ES2005469A6 - Un metodo para formar sobre un sustrato un reestimiento ceramico o semejante a ceramico, en multicapa. - Google Patents
Un metodo para formar sobre un sustrato un reestimiento ceramico o semejante a ceramico, en multicapa.Info
- Publication number
- ES2005469A6 ES2005469A6 ES8703425A ES8703425A ES2005469A6 ES 2005469 A6 ES2005469 A6 ES 2005469A6 ES 8703425 A ES8703425 A ES 8703425A ES 8703425 A ES8703425 A ES 8703425A ES 2005469 A6 ES2005469 A6 ES 2005469A6
- Authority
- ES
- Spain
- Prior art keywords
- hydrogen silsesquioxane
- coating
- ceramified
- multilayer ceramics
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5025—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with ceramic materials
- C04B41/5035—Silica
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5053—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials non-oxide ceramics
- C04B41/5062—Borides, Nitrides or Silicides
- C04B41/5066—Silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/87—Ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02167—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon carbide not containing oxygen, e.g. SiC, SiC:H or silicon carbonitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/318—Inorganic layers composed of nitrides
- H01L21/3185—Inorganic layers composed of nitrides of siliconnitrides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
Abstract
ESTA INVENCION SE REFIERE A MATERIALES PRODUCIDOS DILUYENDO EN UN DISOLVENTE UNA SOLUCION EN DISOLVENTE DE RESINA DE HIDROGENO SILSESQUIOXANO, QUE SE APLICA A UN SUSTRATO Y SE CERAMIFICA POR ACCION DEL CALOR. SOBRE EL REVESTIMIENTO DE SIO2 CERAMIFICADO, SE PUEDE APLICAR UNO O MAS REVESTIMIENTOS CERAMICOS QUE CONTIENEN SILICIO-CARBONO, SILICIO-NITROGENO O SILICIO-CARBONO-NITROGENO. PARA UNA MEJOR PROTECCION, TAMBIEN PUEDE APLICARSE UNA ULTIMA CAPA CVD O PECVD. LA INVENCION ES PARTICULARMENTE UTIL PARA RECUBRIR DISPOSITIVOS ELECTRONICOS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/937,274 US4756977A (en) | 1986-12-03 | 1986-12-03 | Multilayer ceramics from hydrogen silsesquioxane |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2005469A6 true ES2005469A6 (es) | 1989-03-01 |
Family
ID=25469718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8703425A Expired ES2005469A6 (es) | 1986-12-03 | 1987-11-30 | Un metodo para formar sobre un sustrato un reestimiento ceramico o semejante a ceramico, en multicapa. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4756977A (es) |
EP (1) | EP0270369B1 (es) |
JP (1) | JPH0642477B2 (es) |
KR (1) | KR950014273B1 (es) |
CA (1) | CA1329737C (es) |
DE (1) | DE3789606T2 (es) |
ES (1) | ES2005469A6 (es) |
Families Citing this family (175)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5128494A (en) * | 1985-04-26 | 1992-07-07 | Sri International | Hydridosiloxanes as precursors to ceramic products |
KR910003742B1 (ko) * | 1986-09-09 | 1991-06-10 | 세미콘덕터 에너지 라보라터리 캄파니 리미티드 | Cvd장치 |
US4753855A (en) * | 1986-12-04 | 1988-06-28 | Dow Corning Corporation | Multilayer ceramic coatings from metal oxides for protection of electronic devices |
US4808653A (en) * | 1986-12-04 | 1989-02-28 | Dow Corning Corporation | Coating composition containing hydrogen silsesquioxane resin and other metal oxide precursors |
JPS63215578A (ja) * | 1987-02-28 | 1988-09-08 | 株式会社豊田中央研究所 | セラミツク材料表面への固体潤滑被膜の形成方法 |
US5004625A (en) * | 1987-08-11 | 1991-04-02 | North American Philips Corporation | Solid state light modulator incorporating metallized gel and method of metallization |
JP2632879B2 (ja) * | 1987-11-17 | 1997-07-23 | 東京応化工業株式会社 | シリコーン系被膜の形成方法 |
US4847162A (en) * | 1987-12-28 | 1989-07-11 | Dow Corning Corporation | Multilayer ceramics coatings from the ceramification of hydrogen silsequioxane resin in the presence of ammonia |
