CN103857215A

CN103857215A - Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores

Info

Publication number: CN103857215A
Application number: CN201310750377.4A
Authority: CN
Inventors: K·K·沃索亚
Original assignee: Stablcor Inc
Current assignee: Stablcor Inc
Priority date: 2006-03-06
Filing date: 2007-03-06
Publication date: 2014-06-11
Also published as: CN101437676B; KR101477604B1; JP2009529790A; CN101437676A; KR20080100483A; WO2007103949A2; JP2015039002A; WO2007103949A3

Abstract

Methods of manufacturing printed wiring boards including electrically conductive constraining cores that involve a single lamination cycle are disclosed. One example of the method of the invention includes drilling a clearance pattern in an electrically conductive constraining core, arranging the electrically conductive constraining core in a stack up that includes B-stage (semi-cured) layers of dielectric material on either side of the constraining core and additional layers of material arranged to form the at least one functional layer, performing a lamination cycle on the stack up that causes the resin in the B-stage (semi-cured) layers of dielectric to reflow and fill the clearance pattern in the electrically conductive constraining core before curing and drilling plated through holes.

Description

Making has the program of the printed substrate of conduction reinforcement central layer

The application is the divisional application that is called the Chinese patent application 200780016293.0 of " program that making has the printed substrate of conduction reinforcement central layer " in the name that on March 6th, 2007 submits to.

Technical field

The present invention relates generally to the manufacture of printed substrate, and relate more specifically to strengthen for the conduction of the structure of multilayer printed circuit board (PWB) filling of intermittent pattern (clearance pattern) in central layer (constraining core) layer.

Background technology

Computer and similarly electronic product are to go deep in consumer, commercial affairs, military affairs, space flight and government activities.In key application, the use of electronic product has produced the demand that reliable electronic product is increased.Many purposes is specified and can and be had the electronic product of shorter downtime than the operation of desirable longer time in past.

Consumer to reliability emphasize also extend to PWB field.PWB can be used to set up the electrical connection between device.In some cases, device can be installed on printed substrate.The method that device is installed depends on the encapsulation of device conventionally.The application of printed substrate can comprise as heat treatment, the control of expansion mismatch, the challenge of soft or rigidity and higher weight.Some during some materials that use in the past can address the above problem, described material comprises thick metal core board, copper-invar-copper (CIC), copper-molybdenum-copper (CMC).These metal core board materials be conduction and need to through special processing so that its merge in printed substrate.These processing can comprise boring intermittent pattern, and pattern fills and extra pressing step are removed in surface treatment.The use of these materials and relevant extra process cause lower output and extra labour cost conventionally.In addition, on thick metal core board, get out little through hole or electroplating ventilating hole (PHT) can go wrong.In the foundation of high density interconnect, if can not get out the use of little through hole possibility limiting material on material.

Multiple other materials can be used to replace metal material above and solve as heat treatment, as heat management, the control of expansion mismatch, the integrity problem of soft or rigidity and higher weight.What license to Vasoya etc. is numbered 6,869,664 United States Patent (USP), the U.S. Patent application that the sequence number that licenses to Vasoya is 11/131,130, the sequence number that licenses to Vasoya is 11/376,806 U.S. Patent application, and the temporary patent application that the sequence number that licenses to Vasoya is 60/831,108 discloses the technology that can be used for manufacturing printed substrate, described printed substrate has the thermal coefficient of expansion (CTE) needing and uses the fibrous material layer being associated with as weaving carbon fiber.The sequence number that licenses to Vasoya etc. is 6,869,664 U.S. Patent application, the sequence number that licenses to Vasoya is 11/131,130 U.S. Patent application, the U.S. Patent application that the sequence number that licenses to Vasoya is 11/376,806, and the temporary patent application that the sequence number that licenses to Vasoya is 60/831,108 is intactly incorporated to herein as a reference.

Summary of the invention

Disclose printed substrate and strengthened holing in central layer and fill the manufacturing technology of intermittent pattern in conduction.An aspect in the several embodiment of the present invention is to use existingly for the manufacture of not comprising that conduction strengthens the processing of PWB of central layer, and the strengthening core flaggy that makes to conduct electricity is incorporated to PWB.Another aspect of the present invention is to use single pressing cycle making to comprise the PWB of conduction reinforcement central layer.Additional aspect of the present invention is the making of PWB, and described PWB comprises conduction reinforcement central layer, and it is incorporated in PWB and before other layer, does not need the independent pressing cycle to fill the intermittent pattern of strengthening in central layer at reinforcement central layer.

An embodiment of the inventive method is included in conduction strengthening core twist drill and goes out intermittent pattern, strengthen central layer with stack manner arrangement conduction, described stacking B level (semi-harden) dielectric material layer of strengthening central layer both sides and the material extra play that is arranged to form at least one functional layer of being included in, thus before processing and boring electroplating ventilating hole, impel resin backflow filled conductive in B level (semi-harden) dielectric layer to strengthen the intermittent pattern in central layer to the stacking execution pressing cycle.

Another embodiment comprises that extraction is about the information of electroplating ventilating hole position from PCB design, and described through hole is not defined as with described conduction reinforcement central layer and electrically contacts; And determine described spacing pattern about the information of electroplating ventilating hole position described in using, described through hole is not defined as with described conduction reinforcement central layer and electrically contacts.

In another embodiment, wherein said conduction is strengthened central layer and is had two main faces, and can be from a main face direct conduction to another main face.

In another embodiment, wherein, in the time of 1MHz, described conduction is strengthened central layer and is had the dielectric constant that is greater than 6.

In another embodiment, to strengthen central layer be that the fiber material that injects described resin by uses is constructed for wherein said conduction.

In another embodiment, wherein said fiber material is carbon fiber.

In another embodiment, wherein said carbon fiber is metallized.

In another embodiment, wherein said conduction reinforcement central layer is constructed by thick metal layers.

Another embodiment stops before being further included in pressing that (screen) resin enters described conduction and strengthens the intermittent pattern in central layer.

Another further embodiment also comprises: stacking multiple conductions are strengthened central layer; On strengthening central layer stacking, described conduction gets out described intermittent pattern; And strengthen making pressing adjusting hole (tooling hole) in central layer in described conduction.

Thereby another embodiment further comprise described in printing etching conduction strengthen central layer in pressing reach except chip.

In another embodiment, wherein: described B level dielectric layer, i.e. semi-harden dielectric layer, is film (prepreg); And the described stacking conductive material layer that comprises.

In another embodiment, wherein said B level dielectric layer, i.e. semi-harden dielectric layer, comprises at least 70% volume fat content.

In another further embodiment, wherein use base substrate material to set up described conduction and strengthen the region of central layer, and use basement material to set up at least one region of described conduction reinforcement central layer.

Another embodiment also comprises: select base substrate material; Remove the described base substrate material of part; Select basement material; Cut a described basement material, its can be contained in described base substrate material described in remove part; And arrange described base substrate material and a described basement material as described stacking part.

In another further embodiment, the intermittent pattern of wherein holing further comprises: determine the position of septal pathways and the width of needs according to the design of printed substrate; Determine the distance between issuable described indentation in the time holing described passage by selected drill bit and the spacing of wells; And select drill bit and the spacing of wells so that the distance between described indentation is greater than the width of described passage needs.

Another embodiment further comprises: use described printed substrate design, identification is strengthened central layer with described conduction and produced the electroplating ventilating hole being electrically connected, and described electroplating ventilating hole approaches described septal pathways most; Determine the distance between described septal pathways and the electroplating ventilating hole of identification; And select described drill bit and the spacing of wells so that the passage producing not with the position crossover of identified electroplating ventilating hole.

Another further embodiment also comprises: the height of determining described indentation; And select drill bit and the spacing of wells so that the height of described indentation is less than 3mil.

Another further embodiment also comprises and selects drill bit and the spacing of wells so that the height of described indentation is less than 1mil.

Accompanying drawing explanation

Fig. 1 is the oblique view according to the printed substrate of the embodiment of the present invention, has laid multiple electronic devices with different encapsulated types on it.

Fig. 2 is the schematic cross sectional view of printed substrate shown in Fig. 1.

Fig. 3 is the flow chart of manufacturing the step of printed substrate according to the explanation of the embodiment of the present invention from basic material and dielectric insert.

Fig. 4 a-4h is the schematic cross sectional view according to multiple pcb components of the illustrated part manufacturing step of Fig. 3 structure.

