EP3533848A1 - Film de liaison à chauffage diélectrique et procédé de liaison l'utilisant - Google Patents

Film de liaison à chauffage diélectrique et procédé de liaison l'utilisant Download PDF

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Publication number
EP3533848A1
EP3533848A1 EP17863547.0A EP17863547A EP3533848A1 EP 3533848 A1 EP3533848 A1 EP 3533848A1 EP 17863547 A EP17863547 A EP 17863547A EP 3533848 A1 EP3533848 A1 EP 3533848A1
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EP
European Patent Office
Prior art keywords
dielectric
welding film
component
range
dielectric welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17863547.0A
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German (de)
English (en)
Other versions
EP3533848A4 (fr
Inventor
Masakazu Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
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Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of EP3533848A1 publication Critical patent/EP3533848A1/fr
Publication of EP3533848A4 publication Critical patent/EP3533848A4/fr
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K13/00—Welding by high-frequency current heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/40—Applying molten plastics, e.g. hot melt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/40—Applying molten plastics, e.g. hot melt
    • B29C65/42—Applying molten plastics, e.g. hot melt between pre-assembled parts
    • B29C65/425—Applying molten plastics, e.g. hot melt between pre-assembled parts characterised by the composition of the molten plastics applied between pre-assembled parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C09J123/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/46—Dielectric heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/46—Dielectric heating
    • H05B6/48—Circuits
    • H05B6/50—Circuits for monitoring or control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
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    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
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    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/106—Presence of homo or copolymers of propene in the substrate
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    • C09J2451/00—Presence of graft polymer
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    • C09J2467/00—Presence of polyester

Definitions

  • the present invention relates to a dielectric welding film, and a welding method using the dielectric welding film.
  • the present invention relates to a dielectric welding film, which is usable for adherends of different types and is capable of providing a large adhesivity through a relatively short period of dielectric heating (sometimes referred to as high-frequency dielectric heating hereinafter), and a welding method using the dielectric welding film.
  • an adhesive blended with carbon black (CB), silicon carbide (SiC), or the like is interposed between a plurality of adherends and dielectric heating at a frequency of 28 or 40 MHz or microwave heating is applied to weld the plurality of adherends (see Patent Literatures 1 and 2).
  • polyolefin resin is blended with a ferroelectric material and a carbon compound, a conductive material or the like to prepare an adhesive with a dissipation factor (tan ⁇ ) of 0.03 or more, and the adhesive is interposed between a plurality of adherends to adhere the adherends through dielectric heating at a frequency of 40 MHz (see Patent Literatures 3 and 4).
  • an adhesive composition for dielectric heating is produced by adding a dielectric heating medium to an adhesive compatible with a plurality of adherends (base materials) to be bonded.
  • the adhesion layer composition for dielectric heating satisfies a formula: C ⁇ ⁇ (tan ⁇ ) / ⁇ ' ⁇ 1/2 ⁇ d, where ⁇ ' represents specific permittivity, tan ⁇ represents a dissipation factor, d (mm) represents a total thickness of the base materials to be bonded, and the coefficient C is in a range from 78 to 85 (see Patent Literature 5).
  • a modified polyolefin resin composition for heat welding and a sheet thereof are disclosed that are designed to provide excellent weldability to a hard-to-bond base material (see Patent Literature 6).
  • the modified polyolefin resin composition is provided by grafting (b) an epoxy-group containing vinyl monomer, (c) an aromatic vinyl monomer and (d) (meth)acrylate polymer to (a) a polyolefin resin.
  • the modified polyolefin resin composition exhibits heat of fusion ranging from 1 to 100 J/g and melting point ranging from 80 to 190 degrees C.
  • the dielectric heating disclosed in Patent Literatures 3 and 4 is also likely to cause electric breakdown during the dielectric heating process due to the considerable amount of the conductive material (e.g. metal and carbide compound) added in the adhesive resin composition.
  • the conductive material e.g. metal and carbide compound
  • the adhesiveness of the adhesion layer composition for dielectric heating disclosed in Patent Literature 5 is affected by a total thickness of base materials to be adhered, so that the type of usable adherend is likely to be excessively limited.
  • Patent Literatures 1 to 5 discloses or suggests the adhesion layer composition for dielectric heating that is controlled in terms of high-frequency weldability, tensile shear force and high-temperature creep resistance of the dielectric adhesive (welding) agent by controlling a value of heat of fusion (fusion enthalpy) of the adhesive component in the dielectric heating adhesion layer composition .
  • modified polyolefin resin composition and the like disclosed in Patent Literature 6 has heat of fusion and melting point defined within a predetermined range, it is not disclosed or suggested that a dielectric filler is contained, so that the disclosed composition is not applicable for a dielectric welding film.
  • the main component of the disclosed modified polyolefin resin composition and the like is a grafted polyolefin resin, which is extremely expensive and thus is economically disadvantageous.
