HK1040431A1 - Contact probe and fabrication method thereof - Google Patents
Contact probe and fabrication method thereofInfo
- Publication number
- HK1040431A1 HK1040431A1 HK02100269A HK02100269A HK1040431A1 HK 1040431 A1 HK1040431 A1 HK 1040431A1 HK 02100269 A HK02100269 A HK 02100269A HK 02100269 A HK02100269 A HK 02100269A HK 1040431 A1 HK1040431 A1 HK 1040431A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- fabrication method
- contact probe
- probe
- contact
- fabrication
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000164407A JP3773396B2 (ja) | 2000-06-01 | 2000-06-01 | コンタクトプローブおよびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1040431A1 true HK1040431A1 (en) | 2002-06-07 |
Family
ID=18668029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02100269A HK1040431A1 (en) | 2000-06-01 | 2002-01-15 | Contact probe and fabrication method thereof |
Country Status (7)
Country | Link |
---|---|
US (2) | US20020000821A1 (ko) |
EP (1) | EP1160576B1 (ko) |
JP (1) | JP3773396B2 (ko) |
KR (1) | KR100808325B1 (ko) |
DE (1) | DE60133791T2 (ko) |
HK (1) | HK1040431A1 (ko) |
TW (1) | TW548410B (ko) |
Families Citing this family (69)
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US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
US7274549B2 (en) * | 2000-12-15 | 2007-09-25 | X2Y Attenuators, Llc | Energy pathway arrangements for energy conditioning |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7321485B2 (en) * | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US6603646B2 (en) * | 1997-04-08 | 2003-08-05 | X2Y Attenuators, Llc | Multi-functional energy conditioner |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
CN1481603A (zh) * | 2000-10-17 | 2004-03-10 | X2Y˥��������˾ | 屏蔽汞齐和被屏蔽的能量路径及用于单个或多个带公共参考节点电路的其它元件 |
US7193831B2 (en) * | 2000-10-17 | 2007-03-20 | X2Y Attenuators, Llc | Energy pathway arrangement |
US6863149B2 (en) * | 2000-12-12 | 2005-03-08 | Japan Science And Technology Corporation | Steering mechanism of electric car |
EP1387174B1 (en) * | 2001-04-13 | 2010-05-19 | Sumitomo Electric Industries, Ltd. | Contact probe |
WO2003056346A1 (fr) | 2001-12-25 | 2003-07-10 | Sumitomo Electric Industries, Ltd. | Sonde de contact |
JP2004152536A (ja) * | 2002-10-29 | 2004-05-27 | Otax Co Ltd | 電子部品用ソケット |
US7180718B2 (en) * | 2003-01-31 | 2007-02-20 | X2Y Attenuators, Llc | Shielded energy conditioner |
JP3745744B2 (ja) | 2003-04-16 | 2006-02-15 | 住友電気工業株式会社 | 金属構造体の製造方法およびその方法により製造した金属構造体 |
US7675729B2 (en) | 2003-12-22 | 2010-03-09 | X2Y Attenuators, Llc | Internally shielded energy conditioner |
US6855010B1 (en) * | 2004-01-26 | 2005-02-15 | Chuan Yi Precision Industry Co., Ltd. | Terminal for electric connector for communication apparatus |
US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
JP2006064676A (ja) | 2004-08-30 | 2006-03-09 | Tokyo Electron Ltd | プローブ針、プローブ針の製造方法および三次元立体構造の製造方法 |
