六、發明說明： C發明所屬泛^技術領域;j 發明背景 1.發明領域 本發明係有關於一種電路板及其製造方法，且詳而言 之，係有關於一種具有一芯基板之電路板、其製造方法、 使用一電路板之半導體裝置、及一在一電路板中使用之預 浸材。 2.相關技術 用以安裝半導體元件之電路板包括多數具有一芯基板 之板’且該芯基板係由碳纖維強化塑膠(CFRP)製成。一由 CFRP製成之芯基板具有一相較於一由一玻璃環氧基板製 成之習知芯基板為低之熱膨脹係數，且一使用一 CFRP芯基 板之電路板可製造成使該熱膨脹係數與一半導體元件之熱 膨脹係數匹配，如此可有效地避免在該半導體元件與該電 路板間產生之熱應力。 一電路板係藉將多數佈線層積層在該芯基板之兩表面 上’且形成PTH(鑛通孔）以在積層在該芯基板兩表面上之佈 線層間導電而形成。這些PTH藉在該基板中形成多數通孔 且接著進行鍍敷，以在該等通孔之内壁表面上形成導電部 (一鍵層）。 但是，對一具有一如CFRP等導電材料之一芯部的芯基 板而言，如果通孔僅形成在該基板中且鍍敷這些通孔之内 壁表面，則在該PTH與該芯部之間會發生電短路❶因此， 當在一具有一導電芯部之芯基板中形成pTH時以一大於 該PTH之直徑穿過該芯基板形成多數預備孔，且以一絕緣 樹脂填充該等預備孔，接著在該等預備孔内形成該pTH以 防止在該PTH與該芯部之間發生短路(參見專利文獻1、2)。 專利文獻1 曰本公開專利公報第2003-218287號 專利文獻2 曰本國内再發行公報第2004/064467號 【發明内容3 發明概要 但是，對於一其中多數預備孔形成在該芯基板中且該 PTH形成以通過該專預備孔之配置而言，由於該等預備孔 具有大於該PTH之直徑’所以相較於PTH僅形成在該这基板 中之構造，在該PTH間之配置間距會增加，限制了該ρτΗ 可形成之密度。 此外，如果以一絕緣樹脂填充該等預備孔填充，則會 有s亥芯基板之熱膨服你數因此增加之效果，且對·於___ g ; —設有 一由碳纖維製成之怎部的電路板而言，這會減少使今^、々美 板以一低熱膨脹係數形成之有利效果。 本發明係欲解決前述問題而作成，且本發明之目的a 提供一種其中該等鍍通孔以一微小間距配置且滿足有關強 度與熱膨脹係數之要求的電路板、其製造方法、一 千導體 裝置、及一使用在一電路板中之預浸材。 1378753 為了達到前述目的，本發明之一種製造一電路板之方 法包括以下步驟：藉熱壓結合多數預浸材，形成一芯部， 且該等預浸材係藉將多數纖維設置成在多數鍍通孔（以下 稱“PTH”)將通過之位置處產生多數開孔且以樹脂浸潰該等 5 纖維而形成；在該芯部中之開孔位置處形成多數通過該等 開孔内側之通孔；及在該等通孔之内表面上形成一導電 層，以在不會與該等纖維發生干涉之位置處形成PTH且因 此產生一芯基板。 Φ 在形成該芯部之步驟中，該等纖維可以形成為一碳纖 10 維編織材料，且可以使用其中該PTH將通過之多數開孔係 形成在該碳纖維編織材料中的多數預浸材。或者，在形成 該芯部之步驟中，該等纖維可以形成為一碳纖維編織材 料，且該碳纖維編織材料是多數碳纖維與多數非導電纖維 之複合材，並且可使用其中該PTH將通過之多數開孔係形 15 成在該編織材料中的多數預浸材。藉此，可以製造一避免 在該導電芯部與該Ρ Τ Η之間產生電短路的電路板。 • 本發明之一種電路板包括：一芯基板；多數設置成可 積層在該芯基板之兩表面上之佈線層；及多數設置在該芯 基板中且電連接該等佈線層之ΡΤΗ，其中一構成該芯基板 20 之芯部係藉熱壓結合多數預浸材而形成，且該等預浸材係 藉以樹脂浸潰多數纖維而形成，並且該ΡΤΗ係設置成不會 與該芯部之纖維發生干涉。又，亦可使用這電路板作為一 插入物。 該等纖維可有利地形成為碳纖維編織材料，且該ΡΤΗ 5 將通過之開孔可形成在該碳纖維編織材料中。 該等纖維形成為一碳纖維與非導電纖維之複合材之編 織材料亦是有效的，且對於該PTH將通過而形成在該編織 材料中之多數開孔亦是有效的。 此外，亦可藉將一半導體元件安裝在前述電路板上來 提供一半導體裝置。 本發明之一種預浸材係用以形成一電路板之一芯基板 之芯部且包括多數具有比銅低之熱膨脹係數的纖維，其中 該等纖維係設置在不會與欲形成在該芯基板中之ΡΊΉ發生 千涉的位置處。 该等纖維可以形成為碳纖維編織材料，且該PTH將通 過之多數開孔可形成在該碳纖維編織材料中。這預浸材對 於避免在該PTH與該芯基板間產生電短路是有效的，且具 有一低熱膨脹係數。又，將該等纖維形成為一碳纖維與非 導電纖維之複合材的編織材料及將該pTH將通過之多數開 孔形成在該編織材料中均是有利的。 依據本發明之電路板與製造一電路板之方法，包含在 一形成一芯基板之芯部之預浸材係設置成不會與p τ H通過 该芯基板之位置發生干涉，使該pTH可以+會與在該預浸 材中之纖維之配置發生干涉之情形下形成且以一微 小間距 配置該ΡΤΉ。藉適當轉包含在該預浸材巾之纖維，可為 该芯基板提供例如強度等所需特性。 圖式簡單說明 第1Α至1F圖是顯示―芯基板之製造步驟的橫截面圖； 第2圖是一顯示碳纖維編織材料與鍍通孔之配置的平 面圖； 第3圖是一電路板之橫截面圖； 第4圖是一半導體裝置安裝狀態之橫截面圖；及 第5圖是一構成一芯部之編織材料之例子的平面圖。VI. Description of the invention: The invention belongs to the field of technology; the invention relates to a circuit board and a manufacturing method thereof, and in particular to a circuit board having a core substrate And a method of manufacturing the same, a semiconductor device using a circuit board, and a prepreg used in a circuit board. 2. Related Art A circuit board for mounting a semiconductor element includes a plurality of boards having a core substrate and the core substrate is made of carbon fiber reinforced plastic (CFRP). A core substrate made of CFRP has a lower coefficient of thermal expansion than a conventional core substrate made of a glass epoxy substrate, and a circuit board using a CFRP core substrate can be fabricated to have the coefficient of thermal expansion. The thermal expansion coefficient of a semiconductor element is matched, so that thermal stress generated between the semiconductor element and the circuit board