CN107613636A - A kind of circuit board and electronic equipment - Google Patents
A kind of circuit board and electronic equipment Download PDFInfo
- Publication number
- CN107613636A CN107613636A CN201710886420.8A CN201710886420A CN107613636A CN 107613636 A CN107613636 A CN 107613636A CN 201710886420 A CN201710886420 A CN 201710886420A CN 107613636 A CN107613636 A CN 107613636A
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- insulating barrier
- circuit board
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- thickness
- enhancement layer
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Abstract
This application provides a kind of circuit board and electronic equipment, the circuit board includes the first conductive layer, intermediate layer and the second conductive layer being cascading；Wherein, intermediate layer comprises at least the first insulating barrier, the first enhancement layer and the second insulating barrier being cascading, and the thickness in intermediate layer is less than or equal to the first preset thickness, to cause the thickness of circuit board to be less than or equal to the second preset thickness.Circuit board in the application, by setting the first enhancement layer between first insulating barrier and the second insulating barrier in intermediate layer, improve the intensity in intermediate layer, and then improve the intensity of circuit board, and the thickness in intermediate layer is less than or equal to the first preset thickness, to cause the thickness of circuit board to be less than or equal to the second preset thickness, and then in the case where improving circuit board intensity, it ensure that the slimming of circuit board.
Description
Technical field
The application is related to the technical field of electronic equipment, is specifically related to a kind of circuit board and electronic equipment.
Background technology
With the development of science and technology, main flow of the slimming of circuit board as circuit board development, but too thin circuit board meeting
Cause insufficient strength and so that phenomena such as circuit board is broken in use.
The content of the invention
On the one hand the embodiment of the present application provides a kind of circuit board, what the circuit board included being cascading first leads
Electric layer, intermediate layer and the second conductive layer；Wherein, the intermediate layer comprises at least the first insulating barrier being cascading, the
One enhancement layer and the second insulating barrier, the thickness of the circuit board are less than or equal to the first preset thickness, the thickness in the intermediate layer
Less than or equal to the second preset thickness.
On the other hand the embodiment of the present application also provides a kind of electronic equipment, the electronic equipment includes above-mentioned circuit board.
The embodiment that the application provides, added by setting first between first insulating barrier and the second insulating barrier in intermediate layer
Strong layer, improves the intensity in intermediate layer, and then improves the intensity of circuit board, and the thickness in intermediate layer is pre- less than or equal to first
If thickness, to cause the thickness of circuit board to be less than or equal to the second preset thickness, and then in the case where improving circuit board intensity,
It ensure that the slimming of circuit board.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the embodiment of the present application, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the structural representation for the circuit board first embodiment that the application provides；
Fig. 2 is the structural representation for the circuit board second embodiment that the application provides；
Fig. 3 is the structural representation for the circuit board 3rd embodiment that the application provides；
Fig. 4 is the structural representation for the circuit board fourth embodiment that the application provides；
Fig. 5 is the structural representation for the embodiment of circuit board the 5th that the application provides；
Fig. 6 is the structural representation for the circuit board sixth embodiment that the application provides；
Fig. 7 is the structural representation for the electronic equipment first embodiment that the application provides；
Fig. 8 is the structural representation for the electronic equipment second embodiment that the application provides；
Fig. 9 is the structural representation for the electronic equipment 3rd embodiment that the application provides；
Figure 10 is the structural representation for the electronic equipment fourth embodiment that the application provides；
Figure 11 is the structural representation for the embodiment of electronic equipment the 5th that the application provides；
Figure 12 is the structural representation for the electronic equipment sixth embodiment that the application provides.
Embodiment
With reference to the accompanying drawings and examples, the application is described in further detail.It is emphasized that following implement
Example is merely to illustrate the application, but scope of the present application is not defined.Likewise, following examples are only the portion of the application
Point embodiment and not all embodiments, the institute that those of ordinary skill in the art are obtained under the premise of creative work is not made
There are other embodiments, belong to the scope of the application protection.