US4877651A (en) * | 1988-05-31 | 1989-10-31 | Olin Corporation | Process for thermally depositing silicon nitride and silicon dioxide films onto a substrate |
US5336532A (en) * | 1989-02-21 | 1994-08-09 | Dow Corning Corporation | Low temperature process for the formation of ceramic coatings |
US4999397A (en) * | 1989-07-28 | 1991-03-12 | Dow Corning Corporation | Metastable silane hydrolyzates and process for their preparation |
CA2027031A1 (en) * | 1989-10-18 | 1991-04-19 | Loren A. Haluska | Hermetic substrate coatings in an inert gas atmosphere |
US5183684A (en) * | 1989-11-20 | 1993-02-02 | Dow Corning Corporation | Single and multilayer coatings containing aluminum nitride |
US4973526A (en) * | 1990-02-15 | 1990-11-27 | Dow Corning Corporation | Method of forming ceramic coatings and resulting articles |
US5262201A (en) * | 1990-06-04 | 1993-11-16 | Dow Corning Corporation | Low temperature process for converting silica precursor coatings to ceramic silica coatings by exposure to ammonium hydroxide or an environment to which water vapor and ammonia vapor have been added |
US5116637A (en) * | 1990-06-04 | 1992-05-26 | Dow Corning Corporation | Amine catalysts for the low temperature conversion of silica precursors to silica |
US5133993A (en) * | 1990-08-20 | 1992-07-28 | General Atomics | Fiber-reinforced refractory composites |
US5091162A (en) * | 1990-10-01 | 1992-02-25 | Dow Corning Corporation | Perhydrosiloxane copolymers and their use as coating materials |
US5021711A (en) * | 1990-10-29 | 1991-06-04 | Gte Products Corporation | Quartz lamp envelope with molybdenum foil having oxidation-resistant surface formed by ion implantation |
US5063267A (en) * | 1990-11-28 | 1991-11-05 | Dow Corning Corporation | Hydrogen silsesquioxane resin fractions and their use as coating materials |
US5380553A (en) * | 1990-12-24 | 1995-01-10 | Dow Corning Corporation | Reverse direction pyrolysis processing |
US5445894A (en) * | 1991-04-22 | 1995-08-29 | Dow Corning Corporation | Ceramic coatings |
US5238787A (en) * | 1991-04-22 | 1993-08-24 | Dow Corning Corporation | Photodelineable coatings from hydrogen silsesquioxane resin |
US5312684A (en) * | 1991-05-02 | 1994-05-17 | Dow Corning Corporation | Threshold switching device |
US5422982A (en) * | 1991-05-02 | 1995-06-06 | Dow Corning Corporation | Neural networks containing variable resistors as synapses |
US5339211A (en) * | 1991-05-02 | 1994-08-16 | Dow Corning Corporation | Variable capacitor |
US5165955A (en) * | 1991-05-28 | 1992-11-24 | Dow Corning Corporation | Method of depositing a coating containing silicon and oxygen |
US5145723A (en) * | 1991-06-05 | 1992-09-08 | Dow Corning Corporation | Process for coating a substrate with silica |
US5194341A (en) * | 1991-12-03 | 1993-03-16 | Bell Communications Research, Inc. | Silica electrolyte element for secondary lithium battery |
CA2088107A1 (en) * | 1992-02-24 | 1993-08-25 | Ronald Howard Baney | Silicone infiltrated ceramic nanocomposite coatings |
US5436029A (en) * | 1992-07-13 | 1995-07-25 | Dow Corning Corporation | Curing silicon hydride containing materials by exposure to nitrous oxide |
CA2104340A1 (en) * | 1992-08-31 | 1994-03-01 | Grish Chandra | Hermetic protection for integrated circuits |
US5310583A (en) * | 1992-11-02 | 1994-05-10 | Dow Corning Corporation | Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide |
JP3174417B2 (ja) * | 1992-12-11 | 2001-06-11 | ダウ・コ−ニング・コ−ポレ−ション | 酸化ケイ素膜の形成方法 |
JP3210457B2 (ja) * | 1992-12-14 | 2001-09-17 | ダウ・コ−ニング・コ−ポレ−ション | 酸化ケイ素膜の形成方法 |
US5258334A (en) * | 1993-01-15 | 1993-11-02 | The U.S. Government As Represented By The Director, National Security Agency | Process of preventing visual access to a semiconductor device by applying an opaque ceramic coating to integrated circuit devices |