Fig. 5 is the flow chart that inserts material manufacture printed substrate step according to the explanation of the embodiment of the present invention from basic material and at least one non-dielectric matter (or conduction).

Fig. 6 a-6k is the schematic cross sectional view of setting up multiple pcb components according to the part manufacturing step of Fig. 5 explanation.

Fig. 7 is the schematic cross sectional view according to the printed substrate that comprises electroplating ventilating hole of the embodiment of the present invention.

Fig. 8 is the flow chart according to the manufacture printed substrate of the embodiment of the present invention.

Fig. 9 is the schematic cross sectional view of strengthening central layer according to the conduction of the embodiment of the present invention.

Figure 10 is the schematic cross sectional view of strengthening central layer according to the conduction of the embodiment of the present invention.

Figure 11 is the flow chart according to the manufacture printed substrate of the embodiment of the present invention.

Figure l2a-l2d is the schematic cross sectional view of carrying out the conduction reinforcement central layer of multiple processing during the manufacturing step of Figure 11 explanation.

Figure 13 a-l3b is the schematic cross sectional view according to the pcb component of the part manufacturing step structure of Figure 11 explanation.

Figure 14 is the schematic cross sectional view of strengthening the PWB of central layer according to two conductions taking on conductive layer comprising of the embodiment of the present invention.

Figure 15 is the schematic cross sectional view of strengthening the PWB of central layer according to two conductions taking on physical layer rather than conductive layer comprising of the embodiment of the present invention.

Figure 16 is the flow chart of manufacturing metal core board printed substrate step according to the explanation of the embodiment of the present invention.

Figure 17 is the flow chart of strengthening the step of the printed substrate of central layer according to the explanation manufacture of the embodiment of the present invention with conduction.

Figure 18 a-l8h is the schematic cross sectional view according to multiple pcb components of the part manufacturing step structure of Figure 17 explanation.

Figure 19 is the schematic plan according to the reinforcement central layer that gets out spacer holes and interval trough pattern of the embodiment of the present invention.

Figure 20 a-20d is the schematic diagram of the groove that goes out of the hole drill that separates according to the use different distance of the embodiment of the present invention.

Figure 21 a has shown the big or small table that gets out two indentations that hole forms of specific range with the drill bit with special diameter.

Figure 21 b is the schematic diagram according to the pair of holes going out at strengthening core twist drill of the embodiment of the present invention.

Specific embodiment

Turn to now accompanying drawing, manufacture the process of the printed substrate that comprises conduction reinforcement central layer.In many examples, printed substrate uses single pressing periodical configuration.In many examples, conduction is strengthened central layer and carried out and process for constructing the other materials of printed substrate, thereby produce by using stacking in printed substrate of single pressing period-producer.In other embodiments, the generation of printed substrate does not need the independent pressing cycle to strengthen with filled conductive be integrated into other functional layers of printed substrate at central layer before the spacer holes getting out in central layer.The use in single pressing cycle and/or remove the pressing cycle and use compared with the manufacture processing in multiple pressing cycle and can increase significantly output and production capacity.In several embodiment, conduction is strengthened central layer and is comprised material with carbon element.In other embodiments, conduction reinforcement central layer is thick metal core board.In many examples, conduction strengthen central layer comprise have different from CTE(thermal coefficient of expansion) the localized areas of physical attribute.

Embodiment according to printed substrate of the present invention (PWB) is illustrated in Fig. 1.PWB10 comprises multiple electronic devices 12, and it is comprised in dissimilar encapsulation.Printed substrate comprises the region with different CTE.On printed substrate, the position of electronic device is determined, has and the CTE of the CTE compatibility of electronic device so be positioned at each electronic device on printed substrate.Conventionally, the CTE of care is the CTE in the face of packaging and printed substrate.The compatibility of the CTE of the encapsulation of electronic device and printed substrate region CTE greatly depends on that plan is used the action need of the concrete application of printed substrate.

Fig. 2 has illustrated the sectional view of the PWB10 shown in Fig. 1.PWB10 comprises multiple functions and the structure sheaf of being constructed by multiple material.The functional layer of PWB is be intended at electronic device and/or comprise the layer of setting up electrical connection between circuit, and it carries the signal comprising such as the reference voltage of power and ground voltage.The structure sheaf of PWB is be not intended at electronic device and/or comprise the layer that connects between circuit and carry signal.Structure sheaf comprises its physical property.

PWB10 in Fig. 2 comprises that conduction strengthens central layer 20, and it is as structure sheaf, functional layer, or some part as structure sheaf and in other parts as functional layer.The conduction strengthening core flaggy that runs through explanation refers to reinforcement central layer.Strengthen central layer 20 and comprise the region of being constructed by different materials.The embodiment illustrating comprises the region 22 of being constructed by basic material and at least one region 24 of inserting material structure.In the time of the multiple region 24 having by multiple insertion material structures, each insertion material can have different physical attributes.Basis and the customization of inserting the physical attribute of the selection permission reinforcement central layer 20 of material.In many examples, resin 26 or suitable thermmohardening and thermoplastification material such as adhesive can be used to multiple regions to merge to single layer.Resin can provide support structure for multiple material areas.In many examples, resin also can make 28 layers of electric insulation of electric conducting material of strengthening core plate 20 and vicinity.The remainder of PWB comprises conductive material layer 30, and its functional layer and described functional layer that can form PWB is separate by dielectric material layer 32.

As below further discussed, technology described herein can be for merging the material that can be used for PWB structure of any two types almost.Disclosed technology is according to basic material and to insert material be whether dielectric substance (effectively hindering the stream of the signal of telecommunication class of foundation in PWB) or non-dielectric matter (being electric conducting material) and resin 26 are that dielectric changes.The selection of basis and insertion material can affect the physical attribute of PWB.When the physical attribute having at the insertion material 24 of forming section reinforcement central layer 20 is different from the physical attribute of basic material 22, the PWB completing can have the region with different physical attributes.In many examples, insert material 24 selected so that the PWB region with CTE in certain surface to be provided.Described CTE and the interior CTE compatibility of the face that is placed in the upper device of PWB.

In the embodiment of Fig. 2 explanation, basic material 22 is constructed by non-dielectric material, the carbon fiber of described non-dielectric material such as resin by injection, as EP287 and the EP450 of the Lewcott company manufacture of (Millbury) in Massachusetts Mil uncle, inserting material 24 is constructed by dielectric substance, as the E glass of resin by injection, and the resin 26 of merging basic material and insertion material is dielectric resin.

The carbon fiber that is used as basic material in the embodiment that Fig. 2 shows is the example that is suitable for the non-dielectric material of PWB structure.Other example that is applicable to non-dielectric material comprises the fiber of covering metal resin by injection, solid-state carbon plate, carbon-silicon carbide (C-SiC), as the C-SiC of the Starfire System company manufacture of New York Malta (Malta), copper invar copper (Copper Invar Copper), copper molybdenum copper (Copper Molly Copper), chemical gaseous phase deposition (CVD) diamond, as be positioned at the Alan town (Allentown) of Pennsylvania the root advanced ceramic of rubbing (Morgan Advanced Ceramics) Diamonex Products Division manufacture CVD, carbon synthetic and graphite synthetic or metal form synthetic.Each can being attached at least on one side in these materials.

In the time that non-dielectric material comprises carbon fiber, fiber can be continuous, discrete, broken or in blocks.If use discontinuous fiber, fiber can be by around disconnected or break, the X0219 manufacturing such as eastern nation carbon fiber (the Toho Carbon Fiber) company of Tennessee Lockwood (Rockwood).In addition, carbon fiber can comprise PAN fiber and/or pitch fibers.

The fiber that is suitable for metal coating comprises the combination of carbon, graphite, aramid fiber (Aramid), Kevlar (Kevlar) fiber, quartz or these fibers.The metal that can be used for coated fibers comprises nickel, copper, palladium, silver, Xi Hejin.The plated film of fiber material can be by carrying out as the manufacturer of the Electro Fiber Technologies of the Strafford (Stratford) that is positioned at Connecticut (Connecticut).

Configuration that can arranged fiber material comprises by weaving, unidirectional or nonwoven mat.When material is weaved, material can be plain weave, tiltedly knit, 2x2 tiltedly knits, square knit, leno is knitted, satin is knitted, sew up and knit or 3D(three-dimensional) form of knitting.