  • the inventors have found that excellent adhesiveness can be obtained through dielectric heating for, for instance, less than 40 seconds and dielectric fillers with a relatively wide variety of particle sizes are made applicable by controlling the heat of fusion of the thermoplastic resin used for the dielectric welding film.
  • the invention has been made based on the above findings.
  • An object of the invention is to provide a dielectric welding film applicable to a variety of adherends, capable of providing excellent adhesiveness by a short period of dielectric heating, and capable of using dielectric fillers with a relatively wide variety of mean particle sizes, and provide a welding method using the dielectric welding film.
  • a dielectric welding film according to an aspect of the invention is configured to weld a pair of adherends of the same material or different materials though dielectric heating, the dielectric welding film including: a thermoplastic resin as an A component and a dielectric filler as a B component.
  • the dielectric welding film satisfies conditions (i) and (ii) below:
  • the dielectric welding film having the predetermined melting point or the like and the heat of fusion is applicable to a variety of adherends and capable of providing excellent adhesiveness through a short period of dielectric heating.
  • the dielectric welding film having the predetermined melting point or softening point can achieve a good balance between heat resistance (including high-temperature creep resistance) in a use environment or the like and weldability during the dielectric heating.
  • a dielectric property (tan ⁇ / ⁇ ') defined by dividing a dissipation factor tan ⁇ by a permittivity ⁇ ' at 23 degrees C and 40 MHz frequency is 0.005 or more.
  • the dielectric welding film whose dielectric property is controlled as in the above, can reliably ensure excellent weldability during the dielectric heating and, consequently, provide strong adhesivity between the pair of adherends.
  • a content of the B component is in a range from 5 to 800 parts by mass with respect to 100 parts by mass of the A component.
  • the handleability of the dielectric welding film is improvable and excellent adhesiveness can be reliably obtained through a short period of dielectric heating.
  • the A component is at least one thermoplastic resin selected from the group consisting of a polyolefin resin, an olefin thermoplastic elastomer, a styrene thermoplastic elastomer, a polyamide resin, a polyvinyl acetate resin, a polyacetal resin, and a polyester resin.
  • thermoplastic resin uniformly and rapidly melts through a short period of dielectric heating, so that excellent adhesiveness can be reliably obtained even when the adherend is made of hard-to-bond polypropylene resin, polyester resin or the like.
  • the (B) component is zinc oxide.
  • the B component in a form of zinc oxide can exhibit predetermined exothermic effect during the dielectric heating even being blended in the adhesive component (the A component) at a relatively small amount.
  • zinc oxide can be uniformly dispersed in the adhesive component (the A component), providing a favorable balance between the transparency of the dielectric welding film and the weldability during the dielectric heating.
  • a mean particle size of the B component measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 ⁇ m.
  • the B component whose mean particle size is regulated within the predetermined range, is more polarized because of an increase in the polarizable distance inside the filler, so that the inversion motion caused when a high-frequency wave is applied can be intensified, thereby improving the dielectric heating performance.
  • a welding method uses a dielectric welding film configured to weld a pair of adherends of the same material or different materials though dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying conditions (i) and (ii):
  • the welding method according to the above aspect of the invention using the dielectric welding film is applicable to a variety of adherends and provides excellent adhesiveness through a short period of dielectric heating.
  • the dielectric welding film satisfies, in addition to the conditions (i) and (ii), a condition (iii): a dielectric property (tan ⁇ / ⁇ ') defined by dividing a dissipation factor tan ⁇ by a permittivity ⁇ ' at 23 degrees C and 40 MHz frequency is 0.005 or more.
  • the welding method using the above dielectric welding film is applicable to a variety of adherends and provides excellent adhesiveness, high-temperature creep resistance and the like through a short period of dielectric heating.
  • a dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including: a thermoplastic resin as an A component and a dielectric filler as a B component, the dielectric welding film satisfying conditions (i) and (ii) below:
  • the thermoplastic resin as the A component is, for instance, preferably at least one of a polyolefin resin, an olefin thermoplastic elastomer, a styrene thermoplastic elastomer, a polyamide resin, a polyvinyl acetate resin, a polyacetal resin, a polycarbonate resin, a polyacryl resin, a polyamide resin, a polyimide resin, a polyvinyl acetate resin, a phenoxy resin and a polyester resin, which are easily melted and exhibit a predetermined heat resistance.
  • examples of the polyolefin resin include one of or a combination of resins selected from a homopolymer resin such as polyethylene, polypropylene, polybutene and polymethylpentene, and ⁇ -olefin resin of a copolymer of ethylene, propylene, butene, hexene, octene, and 4-methylpentene.
  • polypropylene resin is especially preferable in view of easy adjustability in melting point or softening point, low cost and excellent mechanical strength and transparency thereof.
