WO2007103949A3 - Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores - Google Patents

Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores Download PDF

Info

Publication number
WO2007103949A3
WO2007103949A3 PCT/US2007/063429 US2007063429W WO2007103949A3 WO 2007103949 A3 WO2007103949 A3 WO 2007103949A3 US 2007063429 W US2007063429 W US 2007063429W WO 2007103949 A3 WO2007103949 A3 WO 2007103949A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
conductive constraining
printed wiring
wiring boards
manufacturing printed
Prior art date
Application number
PCT/US2007/063429
Other languages
French (fr)
Other versions
WO2007103949A2 (en
Inventor
Kalu K Vasoya
Original Assignee
Stablcore Inc
Kalu K Vasoya
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stablcore Inc, Kalu K Vasoya filed Critical Stablcore Inc
Priority to JP2008558512A priority Critical patent/JP2009529790A/en
Priority to CN200780016293.0A priority patent/CN101437676B/en
Publication of WO2007103949A2 publication Critical patent/WO2007103949A2/en
Publication of WO2007103949A3 publication Critical patent/WO2007103949A3/en
Priority to KR1020087024427A priority patent/KR101477604B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

Methods of manufacturing printed wiring boards including electrically conductive constraining cores that involve a single lamination cycle are disclosed. One example of the method of the invention includes drilling a clearance pattern in an electrically conductive constraining core, arranging the electrically conductive constraining core in a stack up that includes B-stage (semi-cured) layers of dielectric material on either side of the constraining core and additional layers of material arranged to form the at least one functional layer, performing a lamination cycle on the stack up that causes the resin in the B-stage (semi-cured) layers of dielectric to reflow and fill the clearance pattern in the electrically conductive constraining core before curing and drilling plated through holes.
PCT/US2007/063429 2006-03-06 2007-03-06 Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores WO2007103949A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008558512A JP2009529790A (en) 2006-03-06 2007-03-06 Manufacturing process of printed wiring board having conductive suppression core
CN200780016293.0A CN101437676B (en) 2006-03-06 2007-03-06 Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores
KR1020087024427A KR101477604B1 (en) 2006-03-06 2008-10-06 Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78001306P 2006-03-06 2006-03-06
US60/780,013 2006-03-06

Publications (2)

Publication Number Publication Date
WO2007103949A2 WO2007103949A2 (en) 2007-09-13
WO2007103949A3 true WO2007103949A3 (en) 2008-06-19

Family

ID=38475819

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/063429 WO2007103949A2 (en) 2006-03-06 2007-03-06 Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores

Country Status (4)

Country Link
JP (2) JP2009529790A (en)
KR (1) KR101477604B1 (en)
CN (2) CN101437676B (en)
WO (1) WO2007103949A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5971928B2 (en) * 2011-11-30 2016-08-17 古河電気工業株式会社 Metal core printed wiring board and manufacturing method thereof
KR102253473B1 (en) * 2014-09-30 2021-05-18 삼성전기주식회사 Circuit board
CN105792547A (en) * 2016-04-21 2016-07-20 黄石沪士电子有限公司 Pre-laminating process for inner-layer core plate of thick-copper multilayer PCB
CN109429434A (en) * 2017-08-31 2019-03-05 鹏鼎控股(深圳)股份有限公司 Circuit board and preparation method thereof
CN107613636A (en) * 2017-09-26 2018-01-19 广东欧珀移动通信有限公司 A kind of circuit board and electronic equipment
CN108446042A (en) * 2018-01-31 2018-08-24 北京他山科技有限公司 A kind of capacitive touch sensors, electronic skin and intelligent robot
CN108362427A (en) * 2018-01-31 2018-08-03 北京他山科技有限公司 A kind of contact sensor, electronic skin and intelligent robot with Multifunctional layered
CN113079621B (en) * 2021-03-29 2022-06-14 生益电子股份有限公司 PCB manufacturing method, PCB and leakage detection method of conductive medium

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5819401A (en) * 1996-06-06 1998-10-13 Texas Instruments Incorporated Metal constrained circuit board side to side interconnection technique
US6869664B2 (en) * 2000-12-12 2005-03-22 Thermalworks, Inc. Lightweight circuit board with conductive constraining cores
US20050257957A1 (en) * 2004-05-15 2005-11-24 Kaluk Vasoya Printed wiring board with conductive constraining core including resin filled channels