can be effectively avoided. A circuit board is formed by laminating a plurality of wiring layers on both surfaces of the core substrate and forming PTH (mine through holes) to conduct electricity between wiring layers laminated on both surfaces of the core substrate. These PTHs are formed by forming a plurality of via holes in the substrate and then performing plating to form conductive portions (a key layer) on the inner wall surface of the through holes. However, for a core substrate having a core of a conductive material such as CFRP, if a via hole is formed only in the substrate and the inner wall surface of the through holes is plated, between the PTH and the core An electrical short circuit occurs. Therefore, when a pTH is formed in a core substrate having a conductive core, a plurality of preliminary holes are formed through the core substrate by a diameter larger than the PTH, and the preliminary holes are filled with an insulating resin. The pTH is then formed in the preliminary holes to prevent a short circuit between the PTH and the core (see Patent Documents 1, 2). Patent Document 1 专利 公开 国内 2003 2003 2003 2003 2003 2003 2003 2003 2003 2003 2003 2003 2003 2003 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 2004 In the configuration formed by the dedicated preliminary hole, since the preliminary holes have a diameter larger than the PTH, the configuration in which the PTH is formed only in the substrate is increased, and the arrangement pitch between the PTHs is increased. The density at which the ρτΗ can be formed. In addition, if the preliminary hole filling is filled with an insulating resin, there is an effect that the number of heat expansion of the s-core substrate increases, and the ___g is provided with a carbon fiber. In terms of the circuit board, this will reduce the advantageous effect of forming a low thermal expansion coefficient. The present invention has been made to solve the aforementioned problems, and an object of the present invention is to provide a circuit board in which the plated through holes are arranged at a minute pitch and which meet the requirements of strength and thermal expansion coefficient, a method of manufacturing the same, and a thousand conductor device. And a prepreg used in a circuit board. 1378753 In order to achieve the foregoing object, a method of manufacturing a circuit board of the present invention comprises the steps of: combining a plurality of prepregs by hot pressing to form a core portion, and the prepreg is formed by laminating a plurality of fibers. A through hole (hereinafter referred to as "PTH") is formed by a plurality of openings at a position passing therethrough and impregnating the 5 fibers with a resin; a plurality of openings passing through the inside of the openings are formed at the opening positions in the core a hole; and a conductive layer formed on the inner surface of the through holes to form a PTH at a position that does not interfere with the fibers and thereby produce a core substrate. Φ In the step of forming the core, the fibers may be formed into a carbon fiber 10-dimensional woven material, and a majority of the prepreg