  • permittivity ( ⁇ /1MHz) of the polypropylene resin used in the invention is preferably in a range from 2.2 to 2.6
  • dielectric power factor (tan ⁇ /1MHz) of the polypropylene resin is preferably in a range from 0.0005 to 0.0018
  • loss factor of the polypropylene resin is preferably approximately 0.0047.
  • permittivity ( ⁇ /1MHz) of the crystalline polyester resin is preferably in a range from 2.8 to 4.1
  • dielectric power factor (tan ⁇ /1MHz) of the crystalline polyester resin is preferably in a range from 0.005 to 0.026
  • loss factor of the crystalline polyester resin is preferably in a range from 0.0168 and 0.11.
  • the melting point or softening point of the A component is preferably in a range from 80 to 200 degrees C.
  • the A component as a crystalline resin whose melting point (i.e. a temperature at which a crystalline portion is melted) measured by a differential scanning calorimeter (DSC) or the like is defined within a predetermined range, can achieve a good balance between heat resistance in a use environment and the like and weldability during the dielectric heating.
  • DSC differential scanning calorimeter
  • the melting point may be determined using a differential scanning calorimeter by: raising a temperature of 10 mg measurement sample (first thermoplastic resin) to 250 degrees C; cooling the measurement sample to 25 degrees C at a temperature-decrease rate of 10 degrees C/min to crystallize the measurement sample; again heating the measurement sample at a temperature-increase rate of 10 degrees C/min to re-melt the sample; and measuring a peak temperature of a melting peak observed on a DSC chart (fusion curve) when the sample is re-melted.
  • a differential scanning calorimeter by: raising a temperature of 10 mg measurement sample (first thermoplastic resin) to 250 degrees C; cooling the measurement sample to 25 degrees C at a temperature-decrease rate of 10 degrees C/min to crystallize the measurement sample; again heating the measurement sample at a temperature-increase rate of 10 degrees C/min to re-melt the sample; and measuring a peak temperature of a melting peak observed on a DSC chart (fusion curve) when the sample is re-melted.
  • the A component as an amorphous resin whose softening point (glass transition point) (i.e. a temperature at which an amorphous portion is melted) measured in accordance with a ring-and-ball method or the like is defined within a predetermined range, can also achieve a good balance between heat resistance and weldability during the dielectric heating.
  • the softening point of the A component can be measured in accordance with JIS K 6863 (1994).
  • the heat resistance may become so insufficient that the applicable range may be excessively limited and/or mechanical strength may be significantly reduced.
  • the melting point or softening point of the first thermoplastic resin of the A component is thus more preferably in a range from 100 to 190 degrees C, further preferably from 130 to 180 degrees C.
  • melting point or softening point of the dielectric welding film are preferably in the same range as that of the A component, the above melting point or the softening point is specific to the A component.
  • An average molecular weight (weight average molecular weight) of the A component is usually preferably in a range from 5000 to 300000.
  • the weight average molecular weight of the A component exceeds 300000, the weldability and the like in the dielectric heating may be significantly reduced.
  • the weight average molecular weight of the A component is thus more preferably in a range from 10000 to 200000, further preferably from 30000 to 100000.
  • the weight average molecular weight of the A component can be measured through, for instance, intrinsic viscosity method or gel permeation chromatography (GPC) in accordance with JIS K 7367-3 (1999).
  • the melt flow rate (MFR) of the A component is usually preferably in a range from 1 to 300 g/10min at 230 degrees C under 2.16 kg load, though depending on the weight average molecular weight.
  • the heat resistance at the adhered portion is relatively improved.
  • the adhesion time through the dielectric heating can be reduced and stable adhesiveness can be obtained.
  • the MFR is thus more preferably in a range from 1 to 100 g/10min, further preferably from 1 to 50 g/10min.
  • MFR can be measured in accordance with JIS K 7210-1 (2014) at 230 degrees C under 2.16 kg load.
  • the type of the dielectric filler is not limited as long as the dielectric filler is a high-frequency wave absorbing filler having a high dielectric loss factor enough to generate heat when a high-frequency wave of, for instance, 28 MHz or 40 MHz frequency is applied.
  • the dielectric filler preferably is a single one of or a combination of two or more of compounds selected from zinc oxide, silicon carbide (SiC), anatase-type titanium oxide, barium titanate, barium zirconate titanate, lead titanate, potassium niobate, rutile-type titanium oxide, hydrated aluminum silicate, inorganic substance having crystallization water such as hydrated aluminosilicate salt of alkali metal or alkaline earth metal, and the like.
  • SiC silicon carbide
  • anatase-type titanium oxide barium titanate, barium zirconate titanate, lead titanate, potassium niobate
  • rutile-type titanium oxide hydrated aluminum silicate
  • inorganic substance having crystallization water such as hydrated aluminosilicate salt of alkali metal or alkaline earth metal, and the like.
