ES2010234A6 - Revestimientos ceramicos, procedimiento para su produccion y dispositivos electronicos asi revestidos. - Google Patents

Revestimientos ceramicos, procedimiento para su produccion y dispositivos electronicos asi revestidos.

Info

Publication number
ES2010234A6
ES2010234A6 ES8703428A ES8703428A ES2010234A6 ES 2010234 A6 ES2010234 A6 ES 2010234A6 ES 8703428 A ES8703428 A ES 8703428A ES 8703428 A ES8703428 A ES 8703428A ES 2010234 A6 ES2010234 A6 ES 2010234A6
Authority
ES
Spain
Prior art keywords
platinum
ceramic coatings
metal oxides
rhodium catalyzed
multilayer ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8703428A
Other languages
English (en)
Inventor
Loren Andrew Haluska
Keith Winton Michael
Leo Tarhay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of ES2010234A6 publication Critical patent/ES2010234A6/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Abstract

REVESTIMIENTOS CERAMICOS, PROCEDIMIENTO PARA SU PRODUCCION Y DISPOSITIVOS ELECTRONICOS ASI REVESTIDOS. ESTA INVENCION SE REFIERE A MATERIALES PRODUCIDOS AL DILUIR EN UN DISOLVENTE UNA MEZCLA PRECERAMICA CATALIZADA POR PLATINO O RODIO DE UNA RESINA DE HIDROGENO SILSESQUIXANO Y UN PRECURSOR DE OXIDO METALICO SELECCIONADO DEL GRUPO FORMADO POR UN ALCOXIDO DE ALUMINIO, UN ALCOXIDO DE TITANIO, Y UN ALCOXIDO DE ZIRCONIO. LA SOLUCION DISOLVENTE DE LA MEZCLA PRECERAMICA SE APLICA A UN SUSTRATO Y CERAMIFICA POR CALENTAMIENTO. SE PUEDEN APLICAR UNO O MAS REVESTIMIENTOS CERAMICOS QUE CONTIENEN SILICIO Y CARBONO, SILICIO Y NITROGEBNO, O SILICIO, CARBONO Y NITROGENO, SOBRE EL REVESTIMIENTO DE OXIDO METALICO/SIO2 CERAMIFICADO. SE PUEDE APLICAR UN REVESTIMIENTO SUPERIOR CVD O PECVD PARA UNA PROTECCION ADICIONAL. LA INVENCION ES PARTICULARMENTE UTIL PARA REVESTIR DISPOSITIVOS ELECTRONICOS.
ES8703428A 1986-12-04 1987-11-30 Revestimientos ceramicos, procedimiento para su produccion y dispositivos electronicos asi revestidos. Expired ES2010234A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/938,678 US4911992A (en) 1986-12-04 1986-12-04 Platinum or rhodium catalyzed multilayer ceramic coatings from hydrogen silsesquioxane resin and metal oxides

Publications (1)

Publication Number Publication Date
ES2010234A6 true ES2010234A6 (es) 1989-11-01

Family

ID=25471788

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8703428A Expired ES2010234A6 (es) 1986-12-04 1987-11-30 Revestimientos ceramicos, procedimiento para su produccion y dispositivos electronicos asi revestidos.

Country Status (7)

Country Link
US (1) US4911992A (es)
EP (1) EP0270231B1 (es)
JP (1) JPH0642475B2 (es)
KR (1) KR950011561B1 (es)
CA (1) CA1284748C (es)
DE (1) DE3784645T2 (es)
ES (1) ES2010234A6 (es)