in which the PTH is to be formed in the carbon fiber woven material may be used. Alternatively, in the step of forming the core, the fibers may be formed as a carbon fiber woven material, and the carbon fiber woven material is a composite of a plurality of carbon fibers and a plurality of non-conductive fibers, and may be used in which most of the PTH will pass. The hole pattern 15 is the majority of the prepreg in the woven material. Thereby, a circuit board can be manufactured which avoids an electrical short between the conductive core and the 。 。. A circuit board of the present invention comprising: a core substrate; a plurality of wiring layers disposed on both surfaces of the core substrate; and a plurality of wires disposed in the core substrate and electrically connected to the wiring layers, one of The core portion constituting the core substrate 20 is formed by thermocompression bonding with a plurality of prepregs, and the prepreg is formed by impregnating a plurality of fibers with a resin, and the lanthanum is disposed so as not to be in fibers with the core portion. Interference has occurred. Also, this board can be used as an insert. The fibers may advantageously be formed into a carbon fiber woven material, and the openings through which the enamel 5 will pass may be formed in the carbon fiber woven material. It is also effective to form the fibers into a woven material of a composite of carbon fibers and non-conductive fibers, and it is also effective to form a plurality of openings in the woven material through which the PTH will pass. Further, a semiconductor device can be provided by mounting a semiconductor element on the aforementioned circuit board. A prepreg according to the present invention is for forming a core of a core substrate of a circuit board and comprising a plurality of fibers having a thermal expansion coefficient lower than that of copper, wherein the fibers are disposed not to be formed on the core substrate The location of the shackles in the middle of the squad. The fibers may be formed into a carbon fiber woven material, and the PTH may be formed in the carbon fiber woven material through a plurality of openings. This prepreg is effective for avoiding an electrical short between the PTH and the core substrate and has a low coefficient of thermal expansion. Further, it is advantageous to form the fibers into a woven material of a composite of a carbon fiber and a non-conductive fiber and to form a plurality of openings through which the pTH will pass. A circuit board according to the present invention and a method of manufacturing a circuit board, comprising: a prepreg formed on a core portion of a core substrate disposed so as not to interfere with a position where p τ H passes through the core substrate, so that the pTH can be + will be formed in the case of interference with the arrangement of the fibers in the prepreg and the crucible is arranged at a slight pitch. By appropriately rotating the fibers contained in the prepreg, the core substrate can be provided with desired characteristics such as strength. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 1F are cross-sectional views showing a manufacturing process of a core substrate; FIG. 2 is a plan view showing a configuration of a carbon fiber woven material and plated through holes; and FIG. 3 is a cross section of a circuit board; Fig. 4 is a cross-sectional view showing a state in which a semiconductor device is mounted; and Fig. 5 is a plan view showing an example of a woven material constituting a core portion.
