KR890016627A - 세라믹 피복물을 기판위에 형성하는 방법 - Google Patents

세라믹 피복물을 기판위에 형성하는 방법 Download PDF

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KR890016627A
KR890016627A KR1019890004571A KR890004571A KR890016627A KR 890016627 A KR890016627 A KR 890016627A KR 1019890004571 A KR1019890004571 A KR 1019890004571A KR 890004571 A KR890004571 A KR 890004571A KR 890016627 A KR890016627 A KR 890016627A
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coating
substrate
silicon
vapor deposition
chemical vapor
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KR940008355B1 (ko
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앤드루 할루스카 로렌
윈톤 마이클 케이스
타레이 레오
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노만 에드워드 루이스
다우 코닝 코오포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
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    • C04B41/455—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application the coating or impregnating process including a chemical conversion or reaction
    • C04B41/4554—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application the coating or impregnating process including a chemical conversion or reaction the coating or impregnating material being an organic or organo-metallic precursor of an inorganic material
    • C—CHEMISTRY; METALLURGY
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    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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Abstract

내용 없음

Description

세라믹 피복물을 기판위에 형성하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. (A) 금속 산화물로서 금속 산화물 전구체의 중량비가 약 0.1 내기 약 30%인 알루미늄, 티타늄 및 지르코늄의 아실옥시 및 알콕시 화합물로 이루어진 그룹중에서 선택된 금속 산화물 전구체와 규산염 에스테르의 가수분해되거나 부분적으로 가수분해된 혼합물을 포함하는 조성물의 유동성 용액을 기판에 도포하고, (B) 용액을 건조시켜 전(前)세라믹 피복물을 기판위에 부착시킨 다음, (C) 피복된 기판을 실질적으로 암모니아 대기속에서 기판 위에 세라믹 피복물을 생성시키기에 충분한 온도로 가열하는 단계를 포함함을 특징으로 하여 세라믹 피복물을 기판위에 형성하는 방법.
  2. 제1항에 있어서, 기판이 전자 장치인 방법.
  3. 제2항에 있어서, (D) (i) 실리콘 피복물, (ii) 실리콘-탄소 피복물, (iii) 실리콘-질소 피복물 및 (iv)실리콘-탄소-질소 피복물로 이루어진 그룹중에서 선택된 표면안정화 피복물을 (a) 화학증착, (b) 플라스마 증진된 화학증착 및 (c) 전세라믹 피복물의 도포에 이은 전세라믹 중합체 피복물의 세라믹화로 이루어진 그룹중에서 선택된 수단으로 세라믹 피복물에 도포하는 단계를 추가로 포함하는 방법.
  4. 제3항에 있어서, (E) (i) 실리콘 피복물, (ii) 실리콘-탄소 피복물, (iii) 실리콘-질소 피복물 및 (iv)실리콘-탄소-질소 피복물로 이루어진 그룹중에서 선택된 차단 피복물을 (a) 화학증착 및 (b) 플라스마 증진된 화학증착으로 이루어진 그룹중에서 선택된 수단으로 표면안정화 피복물에 도포하는 단계를 추가로 포함하는 방법.
  5. 제3항에 있어서, 표면안정화 피복물을 금속 보조된 화학증착으로 도포하는 방법.
  6. 제4항에 있어서, 차단 피복물을 금속 보조된 화학증착으로 도포하는 방법.
  7. 제1항의 방법에 의해 피복된 기판.
  8. 제2항의 방법에 의해 피복된 전자장치.
  9. 제3항의 방법에 의해 피복된 전자장치.
  10. 제4항의 방법에 의해 피복된 전자장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004571A 1988-04-07 1989-04-07 기판상에 세라믹 피복물을 형성시키는 방법 KR940008355B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US178,749 1988-04-07
US07/178,749 US4842888A (en) 1988-04-07 1988-04-07 Ceramic coatings from the pyrolysis in ammonia of mixtures of silicate esters and other metal oxide precursors

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KR890016627A true KR890016627A (ko) 1989-11-29
KR940008355B1 KR940008355B1 (ko) 1994-09-12

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US (1) US4842888A (ko)
EP (1) EP0337618B1 (ko)
JP (1) JPH0633204B2 (ko)
KR (1) KR940008355B1 (ko)
CA (1) CA1332680C (ko)
DE (1) DE68902261T2 (ko)

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JPH0633204B2 (ja) 1994-05-02
EP0337618A1 (en) 1989-10-18
CA1332680C (en) 1994-10-25
KR940008355B1 (ko) 1994-09-12
US4842888A (en) 1989-06-27
JPH01290579A (ja) 1989-11-22
DE68902261T2 (de) 1993-01-07
DE68902261D1 (de) 1992-09-03
EP0337618B1 (en) 1992-07-29

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