Term " first " in the application, " second ", " the 3rd " are only used for describing purpose, and it is not intended that instruction or dark
Show relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, " first ", " second ", " are defined
At least one this feature can be expressed or be implicitly included to three " feature.In the description of the present application, " multiple " be meant that to
It is few two, such as two, three etc., unless otherwise specifically defined.The directional instruction of institute is (all in the embodiment of the present application
Such as up, down, left, right, before and after ...) it is only used for explaining the phase under a certain particular pose (as shown in drawings) between each part
To position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith
Become.In addition, term " comprising " and " having " and their any deformations, it is intended that cover non-exclusive include.Such as comprising
The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and
It is alternatively also to include the step of not listing or unit, or alternatively also includes for these processes, method, product or equipment
Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1, Fig. 1 is the structural representation for the first embodiment of circuit board 10 that the application provides, in the present embodiment
Circuit board 10 include the first conductive layer 11, the conductive layer 13 of intermediate layer 12 and second that are cascading.
Optionally, the first conductive layer 11 is copper foil layer, electrolytic copper foil or rolled copper foil can be used to make, the first conductive layer
11 thickness can be 5 μm -70 μm.
Intermediate layer 12 is arranged on the first conductive layer 11, including the first insulating barrier 121, first being cascading is strengthened
The insulating barrier 123 of layer 122 and second, the first insulating barrier 121 are arranged on the first conductive layer 11.
Wherein, the first insulating barrier 121 is prepreg, in general, and prepreg is mainly made up of resin and reinforcing material,
Resin can be epoxy resin, polyimide resin or Teflon resin etc., reinforcing material can be paper, glass fibre or other
Composite etc., under heat, pressure effect, prepreg bonds with the first conductive layer 11 and the first enhancement layer 122, similarly, second
Insulating barrier 123 is also prepreg, is arranged on the first enhancement layer 122 and viscous with the first enhancement layer 122 under heat, pressure effect
Close.
Optionally, the first enhancement layer 122 is metal level, for example is copper foil layer.
Optionally, the second conductive layer 13 is copper foil layer, electrolytic copper foil or rolled copper foil can be used to make, the second conductive layer
13 thickness can be 5 μm -70 μm.
Further, the thickness in intermediate layer 12 is less than or equal to the first preset thickness, to cause the circuit in the present embodiment
The thickness of plate 10 is less than or equal to the second preset thickness.
Optionally, the first preset thickness is 90 μm~330 μm, and the second preset thickness is 100 μm~400 μm.
Such as first the thickness of conductive layer 11 and the second conductive layer 13 be 20 μm, the thickness in intermediate layer 12 is 360 μm,
Then the thickness of circuit board 10 is 400 μm.
Optionally, the thickness of the first insulating barrier 121 and the second insulating barrier 122 is 145 μm, the thickness of the first enhancement layer 122
Spend for 70 μm.
It should be understood that in the present embodiment, the thickness in intermediate layer 12 is less than or equal to the first preset thickness, to cause electricity
On the premise of the thickness of road plate 10 is less than or equal to the second preset thickness, the thickness of the first enhancement layer 122 can be according to actually required
Setting, is not limited herein.
Circuit board in the present embodiment, added by setting first between first insulating barrier and the second insulating barrier in intermediate layer
Strong layer, improves the intensity in intermediate layer, and then improves the intensity of circuit board, and the thickness in intermediate layer is pre- less than or equal to first
If thickness, to cause the thickness of circuit board to be less than or equal to the second preset thickness, and then in the case where improving circuit board intensity,
It ensure that the slimming of circuit board.
Referring to Fig. 2, Fig. 2 is the structural representation for the second embodiment of circuit board 20 that the application provides, in the present embodiment
Circuit board 20 include the first conductive layer 21, the conductive layer 23 of intermediate layer 22 and second that are cascading.
Wherein, intermediate layer 22 includes the first insulating barrier 221, the insulating barrier of intermediate layer 222 and second being cascading
223。
Optionally, the first insulating barrier 221 is prepreg, and in general, prepreg is mainly by resin and reinforcing material group
Can be epoxy resin, polyimide resin or Teflon resin etc. into, resin, reinforcing material can be paper, glass fibre or
Other composites etc., under heat, pressure effect, prepreg bonds with the first conductive layer 21 and the first enhancement layer 222, similarly,
Second insulating barrier 223 is also prepreg, be arranged on the first enhancement layer 222 and heat, pressure effect under with the first enhancement layer 222
Bonding.