C實施方式]J 較佳實施例之說明 製造一電路板之方法 以下將說明本發明之一製造一電路板之方法。在本發 明之製造一電路板之方法中，所使用的是一芯基板，且該 芯基板具有一由碳纖維強化塑膠(CFRP)製成之芯部。 第1A至1F圖顯示直到形成一具有一由CFRp製成之芯 部10之芯基板20的製造步驟。 第1A圖顯示預浸材1〇a、1〇1)與1〇(；已互相定位可進行熱 壓結合之狀態’該等預浸材l〇a、10b與10c包括碳纖維與多 數電絕緣預浸材12，且該等電絕緣預浸材12包括一如氧化 紹或二氧化矽之填料以調整熱膨脹係數。 雖然在此實施例中係以上下疊置之方式放置三個預浸 材10a、10b與l〇c以形成該芯部1〇，但是用來構成該芯部⑺ 之預浸材數目可以依據該電路板之所需厚度、芯基板強度 等適當地選擇》 本發明之製造一電路板之方法的最重要特徵是構成包 括碳纖維且被用來構成該芯部1〇之預浸材1〇3、1%與1^， 洋而έ之，該等預浸材丨如、l〇b與10c係由一使用多數長碳 纖維之編織材料構成，且這碳纖維編織材料被環氧樹脂浸 潰以產生一具有某種程度之黏著性的半硬化狀態。 該等預浸材10a、10b與10c之特有構造取決於編織之方 法’即’雖然在一般的編織材料中，多數纖維被均勻地編 織在一平面上，但是在此實施例之預浸材l〇a' 10b與1〇c中 所使用之碳纖維編織材料係被編織成包括多數在該ΡΊΉ將 通過之位置處的空間，以避免在形成於該芯基板中之ρτΗ 與該碳纖維5a之間的干涉。 第2圖是在預浸材l〇a、i〇b與i〇c中使用之碳纖維編織 材料5的平面圖。雖然該碳纖維編織材料5係藉將該等碳纖 維5a編織成一平蚊組織，但是多數空間(在此說明書中被稱 為“開孔”)以預定間隔形成，使得多數纖維在一平紋組織中 之部伤係位在預定間隔處。當形成該芯基板時，該？丁1^通 過這些開孔6。即，該碳纖維編織材料5被編織成使得該等 開孔6依據欲形成在該芯基板中之PTH的配置事先形成。 欲形成在該芯基板中之PTH之平面配置將隨著產品之 不同而不同，但是通常在一芯基板中形成之1)丁1^被配置成 已經以預定間隔水平地且垂直地對#。#依此方式以預定 間隔配置該PTH時’可以形成該碳纖維編織材料5，使得該 等開孔6依據該PTH之平面配置形成。 又，§形成該碳纖維編織材料5時，不僅可以依據該 PTH之配置調整鱗開孔6之位置，也可以調整該將通 過之開孔6的垂直與水平尺寸。 單一奴纖維具有一大約數μιη之直徑，因此，可以藉編 織多數單一碳纖維來形成一碳纖維編織材料5，如第2圖所 不，且亦可利用藉將多數單一碳纖維扭絞在一起而產生的 線來形成該碳纖維編織材料5。碳纖維之扭絞線具有一大約 數十μΐΏ之直徑。 雖然形成在該芯基板中之配置間距將隨著產品不同而 不同，但是若ΡΤΗ是以大約4〇〇μΠι之配置間距設置在例如， 一用以安裝一半導體元件之典型基板上，則可以使用具有 大約數十μηι之直徑之扭絞線形成一碳纖維編織材料5，且 s亥碳纖維編織材料5具有多數形成在適當位置處之開孔6。 雖然第2圖所示之碳纖維編織材料5係被編織成使得碳 纖維5a以直角互相交叉，但是亦可形成一其中該等開孔6係 藉一編織方法形成之碳纖維編織材料5，且該編織方法係將 該等碳纖維5a以一除直角以外之角度交又，例如，將該等 碳纖維5a以120。之對角地交又。此外，該碳纖維編織材料5 可以被編織成使形成在該碳纖維編織材料5之開孔6的平面 形態不是正方形，而是矩形、菱形、六邊形、八邊形等。 此外，雖然在第2圖中顯示的是該碳纖維編織材料5以 預定間距在垂直與水平方向上與該等開孔6對齊的例子，但 是可了解的是當欲形成在該芯基板中之PTH非均勻配置而 是不均勻地配置在一平面上時，該碳纖維編織材料5可形成 為使得該等開孔6依據該PTH之平面配置來形成。本發明不 限於該PTH均勻地配置之一電路板，且亦可應用於該ρτΗ 非均勻配置之情形。 藉以樹脂浸潰該碳纖維編織材料5，可以獲得一預 材α預讀係藉以樹脂浸㈣碳纖維編織材彬之碳纖維 5a並以樹月曰11填充該等開孔6而得。請注意當該等開孔6為 大時，有時會有該等開孔6無法以樹脂充滿之情形。 第1A圖顯示依此方式獲得之預浸材l〇a、10b與10c已被 定位時之狀態。當多數預浸材依此方式上下疊置定位時， 該等預浸材係被;t位成使得在該碳纖維編織材料5中之開 孔6的配置彳立置互相匹配。 在這製造過程中，製備多數大塊之碳纖維編織材料5， 且該碳纖維編織材料5被如環氧樹脂等樹脂浸潰以形成大 預浸材l〇a、1%與1()c，並且使用該等大預浸材i〇a、⑽與 10c形成該芯基板◎第1A至IF圖顯示將被切割成大量產品之 大預浸材l〇a、l〇b與l〇c之一部份的放大圖。 第1B圖顯示該等預浸材l〇a、10b與l〇c已受到熱壓結合 處理以形成一平板的狀態。藉結合該等預浸材1 〇a、1 與 10c所形成之芯部10係被放置在由該等預浸材12構成之絕 緣層12a内側。這芯部10包括多數包含該等碳纖維5a之區 域、及多數包含在該碳纖維編織材料5中之開孔6的區域。 包含該等礙纖維5a之區域是可導電的，且包含該等開孔6之 區域8填充有該樹脂11並且是電絕緣的。當在該等《炭纖維編 織材料5中之開扎6在一預浸材中未被該樹脂11填滿時，藉 與該等預浸材12進行熱壓結合，該等開孔6將被來自該等預 浸材12之樹脂填滿。 在該芯部1〇已一體成形後’多數通扎13被形成為可位 於填充有該樹脂11(12)之芯部10的區域處’或者換言之，位 1378753 於在該碳纖維编織材料5中之開孔6的位置處（參見第1(： 圖）。該等通孔13被形成為具有一小於形成在該碳纖維編織 材料5中之開孔6的直徑。藉此，該樹脂η暴露於該等通孔 13之内表面，且該等通孔13係藉例如鑽孔而形成。 5 第1D圖顯示無電銅鍍敷與銅電鍍已在該芯部丨〇上進行 以在該等通孔13之内表面上與該芯部1〇之表面上形成—導 電層14 ’以形成该PTH之狀態。由於該等通孔13之内表面 被該樹脂11及該絕緣層12a覆蓋，即使該等通孔13之内表面 被該導電層14覆蓋’在該導電層14與包括該等（導電)碳纖維 10 5之芯部1〇之區域之間亦不會有電短路。 第1E圖顯示導電層16已在該等通孔13已填充有樹脂15 後形成在該怎部10之兩表面上之狀態，且該等導電層16可 以藉電鍍形成。 第1F圖顯示佈線圖案18已藉將該等導電層16组14触刻 I5 成預定圖案而形成在該基板之兩表面上，並藉此形成一卞么 基板20的狀態。形成在該等通孔13之内表面上的導電層14 形成PTH19’且該PTH19與形成在該芯基板2〇之兩表面上的 佈線圖案電性連接。 