  • zinc oxide and silicon carbide which include various types, provide a wide selection of shapes and sizes, allow modification of welding and mechanical properties of the dielectric welding film depending on the intended use, and are capable of generating a lot of heat in a relatively small amount, are especially preferable as the dielectric filler.
  • the content of the B component is preferably in a range from 5 to 800 parts by mass with respect to 100 parts by mass of the A component.
  • the content of the B component is thus preferably in a range from 30 to 600 parts by mass with respect to 100 parts by mass of the A component, more preferably in a range from 50 to 300 parts by mass.
  • a mean particle size (median diameter: D50) of the B component measured in accordance with JIS Z 8819-2 (2001) is preferably in a range from 0.1 to 30 ⁇ m.
  • the filler is more polarized because of the increase in the polarizable distance inside the filler, so that the inversion motion caused when a high-frequency wave is applied is intensified, thereby improving the dielectric heating performance.
  • the mean particle size exceeds 30 ⁇ m, the distance between neighboring dielectric fillers becomes short and the inversion motion caused when a high-frequency wave is applied is attenuated due to electric charge of the neighboring dielectric fillers, so that the dielectric heating performance may be excessively reduced and the adherends may be less tightly welded.
  • the mean particle size of the B component is thus more preferably in a range from 1 to 30 ⁇ m, further preferably from 2 to 25 ⁇ m, most preferably from 3 to 20 ⁇ m.
  • the dielectric welding film is preferably added with at least one of additives such as tackifier, plasticizer, wax, coloring agent, antioxidant, ultraviolet absorber, antibacterial agent, coupling agent, viscosity modifier, and organic or inorganic filler other than the dielectric filler.
  • additives such as tackifier, plasticizer, wax, coloring agent, antioxidant, ultraviolet absorber, antibacterial agent, coupling agent, viscosity modifier, and organic or inorganic filler other than the dielectric filler.
  • the tackifier and the plasticizer can improve melting and welding properties of the dielectric welding film.
  • the tackifier include rosin derivative, polyterpene resin, aromatic modified terpene resin and hydrogenated products thereof, terpene phenol resin, coumarone ⁇ indene resin, aliphatic petroleum resin, and aromatic petroleum resin and hydrogenated products thereof.
  • plasticizer examples include petroleum process oil such as paraffin process oil, naphthene process oil and aromatic process oil, natural oil such as castor oil and tall oil, and low-molecular-weight liquid polymer such as diacid dialkyl (e.g. dibutyl phthalate, dioctyl phthalate, and dibutyl adipate), liquid polybutene and liquid polyisoprene.
  • petroleum process oil such as paraffin process oil, naphthene process oil and aromatic process oil
  • natural oil such as castor oil and tall oil
  • low-molecular-weight liquid polymer such as diacid dialkyl (e.g. dibutyl phthalate, dioctyl phthalate, and dibutyl adipate), liquid polybutene and liquid polyisoprene.
  • the content of the additive is typically preferably in a range from 0.1 to 20 mass% of a total amount of the dielectric welding film, more preferably in a range from 1 to 10 mass%, further preferably in a range from 2 to 5 mass%, though depending on the type and purpose of the additive.
  • the thickness of the dielectric welding film is typically preferably in a range from 10 to 2000 ⁇ m.
  • the thickness of the dielectric welding film exceeds 2000 ⁇ m, it is sometimes difficult to wind the dielectric welding film into a roll and to apply the dielectric welding film to a roll-to-roll process.
  • the thickness of the dielectric welding film is typically more preferably in a range from 100 to 1000 ⁇ m, further preferably in a range from 200 to 600 ⁇ m, though depending on the usage of the dielectric welding film and the like.
  • the dissipation factor (tan ⁇ ) and permittivity ( ⁇ ') as the dielectric property of the dielectric welding film which may be measured in accordance with JIS C 2138:2007, can be easily and accurately measured in accordance with impedance material method.
  • the dielectric property (tan ⁇ / ⁇ '), which is obtained by dividing dissipation factor (tan ⁇ ) measured with an impedance material analyzer or the like by permittivity ( ⁇ ') measured in the same manner, is preferably 0.005 or more.
  • the dielectric welding film does not generate heat as desired through the dielectric heating irrespective of the type of the A component and the like, sometimes making it difficult to tightly adhere the adherends.
  • the dielectric property of the dielectric welding film is more preferably in a range from 0.008 to 0.05, further preferably in a range from 0.01 to 0.03.
  • Total light transmissivity of the dielectric welding film is preferably 1% or more.
  • the upper limit of the total light transmissivity of the dielectric welding film is not specifically limited, excessively large total light transmissivity may excessively restrict the types of the usable A component or B component.
