | 具有嵌入式功能性的多层结构及相关多层结构的制造方法 |
CN112638639B (zh) * | 2018-08-27 | 2024-02-23 | 塔克托科技有限公司 | 具有嵌入式功能性的多层结构及相关多层结构的制造方法 |
CN112951797A (zh) * | 2021-01-27 | 2021-06-11 | 维沃移动通信有限公司 | 指纹模组、电子设备及指纹模组加工方法 |
CN112951797B (zh) * | 2021-01-27 | 2022-10-14 | 维沃移动通信有限公司 | 指纹模组、电子设备及指纹模组加工方法 |
CN114828456A (zh) * | 2022-04-21 | 2022-07-29 | 东山精密新加坡有限公司 | 线路板制作方法及线路板 |
Also Published As
Publication number | Publication date |
---|---|
US9439282B2 (en) | 2016-09-06 |
US20140083744A1 (en) | 2014-03-27 |
CN103687344B (zh) | 2016-08-24 |
TWI465162B (zh) | 2014-12-11 |
TW201414371A (zh) | 2014-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103687344B (zh) | 电路板制作方法 | |
US9295150B2 (en) | Method for manufacturing a printed circuit board | |
CN103458628B (zh) | 多层电路板及其制作方法 | |
KR101241544B1 (ko) | 인쇄회로기판 및 그의 제조 방법 | |
JP6711509B2 (ja) | プリント回路基板、半導体パッケージ及びその製造方法 | |
JP6795137B2 (ja) | 電子素子内蔵型印刷回路基板の製造方法 | |
CN106358379B (zh) | 印刷电路板及其制造方法 | |
US8058568B2 (en) | Circuit board and method for fabricating the same | |
TWI472277B (zh) | 軟硬結合電路基板、軟硬結合電路板及製作方法 | |
CN103871996A (zh) | 封装结构及其制作方法 | |
CN103929895A (zh) | 具有内埋元件的电路板、其制作方法及封装结构 | |
WO2014125567A1 (ja) | 部品内蔵基板及びその製造方法 | |
KR20180013017A (ko) | 인쇄회로기판 | |
WO2007116622A1 (ja) | ケーブル部を有する多層回路基板およびその製造方法 | |
KR101596098B1 (ko) | 인쇄회로기판의 제조방법 | |
CN103889169A (zh) | 电路板及其制作方法 | |
CN107645855B (zh) | 无导线电镀电路板及其制作方法 | |
US20140146504A1 (en) | Circuit board, package structure and method for manufacturing same | |
CN102036498B (zh) | 内埋式组件基板结构及其制作方法 | |
JP4752045B2 (ja) | 印刷回路基板の製造方法 | |
CN110876239B (zh) | 电路板及其制作方法 | |
CN209861268U (zh) | 同时具有贯孔及盲孔的多层电路板结构 | |
CN102196673B (zh) | 线路结构的制作方法 | |
CN101641461A (zh) | 具有填铜穿透孔的多层印刷线路板 | |
CN111629513B (zh) | 同时具有贯孔及盲孔的多层电路板结构及其制法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161220 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Patentee after: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230926 Address after: 066004 No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
TR01 | Transfer of patent right |