Fiber material also can be for the non-form of knitting, as single band (Uni-tape) or felt.In many examples, carbon felt, as the rank that the high fiber non-woven (Advanced Fiber NonWovens) that is positioned at the East Walpole of Massachusetts is manufactured is numbered the felt of 80000402oz or the felt of 80000473oz, be used in the structure by the region 22 of the first material structure.

Use the carbon fiber of compacting carbon dust, carbon plate or chopping can make carbon plate.

Strengthening central layer also can be constructed by the carbon nano-tube synthetic material that comprises injection of polymer.Carbon nano-tube can be Single Walled Carbon Nanotube, as be positioned at the carbon single-walled nanotube (C-SWNT) that the silent industry of Canadian thunder (Raymor Industries) is manufactured, be positioned at Japan and build the advanced industrial science of ripple (Tsukuba) and/or the carbon nano-tube of the national institute of technology (AIST) exploitation.Single Walled Carbon Nanotube is the special shape of pure carbon, its intensity be steel 100 by and weight is 1/6 of steel.C-SWNT has significant electrical characteristics, and it can conduct electricity than fast 1000 times of copper.The current density of carbon nano-tube is that 109A/cm2(is 1000 times of copper).C-SWNT can carry out transferring heat with 10 of copper transferring heat times.Adopt ion processing, chemical gaseous phase deposition (CVD) chemical treatment, gas phase CVD processing, arc discharge processing or laser ablation process can manufacture carbon nano-tube.Carbon nano-tube can be less than 1nm to the diameter of 100nm and be less than the length of 2000nm.

Comprise that at non-dielectric material resin (for example, in the time that resin is injected into substrate) situation under, resin can be the combination of epoxy material, ester class, epoxy triazine bismaleimides (BT), cyanate and/or pi base bismaleimides (BMI), ester class, polyamidoimide, polypropylene amine ester, polyphenylene sulfide, tetrafluoroethene, polysulfones, PPSU, polyether sulfone, polyphtalamide, polyformaldehyde, polyketone, Merlon, polyphenylene oxide, polyether-ether-ketone base or resin.Base resin also can comprise filler, as pyrolysis carbon dust, carbon nano-particle, carbon nano-tube (diameter range is less than from 1 to 100nm), carbon single-walled nanotube (C-SWNT) thereby, carbon dust, carbon granule, diamond dust, boron nitride, alum, aluminium oxide, aluminium nitride, aluminium hydroxide, molybdenum hydroxide, Cab-O-sil and ceramic particle revise physics, machinery, electricity, the hot attribute of basic material.Resin composition can comprise weight and account for this class filler of 2% to 80%.In several embodiment, filler particles size is restricted to and is not more than 25um.

As described above, shown in Fig. 2, inserting material 24 is constructed by dielectric substance.Can comprise for the example of other dielectric substance of structure PWB any mixture of aramid fiber, Kevlar fiber and these fiber materials.

In region 24 by comprising that, in the embodiment of the second material structure of resin, resin can be epoxy, epoxy triazine dimaleoyl imino resin, cyanate ester based resin and/or pi base resin.Resin system also can comprise the filler of revising base resin attribute.

In one embodiment, around the resin 26 in region 24 and 22, by thin E glass construction, as 106 types with high fat content, high crack resistance and high tenacity are strengthened E glass.In many examples, resin can be epoxy triazine dimaleoyl imino resin, mix cyanate ester resin, cyanate ester based, polyimide base and/or PTFE(polytetrafluoroethylene) base resin.Resin 26 also can comprise one or more than one additive that changes base resin physical attribute.In many examples, resin can stand the relevant power of thermal cycle of layer 20 interior multiple material, and the different materials in described layer 20 can have different CTE.Applicable material comprises 44N106, the 84N106B level material manufactured by refined dragon (ARLON) the electronic material branch company of the Lun Qiukukamengjia that is positioned at California, USA (Rancho Cucamonga).Also comprise 370HR106, epoxy 370106 and the PCL-GIP-785 pi 106B level material of Bao Lide laminated sheet (PolyClad Laminates) manufacture that is positioned at Franklin, New Hampshire (Franklin).And the Aesop that the Qian De that is positioned at that state of Ya Lisang strangles city (Chandler) draws the laser that laminated sheet (ISOLA Laminates) is manufactured to soak (Laser Preg) GI30 and 1080.Also can use other film type, as 1080,2113,2313,2116,7628.

Comprise and use the dielectric of at least one or combination discussed above and the reinforcement central layer 20 of non-dielectric matter structure according to many embodiment of PWB of the present invention.Table listed above is not completely.The region 22 of being constructed by basic material and the region 24 of inserting material structure can be constructed by the other materials independent or that be combined with that in fact can produce the pressing that is applicable to PWB.As above discussed, the selection of material is subject to the impact of Material Physics attribute conventionally, and described physical attribute comprises the interior CTE of face in the region of the PWB of the merging material of generation.

In one embodiment,

conductive material layer

28 and 30 can be constructed by Copper Foil, and described Copper Foil is manufactured by the GOULD electronics that is positioned at Ohioan East Lake (Eastlake).Substitute, electric conducting material can be led paper tinsel structure by anti-, as is positioned at the anti-material of leading of the Ohmega technology company manufacture of California Ka Foshi (Culver City).In other embodiments, conductive material layer can be by constructing by the copper of chemical treatment deposit, described chemical treatment is as the processing at through hole cement copper, the Copper Foil of the Copper Foil of the copper of resin plated film (RCC), nickel plated film, nickel gold plated film and can be used for the other materials of the structure of PWB.In addition, conductive material layer can be the similar layer of pre-emphasis central layer 20, and the part of the described reinforcement central layer 20 wherein providing is as functional layer.

In one embodiment, use the E glass construction dielectric layer 32 of being strengthened by resin.In other embodiments, dielectric layer can and can be used for constructing the other materials of dielectric layer in PWB by the Kevlar fiber-based material of epoxy-based material, cyanate ester based material, polyimide sill, GTek material, PTFE sill, aramid fiber sill, chopping, Kevlar fiber-based material, silica based material and constructs.

Although listed many materials above, embodiments of the invention are not restricted to use material above.According to the present invention, in conjunction with the manufacture method of structure PWB described below, other materials can be used.

Depend on for constructing the method for PWB the material that is used to form reinforcement central layer 20 according to of the present invention.Variation in manufacture processing is relevant to the conductivity of the material for PWB structure.In many cases, replace the part of excision can construct PWB layer by cut-out basic material and with inserting material.Fig. 3 has shown that can be used for first of the embodiment of the present invention processes, and is wherein all dielectric for constructing the insertion material of PWB, and in conjunction with basic material with to insert the resin of material be also dielectric.Fig. 5 has shown that can be used for second of the embodiment of the present invention processes, and wherein inserting material at least one of constructing PWB is non-dielectric and/or in conjunction with basic material with to insert the resin of material be non-dielectric.Example according to the embodiment of each processing type of the present invention has below been described.

Fig. 3 illustrates according to the method for structure of the present invention PWB and comprises and use dielectric to insert material to produce the region with the physical attribute different from the attribute of the remainder of PWB.Physical method shown in Fig. 3 can be used for the PWB embodiment that structural map 2 illustrates and inserts material and be all dielectric other embodiment for the resin that merges basic material and insert material.Method 40 comprises preparation (42) basic material and inserts material.The basic material part of the cutting that the preparation of material can comprise removing of basic material part and insert material to be applicable to removing.Then the basic material of preparing and insertion arrangement of materials dielectric layer and conductive material layer are prepared pressing.Dielectric layer and multiple conductive material layer can be taked plating film or the form of plating film and pressing not.Then the pressing cycle is performed (46) to produce pcb component.Can electroplate (49) conduction and/or Heat Conduction Material in the part boring (48) of pcb component and at the liner in hole.The pcb component of electroplating is printed and the PWB of etching (50) to have formed.Then PWB is done (52) and element can be placed on PWB.

The material and the pcb component that in the production shown in Fig. 3 is processed, use according to the embodiment of the present invention are illustrated in Fig. 4 a-4h.The processing of as described above, manufacturing PWB shown in Fig. 3 comprises prepares basic material 60 and inserts material 62.These materials are the materials for constructing the layer similar to the reinforcement central layer 20 shown in Fig. 2.Basic material 60 is materials that composition is strengthened central layer 20 major parts.