  • the total light transmissivity of the dielectric welding film is more preferably in a range from 5 to 99%, further preferably in a range from 10 to 95%.
  • the total light transmissivity has been found to be usually approximately 50% when a suitable polyolefin resin (the A component) and suitable dielectric filler (the B component) are blended at a suitable ratio (approximately 100 parts by weight:156 parts by weight).
  • the melting point or softening point of the dielectric welding film is in a range from 80 to 200 degrees C.
  • the melting point or softening point of the dielectric welding film can be measured with a differential scanning calorimeter (DSC) or the like in the same manner as that of the A component.
  • DSC differential scanning calorimeter
  • the melting point or the softening point of the dielectric welding film exceeds 200 degrees C, welding through the dielectric heating may take an excessively long time and/or the adhesion strength may rather be excessively decreased.
  • the melting point or softening point of the dielectric welding film is thus more preferably in a range from 100 to 190 degrees C, further preferably from 130 to 180 degrees C.
  • the heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.
  • the dielectric welding film having the above heat of fusion can achieve an favorable balance between heat resistance in a use environment or the like and weldability during the dielectric heating.
  • the heat of fusion is less than 1 J/g
  • the high-frequency weldability, the adhesivity (tensile shear force), and the high-temperature creep resistance may be significantly reduced due to insufficient heat resistance.
  • the heat of fusion is thus more preferably in a range from 5 to 70 J/g, further preferably from 10 to 60 J/g.
  • the heat of fusion of the dielectric welding film can be calculated based on a sum of the plurality of melting peaks.
  • viscoelastic property (dynamic elastic modulus) of the dielectric welding film it is preferable that storage modulus (E') measured at 10 Hz frequency is in a range from 1 ⁇ 10 6 to 1 ⁇ 10 10 Pa both at a room temperature and at 80 degrees C.
  • the dielectric welding film may become brittle to make it difficult to unroll the dielectric welding film or adhere the dielectric welding film on an adherend while applying a high tension.
  • a welding method uses a dielectric welding film for welding a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as the A component and a dielectric filler as the B component and satisfying the conditions (i) and (ii) below:
  • the welding method of the dielectric welding film according to the second exemplary embodiment will be described below mainly on features different from those in the first exemplary embodiment.
  • the dielectric welding film is disposed at a predetermined position, where the dielectric welding film is held between the plurality of adherends of the same material or different materials.
  • the dielectric welding film in order to locate the dielectric welding film at a correct position without position gap, to provide a sticky portion all over or on a part of one side or both sides of the dielectric welding film, and/or to provide a temporary fixing hole or projection on a part of the dielectric welding film.
  • the material of the adherend used in the second exemplary embodiment is not specifically limited but may be any one of an organic material, an inorganic material or metal material or a composite of the organic, inorganic and metal materials.
  • the organic material include a plastic material such as polypropylene resin, polyethylene resin, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), polycarbonate resin, polyamide resin (e.g.
  • Nylon 6, Nylon 66 polybutylene terephthalate resin (PBT resin), polyacetal resin (POM resin), polymethyl methacrylate resin and polystyrene resin, and a rubber material such as styrene-butadiene rubber (SBR), ethylene propylene rubber (EPR) and silicone rubber.
  • PBT resin polybutylene terephthalate resin
  • POM resin polyacetal resin
  • SBR styrene-butadiene rubber
  • EPR ethylene propylene rubber
  • silicone rubber such as styrene-butadiene rubber (SBR), ethylene propylene rubber (EPR) and silicone rubber.
  • examples of the organic material include glass.
  • a fiber-reinforced resin which is a composite of glass fiber and the above plastic material, is also preferable as the material of the adherend.
  • dielectric heating is applied on the dielectric welding film held between the plurality of adherends with a dielectric heater, for instance, at a high-frequency output ranging from 0.1 to 20 kW and a high-frequency wave application time of 1 second or more and less than 40 seconds as shown in Fig 1 .
  • the dielectric welding machine used in the step (2) and dielectric heating conditions thereof will be described below.
  • a dielectric welding machine 10 performs dielectric heating through a dielectric welding film 13 held between a first adherend 12 and a second adherend 14 and applies pressure by a first high-frequency electrode 16 and a second high-frequency electrode 18 to adhere the first adherend 12 and the second adherend 14.
  • the dielectric welding machine 10 includes a high-frequency power source 20 configured to apply a high-frequency wave of approximately 28 MHz or 40 MHz frequency to each of the oppositely disposed first high-frequency electrode 16 and second high-frequency electrode 18.
  • the dielectric welding film (more specifically, dielectric heating medium uniformly dispersed in the dielectric welding film) at a part at which the first adherend and the second adherend are overlapped.
  • the dielectric heating medium serves as a heat source, the heat generated by the dielectric heating medium melting the olefin resin (i.e. the main component of the dielectric welding film) and thereby welding the first adherend and the second adherend.