EP0611067B1 (en) * | 1993-02-05 | 1999-03-10 | Dow Corning Corporation | Coating electronic substrates with silica derived from silazane polymers |
US5380555A (en) * | 1993-02-09 | 1995-01-10 | Dow Corning Toray Silicone Co., Ltd. | Methods for the formation of a silicon oxide film |
TW347149U (en) * | 1993-02-26 | 1998-12-01 | Dow Corning | Integrated circuits protected from the environment by ceramic and barrier metal layers |
US5492958A (en) * | 1993-03-08 | 1996-02-20 | Dow Corning Corporation | Metal containing ceramic coatings |
US5387480A (en) | 1993-03-08 | 1995-02-07 | Dow Corning Corporation | High dielectric constant coatings |
US5912047A (en) * | 1993-03-25 | 1999-06-15 | Dow Corning Corporation | Borosilicate electronic coatings |
TW387924B (en) * | 1993-07-19 | 2000-04-21 | Dow Corning | A method of forming a coating on optical fiber with hydrogen silsesquioxane resin |
JP3418458B2 (ja) * | 1993-08-31 | 2003-06-23 | 富士通株式会社 | 半導体装置の製造方法 |
US5320868A (en) * | 1993-09-13 | 1994-06-14 | Dow Corning Corporation | Method of forming SI-O containing coatings |
JPH07169020A (ja) * | 1993-09-21 | 1995-07-04 | Eastman Kodak Co | 磁気薄膜ヘッドのための基板表面の平坦化プロセス |
US5441765A (en) * | 1993-09-22 | 1995-08-15 | Dow Corning Corporation | Method of forming Si-O containing coatings |
JP2739902B2 (ja) * | 1993-09-30 | 1998-04-15 | 東京応化工業株式会社 | 酸化ケイ素系被膜形成用塗布液 |
US5403748A (en) * | 1993-10-04 | 1995-04-04 | Dow Corning Corporation | Detection of reactive gases |
CA2133898A1 (en) * | 1993-12-29 | 1995-06-30 | Keith Winton Michael | Integrated circuits with passivation and metallization for hermetic protection |
US5436083A (en) * | 1994-04-01 | 1995-07-25 | Dow Corning Corporation | Protective electronic coatings using filled polysilazanes |
US5547703A (en) * | 1994-04-11 | 1996-08-20 | Dow Corning Corporation | Method of forming si-o containing coatings |
US5399441A (en) * | 1994-04-12 | 1995-03-21 | Dow Corning Corporation | Method of applying opaque coatings |
US5530293A (en) | 1994-11-28 | 1996-06-25 | International Business Machines Corporation | Carbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuits |
US5508062A (en) * | 1994-12-02 | 1996-04-16 | Dow Corning Corporation | Method for forming an insoluble coating on a substrate |
US5516596A (en) * | 1994-12-19 | 1996-05-14 | Dow Corning Corporation | Method of forming a composite, article and composition |
US5607773A (en) * | 1994-12-20 | 1997-03-04 | Texas Instruments Incorporated | Method of forming a multilevel dielectric |
US5501875A (en) * | 1994-12-27 | 1996-03-26 | Dow Corning Corporation | Metal coated silica precursor powders |
US5656555A (en) * | 1995-02-17 | 1997-08-12 | Texas Instruments Incorporated | Modified hydrogen silsesquioxane spin-on glass |
US5618878A (en) * | 1995-04-07 | 1997-04-08 | Dow Corning Corporation | Hydrogen silsesquioxane resin coating composition |
US5508238A (en) * | 1995-05-11 | 1996-04-16 | Dow Corning Corporation | Monolithic ceramic bodies using modified hydrogen silsesquioxane resin |
CA2175433A1 (en) * | 1995-05-11 | 1996-11-12 | Gregg Alan Zank | Ceramic matrix composites using modified hydrogen silsesquioxane resin |
US5635240A (en) * | 1995-06-19 | 1997-06-03 | Dow Corning Corporation | Electronic coating materials using mixed polymers |
JP3149739B2 (ja) * | 1995-07-14 | 2001-03-26 | ヤマハ株式会社 | 多層配線形成法 |
JP3070450B2 (ja) * | 1995-07-14 | 2000-07-31 | ヤマハ株式会社 | 多層配線形成法 |
US5613993A (en) * | 1995-08-29 | 1997-03-25 | The United States Of America As Represented By The Secretary Of The Army | Process for encapsulating a shaped body for hot isostatic pressing by sol-gel method |
US5661092A (en) * | 1995-09-01 | 1997-08-26 | The University Of Connecticut | Ultra thin silicon oxide and metal oxide films and a method for the preparation thereof |