Wherein, the first insulating barrier 221 is provided with the first extension 2211, and the first enhancement layer 222 includes multiple bosses 2221,
Multiple bosses 2221 are arranged at intervals on the first insulating barrier 221, the first extension 2211 be arranged at multiple bosses 2221 it
Between, and bonded with multiple bosses 2221, in the present embodiment, the quantity of the first extension 2211 is multiple, and multiple first prolong
Extending portion 2211 is arranged between each adjacent multiple bosses 2221.
Optionally, the first enhancement layer 222 is metal level, such as copper foil layer.
Other structures in the present embodiment are identical with above-mentioned first embodiment, will not be repeated here.
Circuit board in the present embodiment, in first embodiment above, improve circuit board intensity and ensure that circuit board
Slimming while, multiple spaced bosses are further included by the first enhancement layer, the first insulating barrier is provided with
First extension, and the first extension is arranged between multiple bosses and bonded with multiple bosses, adds the first enhancement layer
With the bond area of the first insulating barrier, the bonding strength of the first enhancement layer and the first insulating barrier is improved, and then improves circuit
The bulk strength of plate.
Referring to Fig. 3, Fig. 3 is the structural representation for the 3rd embodiment of circuit board 30 that the application provides, in the present embodiment
Circuit board 30 include the first conductive layer 31, the conductive layer 33 of intermediate layer 32 and second that are cascading.
Wherein, intermediate layer 32 includes the first insulating barrier 321, the insulating barrier of intermediate layer 322 and second being cascading
323。
Optionally, the first insulating barrier 321 is prepreg, and in general, prepreg is mainly by resin and reinforcing material group
Can be epoxy resin, polyimide resin or Teflon resin etc. into, resin, reinforcing material can be paper, glass fibre or
Other composites etc., under heat, pressure effect, prepreg bonds with the first conductive layer 31 and the first enhancement layer 322, similarly,
Second insulating barrier 323 is also prepreg, be arranged on the first enhancement layer 322 and heat, pressure effect under with the first enhancement layer 322
Bonding.
Wherein, the first insulating barrier 321 is arranged on the first conductive layer 31, and the first enhancement layer 322 includes multiple bosses
3221, multiple bosses 3221 are arranged at intervals on the first insulating barrier 321, and the second insulating barrier 323 is provided with the second extension 3231,
And second extension 3231 is arranged between multiple bosses 3221, and bonded with multiple bosses 3221, in the present embodiment
In, the quantity of the second extension 3231 is multiple, is arranged between each adjacent multiple bosses 3221.
Optionally, the first enhancement layer 322 is metal level, such as copper foil layer.
Other structures in the present embodiment are identical with above-mentioned first embodiment, will not be repeated here.
Circuit board in the present embodiment, in first embodiment above, improve circuit board intensity and ensure that circuit board
Slimming while, multiple spaced bosses are further included by the first enhancement layer, the second insulating barrier is provided with
Second extension, and the second extension is arranged between multiple bosses and bonded with multiple bosses, adds the first enhancement layer
With the bond area of the second insulating barrier, the bonding strength of the first enhancement layer and the second insulating barrier is improved, and then improves circuit
The bulk strength of plate.
Referring to Fig. 4, Fig. 4 is the structural representation for the 3rd embodiment of circuit board 40 that the application provides, in the present embodiment
Circuit board 40 include the first conductive layer 41, the conductive layer 43 of intermediate layer 42 and second that are cascading.
Wherein, intermediate layer 42 includes the first insulating barrier 421, the insulating barrier of intermediate layer 422 and second being cascading
423。
Optionally, the first insulating barrier 421 is prepreg, and in general, prepreg is mainly by resin and reinforcing material group
Can be epoxy resin, polyimide resin or Teflon resin etc. into, resin, reinforcing material can be paper, glass fibre or
Other composites etc., under heat, pressure effect, prepreg bonds with the first conductive layer 41 and the first enhancement layer 422, similarly,
Second insulating barrier 423 is also prepreg, be arranged on the first enhancement layer 422 and heat, pressure effect under with the first enhancement layer 422
Bonding.