  • first high-frequency electrode 16 and the second high-frequency electrode 18 serving also as a press machine as shown in Fig. 5.
  • the melting of the dielectric welding film 13 in combination with the compression force applied by the electrodes 16 and 18 achieves tight adhesion of the first adherend 12 and the second adherend 14.
  • the high-frequency output is usually preferably in a range from 0.1 to 20 kW, more preferably in a range from 0.2 to 10 kW, further preferably in a range from 0.2 to 5 kW.
  • the application time of the high-frequency wave is preferably 1 second or more and less than 40 seconds, more preferably in a range from 5 to 30 seconds, further preferably in a range from 10 to 20 seconds.
  • the frequency of the high-frequency wave is preferably in a range from 1 to 100 MHz, more preferably in a range from 5 to 80 MHz, further preferably in a range from 10 to 50 MHz.
  • 13.56 MHz, 27.12 MHz, and 40.68 MHz of ISM band allocated by the International Telecommunication Union are used in the dielectric welding method according to the second exemplary embodiment.
  • a component 100 parts by mass of a random polypropylene resin as the A component (Prime Polypro F-744NP manufactured by Prime Polymer Co., Ltd., melting point: 130 degrees C, referred to as A1-1 in Table 1) and 156 parts by mass of zinc oxide (LPZINC11 manufactured by Sakai Chemical Industry Co., Ltd., mean particle size: 11 ⁇ m, referred to as B1 in Table 1) were weighed and each put into a vessel.
  • the A component and B component were preliminarily blended and then were fed into a hopper of a biaxial extruder of 30mm diameter, where the components were melted and kneaded at a cylinder set temperature in a range from 180 to 200 degrees C and a die temperature of 200 degrees C to obtain granular pellets.
  • the obtained granular pellets were put into a hopper of a uniaxial extruder provided with a T-die, and a 400- ⁇ m thick film-shaped molten kneaded product was extruded from the T-die at a cylinder temperature of 200 degrees C and a die temperature of 200 degrees C, and cooled to a room temperature to obtain the dielectric welding film of Example 1.
  • a surface of the dielectric welding film and a cross section of the dielectric welding film are shown in photographs (150x magnification) in Figs. 2(a) and (b) , respectively.
  • Thicknesses of the dielectric welding film cut into a predetermined size were measured at 10 spots with a micrometer and an average of the thicknesses was calculated to obtain an average thickness (sometimes simply referred to as “thickness” hereinafter) of the dielectric welding film.
  • a DSC chart (fusion curve) of the dielectric welding film was obtained using a differential scanning calorimeter (DSC) (Q2000 manufactured by TA Instruments), and the heat of fusion of the A1 component was calculated based on a predetermined area corresponding to the melting peak of the DSC chart.
  • DSC differential scanning calorimeter
  • the melting point was determined by: raising a temperature of 10-mg measurement sample (dielectric welding film) to 250 degrees C; cooling the measurement sample to 25 degrees C at a temperature-decrease rate of 10 degrees C/min to crystallize the measurement sample; again heating the measurement sample at a temperature-increase rate of 10 degrees C/min to re-melt the sample; and measuring a peak temperature of a melting peak observed on a DSC chart (fusion curve) when the sample was re-melted.
  • the permittivity ( ⁇ ') and dissipation factor (tan ⁇ ) of the dielectric welding film cut into a predetermined size were measured at 23 degrees C and 40 MHz frequency to calculate the value of the dielectric property (tan ⁇ / ⁇ ').
  • the total light transmissivity of the dielectric welding film cut into a predetermined size was measured in accordance with JIS K 7361-1 (1997) with a haze meter NDH5000 manufactured by NIPPON DENSHOKU INDUSTRIES CO., LTD. under Illuminant D65.
  • a dielectric welding film (welding film) cut into a predetermined size was held at a predetermined position between two glass-reinforced polypropylene plates (25 cm ⁇ 10 cm ⁇ 1.5 mm) as adherends.
  • a high-frequency dielectric heater (YRP-400T-A manufactured by YAMAMOTO VINITA CO., LTD)
  • a high-frequency wave of 40 MHz frequency and 200 W output was applied for a predetermined time to prepare a test piece (i.e. adherends welded through the welding film).
  • test piece After a 100-gram weight was attached to an end of the test piece obtained in the above evaluation of "(6) High-Frequency Weldability," the test piece was placed in an oven at 80 degrees C with the weight being suspended therefrom, and was left still for 24 hours.
  • test piece after taken out of the oven and returned to a room temperature, was evaluated in terms of the high-temperature creep in accordance with the criteria below.
  • Example 2 the dielectric welding film was prepared and evaluated in the same manner as that of Example 1 except that the A component was changed to an olefin thermoplastic elastomer (ESPOLEX TPE-4675 manufactured by Sumitomo Chemical Co., Ltd., melting point: 160 degrees C, referred to as A-2 in Table 1).