In the embodiment of explanation, basic material 60 is that non-dielectric and both sides are coated with the conductive material layer as copper.In other embodiments, underlying metal 60 can be dielectric and/or monolateral plating or plating not.In the dielectric embodiment of basic material right and wrong, conventionally need to be before pressing prebored hole basic material.

Basic material can be prepared by getting out spacer holes 64 and cutting out part 66.The spacer holes getting out is finally inserted resin and can be made non-dielectric matter basic material and drill through the insulation of PWB conductive plated through hole.The PWB region that cut-out has finally limited, described region has the physical attribute (as CTE) different from other part attributes of PWB.

As above discussed, inserting material 62 is dielectrics.Each insertion material is cut into and will be applicable to the size of the suitable cut-out 66 of basic material.Conventionally, the yardstick of insertion material cutting is slightly less than cut-away area.In one embodiment, use 30mil(mil) gap 68.In other embodiments, gap 68 can be the distance of 10mil to 125mil scope.Between insertion material 62 and basic material, fill with bonding material conventionally in 60 gap 68, and described bonding material is as adhesive or resin.

As manufacturing a part of processing, the basic material of preparation and insertion material are arranged at dielectric layer 70 and the conductive material layer 72 for the preparation of pressing cycle.This processing can be understood with reference to figure 4c-4e.Material is arranged at first both sides and carries out that pressing part 74 plates electric conducting material 72 and stacking the first film 76 on plating pressing part.Conventionally the conductive layer that, closes on film is eclipsed and carves circuit pattern.In the embodiment of explanation, use any manufacturing technology that known those skilled in the art adopt to manufacture plating pressing part 74 and the first film 76.

Then basic material 60 is placed on above the first film 76.As above discussed, basic material can be prepared by getting out spacer holes 64 and producing cutting part 66.Then insert material 62 and be placed on cut-out 66.In the time that insertion material is inserted into cut-out 66, insert material cut with leaving gap 68 and basic material 60.By at basic material 60 with insert material 62 and form layer and place the second film layers 80 above and complete arrangement 78.Then the pressing part that both sides are coated with electric conducting material 82 is placed on above the second film.The conductive layer 82 that closes on the second film can be etched circuit pattern in advance.The arrangement producing is as shown in Fig. 4 e.Although the embodiment illustrating is included in the upper and lower film of basic material 60 and pressing part, other embodiment can comprise plating pressing part and/or the film of the more than one formation pattern on basic material 60 both sides, thereby forms Multifunctional layered.Certainly, can use two films structure according to PWB of the present invention, each at one side plating, described film be positioned at basic material and insert layer that material forms above and below.In addition, many embodiment comprise the multiple layers that form by merging basic material and at least one insertion material.

Then carry out the pressing cycle (46).The person's character in pressing cycle depends on for arranging 78 film and the person's character of dielectric layer.The manufacturer of resin, film, pressing part formulates the temperature and pressure condition that pressing device needs.The pressing cycle can be by adhering to that manufacturer carries out the requirement of the multiple material for PWB structure.

In Fig. 4 f, show the pressing cycle according to the production pcb component 84 of the embodiment of the present invention.Due to the effect in pressing cycle, resin 86 is filled basic material 60 and is inserted the gap 68 between material 62 and they are bonded to together.Resin 86 is also filled spacer holes 64 and

conductive material layer

90 and 91 is bonded to basic material 60 and inserts the layer 20 ' that material 62 forms.

Through hole gets out (48) in pcb component.Fig. 4 g shows the pcb component of boring.Pcb component comprises multiple holes 92, and it is through each layer of printed substrate.

Once hole is got out, hole is plated (49) and conductive material layer is printed and etching (50).These process on multiple layers of PWB and interlayer produces circuit.As above discussed, functional layer can comprise the region of conductive material layer and layer 20 '.The circuit forming between functional layer can be for carrying the signal of telecommunication.By lay electric device on PWB, the PWB(completing is the PWB that electric device is connected and lays) similar to the PWB completing showing in Fig. 2.

As discussed, depend on according to the method for structure PWB of the present invention the material that is used to form PWB layer above.Fig. 5 has illustrated the embodiment of the inventive method, and it can be used for PWB layer, and described PWB layer comprises at least one insertion material of the dielectric basic material of right and wrong and non-dielectric matter and/or dielectric with the resin right and wrong of insertion material for merging basic material.Processing 100 comprises preparation (102) basic material and inserts material.Then the basic material of preparing and insertion material are arranged (104) for preparing resin and conductive material layer of pressing.Then the first pressing cycle (106) of carrying out is to produce pcb component.Then can be through pcb component boring (108) to produce spacer holes.Then pcb component can be printed, etching and oxidation (110) then can be used resin and and electric conducting material arrangement layer (112) pcb component to prepare for the second pressing cycle.Then the second pressing cycle was performed (114) to produce the second pcb component.The second pcb component can have the hole (116) of boring on it again.Hole can be conducted electricity or Heat Conduction Material rag (118).Once hole is by rag, pcb component can be printed, etching (120) and plate are done (122).

Fig. 6 a-6k has illustrated the material and the pcb component that during manufacturing processing shown in Fig. 5, use.What as described above, Fig. 5 illustrated comprises and prepares basic material 60 ' and insert material 62 ' according to the processing for the manufacture of PWB of the present invention.These materials are the materials for being configured in the similar layer of reinforcement central layer 20 that Fig. 2 shows.Method as shown in Figure 3, basic material composition is strengthened the major part of central layer 20, and is prepared by cut-out material.The part 66 ' of these excisions finally comprises inserts material 62 ', the part of the wiring board that its restriction completes, and the physical attribute (as CTE) that wherein said part has is different from the physical attribute that other parts of plate have.

In the embodiment of explanation, basic material 60 ' can be dielectric or non-dielectric matter, and insertion material 62 ' is non-dielectric.Each insertion material is cut into and will be applicable to the suitably size of the part 66 ' of cutting of basic material 60 '.As above discussed, insert the cut dimension of material and be slightly less than cut-away area 66 ' and can there is the in question similar tolerance relevant with Fig. 4 a-4h to Fig. 3.

During manufacture, the basic material of preparation and insert material to be arranged (104) be the layer that comprises resin.In multiple embodiment, comprise that the layer of resin is the form of film.Film can be to inject dielectric resin and/or resin molding.Conventionally, selected to fill the cutting interval of inserting around material during pressing for the resin of film.

Basic material, insert material and comprise resin layer arrangement can understand with reference to Fig. 6 c-6e.Film layers 70 ' is stacked on paper tinsel 72 ' at first, and above (see Fig. 6 c), then basic material 60 ' is placed on film and inserts material 62 ' and is placed in the cut-out 66 ' of basic material.Complete arrangement by then placing the second paper tinsel 72 ' at basic material 60 ' with the upper placement of layer second film 70 ' that inserts material 62 ' formation on the second film.Final arrangement 138 is illustrated in Fig. 6 e.In other embodiments, can use the film at one side plating.

The first pressing cycle was performed (106) with the pcb component 139 shown in production drawing 6f.Conventionally the execution in pressing cycle requirements to multiple materials that are used to form arrangement 138 according to manufacturer.During pressing, under the resin flow of film 70 ' to fill basic material 60 ' and the gap 68 ' of insertion between material 62 '.During pressing, resin deliquescing, gel also solidify basic material 60 ' to be bonded to insertion material 62 '.Resin is also bonded to conductive material layer 72 ' by the layer of basic material 60 ' and the 62 ' formation of insertion material.

After pressing, can on pcb component 139, get out (108) spacer holes 140.The pcb component that gets out spacer holes 140 illustrates in Fig. 6 g.Finally, spacer holes is filled by dielectric substance, and as dielectric resin, and electroplating ventilating hole penetrates the spacer holes of resin filling.The dielectric substance of filling interval sky is used for making basic material 60 ' and inserts material 62 ' and the electroplating ventilating hole insulation getting out through spacer holes.