US20060079102A1 (en) * | 2004-10-13 | 2006-04-13 | The Ludlow Company Lp | Cable terminal with flexible contacts |
KR100585561B1 (ko) * | 2004-10-26 | 2006-06-07 | 주식회사 파이컴 | 수직형 전기적 접촉체 및 그 제조방법 |
JP2006132982A (ja) * | 2004-11-02 | 2006-05-25 | Tokyo Electron Ltd | プローブ |
JP4700353B2 (ja) * | 2005-01-13 | 2011-06-15 | 山一電機株式会社 | プローブエレメントの製造方法 |
KR20070107746A (ko) * | 2005-03-01 | 2007-11-07 | 엑스2와이 어테뉴에이터스, 엘.엘.씨 | 내부 중첩된 조절기 |
US7817397B2 (en) | 2005-03-01 | 2010-10-19 | X2Y Attenuators, Llc | Energy conditioner with tied through electrodes |
JP2006242685A (ja) * | 2005-03-02 | 2006-09-14 | Fuchigami Micro:Kk | コンタクトプローブカード |
JP2006242774A (ja) * | 2005-03-03 | 2006-09-14 | Tokyo Electron Ltd | プローブ及びプローブカード |
JP4649248B2 (ja) * | 2005-03-22 | 2011-03-09 | 山一電機株式会社 | プローブユニット |
JP4884753B2 (ja) | 2005-11-22 | 2012-02-29 | 日本発條株式会社 | 導電性接触子ユニットおよび導電性接触子 |
JP4907191B2 (ja) | 2006-02-17 | 2012-03-28 | 日本発條株式会社 | 導電性接触子ユニット |
WO2007102401A1 (ja) | 2006-03-03 | 2007-09-13 | Nhk Spring Co., Ltd. | 導電性接触子ユニット |
CN101395481B (zh) | 2006-03-03 | 2012-07-18 | 日本发条株式会社 | 导电性接触器单元 |
CN101395683A (zh) | 2006-03-07 | 2009-03-25 | X2Y衰减器有限公司 | 能量调节装置结构 |
JP4842733B2 (ja) | 2006-08-18 | 2011-12-21 | 日本発條株式会社 | 導電性接触子および導電性接触子ユニット |
KR100864185B1 (ko) * | 2007-01-31 | 2008-10-17 | 한국기계연구원 | 가변강성 기능을 가진 수직형 미세 접촉 프로브 |
JP2008275488A (ja) * | 2007-04-28 | 2008-11-13 | Sankei Engineering:Kk | 導電接触ピンおよびピン保持具、電気部品検査装置ならびに電気部品の製造方法 |
JP2009002845A (ja) * | 2007-06-22 | 2009-01-08 | Micronics Japan Co Ltd | 接触子及び接続装置 |
US20090144970A1 (en) * | 2007-12-06 | 2009-06-11 | Winmems Technologies Holdings Co., Ltd. | Fabricating an array of mems parts on a substrate |
US7811849B2 (en) * | 2008-01-30 | 2010-10-12 | Winmems Technologies Co., Ltd. | Placing a MEMS part on an application platform using a guide mask |
KR100984876B1 (ko) * | 2008-05-08 | 2010-10-04 | 한국기계연구원 | 가변강성 기능을 가진 수직형 미세 접촉 프로브 |
US8089294B2 (en) * | 2008-08-05 | 2012-01-03 | WinMENS Technologies Co., Ltd. | MEMS probe fabrication on a reusable substrate for probe card application |
US7737714B2 (en) * | 2008-11-05 | 2010-06-15 | Winmems Technologies Holdings Co., Ltd. | Probe assembly arrangement |
US7928751B2 (en) * | 2009-02-18 | 2011-04-19 | Winmems Technologies Holdings Co., Ltd. | MEMS interconnection pins fabrication on a reusable substrate for probe card application |
JP2010243411A (ja) * | 2009-04-08 | 2010-10-28 | Japan Electronic Materials Corp | 垂直型プローブ |
JP2010276579A (ja) * | 2009-06-01 | 2010-12-09 | Koyo Technos:Kk | 電気接触子およびそれを備える検査治具 |
WO2011115082A1 (ja) * | 2010-03-15 | 2011-09-22 | 日本電産リード株式会社 | 接続端子及び接続治具 |
EP2555001A1 (en) * | 2010-03-30 | 2013-02-06 | Sumitomo Electric Industries, Ltd. | Contact probe, contact probe connecting body and methods for manufacturing same |
TW201135239A (en) * | 2010-04-02 | 2011-10-16 | Pleader Yamaichi Co Ltd | High-frequency vertical elastic probe structure |