US5814397A (en) * | 1995-09-13 | 1998-09-29 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method for waterproofing ceramic materials |
US5693701A (en) * | 1995-10-26 | 1997-12-02 | Dow Corning Corporation | Tamper-proof electronic coatings |
TW308719B (es) | 1995-10-23 | 1997-06-21 | Dow Corning | |
US5753374A (en) * | 1995-11-27 | 1998-05-19 | Dow Corning Corporation | Protective electronic coating |
US5609925A (en) | 1995-12-04 | 1997-03-11 | Dow Corning Corporation | Curing hydrogen silsesquioxane resin with an electron beam |
US5707683A (en) * | 1996-02-22 | 1998-01-13 | Dow Corning Corporation | Electronic coating composition method of coating an electronic substrate, composition and article |
US5682065A (en) | 1996-03-12 | 1997-10-28 | Micron Technology, Inc. | Hermetic chip and method of manufacture |
US5789325A (en) * | 1996-04-29 | 1998-08-04 | Dow Corning Corporation | Coating electronic substrates with silica derived from polycarbosilane |
US6114186A (en) * | 1996-07-30 | 2000-09-05 | Texas Instruments Incorporated | Hydrogen silsesquioxane thin films for low capacitance structures in integrated circuits |
DE69703770T2 (de) * | 1996-08-14 | 2001-07-12 | Tokyo Ohka Kogyo Co Ltd | Besichtigungslösung auf Polysilazan-Basis für die Isolierung mit einer Zwischenschicht |
US5730792A (en) * | 1996-10-04 | 1998-03-24 | Dow Corning Corporation | Opaque ceramic coatings |
US5863595A (en) * | 1996-10-04 | 1999-01-26 | Dow Corning Corporation | Thick ceramic coatings for electronic devices |
US5776235A (en) * | 1996-10-04 | 1998-07-07 | Dow Corning Corporation | Thick opaque ceramic coatings |
US6020410A (en) * | 1996-10-29 | 2000-02-01 | Alliedsignal Inc. | Stable solution of a silsesquioxane or siloxane resin and a silicone solvent |
JP3123449B2 (ja) * | 1996-11-01 | 2001-01-09 | ヤマハ株式会社 | 多層配線形成法 |
JP3082688B2 (ja) * | 1996-11-05 | 2000-08-28 | ヤマハ株式会社 | 配線形成法 |
JP3225872B2 (ja) | 1996-12-24 | 2001-11-05 | ヤマハ株式会社 | 酸化シリコン膜形成法 |
JPH10247686A (ja) * | 1996-12-30 | 1998-09-14 | Yamaha Corp | 多層配線形成法 |
US5707681A (en) * | 1997-02-07 | 1998-01-13 | Dow Corning Corporation | Method of producing coatings on electronic substrates |
US5981354A (en) * | 1997-03-12 | 1999-11-09 | Advanced Micro Devices, Inc. | Semiconductor fabrication employing a flowable oxide to enhance planarization in a shallow trench isolation process |
JP3415741B2 (ja) * | 1997-03-31 | 2003-06-09 | 東レ・ダウコーニング・シリコーン株式会社 | 電気絶縁性薄膜形成用組成物および電気絶縁性薄膜の形成方法 |
US6143855A (en) | 1997-04-21 | 2000-11-07 | Alliedsignal Inc. | Organohydridosiloxane resins with high organic content |
US6743856B1 (en) | 1997-04-21 | 2004-06-01 | Honeywell International Inc. | Synthesis of siloxane resins |
US6218497B1 (en) | 1997-04-21 | 2001-04-17 | Alliedsignal Inc. | Organohydridosiloxane resins with low organic content |
US6015457A (en) * | 1997-04-21 | 2000-01-18 | Alliedsignal Inc. | Stable inorganic polymers |
EP0881668A3 (en) | 1997-05-28 | 2000-11-15 | Dow Corning Toray Silicone Company, Ltd. | Deposition of an electrically insulating thin film with a low dielectric constant |
US5866197A (en) * | 1997-06-06 | 1999-02-02 | Dow Corning Corporation | Method for producing thick crack-free coating from hydrogen silsequioxane resin |
TW392288B (en) * | 1997-06-06 | 2000-06-01 | Dow Corning | Thermally stable dielectric coatings |
JP3729226B2 (ja) * | 1997-09-17 | 2005-12-21 | 富士通株式会社 | 半導体集積回路装置及びその製造方法 |
US6018002A (en) * | 1998-02-06 | 2000-01-25 | Dow Corning Corporation | Photoluminescent material from hydrogen silsesquioxane resin |
US6218020B1 (en) | 1999-01-07 | 2001-04-17 | Alliedsignal Inc. | Dielectric films from organohydridosiloxane resins with high organic content |
US6177199B1 (en) | 1999-01-07 | 2001-01-23 | Alliedsignal Inc. | Dielectric films from organohydridosiloxane resins with low organic content |