After boring spacer holes, conductive material layer is printed, etching and oxidation (110) to be to produce separation pad and to remove chip.Then pcb component can arrange (112) to prepare for the second pressing cycle with film 70 ' and conductive material layer 72 '.In one embodiment, use both sides to be coated with the pressing part 142 of electric conducting material and the film 144 between pcb component 139 and pressing part forms stacking.In the face of being eclipsed, pressing part 142 on the conductive material layer of film 144 carving circuit pattern.Then stacking can completing by additional another film 146 and the pressing part 148 that is coated with conductive material layer on both sides.Pressing part 148 is etching circuit pattern in the face of on the conductive material layer of film 146.The structure of plating pressing part 142 and 148 and film 122 and 146 can be by using traditional manufacturing technology to reach.Although the stacking above and below film of pcb component and the plating pressing part of being included in that Fig. 6 h shows, embodiments of the invention can be included in the pressing part of the above and below monolateral plating of printed substrate.Equally, embodiments of the invention can comprise more than one film and/or pressing part.In many examples, multiple pcb components are integrated into single stacking to produce PWB.In addition, pcb component can be used as according to the layer in the PWB structure of the method shown in Fig. 3.

The second pressing cycle was performed (114) with the second pcb component shown in production drawing 6i.Equally, the pressing cycle person's character being performed depends on the requirement of manufacturer to the material for PWB structure.During pressing, flow out with filler opening 140 from the resin 150 of film 144 and 146.After pressing, together with film 144 is bonded to the layer of the second pcb component with the resin in 146.

Once the second pressing cycle completed, hole 152 can get out (116) to form placed hole and electroplating ventilating hole in the second pcb component.The embodiment in the saturating hole 152 of the second pcb component 149 and its upper brill shows in Fig. 6 j.Then hole can be by rag (118) to produce the electroplating ventilating hole 154 as shown in Fig. 6 k.After the rag in hole, the exterior layer of PWB is printed before can completing at PWB (122) and lay any element on PWB and etching (120).

Fig. 7 shows the embodiment according to PWB160 of the present invention, and it comprises the basic material as the functional layer in PWB.The PWB160 illustrating can be according to the processing structure of Fig. 5 explanation.The electrical connection that uses electroplating ventilating hole 162 to set up circuit pattern on basic material and other conductive layers of PWB.

Although mentioned concrete material in the discussion according to manufacture of the present invention PWB above, any material that can be used for manufacturing PWB also can be used as the basic material in manufacturing according to PWB of the present invention and insert material.Greatly depend on the glass transition temperature of material according to the material combination of formation PWB of the present invention.At C level material (having passed through the material in full cure cycle), as inserting in the embodiment of material, basic material can be with the B level material (being semi-harden material) that is equal to or less than C level and inserts the glass transition temperature of material glass conversion temperature.When basic material is C level material and inserts material while being B level material, above-mentioned situation is also set up.In addition,, in the time that basic material is C level material with insertion material, to note equally the selection for merging basic material and inserting the resin of material.Once material is selected, whether the selection of manufacture method is depended on any insertion material and/or is non-dielectric for the resin that merges basic material and insertion material.As above discussed, if insert material and be dielectric for merging basic material and inserting the resin of material, the method shown in Fig. 3 and Fig. 5 all can be used for the manufacture of PWB so.If one insert material be conduction and electroplating ventilating hole by insert material, so conventionally use the processing shown in Fig. 5.

Above-described method comprises for the manufacture of the PWB that comprises the reinforcement central layer that basic material and insertion combination of materials form.With reference now to Fig. 8-Figure 18 g,, the generalized approach that comprises dissimilar reinforcement central layer for constructing is disclosed, described method does not need to strengthen central layer and stand the pressing cycle at multiple embodiment before itself and other material of constructing for PWB merges, and uses single pressing periodical configuration PWB.In other embodiments, use multiple pressing periodical configuration PWB.In many examples, single pressing cycle is used to fill intermittent pattern and/or bonding substrate and basement material and merges and strengthens central layer and the functional layer of closing on.

Fig. 8 shown according to the embodiment of the present invention for the manufacture of comprising that at least one strengthens the processing of central layer.Processing 200 comprises checks and prepares Ge Bai (Gerber) data of manufacturing for PWB.Check can comprise determine that minimum walks that gap between linear dimension, minimum cabling, minimum vias size, boring aspect ratio, signal impedance requirement, dimensional tolerance, Surface Machining require, plane tolerance and/or final split requirement.In many examples, PWB design comprise insert with PWB on lay the material of the CTE that the CTE of element matches.Then strengthening core flaggy processed (204) use internal layer (206) pressing of B level (semi-harden) dielectric film with other.After pressing, PWB can be done (208).Although above-mentioned processing comprises single pressing cycle, in other embodiments, the reinforcement central layer that forms pattern can merge and complete PWB in the follow-up pressing cycle with B level dielectric film with for the material of constructing other layers of PWB within the first pressing cycle.

The Gerber data that are used for the PWB that comprises the embodiment of the present invention generally include functional layer and NOT function ergosphere.Functional layer comprises signals layer, signal path layer, routing layer, circuit layer, ground plane, bus plane, segmentation plane layer, reference planes layer, underground heat plane layer, hybrid planar layer, bury passive layer (buried passive layer) and for integrated circuit, bare chip and/or be connected to the layer of other device telecommunication of PWB.NOT function ergosphere generally include structure draw (fab drawing), boring drawing, borehole data, solder mask layer, silk-screen layer, scolder adhered layer, hot plate layer, mechanical strengthening course, structure sheaf and be not used for be connected to PWB device telecommunication layer.

Fig. 9 shows the sectional view according to the reinforcement central layer of the embodiment of the present invention.Strengthen central layer 212 and comprise the conductive layer 214 being clipped between the first metal-clad 216 and the second metal-clad 218.Be included in the metal-clad on two sides although embodiment illustrated in fig. 9, can comprise only at the monolateral layer that covers metal according to reinforcement central layer embodiment of the present invention.Shown in Fig. 9 and comprise that having single or double reinforced layer covers metal and strengthen the configuration of central layer and can be called as " covering the synthetic pressing of metal " or " covering metal pressing ".

Strengthen central layer 212 and electric current can be transmitted to the second metal-clad 218 from the first metal-clad 216 by conductive layer 214.In multiple embodiment, strengthen central layer and in the time of 1MHz, there is the dielectric constant that is greater than 6.As described below, according to embodiments of the invention, multiple material can be for the structure of strengthening core plate.The selection that is used for the material of strengthening central layer structure can be depended on the benefit of the level needs of final products, as pyroconductivity, thermal coefficient of expansion, hardness and these combination.

In one embodiment, can use the conductive layer by the fiber material structure of resin by injection.In multiple embodiment, fiber material is carbon, as CN80-3k, the CN80-1.5k, CN-60, CN-50, the YS-90 that are manufactured by Japanese Japanese graphite fibre, T300-3k, T300-1k, K800, KI100 graphite fibre that the K13B12 being manufactured by Mitsubishi chemical company, K13C1U, K63D2U or Su Taike (Cytec) the carbon fiber limited liability company system by South Carolina Ge Liweier (Greenville) make.In other embodiments, metalized fibers is used to the structure of conductive layer.By metallizing independent fiber metallized fiber is formed in fabric can metalized fibers material fiber material, fiber can be formed into that then fabric can be metallized can metalized fibers material fiber material, or the combination of two metalized.The fiber that can be metallized comprises the combination of carbon, graphite, E glass, S glass, aramid fiber, Kevlar fiber, quartz, liquid crystal polymer or these fibers.Once be metallized, by by resin injection metalized fibers, can form electric conducting material according to the present invention.

In one embodiment, the fiber material that is injected into resin can be continuous carbon fibre.In other embodiments, fiber material can be discontinuous carbon fiber.The example of suitable discontinuous fibre comprises as Tennessee, and the X0219 that the Toho carbon fiber company of Rockwood manufactures spins protruding end.

The fiber material for strengthening central layer structure according to the embodiment of the present invention can be fabric or non-woven.Non-woven material can be the form of single band (Uni-tape) or felt.Suitable carbon felt example comprises Massachusetts, the carbon felt of the rank numbering 8000040 and 8000047 that is respectively 2oz and 3oz of high fiber non-woven (the Advanced Fiber NonWovens) manufacture of East Walpole.In other embodiments, the combination of fiber material and resin can be used and cause having the layer of the dielectric constant that is greater than 6.0 in the time of 1MHz.

In multiple embodiment, conductive layer can be by PAN(polyacrylonitrile) combined structure of base carbon fibre, asphalt base carbon fiber or PAN base carbon fibre, asphalt base carbon fiber.