JP5036892B2 (ja) * | 2010-05-10 | 2012-09-26 | 株式会社神戸製鋼所 | コンタクトプローブ |
KR101149758B1 (ko) * | 2010-06-30 | 2012-07-11 | 리노공업주식회사 | 프로브 |
TW201231977A (en) * | 2011-01-20 | 2012-08-01 | Pleader Yamaichi Co Ltd | Structure of high-frequency vertical spring plate probe card |
US8829937B2 (en) * | 2011-01-27 | 2014-09-09 | Formfactor, Inc. | Fine pitch guided vertical probe array having enclosed probe flexures |
KR20130010311A (ko) * | 2011-07-18 | 2013-01-28 | 주식회사 코리아 인스트루먼트 | 수직형 프로브 카드 |
JP2013072658A (ja) | 2011-09-26 | 2013-04-22 | Sumitomo Electric Ind Ltd | コンタクトプローブの製造方法 |
JP5699899B2 (ja) * | 2011-10-14 | 2015-04-15 | オムロン株式会社 | 接触子 |
JP5687172B2 (ja) * | 2011-11-01 | 2015-03-18 | 三菱電機株式会社 | 半導体テスト治具およびそれを用いた耐圧測定方法 |
TW201533449A (zh) * | 2014-02-24 | 2015-09-01 | Mpi Corp | 具有彈簧套筒式探針之探針裝置 |
DE102015004151B4 (de) * | 2015-03-31 | 2022-01-27 | Feinmetall Gmbh | Verfahren zur Herstellung einer Federkontaktstift-Anordnung mit mehreren Federkontaktstiften |
WO2016156003A1 (en) * | 2015-03-31 | 2016-10-06 | Technoprobe S.P.A. | Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications |
JP1558200S (ko) * | 2015-11-12 | 2016-09-12 | ||
JP1558199S (ko) * | 2015-11-12 | 2016-09-12 | ||
JP1558740S (ko) * | 2015-11-12 | 2016-09-12 | ||
KR101813006B1 (ko) * | 2016-01-04 | 2017-12-28 | 주식회사 아이에스시 | 반도체 테스트용 콘택터 |
KR20170119469A (ko) * | 2016-04-19 | 2017-10-27 | 장용일 | 전기 단자 테스트용 메쉬형 컨택 핀 |
JP2018197714A (ja) * | 2017-05-24 | 2018-12-13 | 山一電機株式会社 | Mems型プローブ、及び、これを使用した電気検査用装置 |
KR102080592B1 (ko) * | 2018-12-19 | 2020-04-20 | 주식회사 오킨스전자 | S-타입 탄성편을 이용하여 3개의 플런저 상호 간의 콘택 특성이 개선되는 데스트 핀 |
KR102519285B1 (ko) * | 2021-02-22 | 2023-04-17 | (주)포인트엔지니어링 | 전기 전도성 접촉핀 및 이의 제조방법 |
KR102538834B1 (ko) * | 2021-04-15 | 2023-06-02 | (주)위드멤스 | 프로브 핀 |
KR102606892B1 (ko) * | 2021-06-15 | 2023-11-29 | (주)포인트엔지니어링 | 검사 소켓용 지지 플레이트, 검사 소켓용 소켓핀 및 이들을 구비하는 검사 소켓 |
TWI833186B (zh) * | 2022-03-29 | 2024-02-21 | 大陸商迪科特測試科技(蘇州)有限公司 | 探針及其彈性結構 |
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EP0256541A3 (de) * | 1986-08-19 | 1990-03-14 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Kontaktiervorrichtung |
DE8711110U1 (de) * | 1986-08-19 | 1987-12-17 | Feinmetall Gmbh, 7033 Herrenberg | Kontaktiervorrichtung |
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US5148810A (en) | 1990-02-12 | 1992-09-22 | Acuson Corporation | Variable origin-variable angle acoustic scanning method and apparatus |
US5015947A (en) | 1990-03-19 | 1991-05-14 | Tektronix, Inc. | Low capacitance probe tip |
DE4029829A1 (de) | 1990-09-20 | 1992-04-02 | Dornier Medizintechnik | Dreidimensionale darstellung von ultraschall-bildern |
JPH0629625A (ja) * | 1992-07-07 | 1994-02-04 | Nippon Telegr & Teleph Corp <Ntt> | 垂直共振器型双安定半導体レーザ |
DE69416200T2 (de) * | 1993-06-16 | 1999-06-02 | Nitto Denko Corp., Ibaraki, Osaka | Sondenkonstruktion |