Wherein, the first insulating barrier 421 is arranged on the first conductive layer 41, and is provided with the first extension 4211, and first strengthens
Layer 422 includes multiple bosses 4221, and multiple bosses 4221 are arranged at intervals on the first insulating barrier 421, and make it that first prolongs
Extending portion 4211 is arranged between each adjacent multiple bosses 4221, and is bonded with multiple bosses 4221, the second insulating barrier
423 are arranged on the first enhancement layer 422, and are provided with the second extension 4231, and the second extension 4231 is arranged at each adjacent
Between multiple bosses 4221, and it is in dock setting with the first extension 4211.
Optionally, the first enhancement layer 422 is metal level, such as copper foil layer.
Other structures in the present embodiment are identical with above-mentioned first embodiment, will not be repeated here.
Circuit board in the present embodiment, in first embodiment above, improve circuit board intensity and ensure that circuit board
Slimming while, multiple spaced bosses are further included by the first enhancement layer, the first insulating barrier is provided with
First extension, and the first extension is arranged between multiple bosses and bonded with multiple bosses, the second insulating barrier is provided with
Second extension, and the second extension is arranged between multiple bosses and bonded with multiple bosses, and with the first extension pair
Setting is connect, while adds the first enhancement layer and the bond area of the first insulating barrier and the second insulating barrier, improves the first reinforcement
The bonding strength of layer and the first insulating barrier and the second insulating barrier, and then improve the bulk strength of circuit board.
Refering to Fig. 5, Fig. 5 is the embodiment docking structure schematic diagram of circuit board 50 the 5th that the application provides, in the present embodiment
Circuit board 50 include the first conductive layer 51, the conductive layer 53 of intermediate layer 52 and second that are cascading.
Wherein, intermediate layer 52 includes the first insulating barrier 521, the insulating barrier of intermediate layer 522 and second being cascading
523。
Optionally, the first insulating barrier 521 is prepreg, and in general, prepreg is mainly by resin and reinforcing material group
Can be epoxy resin, polyimide resin or Teflon resin etc. into, resin, reinforcing material can be paper, glass fibre or
Other composites etc., under heat, pressure effect, prepreg bonds with the first conductive layer 51 and the first enhancement layer 522, similarly,
Second insulating barrier 523 is also prepreg, be arranged on the first enhancement layer 522 and heat, pressure effect under with the first enhancement layer 522
Bonding.
Wherein, the first insulating barrier 521 is arranged on the first conductive layer 51, and is provided with the first extension 5211, and first strengthens
Layer 522 includes multiple bosses 5221, and multiple bosses 5221 are arranged at intervals on the first insulating barrier 521, and make it that first prolongs
Extending portion 5211 is arranged between multiple bosses 5221, and the second insulating barrier 523 is arranged on the first enhancement layer 522, and provided with the
Two extensions 5231, the second extension 5231 are arranged between multiple bosses 5221,
Wherein, the first extension 5211 and the second extension 5231 are alternately disposed between multiple bosses 5221, and with
Multiple bosses 5221 bond.
Optionally, the first enhancement layer 522 is metal level, such as copper foil layer.
Other structures in the present embodiment are identical with above-mentioned first embodiment, will not be repeated here.
Circuit board in the present embodiment, in first embodiment above, improve circuit board intensity and ensure that circuit board
Slimming while, multiple spaced bosses are further included by the first enhancement layer, the first insulating barrier is provided with
First extension, and the first extension is arranged between multiple bosses and bonded with multiple bosses, the second insulating barrier is provided with
Second extension, and the second extension is arranged between multiple bosses and bonded with multiple bosses, and with the first extension pair
Setting is connect, while adds the first enhancement layer and the bond area of the first insulating barrier and the second insulating barrier, improves the first reinforcement
The bonding strength of layer and the first insulating barrier and the second insulating barrier, and then improve the bulk strength of circuit board.
Referring to Fig. 6, Fig. 6 is the structural representation for the sixth embodiment of circuit board 60 that the application provides, the present embodiment
In circuit board 60 include the first conductive layer 61, the conductive layer 63 of intermediate layer 62 and second that are cascading.