該PTH19設置成可通過形成在該芯部1〇中之通孔13， 20且由於該等通孔13之内表面被一電絕緣樹脂覆蓋，可防止 在該mm與該芯部10之導電部份，即，包括該等碳纖維 5a之區域間的短路。 依此方式，依據此實施例之製造—芯基板之方法，藉 在構成該芯部10之碳纖維編織材料5中提供多數供該 11 1378753 PTH19通過之開孔6 ’當該PTH19設置在該芯基板2〇中時， 可避免在該PTH19與該碳纖維編織材料5間導電，且因此防 止在該PTH19與該芯部1〇之間的短路。 此外，形成該PTH19之通孔13亦僅設置在該芯基板2〇 5之心°卩1〇中，因此與一習知芯基板不同，不需要設置用以 使該PTH通過該隔件之預備孔。藉此，形成在該芯基板2〇 中之PTH19之配置間距可以作成比在一習知芯基板上更 窄’且該PTH19可以一較高密度形成。 由於形成在該芯部10中之通孔13具有比在一習知基板 〇上更小之直徑，即使該等通孔13填充有該樹脂15，所以相 較於如同在一習知基板中一般地以樹脂填充預備孔，用以 填充該等孔之樹脂量減少，這可有效抑制該芯基板之熱膨 騰係數增加。 電路板 5 第3圖顯示多數佈線層22已積層在該芯基板2〇之兩表 面上以形成一電路板3〇的狀態。該等佈線層22被形成為使 多數佈線圖案26藉導通孔24電性連接’且多數絕緣層乃位 於其間。开>成在該電路板3〇兩表面上之佈線層22上的佈線 圖案26透過形成在該芯基板2〇中之pTH19電性連接。 5亥等佈線層22可以藉一如增層等方法形成，且多數用 以連接一半導體元件之墊27係形成在一半導體元件欲安裝 之該電路板30之一表面上，而與如焊料球等外部連接端子 結合之焊盤28則形成在該電路板3〇之另一表面上。 第4圖顯不一藉將一半導體元件4〇安裝在該電路板3〇 12C. EMBODIMENT DESCRIPTION OF THE PREFERRED EMBODIMENT A method of manufacturing a circuit board A method of manufacturing a circuit board of the present invention will be described below. In the method of manufacturing a circuit board of the present invention, a core substrate is used, and the core substrate has a core made of carbon fiber reinforced plastic (CFRP). Figs. 1A to 1F show the manufacturing steps up to the formation of a core substrate 20 having a core 10 made of CFRp. Fig. 1A shows a prepreg 1〇a, 1〇1) and 1〇 (a state in which mutual positioning can be performed by thermocompression bonding). The prepregs l〇a, 10b and 10c comprise carbon fibers and a plurality of electrical insulation pre- The dip material 12, and the electrically insulating prepreg 12 comprises a filler such as oxidized or cerium oxide to adjust the coefficient of thermal expansion. Although in this embodiment three prepregs 10a are placed in a manner of being stacked one above another, 10b and 10c to form the core 1〇, but the number of prepregs used to form the core (7) can be appropriately selected according to the required thickness of the board, the strength of the core substrate, etc. The most important feature of the method of the board is to constitute a prepreg comprising carbon fibers and used to form the core 1〇3, 1% and 1^, and the prepreg such as l〇 b and 10c are composed of a woven material using a plurality of long carbon fibers, and the carbon fiber woven material is impregnated with an epoxy resin to produce a semi-hardened state having a certain degree of adhesion. The prepregs 10a, 10b and The unique construction of 10c depends on the method of weaving 'ie' although in general woven materials Most of the fibers are uniformly woven on a flat surface, but the carbon fiber woven materials used in the prepregs l〇a' 10b and 1〇c of this embodiment are woven to include a plurality of positions at which the crucible will pass. a space for avoiding interference between ρτΗ formed in the core substrate and the carbon fiber 5a. Fig. 2 is a carbon fiber woven material 5 used in the prepregs l〇a, i〇b and i〇c The carbon fiber woven material 5 is formed by weaving the carbon fibers 5a into a flat mosquito tissue, but most spaces (referred to as "openings" in this specification) are formed at predetermined intervals so that most of the fibers are in a plain weave. The middle of