  • A-2 olefin thermoplastic elastomer
  • Example 3 the dielectric welding film was prepared and evaluated in the same manner as that of Example 1 except that the A component was changed to a styrene thermoplastic elastomer (ESPOLEX SB-2400 manufactured by Sumitomo Chemical Co., Ltd., melting point: 162 degrees C, referred to as A-3 in Table 1).
  • a component a styrene thermoplastic elastomer manufactured by Sumitomo Chemical Co., Ltd., melting point: 162 degrees C, referred to as A-3 in Table 1).
  • Example 4 the dielectric welding film was prepared and evaluated in the same manner as that of Example 1 except that the A component was changed to a combination of 70 parts by mass of A-1 used in Example 1 and 30 parts by mass of a maleic anhydride modified polypropylene (UMEX 1001, manufactured by Sanyo Chemical Industries, Ltd., melting point: 142 degrees C, referred to as A-4 in Table 1).
  • UAEX 1001 manufactured by Sanyo Chemical Industries, Ltd., melting point: 142 degrees C
  • Example 5 the dielectric welding film was prepared and evaluated in the same manner as that of Example 1 except that the A component was changed to an ethylene-(meth)acrylate copolymer (Nucrel 410 manufactured by DUPONT-MITSUI POLYCHEMICALS CO.,LTD., melting point: 98 degrees C, referred to as A-5 in Table 1).
  • the dielectric welding film of Example 6 was prepared and evaluated in the same manner as that of Example 1 except that the B component was changed to 156 parts by mass of zinc oxide (LPZINC2 manufactured by Sakai Chemical Industry Co., Ltd., mean particle size: 2 ⁇ m, specific weight: 5.6, referred to as B-2 in Table 1).
  • B component 156 parts by mass of zinc oxide (LPZINC2 manufactured by Sakai Chemical Industry Co., Ltd., mean particle size: 2 ⁇ m, specific weight: 5.6, referred to as B-2 in Table 1).
  • the dielectric welding film of Example 7 was prepared and evaluated in the same manner as that of Example 1 except that the B component was changed to 156 parts by mass of silicon carbide (GMF15 manufactured by Pacific Rundum Co., Ltd., mean particle size: 0.5 ⁇ m, specific weight: 5.6, referred to as B-3 in Table 1).
  • the dielectric welding film of Example 8 was prepared and evaluated in the same manner as that of Example 1 except that 100 parts by mass of a crystalline polyester resin (Vylon GM-915 manufactured by TOYOBO CO., LTD., melting point: 139 degrees C, weight average molecular weight: 45000, referred to as A-6 in Table 1) was used as the A component and the adherends were changed to a combination of a glass-fiber-reinforced polypropylene plate and an ABS plate (both 15 cm ⁇ 10 cm ⁇ 1.5 mm).
  • a crystalline polyester resin Vylon GM-915 manufactured by TOYOBO CO., LTD., melting point: 139 degrees C, weight average molecular weight: 45000, referred to as A-6 in Table 1
  • A-6 weight average molecular weight
  • the dielectric welding film of Example 9 was prepared and evaluated in the same manner as that of Example 1 except that 100 parts by mass of a crystalline polyester resin (Vylon GM-920 manufactured by TOYOBO CO., LTD., melting point: 107 degrees C, weight average molecular weight: 30000, referred to as A-7 in Table 1) was used as the A component, 156 parts by mass of zinc oxide (manufactured by Wako Pure Chemical Industries Ltd., mean particle size 0.4 ⁇ m, specific weight: 5.6, referred to as B-4 in Table 1) was used as the B component, and the adherends were changed to a combination of a glass-fiber-reinforced polypropylene plate and an ABS plate (both 15 cm ⁇ 10 cm ⁇ 1.5 mm).
  • a crystalline polyester resin Vylon GM-920 manufactured by TOYOBO CO., LTD., melting point: 107 degrees C, weight average molecular weight: 30000, referred to as A-7 in Table 1
  • 156 parts by mass of zinc oxide manufactured by Wak
  • Example 10 a dielectric welding film was prepared and evaluated in the same manner as that of Example 1 except that the content of the B-1 used in Example 1 was changed to 267 parts by mass.
  • Example 11 a dielectric welding film was prepared and evaluated in the same manner as that of Example 1 except that the content of the B-1 used in Example 1 was changed to 67 parts by mass.
  • the dielectric welding film was prepared and evaluated in the same manner as that of Example 1 except that the A component was changed to 100 parts by mass of homopolypropylene (NOVATEC PPMH4 manufactured by Japan Polypropylene Corporation, melting point: 165 degrees C, MFR: 5 g/10min, referred to as A-8 in Table 1), and the B component was changed to 156 parts by mass of zinc oxide B4 used in Example 9.