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286888A (en) * 1985-10-14 1987-04-21 松下電工株式会社 Metal base substrate
JP2899217B2 (en) * 1994-07-28 1999-06-02 田中貴金属工業株式会社 Manufacturing method of metal core printed wiring board
JPH1140902A (en) * 1997-07-18 1999-02-12 Cmk Corp Printed wiring board and manufacture thereof
JPH11186734A (en) * 1997-12-25 1999-07-09 Mitsubishi Plastics Ind Ltd Manufacture of metal core multilayer shield board
US6613413B1 (en) * 1999-04-26 2003-09-02 International Business Machines Corporation Porous power and ground planes for reduced PCB delamination and better reliability
JP2003273482A (en) * 2002-03-15 2003-09-26 Fujitsu Ltd Circuit board and manufacturing method thereof, and electronic equipment
US20030168249A1 (en) * 2002-02-14 2003-09-11 Ngk Spark Plug Co., Ltd. Wiring board and method for producing the same
JP4488684B2 (en) * 2002-08-09 2010-06-23 イビデン株式会社 Multilayer printed wiring board
JP2006019451A (en) * 2004-06-30 2006-01-19 Ibiden Co Ltd Printed-circuit board and interlayer insulating layer therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5819401A (en) * 1996-06-06 1998-10-13 Texas Instruments Incorporated Metal constrained circuit board side to side interconnection technique
US6869664B2 (en) * 2000-12-12 2005-03-22 Thermalworks, Inc. Lightweight circuit board with conductive constraining cores
US20050257957A1 (en) * 2004-05-15 2005-11-24 Kaluk Vasoya Printed wiring board with conductive constraining core including resin filled channels

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards

Also Published As

Publication number Publication date
KR20080100483A (en) 2008-11-18
CN101437676A (en) 2009-05-20
CN101437676B (en) 2014-01-29
JP2015039002A (en) 2015-02-26
WO2007103949A2 (en) 2007-09-13
KR101477604B1 (en) 2014-12-30
CN103857215A (en) 2014-06-11
JP2009529790A (en) 2009-08-20

Similar Documents

Publication Publication Date Title
WO2007103949A3 (en) Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores
US9439282B2 (en) Method for manufacturing printed circuit board
TW200623318A (en) Method for fabricating a multi-layer circuit board with fine pitch
TW200505304A (en) Multilayer circuit board and method for manufacturing the same
WO2012072212A3 (en) Electronic device, method for producing the latter, and printed circuit board comprising electronic device
WO2008155957A1 (en) Method for manufacturing substrate with built-in component and substrate with built-in component
WO2009037939A1 (en) Printed wiring board and method for manufacturing the same
TW200744417A (en) Method for manufacturing stack via of HDI printed circuit board
US10321560B2 (en) Dummy core plus plating resist restrict resin process and structure
KR102488164B1 (en) Printed circuit boards having profiled conductive layer and methods of manufacturing same
WO2009054105A1 (en) Part built-in printed wiring board, and its manufacturing method
KR102268388B1 (en) Printed circuit board and manufacturing method thereof
EP1776002A4 (en) Hybrid electronic component and method for manufacturing the same
KR101516078B1 (en) Printed circuit board and method of mamufacturing the same
US10772220B2 (en) Dummy core restrict resin process and structure
US8586876B2 (en) Laminated circuit board and board producing method
TW200618707A (en) Multi-layer printed circuit board layout and manufacturing method thereof
CN103889169B (en) Package substrate and preparation method thereof
KR20110113980A (en) Multi-layer printed circuit board comprising film and method for fabricating the same
KR102442389B1 (en) Printed circuit board and method of manufacturing the same
JP2011222962A (en) Print circuit board and method of manufacturing the same
CN112351600A (en) High-speed ATE test board and manufacturing method thereof
US20090139756A1 (en) Fabricating process of circuit board with embedded passive component
KR100754071B1 (en) Method of manufacturing printed circuit board for using all layer interstitial via hole
CN105282972B (en) Device internally-arranged type printed circuit board, semiconductor packages and its manufacturing method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2008558512

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 200780016293.0

Country of ref document: CN

122 Ep: pct application non-entry in european phase

Ref document number: 07758020

Country of ref document: EP

Kind code of ref document: A2