According to the embodiment of the present invention, various kinds of resin can be used for injecting fiber with structure conductive layer.In several embodiment, the resin using can be epoxy, as be positioned at Massachusetts, EP387 and EP450 that the Lewcott company of Millbury produces, resin can be based on triazine bismaleimides (BT), pi base bismaleimides (BMI), cyanate, polyimides, phenol or this resinoid combination.In many examples, comprise packing material for the resin that injects fiber, as pyrolysis carbon dust, carbon dust, carbon granule, diamond dust, boron carbide, aluminium oxide, ceramic particle and phenol particle.Resin conducts electricity in many examples.

In the time of fibrous structure conductive layer by resin by injection, conductive layer can obtain its electrical characteristics from fiber.The conductive layer of for example, being constructed by the graphite fibre of injection reinforcing epoxides.In other embodiments, the electrical characteristics of conductive layer can be affected by resin.For example, by the conductive layer of the fiberglass construction of injection reinforcing epoxy resin, wherein pyrolysis carbon dust is as packing material.

The material that can be used for conductive layer structure is not restricted to the fiber of resin by injection.In many examples, conductive layer is by the carbon plate structure of shaping.In multiple embodiment, use carbon dust or graphite powder to make sizing carbon plate.In other embodiments, use carbon plate or make solid-state carbon plate with the broken carbon of thermoplasticity or heat setting adhesive.In many examples, use the C-SiC(carbon-silicon carbide of being manufactured by the Starfire system house that is positioned at New York Malta) structure conductive layer.

Also can use metal core board.As described above, metal core board comprises thick metal layers, copper-invar-copper and copper-molybdenum-copper.

In other embodiments, be not restricted to fiber material and the carbon synthetic of resin by injection for the material of conductive layer structure.When 1MHz can be formed on, there is the structure that any material of layer of the dielectric constant that is greater than 6.0 or the combination of material can be used to conductive layer.

In many examples, metal-clad can be constructed by the electric conducting material as metal.In multiple embodiment, use copper structure metal-clad.

Figure 10 shows the sectional view according to the reinforcement central layer of the embodiment of the present invention.Strengthen central layer 212 ' and comprise conductive layer 214 '.The reinforcement central layer at each face without metal-clad can be called as " not covering the synthetic pressing of metal " or " not covering metal pressing ".

Strengthen central layer 211 ' and electricity can be passed to another first type surface from a first type surface by conductive layer 214 '.In multiple embodiment, strengthen central layer 212 ' and in the time of 1MHz, there is the dielectric constant that is greater than 6.Conductive layer 214 ' can be configured to the above-described conductive layer 214 about Fig. 9 in a similar manner.

Figure 11 shows the structure processing according to the PWB of the merging strengthening core plate material of the embodiment of the present invention.Process 230 and comprise that preparation (232) is by the material of the reinforcement central layer for generation of PWB.The preparation of strengthening core plate material can comprise as the boring of the location hole of pressing location hole or punching.Then the strengthening core plate material of preparing is stacked and bores (234) and goes out intermittent pattern.Then the strengthening core plate material of boring is printed also etching (236) to remove the back of the body copper in chip etching PWB circumferential perimeter region.If need also can carry out prefabricated processing (238).As the surface treatment of brown oxidation processes is applied in (240) in strengthening core plate material surface.

Be parallel to above-mentioned processing, other internal layers of PWB can use conventional process technology processed (242) to think pressing preparation internal layer.Internal layer generally includes film and conductive material layer.Then, the strengthening core flaggy of processing and the internal layer of processing be arranged (244) think pressing prepare.Then (246) the pressing cycle of can carrying out produces pcb component.Can get out by pcb component (248) through hole and be coated with (250) thereby the liner of the through hole of heat conduction and/or electric conducting material generation PTH(plated-through-hole).Then can print the also skin of etching (252) pcb component.Then PWB is done (254) and assembly can be placed to PWB.Although above-mentioned processing comprises single pressing cycle, in other embodiments, can and be combined for the material of constructing other layers of PWB with B level dielectric film at the central layer of the first pressing period-producer pattern, and PWB completed in the follow-up pressing cycle.

The processing above described allows without the extra pressing cycle or is used for filling the structure of the special process-cycle PWB that strengthens the spacer holes on central layer.During the pressing cycle (246), be back in the spacer holes and groove getting out in reinforcement central layer from the dielectric resin that is arranged in the film of strengthening central layer both sides.Comprise basic material and insert material to have in the embodiment from the different physical characteristic of basic material strengthening central layer, be back to basic material and insert the gap between material from the electrolyte resin of film.Flow into the conductive plated PTH electric insulation that the dielectric resin of strengthening in core cavity can make strengthening core plate and the electrolyte resin of strengthening core cavity by filling hole.

Figure 12 a-12d shows according to the material of constructing for strengthening central layer of processing shown in Figure 11.Figure 12 a has shown the reinforcement central layer similar to strengthening central layer shown in Fig. 9.By getting out spacer holes, for the manufacture of PWB prepares to strengthen central layer.The spacer holes getting out finally also can electric insulation strengthening core plate material and PTH by resin filling.

Figure 12 b shows the reinforcement central layer according to the processing as ground plane in PWB of the embodiment of the present invention.Strengthen the first pattern that central layer 212a comprises spacer holes 262.In Figure 12 c, be shown as the strengthening core flaggy as the processing of bus plane in PWB.Strengthen the second pattern that central layer 212b comprises spacer holes 264.Figure 12 d shows the strengthening core flaggy according to the processing as NOT function ergosphere in PWB of the embodiment of the present invention.Strengthen the 3rd pattern that central layer 212c comprises spacer holes 266.

As discussed above about the manufacture processing shown in Figure 11, thus the strengthening core plate material that the strengthening core plate material of processing and film, the dielectric core sheet material bed of material and electric conducting material arrangement layer are prepared is the preparation of pressing cycle.Figure 13 a shows stacking according to the dielectric core flaggy of the reinforcement central layer of the embodiment of the present invention, film, electric conducting material.Initial by by electric conducting material (at this situation Copper Foil) 272 and on Copper Foil stacking the first film 274 arrange stacking 270.In the embodiment of explanation, any known manufacturing technology manufacturing copper foil 272 and the first film 274 that use those skilled in the art to adopt.

Then strengthening core flaggy is placed on the top of the first film 274.As discussed, can prepare strengthening core flaggy by the pattern that gets out spacer holes 264 above.Strengthening core flaggy 212b is as stacking bus plane.Then the second film 276 is placed on the top of strengthening core flaggy 212.Then the pressing layer 278 that is covered with electric conducting material 280 on both sides is placed on the second film 276.Conventionally, be eclipsed and carve circuit pattern at the conductive layer on pressing layer 278 both sides.Then the 3rd film 282 is placed on pressing layer 278.Then, another strengthening core flaggy 212a is placed in above the 3rd film 282.As above-mentioned, prepare this strengthening core flaggy by getting out one group of spacer holes 262.Strengthening core flaggy 212a is as stacking ground plane.The 4th film 284 is positioned on strengthening core flaggy 212a.By placing second layer electric conducting material 286(at this situation Copper Foil in the 4th film layers 284) complete stacking 270.

Although the stacking of Figure 13 a explanation is included in each strengthening core flaggy upper and lower film and pressing layer, thus other embodiment can be included in the every limit of strengthening core flaggy more than one formation pattern cover turnover pressing layer and/or film forms multiple functional layers.Even, can use two film structures according to the PWB of the embodiment of the present invention, each film is covered with metal at a face, and it is upper and lower that it is placed on reinforcement central layer.In addition, many embodiment comprise multiple strengthening core flaggies and the multiple conductive material layers that separated by dielectric layer.

In one embodiment, the film layers 212a and the 212b that are used in reinforcement central layer both sides have high resin content, as 106 type films.General resin content at 106 films exceedes 70% of volume.In other embodiments, be used in and strengthen the film layers 212a on central layer both sides and 212b and there is sufficient resin and fill the intermittent pattern getting out and smooth outer surface is provided after pressing.In another embodiment, the both sides that the film of multiple layers can be used in strengthening core flaggy are to fill spacer holes and groove.