the injury is located at a predetermined interval. When the core substrate is formed, the filaments pass through the openings 6. That is, the carbon fiber woven material 5 is woven such that the openings 6 are formed according to the The arrangement of the PTH in the core substrate is formed in advance. The planar configuration of the PTH to be formed in the core substrate will vary from product to product, but usually formed in a core substrate is configured to have been The predetermined interval is horizontal and Straight to the #. When the PTH is disposed at predetermined intervals in this manner, the carbon fiber woven material 5 can be formed such that the openings 6 are formed in accordance with the plane configuration of the PTH. Further, when the carbon fiber woven material 5 is formed, not only the position of the scale opening 6 but also the vertical and horizontal dimensions of the opening 6 to be passed can be adjusted depending on the arrangement of the PTH. The single slave fiber has a diameter of about several μm, so that a single carbon fiber can be woven to form a carbon fiber woven material 5, as shown in Fig. 2, and can also be produced by twisting together a plurality of single carbon fibers. A wire is used to form the carbon fiber woven material 5. The twisted wire of carbon fiber has a diameter of about several tens of μΐΏ. Although the arrangement pitch formed in the core substrate will vary from product to product, it can be used if it is disposed on a typical substrate for mounting a semiconductor element at a configuration pitch of about 4 μm. The twisted wire having a diameter of about several tens of μm forms a carbon fiber woven material 5, and the carbon fiber woven material 5 has a plurality of openings 6 formed at appropriate positions. Although the carbon fiber woven material 5 shown in FIG. 2 is woven such that the carbon fibers 5a cross each other at a right angle, a carbon fiber woven material 5 in which the openings 6 are formed by a knitting method may be formed, and the knitting method is The carbon fibers 5a are left at an angle other than a right angle, for example, the carbon fibers 5a are at 120. The diagonally intersected again. Further, the carbon fiber woven material 5 may be woven such that the planar shape of the opening 6 formed in the carbon fiber woven material 5 is not a square, but a rectangle, a diamond, a hexagon, an octagon or the like. Further, although an example in which the carbon fiber woven material 5 is aligned with the openings 6 in the vertical and horizontal directions at a predetermined pitch is shown in FIG. 2, it is understood that the PTH to be formed in the core substrate is understood. When the non-uniform arrangement is unevenly arranged on a plane, the carbon fiber woven material 5 may be formed such that the openings 6 are formed in accordance with the planar configuration of the PTH. The present invention is not limited to the PTH uniformly arranging one of the boards, and can also be applied to the case where the ρτΗ is not uniformly arranged. By dipping the carbon fiber woven material 5 with a resin, it is possible to obtain a pre-material