Wherein, intermediate layer 62 includes the first insulating barrier 621, the insulating barrier of intermediate layer 622 and second being cascading
623, the first insulating barrier 621, the insulating barrier 623 of intermediate layer 622 and second in the present embodiment are identical with above-mentioned first embodiment,
This is repeated no more, and the intermediate layer 62 in the present embodiment further comprises the second enhancement layer 624 and the 3rd insulating barrier 625.
Wherein, the second enhancement layer 624 is arranged at side of second insulating barrier 623 away from the first enhancement layer 622, the 3rd insulation
Layer 625 is arranged at the second reinforcement once 624 side away from the second insulating barrier 623, namely to be arranged at second exhausted for the second enhancement layer 624
In edge layer 623, the 3rd insulating barrier 625 is arranged on the second enhancement layer 624.
Optionally, the second enhancement layer 624 is metal level, for example copper foil layer, the 3rd insulating barrier 625 are prepreg.
Similarly, the second enhancement layer 624 in the present embodiment can also be arranged at the first insulating barrier 621 away from the first enhancement layer
622 side, the 3rd insulating barrier 625 are arranged at side of second enhancement layer 624 away from the first insulating barrier 621, namely the 3rd exhausted
Edge layer 625 is arranged on the first conductive layer 61, and the second enhancement layer 624 is arranged on the 3rd insulating barrier 625.
It should be understood that in other embodiments, the number of plies of insulating barrier and enhancement layer can be other quantity, herein not
It is limited.
Refering to Fig. 7, Fig. 7 be the application provide the first embodiment of electronic equipment 101 structural representation, the electronic equipment
101 can be any equipment for possessing communication and store function, such as：It is tablet personal computer, mobile phone, electronic reader, remote control, individual
People's computer (Personal Computer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have
The smart machine of network function.
Wherein, the electronic equipment 101 includes the circuit board 10 in above-mentioned first embodiment.
Refering to Fig. 8, Fig. 8 be the application provide the second embodiment of electronic equipment 201 structural representation, the electronic equipment
201 can be any equipment for possessing communication and store function, such as：It is tablet personal computer, mobile phone, electronic reader, remote control, individual
People's computer (Personal Computer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have
The smart machine of network function.
Wherein, the electronic equipment 201 includes the circuit board 20 in above-mentioned second embodiment.
Refering to Fig. 9, Fig. 9 be the application provide the 3rd embodiment of electronic equipment 301 structural representation, the electronic equipment
301 can be any equipment for possessing communication and store function, such as：It is tablet personal computer, mobile phone, electronic reader, remote control, individual
People's computer (Personal Computer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have
The smart machine of network function.
Wherein, the electronic equipment 301 includes the circuit board 30 in above-mentioned 3rd embodiment.
Refering to Figure 10, Figure 10 is the structural representation for the fourth embodiment of electronic equipment 401 that the application provides, and the electronics is set
Standby 401 can be any equipment for possessing communication and store function, such as：Tablet personal computer, mobile phone, electronic reader, remote control,
Personal computer (Personal Computer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have
There is the smart machine of network function.
Wherein, the electronic equipment 401 includes the circuit board 40 in above-mentioned first embodiment.
Refering to Figure 11, Figure 11 is the structural representation for the embodiment of electronic equipment 501 the 5th that the application provides, and the electronics is set
Standby 501 can be any equipment for possessing communication and store function, such as：Tablet personal computer, mobile phone, electronic reader, remote control,
Personal computer (Personal Computer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have
There is the smart machine of network function.
Wherein, the electronic equipment 501 includes the circuit board 50 in above-mentioned first embodiment.
Refering to Figure 12, Figure 12 is the structural representation for the sixth embodiment of electronic equipment 601 that the application provides, and the electronics is set
Standby 601 can be any equipment for possessing communication and store function, such as：Tablet personal computer, mobile phone, electronic reader, remote control,
Personal computer (Personal Computer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have
There is the smart machine of network function.
Wherein, the electronic equipment 601 includes the circuit board 60 in above-mentioned first embodiment.