JPH0727789A (ja) | 1993-07-09 | 1995-01-31 | Nitto Denko Corp | 回路配線板およびその製造方法 |
US5513430A (en) * | 1994-08-19 | 1996-05-07 | Motorola, Inc. | Method for manufacturing a probe |
US5977783A (en) * | 1994-10-28 | 1999-11-02 | Nitto Denko Corporation | Multilayer probe for measuring electrical characteristics |
JP2706432B2 (ja) | 1995-07-24 | 1998-01-28 | 日東工業株式会社 | 電子写真装置用定着ベルト及び定着装置 |
US5667410A (en) * | 1995-11-21 | 1997-09-16 | Everett Charles Technologies, Inc. | One-piece compliant probe |
JPH09279365A (ja) | 1996-04-11 | 1997-10-28 | Mitsubishi Materials Corp | 微細構造部品を製造する方法 |
JPH10303258A (ja) | 1997-04-22 | 1998-11-13 | Sumitomo Electric Ind Ltd | 電子、電気回路の検査装置 |
JPH1144708A (ja) | 1997-07-24 | 1999-02-16 | Mitsubishi Materials Corp | コンタクトプローブおよびその製造方法 |
JP3458684B2 (ja) | 1997-11-28 | 2003-10-20 | 三菱マテリアル株式会社 | コンタクトプローブ |
JPH11191453A (ja) | 1997-12-25 | 1999-07-13 | Oputonikusu Seimitsu:Kk | 端子板およびその製造方法 |
JPH11269587A (ja) | 1998-03-24 | 1999-10-05 | Toru Yamazaki | 電解析出法による合金及びそれを用いた マイクロアレイコネクター |
JP3281601B2 (ja) | 1998-05-26 | 2002-05-13 | 武田産業株式会社 | プロ−ブ針およびスプリングプロ−ブ用バネの製造方法 |
US5989994A (en) * | 1998-12-29 | 1999-11-23 | Advantest Corp. | Method for producing contact structures |
SG75186A1 (en) | 1998-11-30 | 2000-09-19 | Advantest Corp | Method for producing contact structures |
JP2001013166A (ja) | 1999-06-28 | 2001-01-19 | Toshiba Corp | 半導体装置評価用プローブ構造体及びその製造方法 |
NL1012695C2 (nl) * | 1999-07-23 | 2001-01-24 | Berg Electronics Mfg | Contactelement, werkwijze voor het vervaardigen daarvan en connector die hetzelfde omvat. |
JP2001342591A (ja) | 2000-03-27 | 2001-12-14 | Takayasu Mochizuki | 高強度合金及びその製造方法並びにその高強度合金を被覆してなる金属とその高強度合金を用いたマイクロ構造体 |
-
2000
- 2000-06-01 JP JP2000164407A patent/JP3773396B2/ja not_active Expired - Fee Related
-
2001
- 2001-05-30 US US09/870,420 patent/US20020000821A1/en not_active Abandoned
- 2001-05-31 TW TW090113187A patent/TW548410B/zh not_active IP Right Cessation
- 2001-05-31 EP EP01304766A patent/EP1160576B1/en not_active Expired - Lifetime
- 2001-05-31 DE DE60133791T patent/DE60133791T2/de not_active Expired - Fee Related
- 2001-06-01 KR KR1020010030662A patent/KR100808325B1/ko not_active IP Right Cessation
-
2002
- 2002-01-15 HK HK02100269A patent/HK1040431A1/xx not_active IP Right Cessation
-
2003
- 2003-05-23 US US10/445,181 patent/US6784680B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1160576A3 (en) | 2003-07-23 |
US20020000821A1 (en) | 2002-01-03 |
DE60133791D1 (de) | 2008-06-12 |
JP3773396B2 (ja) | 2006-05-10 |
JP2001343397A (ja) | 2001-12-14 |
EP1160576A2 (en) | 2001-12-05 |
DE60133791T2 (de) | 2009-06-25 |
TW548410B (en) | 2003-08-21 |
EP1160576B1 (en) | 2008-04-30 |
KR20010110168A (ko) | 2001-12-12 |
US20030210063A1 (en) | 2003-11-13 |
US6784680B2 (en) | 2004-08-31 |
KR100808325B1 (ko) | 2008-02-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120531 |