TWI455954B - 填孔用熱硬化性樹脂組成物及該組成物與抗焊層形成用光硬化性熱硬化性樹脂組成物之組合單元、以及印刷電路板 - Google Patents

填孔用熱硬化性樹脂組成物及該組成物與抗焊層形成用光硬化性熱硬化性樹脂組成物之組合單元、以及印刷電路板 Download PDF

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Publication number
TWI455954B
TWI455954B TW098115003A TW98115003A TWI455954B TW I455954 B TWI455954 B TW I455954B TW 098115003 A TW098115003 A TW 098115003A TW 98115003 A TW98115003 A TW 98115003A TW I455954 B TWI455954 B TW I455954B
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TW
Taiwan
Prior art keywords
resin composition
thermosetting resin
circuit board
printed circuit
solder resist
Prior art date
Application number
TW098115003A
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English (en)
Other versions
TW201004994A (en
Inventor
Arata Endo
Daisuke Shibata
Katsuto Murata
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008121456A external-priority patent/JP5238342B2/ja
Priority claimed from JP2008121474A external-priority patent/JP5112944B2/ja
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW201004994A publication Critical patent/TW201004994A/zh
Application granted granted Critical
Publication of TWI455954B publication Critical patent/TWI455954B/zh

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Claims (6)

  1. 一種填孔用熱硬化性樹脂組成物，其特徵為含有環氧樹脂、環氧樹脂硬化劑及無機填料且填充於印刷電路板的孔部之熱硬化性樹脂組成物，其中前述環氧樹脂係將3官能以上的環氧樹脂溶解在液狀2官能環氧樹脂者，以溶解後的黏度在25℃為5dPa．s以上，未達100dPa．s下使用者，前述無機填料係由週期表第IIa族的元素之鹽所構成者。
  2. 一種印刷電路板，其特徵為：印刷電路板的孔部係被前述申請專利範圍第1項之熱硬化性樹脂組成物的硬化物所填充。
  3. 一種填孔用熱硬化性樹脂組成物與抗焊層形成用光硬化性熱硬化性樹脂組成物之組合單元，其係填充於印刷電路板的孔部之填孔用熱硬化性樹脂組成物(I)、與用於形成與由該填孔用熱硬化性樹脂組成物的硬化物所成的孔部絕緣層接觸所形成的抗焊層之光硬化性熱硬化性樹脂組成物(II)之組合單元，其特徵為：前述填孔用熱硬化性樹脂組成物(I)係以組成物總量之40~85質量%的比例含有由週期表第IIa族的元素之鹽所成的無機填料，前述抗焊層形成用光硬化性熱硬化性樹脂組成物(II)中所含有的光聚合引發劑之分解溫度為250℃以上。
  4. 如申請專利範圍第3項之組合單元，其中前述填孔用熱硬化性樹脂組成物(I)含有環氧樹脂、環氧樹脂硬化劑及由週期表第IIa族的元素之鹽所成的無機填料。
  5. 如申請專利範圍第3項之組合單元，其中前述無機填料係碳酸鈣。
  6. 一種印刷電路板，其特徵為：印刷電路板的孔部係被含有由週期表第IIa族的元素之鹽所成的無機填料之填孔用熱硬化性樹脂組成物(I)的硬化物所填充，形成有與由該硬化物所成的孔部絕緣層接觸，含有分解溫度為250℃以上的光聚合引發劑之抗焊層形成用光硬化性熱硬化性樹脂組成物(II)的硬化物所成的抗焊層。
TW098115003A 2008-05-07 2009-05-06 填孔用熱硬化性樹脂組成物及該組成物與抗焊層形成用光硬化性熱硬化性樹脂組成物之組合單元、以及印刷電路板 TWI455954B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008121456A JP5238342B2 (ja) 2008-05-07 2008-05-07 プリント配線板の穴埋め用熱硬化性樹脂組成物及びそれを用いたプリント配線板
JP2008121474A JP5112944B2 (ja) 2008-05-07 2008-05-07 穴埋め用熱硬化性樹脂組成物とソルダーマスク形成用光硬化性・熱硬化性樹脂組成物の組合せユニット及びプリント配線板

Publications (2)

Publication Number Publication Date
TW201004994A TW201004994A (en) 2010-02-01
TWI455954B true TWI455954B (zh) 2014-10-11

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TW098115003A TWI455954B (zh) 2008-05-07 2009-05-06 填孔用熱硬化性樹脂組成物及該組成物與抗焊層形成用光硬化性熱硬化性樹脂組成物之組合單元、以及印刷電路板

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TW (1) TWI455954B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI488553B (zh) * 2013-07-08 2015-06-11 Boardtek Electronics Corp 電路板及其製造方法
TWI605733B (zh) * 2016-11-10 2017-11-11 南亞電路板股份有限公司 電路板及其製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI254722B (en) * 2001-09-27 2006-05-11 San Ei Kagaku Co Photo-setting and thermosetting resin composition, and process for preparing plugged-through-hole printed wiring board
CN1800979A (zh) * 2005-01-07 2006-07-12 太阳油墨股份有限公司 光固化性/热固化性单液型阻焊剂组合物以及使用其的印刷电路板
JP2007249148A (ja) * 2006-03-17 2007-09-27 Sanei Kagaku Kk 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI254722B (en) * 2001-09-27 2006-05-11 San Ei Kagaku Co Photo-setting and thermosetting resin composition, and process for preparing plugged-through-hole printed wiring board
CN1800979A (zh) * 2005-01-07 2006-07-12 太阳油墨股份有限公司 光固化性/热固化性单液型阻焊剂组合物以及使用其的印刷电路板
JP2007249148A (ja) * 2006-03-17 2007-09-27 Sanei Kagaku Kk 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。

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