US6008070A (en) | 1998-05-21 | 1999-12-28 | Micron Technology, Inc. | Wafer level fabrication and assembly of chip scale packages |
US5906859A (en) * | 1998-07-10 | 1999-05-25 | Dow Corning Corporation | Method for producing low dielectric coatings from hydrogen silsequioxane resin |
JP2000143810A (ja) | 1998-11-18 | 2000-05-26 | Dow Corning Asia Ltd | 水素シルセスキオキサン樹脂の製造方法 |
US6231989B1 (en) | 1998-11-20 | 2001-05-15 | Dow Corning Corporation | Method of forming coatings |
KR100308213B1 (ko) * | 1999-02-12 | 2001-09-26 | 윤종용 | 반도체 장치를 위한 저유전 층간 절연막의 제조 방법 |
JP3543669B2 (ja) | 1999-03-31 | 2004-07-14 | 信越化学工業株式会社 | 絶縁膜形成用塗布液及び絶縁膜の形成方法 |
KR100804873B1 (ko) * | 1999-06-10 | 2008-02-20 | 얼라이드시그날 인코퍼레이티드 | 포토리소그래피용 sog 반사방지 코팅 |
US6544880B1 (en) * | 1999-06-14 | 2003-04-08 | Micron Technology, Inc. | Method of improving copper interconnects of semiconductor devices for bonding |
US6197913B1 (en) | 1999-08-26 | 2001-03-06 | Dow Corning Corporation | Method for making microporous silicone resins with narrow pore-size distributions |
US6440550B1 (en) | 1999-10-18 | 2002-08-27 | Honeywell International Inc. | Deposition of fluorosilsesquioxane films |
US6472076B1 (en) | 1999-10-18 | 2002-10-29 | Honeywell International Inc. | Deposition of organosilsesquioxane films |
EP1094506A3 (en) * | 1999-10-18 | 2004-03-03 | Applied Materials, Inc. | Capping layer for extreme low dielectric constant films |
US6541107B1 (en) | 1999-10-25 | 2003-04-01 | Dow Corning Corporation | Nanoporous silicone resins having low dielectric constants |
US6359096B1 (en) | 1999-10-25 | 2002-03-19 | Dow Corning Corporation | Silicone resin compositions having good solution solubility and stability |
US6232424B1 (en) | 1999-12-13 | 2001-05-15 | Dow Corning Corporation | Soluble silicone resin compositions having good solution stability |
US6313045B1 (en) | 1999-12-13 | 2001-11-06 | Dow Corning Corporation | Nanoporous silicone resins having low dielectric constants and method for preparation |
US6143360A (en) * | 1999-12-13 | 2000-11-07 | Dow Corning Corporation | Method for making nanoporous silicone resins from alkylydridosiloxane resins |
JP2001214127A (ja) | 2000-01-31 | 2001-08-07 | Dow Corning Toray Silicone Co Ltd | 電気絶縁性薄膜形成性樹脂組成物、および電気絶縁性薄膜の形成方法 |
JP2001247819A (ja) * | 2000-03-03 | 2001-09-14 | Dow Corning Toray Silicone Co Ltd | 電気絶縁性架橋薄膜形成性有機樹脂組成物、および電気絶縁性架橋薄膜の形成方法 |
US6558755B2 (en) | 2000-03-20 | 2003-05-06 | Dow Corning Corporation | Plasma curing process for porous silica thin film |
US7011868B2 (en) * | 2000-03-20 | 2006-03-14 | Axcelis Technologies, Inc. | Fluorine-free plasma curing process for porous low-k materials |
US6576300B1 (en) | 2000-03-20 | 2003-06-10 | Dow Corning Corporation | High modulus, low dielectric constant coatings |
US6913796B2 (en) * | 2000-03-20 | 2005-07-05 | Axcelis Technologies, Inc. | Plasma curing process for porous low-k materials |
US6759098B2 (en) | 2000-03-20 | 2004-07-06 | Axcelis Technologies, Inc. | Plasma curing of MSQ-based porous low-k film materials |
JP2001291427A (ja) * | 2000-04-06 | 2001-10-19 | Dow Corning Toray Silicone Co Ltd | 電気絶縁性薄膜形成性樹脂組成物、および電気絶縁性薄膜の形成方法 |
US6891237B1 (en) * | 2000-06-27 | 2005-05-10 | Lucent Technologies Inc. | Organic semiconductor device having an active dielectric layer comprising silsesquioxanes |
US6368400B1 (en) * | 2000-07-17 | 2002-04-09 | Honeywell International | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography |
US6524881B1 (en) | 2000-08-25 | 2003-02-25 | Micron Technology, Inc. | Method and apparatus for marking a bare semiconductor die |
AU2001296737A1 (en) | 2000-10-12 | 2002-04-22 | North Carolina State University | Co2-processes photoresists, polymers, and photoactive compounds for microlithography |