The embodiment that the application provides, added by setting first between first insulating barrier and the second insulating barrier in intermediate layer
Strong layer, improves the intensity in intermediate layer, and then improves the intensity of circuit board, and the thickness in intermediate layer is pre- less than or equal to first
If thickness, to cause the thickness of circuit board to be less than or equal to the second preset thickness, and then in the case where improving circuit board intensity,
It ensure that the slimming of circuit board.
The section Example of the application is the foregoing is only, not thereby limits the protection domain of the application, every utilization
The equivalent device or equivalent flow conversion that present specification and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, be similarly included in the scope of patent protection of the application.
Claims (10)
- A kind of 1. circuit board, it is characterised in that the circuit board include be cascading the first conductive layer, intermediate layer and Second conductive layer；Wherein, the intermediate layer comprises at least the first insulating barrier, the first enhancement layer and the second insulating barrier being cascading, institute The thickness for stating intermediate layer is less than or equal to the first preset thickness, make it that it is default that the thickness of the circuit board is less than or equal to second Thickness.
- 2. circuit board according to claim 1, it is characterised in that first enhancement layer include it is multiple it is spaced plus Strong block；Wherein, first insulating barrier is provided with the first extension, and the multiple boss is arranged on first insulating barrier, institute The first extension is stated to be arranged between the multiple boss；And/orSecond insulating barrier is provided with the second extension, and second insulating barrier is arranged on the multiple boss, and described Two extensions are arranged between the multiple boss.
- 3. circuit board according to claim 2, it is characterised in that first extension is set with second extension Set between each adjacent the multiple boss, and in docking.
- 4. circuit board according to claim 2, it is characterised in that first extension replaces with second extension It is arranged between the multiple boss.
- 5. circuit board according to claim 1, it is characterised in that the intermediate layer also includes the second reinforcement being stacked Layer and the 3rd insulating barrier, second enhancement layer are arranged at side of first insulating barrier away from first enhancement layer, institute State the 3rd insulating barrier and be arranged at side of second enhancement layer away from first insulating barrier, or second enhancement layer is set In side of second insulating barrier away from first enhancement layer, it is remote that the 3rd insulating barrier is arranged at second enhancement layer From the side of second insulating barrier.
- 6. circuit board according to claim 1, it is characterised in that first preset thickness is 90 μm~330 μm, described Second preset thickness is 100 μm~400 μm.
- 7. circuit board according to claim 6, it is characterised in that the thickness in the intermediate layer is 360 μm, the circuit board 10 thickness is 400 μm.
- 8. circuit board according to claim 1, it is characterised in that first enhancement layer is metal level.
- 9. circuit board according to claim 1, it is characterised in that first insulating barrier and second insulating barrier is partly Cured sheets.
- 10. a kind of electronic equipment, it is characterised in that the electronic equipment includes the circuit as described in any one of claim 1~9 Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710886420.8A CN107613636A (en) | 2017-09-26 | 2017-09-26 | A kind of circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710886420.8A CN107613636A (en) | 2017-09-26 | 2017-09-26 | A kind of circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107613636A true CN107613636A (en) | 2018-01-19 |
Family
ID=61058922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710886420.8A Pending CN107613636A (en) | 2017-09-26 | 2017-09-26 | A kind of circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107613636A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101151944A (en) * | 2005-03-28 | 2008-03-26 | 古河电气工业株式会社 | Reinforcing structure for metal core board and electric connection box |
| CN103857215A (en) * | 2006-03-06 | 2014-06-11 | 斯塔布科尔技术公司 | Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores |
| US20140347834A1 (en) * | 2013-05-24 | 2014-11-27 | Samsung Electro-Mechanics Co., Ltd. | Electronic component embedded printed circuit board and method for manufacturing the same |
-
2017
- 2017-09-26 CN CN201710886420.8A patent/CN107613636A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101151944A (en) * | 2005-03-28 | 2008-03-26 | 古河电气工业株式会社 | Reinforcing structure for metal core board and electric connection box |
| CN103857215A (en) * | 2006-03-06 | 2014-06-11 | 斯塔布科尔技术公司 | Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores |
| US20140347834A1 (en) * | 2013-05-24 | 2014-11-27 | Samsung Electro-Mechanics Co., Ltd. | Electronic component embedded printed circuit board and method for manufacturing the same |
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Application publication date: 20180119 |
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