In multiple embodiment, as California, 44N106 and the 84N106 film of the Arlon material manufacture of Rancho Cucamonga can be used to form according to the embodiment of the present invention stacking.In another embodiment, be the 1080F epoxy material of manufacture stacking can comprising by FDAC chemical company, the pi film of being manufactured by FDAC chemical company, by new Durham prefecture, PCL-FRP-370106 (78%RC) film that the Polyclad Laminates of Franklin manufactures, by Arizona State, 1080 films that the Isola Laminates of Chandler manufactures, by New York, epoxy 106 films that epoxy 106 films that the Teflon (Taconic) in Peter's bodyguard fort (Petersburg) is manufactured and Taiwan Nanya Technology Corp manufacture.In one embodiment, 2 106 films are used in the both sides of each reinforcement central layer.In other embodiments, if the thickness of strengthening core version is greater than 0.012 ", can be used to strengthen the both sides of central layer more than 106 films of 2.

In other embodiments, resinize both sides that copper (RCC) paper tinsel also can be used to strengthen central layer to fill intermittent pattern.

In multiple embodiment, strengthening core plate thickness can be up to 0.012 ".In many examples, the thickness of reinforcement central layer is restricted to 0.010 " and in certain embodiments, thickness is restricted to 0.080 ".

Described above about the manufacture processing shown in Figure 11, on stacking 270, carry out the pressing cycle.The person's character in pressing cycle depends on film and the person's character for stacking 270 dielectric layer.During pressing, to meet the temperature and pressure condition of manufacturer's appointment of resin and film.Can be by adhering to that manufacturer carries out the pressing cycle to the requirement of the multiple materials for PWB structure.

The pressing cycle is produced the pcb component 270 ' according to the embodiment of the present invention that Figure 13 b shows.As the result in pressing cycle, dielectric resin refluxes and fills the pattern of strengthening the spacer holes 264 ' in central layer 212b from dielectric film 274 and 276.Similarly, dielectric resin refluxes and fills the spacer holes 262 ' of strengthening in central layer 212a from dielectric film 282 and 284.Multiple film layers are also bonded to stacking 270 ' layer together.

Figure 14 shows the pcb component that is got out PTH.Pcb component 270 " comprise PTH290, it is by each layer of extension of pcb component.Strengthening

central layer

212a and 212b is functional layer.In several positions of the cross-section reinforcement central layer of PTH, the spacer holes 262 of resin filling " make to strengthen the plating liner electric insulation of central layer and through hole.In multiple positions of the cross-section reinforcement central layer of PTH, the plating liner of through hole directly contacts the material of strengthening central layer.In these positions 292, be connected electrically in PTH and strengthen existing between central layer.Figure 15 shows similar pcb component.Pcb component 270 " ' comprise two strengthening core versions 34, it is only as NOT function ergosphere or structure sheaf.By with resin filling spacer holes 262 ' ", pcb component 270 ' " each PTH and strengthening core version electric insulation.

As the material of thick copper central layer, thick metal core board, copper-invar-copper (CIC), copper-molybdenum-copper (CMC) is used to PWB to solve heat and and thermal coefficient of expansion (CTE) control problem.Thick metal be conventionally difficult to process and the special processing of needs from making.Use special etching chemistry can manufacture intermittent pattern.Equally, to describe similar boring above and process and also can be used to form spacer holes.But during spacer holes boring, thick metal layers can not be stacked conventionally.During spacer holes boring, the ability of stacking reinforcement central layer can increase output, and this is because multiple central layers can be holed simultaneously.In the time using thick metal core board, another problem may occur, namely has the restriction of the size of the PTH that can hole by PWB metal core board, and this is that less drill bit trends towards deflection and/or breakage because when in the time that thick metal layers is holed.

Figure 16 display structure is with the method for the PWB of metal core board.Processing 300 has described for the manufacture of comprising as the processing of the PWB of the metal core board of CIC, CMC and/or thick copper.Metal core board is prepared (304).The internal layer of PWB is also prepared (302).Conventionally, prepare included metal level form circuit pattern.Use above-described any boring method to form spacer holes pattern (306) at metal core board.Use chemical metal etchants also can on metal core board, produce spacer holes pattern (308).In many cases, special surface treatment need to be put on to the bonding of metal level with structure and other layer in PWB.Be different from above-described processing, spacer holes pattern does not have during pressing by resin filling.But spacer holes pattern before pressing by by resin filling.In certain embodiments, spacer holes is filled (312) to comprise the resin that uses the suitable injector material that stops (screening) method.Can be that form liquid, pasty state can be also the form of powdery for filling the resin of spacer holes pattern.Then at the temperature that metal level requires resin manufacturer, be baked or pressurize (314) for processing or partly process resin.The metal-cored flaggy of then filling and interior arrangement layer (316) are to form stacking and execution pressing processing.Then carry out (318) multiple processing to complete PWB.Although above-mentioned processing comprises single pressing cycle, in other embodiments, the reinforcement central layer that forms pattern can merge for the material of other layer of constructing PWB with B level electrolyte film with in the first pressing cycle, and PWB completed in the follow-up pressing cycle.

The constraint that the restriction that these sorting holes are filled is used with the less electroplating ventilating hole relevant to thick metal reinforcement central layer can replace metal core board solve by using with other type strengthening core plate material.

Figure 17 shows the method that comprises the PWB of conduction reinforcement central layer according to the structure of the embodiment of the present invention, wherein strengthens central layer and uses at the different materials with different physical attributes of strengthening in central layer zones of different.Method 340 comprises preparation (342) strengthening core plate material.A part of preparing as strengthening core plate material, part strengthening core plate material is removed.Then the strengthening core plate material of preparing and dielectric layer and electric conducting material arrangement layer (344) think that pressing prepares.Dielectric layer and conductive material layer can be the forms of covering metal or not covering metal film and pressing layer.Then (346) the pressing cycle of carrying out is to form pcb component.Can be in the part boring (348) of pcb component and with the liner in conduction and/or Heat Conduction Material plating (349) hole.The pcb component of electroplating is printed and the PWB of etching (350) to have formed.Then PWB is done (352) and element can be placed on PWB.Although above-mentioned processing comprises single pressing cycle, in other embodiments, within the first pressing cycle, form the basis of pattern and insert material and can merge with B level electrolyte film and the material that is used to form other conductive layers of PWB, and PWB completes within the follow-up pressing cycle.

Figure 18 a-18h has shown the material and the pcb component that during manufacturing processing, use that in the Figure 17 according to the embodiment of the present invention, show.As described above, the manufacture PWB that Figure 17 shows processes and comprises preparation strengthening core plate material 360.This material is similar to the layer 212 shown in Fig. 9.

In the embodiment of explanation, strengthening core plate material 360 is non-dielectrics and is covered with the electric conducting material as copper on its both sides.In other embodiments, strengthening new core material 360 can monolaterally cover metal or not cover metal.In the embodiment of the non-dielectric matter of strengthening core plate material, conventionally need strengthening core plate material before pressing by prebored hole.

Can prepare strengthening core plate material by boring spacer holes 364 and septal pathways 366.Septal pathways can be by getting out several very close holes to each other or manufacturing by path device.The spacer holes of boring or passage finally also can make non-dielectric matter strengthening core plate material and the PTH electric insulation of holing by PWB by resin filling.

As manufacturing a part of processing, the pressing core material of preparation and dielectric layer 370 and electric conducting material 372 arrange (344) to think the preparation of pressing cycle.This processing can be understood with reference to Figure 18 c-18e.By at first covering the pressing layer 374 of electric conducting material 372 and prepare material covering stacking the first film 367 on metal pressing layer with both sides.Conventionally the conductive layer that, is close to film is eclipsed and carves circuit pattern.In the embodiment of explanation, metal pressing layer 374 and the first film 367 are covered in the manufacturing technology manufacture of knowing that uses those skilled in the art to adopt.

Then strengthening core plate material is placed on the first film 376.As discussed, can prepare strengthening core plate material by boring spacer holes 364 and septal pathways 366 above.Complete arrangement 378 by place the second film layers 380 on the layer being formed by strengthening core plate material 360.Then the pressing layer that both sides are covered with 382 layers of electric conducting materials is placed on the second film.The conductive layer 372 of contiguous the second film can be got out circuit pattern in advance.Figure 18 e shows the arrangement of gained.Although the embodiment illustrating is included in the upper and lower film of strengthening core plate material 360 and pressing layer, thereby other embodiment can be included in, metal pressing layer is covered in the more than one formation pattern online on strengthening core plate material 360 each limits and/or film forms multiple functional layers.Certainly, can use two films to construct according to PWB of the present invention, each being positioned at strengthened the upper and lower monolateral metal that covers of film of layer that central layer forms.In addition, many embodiment comprise the multiple layers that formed by the strengthening core plate material of being combined with at least one dielectric substance.