  • a component was changed to 100 parts by mass of homopolypropylene (NOVATEC PPMH4 manufactured by Japan Polypropylene Corporation, melting point: 165 degrees C, MFR: 5 g/10min, referred to as A-8 in Table 1
  • the B component was changed to 156 parts by mass of zinc oxide B4 used in Example 9.
  • the dielectric welding film of Comparative 2 was prepared and evaluated in the same manner as that of Example 1 except that 100 parts by mass of random polypropylene (A1) was solely used and no B component was blended.
  • the dielectric welding film was prepared and evaluated in the same manner as that of Example 1 except that the A component was changed to 100 parts by mass of an ethylene- ⁇ -olefin copolymer (EXCELLEN FX352 manufactured by SUMITOMO CHEMICAL Co., Ltd., melting point: 70 degrees C, MFR: 4 g/10min, referred to as A1-9 in Table 1), and the B component was changed to 156 parts by mass of zinc oxide B4 used in Example 9.
  • a component was changed to 100 parts by mass of an ethylene- ⁇ -olefin copolymer (EXCELLEN FX352 manufactured by SUMITOMO CHEMICAL Co., Ltd., melting point: 70 degrees C, MFR: 4 g/10min, referred to as A1-9 in Table 1)
  • the B component was changed to 156 parts by mass of zinc oxide B4 used in Example 9.
  • the dielectric welding film or the like of the invention which has a predetermined melting point or softening point and heat of fusion regulated within a predetermined range, is capable of providing tight adhesivity to a variety of adherends through a short period of dielectric heating.
  • a predetermined transparency (total light transmissivity) of the dielectric welding film of the invention can also be ensured. Accordingly, the dielectric welding film can be placed onto a desired portion on an adherend without using any positioning member.
  • a predetermined position can be locally heated by a dielectric heater from an outside.
  • the welding method is very effective in adhering adherends of a large-sized and complicated three-dimensional structure or a thick complicated three-dimensional structure with high dimensional accuracy.
  • the dielectric welding film or the like of the invention allows appropriate control of the thickness and storage modulus of the welding film and the like, and thus is applicable to a roll-to-roll process.
  • the dielectric welding film or the like can be designed into any size and shape by punching or the like depending on the adhesion area and shape between the plurality of adherends, providing great advantage in the production process.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
EP17863547.0A 2016-10-27 2017-10-18 Film de liaison à chauffage diélectrique et procédé de liaison l'utilisant Pending EP3533848A4 (fr)

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JP2020163786A (ja) * 2019-03-29 2020-10-08 リンテック株式会社 高周波誘電加熱接着シート、布帛接合体及び接合方法
US20230111471A1 (en) * 2020-03-31 2023-04-13 Lintec Corporation Adhesive for high-frequency dielectric heating, structure, and manufacturing method of structure
EP4174146A4 (fr) * 2020-06-30 2024-07-10 Lintec Corp Feuille adhésive chauffante diélectrique à haute fréquence
JPWO2022004606A1 (fr) * 2020-06-30 2022-01-06
CN111909628A (zh) * 2020-08-05 2020-11-10 苏州中来光伏新材股份有限公司 一种增强型光伏封装胶膜及其制备方法
JPWO2022045156A1 (fr) * 2020-08-31 2022-03-03
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CN109923184B (zh) 2021-07-20
US20190283334A1 (en) 2019-09-19
JP6499808B2 (ja) 2019-04-10
JP6648299B2 (ja) 2020-02-14
EP3533847A4 (fr) 2020-07-01
EP3533847B1 (fr) 2023-09-27
JPWO2018079356A1 (ja) 2019-09-12
EP3533848A4 (fr) 2020-09-30
JPWO2018079354A1 (ja) 2018-11-01
WO2018079355A1 (fr) 2018-05-03
JP6632748B2 (ja) 2020-01-22
US11007722B2 (en) 2021-05-18
WO2018079354A1 (fr) 2018-05-03
KR20190075935A (ko) 2019-07-01
WO2018079356A1 (fr) 2018-05-03
CN109890923A (zh) 2019-06-14
EP3533847A1 (fr) 2019-09-04
JP2019094503A (ja) 2019-06-20
CN109890925A (zh) 2019-06-14
EP3533849A4 (fr) 2020-07-01
CN109923184A (zh) 2019-06-21
JPWO2018079355A1 (ja) 2019-09-12
US20200063001A1 (en) 2020-02-27
JP6648300B2 (ja) 2020-02-14
US20190329504A1 (en) 2019-10-31
US11673340B2 (en) 2023-06-13
CN109890923B (zh) 2022-05-17
US11541607B2 (en) 2023-01-03
CN109890925B (zh) 2021-12-14
KR102366349B1 (ko) 2022-02-22

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