US6399210B1 (en) | 2000-11-27 | 2002-06-04 | Dow Corning Corporation | Alkoxyhydridosiloxane resins |
US6528432B1 (en) | 2000-12-05 | 2003-03-04 | Advanced Micro Devices, Inc. | H2-or H2/N2-plasma treatment to prevent organic ILD degradation |
US6436808B1 (en) | 2000-12-07 | 2002-08-20 | Advanced Micro Devices, Inc. | NH3/N2-plasma treatment to prevent organic ILD degradation |
US6444495B1 (en) * | 2001-01-11 | 2002-09-03 | Honeywell International, Inc. | Dielectric films for narrow gap-fill applications |
US6653718B2 (en) | 2001-01-11 | 2003-11-25 | Honeywell International, Inc. | Dielectric films for narrow gap-fill applications |
US6599839B1 (en) | 2001-02-02 | 2003-07-29 | Advanced Micro Devices, Inc. | Plasma etch process for nonhomogenous film |
US6455409B1 (en) | 2001-02-28 | 2002-09-24 | Advanced Micro Devices, Inc. | Damascene processing using a silicon carbide hard mask |
US6713874B1 (en) | 2001-03-27 | 2004-03-30 | Advanced Micro Devices, Inc. | Semiconductor devices with dual nature capping/arc layers on organic-doped silica glass inter-layer dielectrics |
US6518646B1 (en) | 2001-03-29 | 2003-02-11 | Advanced Micro Devices, Inc. | Semiconductor device with variable composition low-k inter-layer dielectric and method of making |
US6576545B1 (en) | 2001-03-29 | 2003-06-10 | Advanced Micro Devices, Inc. | Semiconductor devices with dual nature capping/ARC layers on fluorine doped silica glass inter-layer dielectrics and method of forming capping/ARC layers |
CA2441901A1 (en) * | 2001-04-06 | 2002-10-17 | Paul Apen | Low dielectric constant materials and methods of preparation thereof |
US6872456B2 (en) * | 2001-07-26 | 2005-03-29 | Dow Corning Corporation | Siloxane resins |
US6596404B1 (en) | 2001-07-26 | 2003-07-22 | Dow Corning Corporation | Siloxane resins |
US6596834B2 (en) | 2001-09-12 | 2003-07-22 | Dow Corning Corporation | Silicone resins and porous materials produced therefrom |
US6756085B2 (en) * | 2001-09-14 | 2004-06-29 | Axcelis Technologies, Inc. | Ultraviolet curing processes for advanced low-k materials |
US20030096090A1 (en) * | 2001-10-22 | 2003-05-22 | Boisvert Ronald Paul | Etch-stop resins |
US20040247896A1 (en) * | 2001-12-31 | 2004-12-09 | Paul Apen | Organic compositions |
US7169685B2 (en) | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
US6967172B2 (en) | 2002-07-03 | 2005-11-22 | Honeywell International Inc. | Colloidal silica composite films for premetal dielectric applications |
US7758911B2 (en) * | 2003-05-08 | 2010-07-20 | Honeywell International Inc. | Microelectronic security coatings |
KR100506695B1 (ko) * | 2003-06-02 | 2005-08-08 | 삼성전자주식회사 | 실록산계 수지 및 이를 이용한 반도체 층간 절연막 |
JP4465233B2 (ja) | 2003-06-30 | 2010-05-19 | 三星電子株式会社 | 多官能性環状シロキサン化合物、この化合物から製造されたシロキサン系重合体及びこの重合体を用いた絶縁膜の製造方法 |
KR100507967B1 (ko) * | 2003-07-01 | 2005-08-10 | 삼성전자주식회사 | 실록산계 수지 및 이를 이용한 반도체 층간 절연막 |
KR100504291B1 (ko) * | 2003-07-14 | 2005-07-27 | 삼성전자주식회사 | 게르마늄을 포함하는 실록산계 수지 및 이를 이용한반도체 층간 절연막 형성 방법 |
KR20050024721A (ko) * | 2003-09-01 | 2005-03-11 | 삼성전자주식회사 | 신규 실록산계 수지 및 이를 이용한 반도체 층간 절연막 |
KR100979355B1 (ko) * | 2003-10-09 | 2010-08-31 | 삼성전자주식회사 | 다반응성 환형 실리케이트 화합물, 상기 화합물로부터제조된 실록산계 중합체 및 상기 중합체를 이용한 절연막제조방법 |
US8053159B2 (en) | 2003-11-18 | 2011-11-08 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
US7470634B2 (en) * | 2003-11-24 | 2008-12-30 | Samsung Electronics Co., Ltd. | Method for forming interlayer dielectric film for semiconductor device by using polyhedral molecular silsesquioxane |
KR101007807B1 (ko) * | 2003-12-13 | 2011-01-14 | 삼성전자주식회사 | 다반응성 선형 실록산 화합물, 상기 화합물로부터 제조된실록산 중합체 및 상기 중합체를 이용한 절연막 제조방법 |
WO2005097883A2 (en) * | 2004-03-26 | 2005-10-20 | King Industries, Inc. | Method of producing a crosslinked coating in the manufacture of integrated circuits |