α pre-reading by which the carbon fiber 5a of the resin-impregnated (four) carbon fiber woven material is filled and filled with the openings 6. Please note that when the openings 6 are large, there may be cases where the openings 6 cannot be filled with resin. Fig. 1A shows the state in which the prepregs l〇a, 10b, and 10c obtained in this manner have been positioned. When a plurality of prepregs are positioned one above another in this manner, the prepregs are t-positioned such that the arrangement of the openings 6 in the carbon fiber woven material 5 are erected to each other. In this manufacturing process, a majority of the bulk carbon fiber woven material 5 is prepared, and the carbon fiber woven material 5 is impregnated with a resin such as an epoxy resin to form large prepregs l〇a, 1% and 1()c, and The core substrate is formed using the large prepregs i〇a, (10) and 10c. ◎1A to IF show one of the large prepregs l〇a, l〇b and l〇c to be cut into a large number of products. Magnified view of the share. Fig. 1B shows a state in which the prepregs l〇a, 10b and l〇c have been subjected to a thermocompression bonding process to form a flat plate. The core portion 10 formed by combining the prepregs 1a, 1 and 10c is placed inside the insulating layer 12a composed of the prepregs 12. This core portion 10 includes a plurality of regions including the carbon fibers 5a, and a plurality of regions including the openings 6 in the carbon fiber woven material 5. The region containing the barrier fibers 5a is electrically conductive, and the region 8 containing the openings 6 is filled with the resin 11 and is electrically insulating. When the opening 6 of the carbon fiber woven material 5 is not filled with the resin 11 in a prepreg, the openings 6 will be subjected to thermocompression bonding with the prepregs 12 The resin from the prepregs 12 is filled. After the core portion 1 has been integrally formed, the 'most of the through bars 13 are formed to be located at a region filled with the core portion 10 of the resin 11 (12)' or in other words, the position 1378753 is in the carbon fiber woven material 5 At the position of the opening 6 (see Fig. 1: Fig.), the through holes 13 are formed to have a smaller diameter than the opening 6 formed in the carbon fiber woven material 5. Thereby, the resin η is exposed to The inner surfaces of the through holes 13 and the through holes 13 are formed by, for example, drilling. 5 FIG. 1D shows that electroless copper plating and copper plating have been performed on the core portion to be in the through holes. a conductive layer 14' is formed on the surface of the inner surface of the core portion 13 to form the PTH. Since the inner surface of the through holes 13 is covered by the resin 11 and the insulating layer 12a, even if The inner surface of the through hole 13 is covered by the conductive layer 14 and there is no electrical short between the conductive layer 14 and the region including the core portion 1 of the (conductive) carbon fiber 105. Fig. 1E shows the conductive layer 16 has been formed on the two surfaces of the portion 10 after the through holes 13 have been filled with