ES2005469A6 - Un metodo para formar sobre un sustrato un reestimiento ceramico o semejante a ceramico, en multicapa. - Google Patents

Un metodo para formar sobre un sustrato un reestimiento ceramico o semejante a ceramico, en multicapa.

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Publication number
ES2005469A6
ES2005469A6 ES8703425A ES8703425A ES2005469A6 ES 2005469 A6 ES2005469 A6 ES 2005469A6 ES 8703425 A ES8703425 A ES 8703425A ES 8703425 A ES8703425 A ES 8703425A ES 2005469 A6 ES2005469 A6 ES 2005469A6
Authority
ES
Spain
Prior art keywords
hydrogen silsesquioxane
coating
ceramified
multilayer ceramics
nitrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8703425A
Other languages
English (en)
Inventor
Loren Andrew Haluska
Leith Winton Michael
Leo Tarhay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25469718&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2005469(A6) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of ES2005469A6 publication Critical patent/ES2005469A6/es
Expired legal-status Critical Current

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    • HELECTRICITY
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    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5025Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with ceramic materials
    • C04B41/5035Silica
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5053Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials non-oxide ceramics
    • C04B41/5062Borides, Nitrides or Silicides
    • C04B41/5066Silicon nitride
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
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    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/89Coating or impregnation for obtaining at least two superposed coatings having different compositions
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    • H01L21/02211Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
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    • H01L21/02205Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • H01L21/02214Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H01L21/02216Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L21/318Inorganic layers composed of nitrides
    • H01L21/3185Inorganic layers composed of nitrides of siliconnitrides
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    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844Uses not provided for elsewhere in C04B2111/00 for electronic applications
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/312Organic layers, e.g. photoresist
    • H01L21/3121Layers comprising organo-silicon compounds

Abstract

ESTA INVENCION SE REFIERE A MATERIALES PRODUCIDOS DILUYENDO EN UN DISOLVENTE UNA SOLUCION EN DISOLVENTE DE RESINA DE HIDROGENO SILSESQUIOXANO, QUE SE APLICA A UN SUSTRATO Y SE CERAMIFICA POR ACCION DEL CALOR. SOBRE EL REVESTIMIENTO DE SIO2 CERAMIFICADO, SE PUEDE APLICAR UNO O MAS REVESTIMIENTOS CERAMICOS QUE CONTIENEN SILICIO-CARBONO, SILICIO-NITROGENO O SILICIO-CARBONO-NITROGENO. PARA UNA MEJOR PROTECCION, TAMBIEN PUEDE APLICARSE UNA ULTIMA CAPA CVD O PECVD. LA INVENCION ES PARTICULARMENTE UTIL PARA RECUBRIR DISPOSITIVOS ELECTRONICOS.
ES8703425A 1986-12-03 1987-11-30 Un metodo para formar sobre un sustrato un reestimiento ceramico o semejante a ceramico, en multicapa. Expired ES2005469A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/937,274 US4756977A (en) 1986-12-03 1986-12-03 Multilayer ceramics from hydrogen silsesquioxane

Publications (1)

Publication Number Publication Date
ES2005469A6 true ES2005469A6 (es) 1989-03-01

Family

ID=25469718

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8703425A Expired ES2005469A6 (es) 1986-12-03 1987-11-30 Un metodo para formar sobre un sustrato un reestimiento ceramico o semejante a ceramico, en multicapa.

Country Status (7)

Country Link
US (1) US4756977A (es)
EP (1) EP0270369B1 (es)
JP (1) JPH0642477B2 (es)
KR (1) KR950014273B1 (es)
CA (1) CA1329737C (es)
DE (1) DE3789606T2 (es)
ES (1) ES2005469A6 (es)

Families Citing this family (175)

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US5128494A (en) * 1985-04-26 1992-07-07 Sri International Hydridosiloxanes as precursors to ceramic products
KR910003742B1 (ko) * 1986-09-09 1991-06-10 세미콘덕터 에너지 라보라터리 캄파니 리미티드 Cvd장치
US4753855A (en) * 1986-12-04 1988-06-28 Dow Corning Corporation Multilayer ceramic coatings from metal oxides for protection of electronic devices
US4808653A (en) * 1986-12-04 1989-02-28 Dow Corning Corporation Coating composition containing hydrogen silsesquioxane resin and other metal oxide precursors
JPS63215578A (ja) * 1987-02-28 1988-09-08 株式会社豊田中央研究所 セラミツク材料表面への固体潤滑被膜の形成方法
US5004625A (en) * 1987-08-11 1991-04-02 North American Philips Corporation Solid state light modulator incorporating metallized gel and method of metallization
JP2632879B2 (ja) * 1987-11-17 1997-07-23 東京応化工業株式会社 シリコーン系被膜の形成方法
US4847162A (en) * 1987-12-28 1989-07-11 Dow Corning Corporation Multilayer ceramics coatings from the ceramification of hydrogen silsequioxane resin in the presence of ammonia
US4877651A (en) * 1988-05-31 1989-10-31 Olin Corporation Process for thermally depositing silicon nitride and silicon dioxide films onto a substrate
US5336532A (en) * 1989-02-21 1994-08-09 Dow Corning Corporation Low temperature process for the formation of ceramic coatings
US4999397A (en) * 1989-07-28 1991-03-12 Dow Corning Corporation Metastable silane hydrolyzates and process for their preparation
CA2027031A1 (en) * 1989-10-18 1991-04-19 Loren A. Haluska Hermetic substrate coatings in an inert gas atmosphere
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DE3789606T2 (de) 1994-11-24
EP0270369A2 (en) 1988-06-08
EP0270369A3 (en) 1989-12-13
JPH0642477B2 (ja) 1994-06-01
EP0270369B1 (en) 1994-04-13
JPS63144525A (ja) 1988-06-16
KR950014273B1 (ko) 1995-11-24
DE3789606D1 (de) 1994-05-19
US4756977A (en) 1988-07-12
KR880008438A (ko) 1988-08-31
CA1329737C (en) 1994-05-24

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