Then carry out the pressing cycle (346).The person's character in pressing cycle depends on for arranging 378 film and the person's character of dielectric layer.The temperature and pressure that requires resin, film and pressing layer manufacturer to specify during pressing.By the requirement of the multiple materials for PWB structure being carried out to the pressing cycle according to manufacturer.

The pressing cycle is produced the pcb component 384 according to the embodiment of the present invention that Figure 18 f shows.As the result in pressing cycle, resin 386 is filled septal pathways space and layer is bonded to together.Resin 386 is also filled spacer holes 364 layer 320 ' that also bonding forms

conductive material layer

390 and 391 to reinforcement central layer 360.

On pcb component, get out (48) through hole.Figure 18 g shows the pcb component according to the boring of the embodiment of the present invention.Pcb component comprises the multiple through holes 392 by each layer of extension of pcb component.

Once hole is got out, hole is plated (349) and conductive material layer is printed and etching (350).These process on PWB layer and interlayer produces circuit.As above discussed, functional layer can comprise the region of conductive material layer and layer 320 '.The circuit producing between functional layer can be used to carry the signal of telecommunication.The PWB(that then can form, connects and lays the PWB of electronic device).

Above-mentioned processing also can be used to manufacture and comprise the PWB that buries hole, blind hole and/or micropore.Similar treatment step can be for the manufacture of the integrated circuit substrate (IC substrate or package substrates) with at least one reinforcement central layer.

Above-described many processing comprise the groove in strengthening core plate.Referring now to Figure 19-21, it has illustrated the technology that produces groove for holing by use, and described boring comprises effective use of boring.

Figure 19 shows the vertical view according to the reinforcement central layer that is drilled with spacer holes and groove (or septal pathways) of the embodiment of the present invention.Strengthen central layer 400 and comprise spacer holes 404 and septal pathways 402.Because spacer holes is too near or spacer holes is overlapping to each other to each other, septal pathways is manufactured.Septal pathways on strengthening core flaggy does not need to strengthen the position that central layer cross section exposes (, as the cross-sectional wall of the cut-out in printed substrate marginal position or the PWB region that has been positioned at) after can being positioned at the most closely the multiple PTH by strengthening central layer or being located at printed substrate.Conventionally, can form septal pathways by the combination of machine drilling, laser drill, CNC arrangement path, punching, laser cutting, water injection cutting or these processing.The septal pathways that is positioned at the through hole of the multiple plating in PWB region can form by machine drilling, laser drill, lasser cutting, because these are processed than CNC arrangement path, punching and water inject process more accurately and more accurate, wherein said region is adjacent to multiple electroplating ventilating holes most.The in the situation that of the high-level precision of needs, machine drilling and laser drill processing are preferred.

Septal pathways is that from the different of plating passage septal pathways is got out with material of electric insulation and reinforcement central layer.Septal pathways is conventionally considerably wider than PTH.Electroplating passage is the passage that produces electrical connection, is generally between PWB and the lead-in wire of electronic component.Figure 20 a shows the plating passage according to the embodiment of the present invention.Passage 410 comprises very level and smooth side wall profile 412.Embodiment at passage for comprising component lead, this wall can be easy to the insertion of lead-in wire.Level and smooth side wall profile 412 can form by multiple little spacing hole of holing, as 1 to 3mil spacing (preferably 1mil(0.001 inch) spacing).In 1mil spacing, 1000 holes form the plating passage of 1.0 inches long.

As described above, septal pathways produces than electroplating passage instrument wider and use larger diameter conventionally.Figure 20 b has shown septal pathways.Septal pathways 420 has the level and smooth surface 422 similar to electroplating passage.Multiple holes 426 are got out to produce has very closely spaced septal pathways 420.As from Figure 20 b, the sidewall of septal pathways is not completely level and smooth.The ripple existing is processed relevant with the boring of repetition.Indentation height 424(is the degree that side-wall material extends to passage, sees that Figure 20 is c) very little, is less than 0.5mil.Like this, level and smooth septal pathways side wall profile needs many holes to complete.

When produce septal pathways in reinforcement central layer time, always do not need level and smooth sidewall.As Figure 20 c and Figure 20 d visible, large spacing can be used to form septal pathways (seeing the

septal pathways

430 and 440 in Figure 20 c and Figure 20 d).The

side wall profile

432 and 442 that shown septal pathways has does not have side wall profile 422 level and smooth.Large spacing will increase indentation height 434 and 444.In many examples, large spacing can be for boring with the passage of width that equals indentation spacing.Like this, the passage with rough finish can be produced, and it does not have the indentation of the required width of any invasive channel.In the time strengthening central layer internal drilling spacer holes and septal pathways pattern, the quantity that reduces the required hole of formation passage can increase output fully.

In multiple embodiment, owing to coming off at indentation during pressing and producing the risk of the potential short circuit between PTH and reinforcement central layer, the height of indentation is limited.Strengthening being less than 3mil every the preferred indentation height of passage in the middle of central layer.In septal pathways, preferred indentation height is less than or equal to 1mil.

Figure 21 a has shown indentation Size dependence in the table of spacer holes spacing and bore diameter.If for example hole dimension is 28mil, pitch of holes can be increased to 10mil and indentation size still fully lower than 1.0mil.Example table understands 1/10 minimizing of the required hole count of the sidewall smoothness that reaches comparable with electroplating the smoothness of passage.

Although above-described embodiment is disclosed as typical case, is appreciated that and can disclosed system is carried out multiple extra variations, deletes and be revised and not deviate from scope of the present invention.For example, can be included in PWB to 139 similar multiple layers in the reinforcement central layer 20 shown in Fig. 2 or Fig. 7.Equally, the combination of basic material and insertion material can be used as functional layer or NOT function ergosphere.Be used to form in the embodiment of functional layer at basic material and insertion material, functional layer can be used as ground plane, bus plane or separating plane layer.In addition, the dielectric of any kind and electric conducting material can be used as basic material or insert material.In addition, excision and insertion can be the single excision districts that arbitrary shape and multiple insertion can be positioned at basic material.Therefore, scope of the present invention should not limited by illustrated embodiment, and should be limited by claims and their equivalent.

Claims

1. construct a method for printed substrate, described printed substrate comprises conduction reinforcement central layer and at least one functional layer, and described method comprises:

At conduction strengthening core twist drill span pattern;

Arrange described conduction to strengthen central layer with stack manner, described stacking B level (semi-harden) dielectric material layer that is included in described reinforcement central layer both sides, and be arranged to form the additional layer of material of at least one functional layer;

Thereby before baking, impel the resin in described B level (semi-harden) dielectric layer reflux and fill described conduction and strengthen the described intermittent pattern in central layer to the described stacking execution pressing cycle; And

Boring electroplating ventilating hole.

2. method according to claim 1, it further comprises:

From PCB design, extract the information about electroplating ventilating hole position, described through hole is not defined as with described conduction reinforcement central layer and electrically contacts; And

Described in using, determine described spacing pattern about the information of electroplating ventilating hole position, described through hole is not defined as with described conduction reinforcement central layer and electrically contacts.

3. method according to claim 1, wherein said conduction is strengthened central layer and is had two main faces, and a main face can be directly electrically connected to another main face.

4. method according to claim 3, wherein, in the time of 1MHz, described conduction is strengthened central layer and is had the dielectric constant that is greater than 6.

5. method according to claim 3, it is that the fiber material that injects described resin by uses is constructed that wherein said conduction is strengthened central layer.

6. method according to claim 5, wherein said fiber material is carbon fiber.

7. method according to claim 6, wherein said carbon fiber is metallized.

8. method according to claim 3, wherein said conduction is strengthened central layer and is constructed by thick metal layers.

9. method according to claim 8, it is further included in before pressing barrier resin and enters described conduction and strengthen the described intermittent pattern in central layer.

10. method according to claim 1, it further comprises:

Stacking multiple conduction is strengthened central layer;

On strengthening central layer stacking, described conduction gets out described intermittent pattern; And strengthen making pressing location hole in central layer in described conduction.