the resin 15, and the same The conductive layer 16 can be formed by electroplating. The first F-picture shows that the wiring pattern 18 has been formed on the two surfaces of the substrate by engraving the conductive layer 16 group 14 into a predetermined pattern, thereby forming a substrate 20 The conductive layer 14 formed on the inner surface of the through holes 13 forms a PTH 19' and the PTH 19 is electrically connected to wiring patterns formed on both surfaces of the core substrate 2. The PTH 19 is disposed to be formed by The through holes 13, 20 in the core portion 1 and because the inner surface of the through holes 13 are covered with an electrically insulating resin, the conductive portion at the mm and the core portion 10 can be prevented, that is, including the same A short circuit between the regions of the carbon fibers 5a. In this manner, according to the method of manufacturing the core substrate of this embodiment, a plurality of openings 6' through which the 11 1378753 PTH 19 is passed are provided in the carbon fiber woven material 5 constituting the core portion 10. When the PTH 19 is disposed in the core substrate 2, conduction between the PTH 19 and the carbon fiber woven material 5 can be avoided, and thus a short circuit between the PTH 19 and the core portion 1 is prevented. Further, the PTH 19 is formed. The through hole 13 is also disposed only on the core substrate 2 5 is in the center of the core, so unlike a conventional core substrate, there is no need to provide a preliminary hole for the PTH to pass through the spacer. Thereby, the arrangement pitch of the PTH 19 formed in the core substrate 2〇 It can be made narrower than on a conventional core substrate' and the PTH 19 can be formed at a higher density. Since the through hole 13 formed in the core 10 has a smaller diameter than that on a conventional substrate, even The through holes 13 are filled with the resin 15, so that the amount of resin for filling the holes is reduced as compared with the case where the preliminary holes are generally filled with resin as in a conventional substrate, which can effectively suppress the heat of the core substrate. The expansion factor increases. Circuit Board 5 Fig. 3 shows a state in which a plurality of wiring layers 22 have been laminated on both surfaces of the core substrate 2 to form a circuit board 3A. The wiring layers 22 are formed such that a plurality of wiring patterns 26 are electrically connected by via holes 24 and a plurality of insulating layers are interposed therebetween. The wiring pattern 26 on the wiring layer 22 on both surfaces of the board 3 is electrically connected through the pTH 19 formed in the core substrate 2A. The wiring layer 22 such as 5 hai may be formed by a method such as build-up, and a plurality of pads 27 for connecting a semiconductor element are formed on one surface of the circuit board 30 to be mounted on the semiconductor element, such as a solder ball. A pad 28, to which an external connection terminal is bonded, is formed on the other surface of the circuit board 3. Figure 4 shows the mounting of a semiconductor component 4 on the board 3 〇 12