CN103369871A - 多层印刷电路板及其制作方法 - Google Patents
多层印刷电路板及其制作方法 Download PDFInfo
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- CN103369871A CN103369871A CN2012100928336A CN201210092833A CN103369871A CN 103369871 A CN103369871 A CN 103369871A CN 2012100928336 A CN2012100928336 A CN 2012100928336A CN 201210092833 A CN201210092833 A CN 201210092833A CN 103369871 A CN103369871 A CN 103369871A
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- Prior art keywords
- resin
- consent
- layer pcb
- manufacturing
- daughter board
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000007731 hot pressing Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 4
- 238000007711 solidification Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 9
- 238000002203 pretreatment Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000009172 bursting Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210092833.6A CN103369871B (zh) | 2012-03-30 | 2012-03-30 | 多层印刷电路板的制作方法 |
Applications Claiming Priority (1)
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CN201210092833.6A CN103369871B (zh) | 2012-03-30 | 2012-03-30 | 多层印刷电路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN103369871A true CN103369871A (zh) | 2013-10-23 |
CN103369871B CN103369871B (zh) | 2016-12-14 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210092833.6A Expired - Fee Related CN103369871B (zh) | 2012-03-30 | 2012-03-30 | 多层印刷电路板的制作方法 |
Country Status (1)
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CN (1) | CN103369871B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105101643A (zh) * | 2015-07-17 | 2015-11-25 | 昆山旭发电子有限公司 | 树脂塞孔工艺 |
CN105555033A (zh) * | 2016-01-25 | 2016-05-04 | 深圳市通为信电路科技有限公司 | 一种led铝基板的过孔方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05110254A (ja) * | 1991-10-18 | 1993-04-30 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
JPH0918141A (ja) * | 1995-06-27 | 1997-01-17 | Matsushita Electric Works Ltd | 積層板の製造方法 |
JP2000091744A (ja) * | 1998-09-07 | 2000-03-31 | Ibiden Co Ltd | 多層プリント配線板及びその製造方法 |
CN1359410A (zh) * | 1999-07-06 | 2002-07-17 | 太阳油墨制造株式会社 | 液状热固性树脂组合物及使用其永久性填孔印刷线路板的方法 |
EP1553450A1 (en) * | 2001-09-27 | 2005-07-13 | San-Ei Kagaku Co. Ltd. | Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board |
CN101626666A (zh) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | 蚀刻线路后树脂塞孔工艺流程 |
CN101720167A (zh) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | 内层芯板树脂塞孔的线路板制作方法 |
CN102244987A (zh) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | 高厚径比背板树脂塞孔方法 |
CN102248738A (zh) * | 2011-04-25 | 2011-11-23 | 衢州威盛精密电子科技有限公司 | 一种液态填孔真空压合工艺 |
-
2012
- 2012-03-30 CN CN201210092833.6A patent/CN103369871B/zh not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05110254A (ja) * | 1991-10-18 | 1993-04-30 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
JPH0918141A (ja) * | 1995-06-27 | 1997-01-17 | Matsushita Electric Works Ltd | 積層板の製造方法 |
JP2000091744A (ja) * | 1998-09-07 | 2000-03-31 | Ibiden Co Ltd | 多層プリント配線板及びその製造方法 |
CN1359410A (zh) * | 1999-07-06 | 2002-07-17 | 太阳油墨制造株式会社 | 液状热固性树脂组合物及使用其永久性填孔印刷线路板的方法 |
EP1553450A1 (en) * | 2001-09-27 | 2005-07-13 | San-Ei Kagaku Co. Ltd. | Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board |
CN101626666A (zh) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | 蚀刻线路后树脂塞孔工艺流程 |
CN101720167A (zh) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | 内层芯板树脂塞孔的线路板制作方法 |
CN102244987A (zh) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | 高厚径比背板树脂塞孔方法 |
CN102248738A (zh) * | 2011-04-25 | 2011-11-23 | 衢州威盛精密电子科技有限公司 | 一种液态填孔真空压合工艺 |
Non-Patent Citations (1)
Title |
---|
FELSISTER: "《印制塞孔加工工艺》", 13 August 2010, 百度文库 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105101643A (zh) * | 2015-07-17 | 2015-11-25 | 昆山旭发电子有限公司 | 树脂塞孔工艺 |
CN105555033A (zh) * | 2016-01-25 | 2016-05-04 | 深圳市通为信电路科技有限公司 | 一种led铝基板的过孔方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103369871B (zh) | 2016-12-14 |
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Effective date of registration: 20220617 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. |
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Granted publication date: 20161214 |
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CF01 | Termination of patent right due to non-payment of annual fee |