KR20060020830A (ko) * | 2004-09-01 | 2006-03-07 | 삼성코닝 주식회사 | 계면활성제를 템플릿으로 이용한 저유전성 메조포러스박막의 제조방법 |
US7756384B2 (en) * | 2004-11-08 | 2010-07-13 | Dow Corning Corporation | Method for forming anti-reflective coating |
KR20060057778A (ko) * | 2004-11-24 | 2006-05-29 | 삼성코닝 주식회사 | 저유전성 메조포러스 박막의 제조방법 |
KR20060068348A (ko) * | 2004-12-16 | 2006-06-21 | 삼성코닝 주식회사 | 실록산계 중합체 및 상기 중합체를 이용한 절연막 제조방법 |
KR101202955B1 (ko) * | 2004-12-31 | 2012-11-19 | 삼성코닝정밀소재 주식회사 | 다공성 나노 입자를 포함하는 저유전 박막 형성용 조성물및 이를 이용한 저유전 박막의 제조방법 |
KR101119141B1 (ko) * | 2005-01-20 | 2012-03-19 | 삼성코닝정밀소재 주식회사 | 폴리머 나노 입자를 포함하는 저유전 박막 형성용 조성물및 이를 이용한 저유전 박막의 제조방법 |
US20090032901A1 (en) * | 2005-06-15 | 2009-02-05 | Wei Chen | Method of curing hydrogen silsesquioxane and densification in nano-scale trenches |
US7779776B2 (en) * | 2005-07-18 | 2010-08-24 | Tessera, Inc. | Polyceramic-coated tool for applying a flowable composition |
JP5043317B2 (ja) | 2005-08-05 | 2012-10-10 | 東レ・ダウコーニング株式会社 | 環状ジハイドロジェンポリシロキサン、ハイドロジェンポリシロキサン、それらの製造方法、シリカ系ガラス成形体およびその製造方法、光学素子およびその製造方法 |
JP5192687B2 (ja) * | 2006-12-25 | 2013-05-08 | 三菱重工業株式会社 | 熱処理方法 |
US8642246B2 (en) | 2007-02-26 | 2014-02-04 | Honeywell International Inc. | Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof |
US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
KR101224514B1 (ko) | 2010-07-05 | 2013-01-22 | 한국과학기술연구원 | 환형 실세스퀴옥산을 이용한 실록산계 저유전막 및 이의 제조방법 |
US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
WO2013017132A1 (en) * | 2011-07-29 | 2013-02-07 | Inmold Biosystems A/S | Reactive silicon oxide precursor facilitated anti-corrosion treatment |
EP3194502A4 (en) | 2015-04-13 | 2018-05-16 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
US10597495B2 (en) | 2016-02-19 | 2020-03-24 | Dow Silicones Corporation | Aged polymeric silsesquioxanes |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US652939A (en) * | 1900-04-10 | 1900-07-03 | Patent Button Co | Garment-fastener. |
US835029A (en) * | 1906-03-07 | 1906-11-06 | Louis Mayer | Excavating apparatus. |
US926145A (en) * | 1908-01-30 | 1909-06-29 | Edwin M Skinner | Trenching device. |
US926607A (en) * | 1908-07-22 | 1909-06-29 | William E Rickey | Envelop. |
US4330569A (en) * | 1979-05-25 | 1982-05-18 | Ncr Corporation | Method for conditioning nitride surface |
US4340619A (en) * | 1981-01-15 | 1982-07-20 | Dow Corning Corporation | Process for the preparation of poly(disilyl)silazane polymers and the polymers therefrom |
US4404153A (en) * | 1981-01-15 | 1983-09-13 | Dow Corning Corporation | Process for the preparation of poly(disilyl)silazane polymers and the polymers therefrom |
US4312970A (en) * | 1981-02-20 | 1982-01-26 | Dow Corning Corporation | Silazane polymers from {R'3 Si}2 NH and organochlorosilanes |
US4395460A (en) * | 1981-09-21 | 1983-07-26 | Dow Corning Corporation | Preparation of polysilazane polymers and the polymers therefrom |
EP0076656B1 (en) * | 1981-10-03 | 1988-06-01 | Japan Synthetic Rubber Co., Ltd. | Solvent-soluble organopolysilsesquioxanes, processes for producing the same, and compositions and semiconductor devices using the same |
JPS5866335A (ja) * | 1981-10-16 | 1983-04-20 | Fujitsu Ltd | 集積回路 |
US4397828A (en) * | 1981-11-16 | 1983-08-09 | Massachusetts Institute Of Technology | Stable liquid polymeric precursor to silicon nitride and process |
CA1204527A (en) * | 1982-08-13 | 1986-05-13 | Theodore F. Retajczyk, Jr. | Polymeric films for electronic circuits |
JPS6085548A (ja) * | 1983-10-17 | 1985-05-15 | Nec Corp | 集積回路装置 |
US4540803A (en) * | 1983-11-28 | 1985-09-10 | Dow Corning Corporation | Hydrosilazane polymers from [R3 Si]2 NH and HSiCl3 |
US4543344A (en) * | 1983-11-28 | 1985-09-24 | Dow Corning Corporation | Silicon nitride-containing ceramic material prepared by pyrolysis of hydrosilazane polymers from (R3 Si)2 NH and HSiCl3 |
