CN103052264B - 一种夹心铝基印制线路板压合方法 - Google Patents
一种夹心铝基印制线路板压合方法 Download PDFInfo
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- CN103052264B CN103052264B CN201210508626.4A CN201210508626A CN103052264B CN 103052264 B CN103052264 B CN 103052264B CN 201210508626 A CN201210508626 A CN 201210508626A CN 103052264 B CN103052264 B CN 103052264B
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- Prior art keywords
- aluminium base
- hole
- printed circuit
- aluminum
- aluminum substrate
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- 238000003825 pressing Methods 0.000 title abstract description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 85
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011889 copper foil Substances 0.000 claims abstract description 22
- 238000005491 wire drawing Methods 0.000 claims abstract description 15
- 239000004411 aluminium Substances 0.000 claims description 74
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims description 11
- 238000003475 lamination Methods 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 4
- 235000013312 flour Nutrition 0.000 claims description 3
- 238000005553 drilling Methods 0.000 abstract 1
- 238000004382 potting Methods 0.000 description 7
- 101100257134 Caenorhabditis elegans sma-4 gene Proteins 0.000 description 2
- 230000009172 bursting Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210508626.4A CN103052264B (zh) | 2012-12-03 | 2012-12-03 | 一种夹心铝基印制线路板压合方法 |
Applications Claiming Priority (1)
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CN201210508626.4A CN103052264B (zh) | 2012-12-03 | 2012-12-03 | 一种夹心铝基印制线路板压合方法 |
Publications (2)
Publication Number | Publication Date |
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CN103052264A CN103052264A (zh) | 2013-04-17 |
CN103052264B true CN103052264B (zh) | 2015-04-22 |
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Family Applications (1)
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CN201210508626.4A Expired - Fee Related CN103052264B (zh) | 2012-12-03 | 2012-12-03 | 一种夹心铝基印制线路板压合方法 |
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CN (1) | CN103052264B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103415140A (zh) * | 2013-08-06 | 2013-11-27 | 鑫茂电子(昆山)有限公司 | 一种新型线路板 |
CN104902694B (zh) * | 2014-03-05 | 2018-02-23 | 深南电路有限公司 | 内层厚铜电路板的加工方法和内层厚铜电路板 |
CN105407656B (zh) * | 2014-09-12 | 2018-08-07 | 深南电路有限公司 | 一种印制电路板层间互联结构制造的方法及印制电路板 |
CN105792505A (zh) * | 2016-03-25 | 2016-07-20 | 龙南骏亚电子科技有限公司 | 高导热性铝基电路板 |
CN106799885A (zh) * | 2017-01-14 | 2017-06-06 | 东莞市台信光电科技有限公司 | 铝基覆铜板的层压方法 |
CN106879167B (zh) * | 2017-04-06 | 2023-11-28 | 昆山苏杭电路板有限公司 | 高精密度内嵌超高导热陶瓷块的双面铝基板及其制作方法 |
CN107484356B (zh) * | 2017-08-01 | 2020-06-02 | 深圳明阳电路科技股份有限公司 | 一种厚铜夹心铝基板的制作方法 |
CN107498953A (zh) * | 2017-08-17 | 2017-12-22 | 湖北华锐铝基板科技有限公司 | 一种铝基板生产工艺 |
CN107787116A (zh) * | 2017-11-16 | 2018-03-09 | 厦门利德宝电子科技股份有限公司 | 一种适用于元器件穿孔插件焊接的铝基板及其制作方法 |
CN108040416A (zh) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | 一种双面铝基板的制作方法 |
CN108135099B (zh) * | 2017-12-18 | 2020-05-12 | 广州兴森快捷电路科技有限公司 | 线路板及其制作方法 |
CN108260274A (zh) * | 2018-03-06 | 2018-07-06 | 宁波科杰电子科技有限公司 | 一种led灯用单面铝基板及其制造工艺 |
CN110248472A (zh) * | 2019-05-20 | 2019-09-17 | 南亚电路板(昆山)有限公司 | 一种电路板加工工艺 |
CN112788835A (zh) * | 2019-11-11 | 2021-05-11 | 无锡深南电路有限公司 | 线路板及其制作方法 |
CN114980573A (zh) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | 电路板的制作方法、电路板及电子装置 |
CN115348737B (zh) * | 2022-08-12 | 2023-09-26 | 江苏迪飞达电子有限公司 | 一种双面厚铜铝基混压板的制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102036476A (zh) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | 一种双面金属基线路板及其生产方法 |
CN102427665A (zh) * | 2011-09-16 | 2012-04-25 | 深圳市万泰伟业科技有限公司 | 立体的双面铝基板制作工艺 |
Family Cites Families (1)
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CA2252113A1 (en) * | 1997-10-29 | 1999-04-29 | Yoshihiko Numata | Substrate and process for producing the same |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102036476A (zh) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | 一种双面金属基线路板及其生产方法 |
CN102427665A (zh) * | 2011-09-16 | 2012-04-25 | 深圳市万泰伟业科技有限公司 | 立体的双面铝基板制作工艺 |
Non-Patent Citations (1)
Title |
---|
铜箔基板环氧树脂含浸液之研究;翁维祥;《[化学工程与材料工程研究所]博硕士论文》;国立中央大学图书馆硕博士论文系统;20090921;第16页第5段 * |
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CN103052264A (zh) | 2013-04-17 |
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Owner name: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO., LTD. Effective date: 20141014 |
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C41 | Transfer of patent application or patent right or utility model | ||
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CB03 | Change of inventor or designer information |
Inventor after: Zhang Junjie Inventor after: Jiang Xuefei Inventor after: Deng Jun Inventor after: Liu Dong Inventor after: Song Jianyuan Inventor before: Zhang Junjie Inventor before: Jiang Xuefei Inventor before: Li Xueming Inventor before: Liu Dong Inventor before: Song Jianyuan |
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COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: ZHANG JUNJIE JIANG XUEFEI LI XUEMING LIU DONG SONG JIANYUAN TO: ZHANG JUNJIE JIANG XUEFEI DENG JUN LIU DONG SONG JIANYUAN |
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TA01 | Transfer of patent application right |
Effective date of registration: 20141014 Address after: The new industrial zone of Baoan District Jade Road Shenzhen City manhole street 518000 Guangdong province Henggang Xinqiao building 3 Applicant after: Shenzhen Suntak Multilayer PCB Co., Ltd. Applicant after: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO., LTD. Address before: The new industrial zone of Baoan District Jade Road Shenzhen City manhole street 518000 Guangdong province Henggang Xinqiao building 3 Applicant before: Shenzhen Suntak Multilayer PCB Co., Ltd. |
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