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US5336532A (en) * 1989-02-21 1994-08-09 Dow Corning Corporation Low temperature process for the formation of ceramic coatings
US5034358A (en) * 1989-05-05 1991-07-23 Kaman Sciences Corporation Ceramic material and method for producing the same
JPH03115586A (ja) * 1989-09-28 1991-05-16 Nkk Corp セラミック膜の形成方法
US4973526A (en) * 1990-02-15 1990-11-27 Dow Corning Corporation Method of forming ceramic coatings and resulting articles
US5116637A (en) * 1990-06-04 1992-05-26 Dow Corning Corporation Amine catalysts for the low temperature conversion of silica precursors to silica
US5059448A (en) * 1990-06-18 1991-10-22 Dow Corning Corporation Rapid thermal process for obtaining silica coatings
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US5380553A (en) * 1990-12-24 1995-01-10 Dow Corning Corporation Reverse direction pyrolysis processing
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US5445894A (en) * 1991-04-22 1995-08-29 Dow Corning Corporation Ceramic coatings
US5231061A (en) * 1991-06-10 1993-07-27 The Dow Chemical Company Process for making coated ceramic reinforcement whiskers
US5300322A (en) * 1992-03-10 1994-04-05 Martin Marietta Energy Systems, Inc. Molybdenum enhanced low-temperature deposition of crystalline silicon nitride
US5310583A (en) * 1992-11-02 1994-05-10 Dow Corning Corporation Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide
US5352485A (en) * 1993-04-08 1994-10-04 Case Western Reserve University Synthesis of metal oxide thin films
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US5567661A (en) * 1993-08-26 1996-10-22 Fujitsu Limited Formation of planarized insulating film by plasma-enhanced CVD of organic silicon compound
US5320868A (en) * 1993-09-13 1994-06-14 Dow Corning Corporation Method of forming SI-O containing coatings
US5512351A (en) * 1993-12-28 1996-04-30 Nikkiso Company Limited Prepreg, process for preparation of prepreg, and products derived therefrom
US5863595A (en) * 1996-10-04 1999-01-26 Dow Corning Corporation Thick ceramic coatings for electronic devices
US6218497B1 (en) 1997-04-21 2001-04-17 Alliedsignal Inc. Organohydridosiloxane resins with low organic content
US6743856B1 (en) 1997-04-21 2004-06-01 Honeywell International Inc. Synthesis of siloxane resins
US6015457A (en) * 1997-04-21 2000-01-18 Alliedsignal Inc. Stable inorganic polymers
US6143855A (en) 1997-04-21 2000-11-07 Alliedsignal Inc. Organohydridosiloxane resins with high organic content
US6051321A (en) 1997-10-24 2000-04-18 Quester Technology, Inc. Low dielectric constant materials and method
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US6177199B1 (en) 1999-01-07 2001-01-23 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with low organic content
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AU3870899A (en) * 1998-05-01 1999-11-23 Seshu B. Desu Oxide/organic polymer multilayer thin films deposited by chemical vapor deposition
KR100804873B1 (ko) * 1999-06-10 2008-02-20 얼라이드시그날 인코퍼레이티드 포토리소그래피용 ｓｏｇ 반사방지 코팅
US6495208B1 (en) 1999-09-09 2002-12-17 Virginia Tech Intellectual Properties, Inc. Near-room temperature CVD synthesis of organic polymer/oxide dielectric nanocomposites
US6472076B1 (en) 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
US6440550B1 (en) 1999-10-18 2002-08-27 Honeywell International Inc. Deposition of fluorosilsesquioxane films
US6368400B1 (en) * 2000-07-17 2002-04-09 Honeywell International Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
KR20030057133A (ko) * 2001-12-28 2003-07-04 삼성전자주식회사 금속 패턴 형성용 유기금속 전구체 및 이를 이용한 금속패턴 형성방법
US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
US8642246B2 (en) * 2007-02-26 2014-02-04 Honeywell International Inc. Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
EP2510148B1 (en) * 2009-12-09 2013-08-14 Teijin Aramid B.V. Use of core-shell particles for anti-wicking application of a yarn or fabric
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US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
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US20130241390A1 (en) * 2012-03-14 2013-09-19 Peter Guschl Metal-containing encapsulant compositions and methods
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JP2018521443A (ja) 2015-02-26 2018-08-02 ダイナミック ソーラー システムズ アクツィエンゲゼルシャフトＤｙｎａｍｉｃ Ｓｏｌａｒ Ｓｙｓｔｅｍｓ Ａｇ 電気技術的薄層の室温製造法および上記方法によって得られる薄層シーケンス
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Also Published As

Publication number Publication date
KR950011561B1 (ko) 1995-10-06
DE3784645D1 (de) 1993-04-15
US4911992A (en) 1990-03-27
CA1284748C (en) 1991-06-11
DE3784645T2 (de) 1993-09-30
EP0270231B1 (en) 1993-03-10
EP0270231A3 (en) 1989-12-13
KR890011065A (ko) 1989-08-12
JPS63152130A (ja) 1988-06-24
EP0270231A2 (en) 1988-06-08
JPH0642475B2 (ja) 1994-06-01

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SA6 Expiration date (snapshot 920101)

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