US4482669A (en) * | 1984-01-19 | 1984-11-13 | Massachusetts Institute Of Technology | Preceramic organosilazane polymers |
US4482689A (en) * | 1984-03-12 | 1984-11-13 | Dow Corning Corporation | Process for the preparation of polymetallo(disily)silazane polymers and the polymers therefrom |
US4535007A (en) * | 1984-07-02 | 1985-08-13 | Dow Corning Corporation | Silicon nitride-containing ceramics |
US4826733A (en) * | 1986-12-03 | 1989-05-02 | Dow Corning Corporation | Sin-containing coatings for electronic devices |
US4822697A (en) * | 1986-12-03 | 1989-04-18 | Dow Corning Corporation | Platinum and rhodium catalysis of low temperature formation multilayer ceramics |
-
1986
- 1986-12-03 US US06/937,274 patent/US4756977A/en not_active Expired - Lifetime
-
1987
- 1987-10-19 CA CA000549577A patent/CA1329737C/en not_active Expired - Fee Related
- 1987-11-30 ES ES8703425A patent/ES2005469A6/es not_active Expired
- 1987-12-02 JP JP62303430A patent/JPH0642477B2/ja not_active Expired - Lifetime
- 1987-12-03 KR KR1019870013741A patent/KR950014273B1/ko not_active IP Right Cessation
- 1987-12-03 DE DE3789606T patent/DE3789606T2/de not_active Expired - Fee Related
- 1987-12-03 EP EP87310654A patent/EP0270369B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3789606T2 (de) | 1994-11-24 |
EP0270369A2 (en) | 1988-06-08 |
EP0270369A3 (en) | 1989-12-13 |
JPH0642477B2 (ja) | 1994-06-01 |
EP0270369B1 (en) | 1994-04-13 |
JPS63144525A (ja) | 1988-06-16 |
KR950014273B1 (ko) | 1995-11-24 |
DE3789606D1 (de) | 1994-05-19 |
US4756977A (en) | 1988-07-12 |
KR880008438A (ko) | 1988-08-31 |
CA1329737C (en) | 1994-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2005469A6 (es) | Un metodo para formar sobre un sustrato un reestimiento ceramico o semejante a ceramico, en multicapa. | |
ES2005468A6 (es) | Procedimiento para formar sobre un sustrato un revestimiento de capas multiples del tipo de ceramica o parecido. | |
ES2010233A6 (es) | Revestimientos ceramicos, metodo para su produccion y dispositivos electronicos asi revestidos. . | |
ES2010234A6 (es) | Revestimientos ceramicos, procedimiento para su produccion y dispositivos electronicos asi revestidos. | |
ES2005955A6 (es) | Un procedimiento para formar sobre un dispositivo electronico, un revestimiento de capas multiples del tipo de ceramica o parecido. | |
ES2005496A6 (es) | Un metodo para formar sobre un sustrato un revestimiento ceramico o semejante a ceramico, en multicapa. | |
KR100313382B1 (ko) | 실라잔중합체로부터유도된실리카피막을전자기판에부착시키는방법 | |
CA2055306A1 (en) | Hydrogen silsesquioxane resin fractions and their use as coating materials | |
KR920001620A (ko) | 반도체장치 및 그의 제조방법 | |
US5008320A (en) | Platinum or rhodium catalyzed multilayer ceramic coatings from hydrogen silsesquioxane resin and metal oxides | |
US4898907A (en) | Compositions of platinum and rhodium catalyst in combination with hydrogen silsesquioxane resin | |
KR890011070A (ko) | 세라믹 피복물을 지지체위에 형성하는 방법 | |
KR920021630A (ko) | 하이드로겐 실세스퀴옥산 수지의 증기상 증착 | |
KR950032541A (ko) | 보호 피복물을 전자 기판에 형성시키는 방법 | |
KR890011069A (ko) | 세라믹 피복물을 기재위에 형성시키는 방법 | |
CA1266942C (en) | URETHANE RESINS CONTAINING HYDROLYSABLE FRACTIONS, OBTAINED FROM ORGANOSILANES | |
AU577674B2 (en) | Organopolysilazanes | |
ES2008720A6 (es) | Un procedimiento para la preparacion de un compuesto organosilicico. | |
DE3169725D1 (en) | Process for coating substrates | |
CA1284749C (en) | Si-n containing coatings for electronic devices | |
FR2681334B1 (es) | ||
EP0834914A3 (en) | Electronic coatings | |
US5912047A (en) | Borosilicate electronic coatings | |
KR940005520A (ko) | 다공성 세라믹 전자기판의 밀봉방법 | |
TW353108B (en) | Composite electronic coatings |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
SA6 | Expiration date (snapshot 920101) |
Free format text: 2007-11-30 |