EP2289667A4 - Reinigungsmittel für ein synthetisches quarzglassubstrat - Google Patents

Reinigungsmittel für ein synthetisches quarzglassubstrat

Info

Publication number
EP2289667A4
EP2289667A4 EP09762368A EP09762368A EP2289667A4 EP 2289667 A4 EP2289667 A4 EP 2289667A4 EP 09762368 A EP09762368 A EP 09762368A EP 09762368 A EP09762368 A EP 09762368A EP 2289667 A4 EP2289667 A4 EP 2289667A4
Authority
EP
European Patent Office
Prior art keywords
glass substrate
quartz glass
synthetic quartz
polishing agent
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09762368A
Other languages
English (en)
French (fr)
Other versions
EP2289667A1 (de
EP2289667B1 (de
Inventor
Daijitsu Harada
Masaki Takeuchi
Yukio Shibano
Shuhei Ueda
Atsushi Watabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008152940A external-priority patent/JP5407188B2/ja
Priority claimed from JP2008152924A external-priority patent/JP5369506B2/ja
Priority claimed from JP2008152964A external-priority patent/JP5071678B2/ja
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of EP2289667A1 publication Critical patent/EP2289667A1/de
Publication of EP2289667A4 publication Critical patent/EP2289667A4/de
Application granted granted Critical
Publication of EP2289667B1 publication Critical patent/EP2289667B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Surface Treatment Of Glass (AREA)
EP09762368.0A 2008-06-11 2009-05-27 Reinigungsmittel für ein synthetisches quarzglassubstrat Active EP2289667B1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2008152899 2008-06-11
JP2008152940A JP5407188B2 (ja) 2008-06-11 2008-06-11 合成石英ガラス基板用研磨剤
JP2008152924A JP5369506B2 (ja) 2008-06-11 2008-06-11 合成石英ガラス基板用研磨剤
JP2008152964A JP5071678B2 (ja) 2008-06-11 2008-06-11 合成石英ガラス基板用研磨剤
PCT/JP2009/059676 WO2009150938A1 (ja) 2008-06-11 2009-05-27 合成石英ガラス基板用研磨剤

Publications (3)

Publication Number Publication Date
EP2289667A1 EP2289667A1 (de) 2011-03-02
EP2289667A4 true EP2289667A4 (de) 2012-01-11
EP2289667B1 EP2289667B1 (de) 2019-06-26

Family

ID=41416649

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09762368.0A Active EP2289667B1 (de) 2008-06-11 2009-05-27 Reinigungsmittel für ein synthetisches quarzglassubstrat

Country Status (7)

Country Link
US (2) US20100243950A1 (de)
EP (1) EP2289667B1 (de)
KR (1) KR101548756B1 (de)
CN (1) CN101821058A (de)
MY (1) MY155533A (de)
TW (1) TWI557195B (de)
WO (1) WO2009150938A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5251861B2 (ja) * 2009-12-28 2013-07-31 信越化学工業株式会社 合成石英ガラス基板の製造方法
CN102169284A (zh) * 2010-02-26 2011-08-31 深圳清溢光电股份有限公司 一种铬版的检查方法
JP5516184B2 (ja) * 2010-07-26 2014-06-11 信越化学工業株式会社 合成石英ガラス基板の製造方法
JP5795843B2 (ja) * 2010-07-26 2015-10-14 東洋鋼鈑株式会社 ハードディスク基板の製造方法
JP5640920B2 (ja) 2011-08-18 2014-12-17 信越化学工業株式会社 チタニアドープ石英ガラス及びその製造方法
JP5673506B2 (ja) * 2011-11-18 2015-02-18 信越化学工業株式会社 合成石英ガラス基板用研磨剤及び合成石英ガラス基板の製造方法
JP5907081B2 (ja) * 2012-02-02 2016-04-20 信越化学工業株式会社 合成石英ガラス基板の製造方法
CN104620176B (zh) * 2012-09-26 2019-02-26 大日本印刷株式会社 玻璃再生处理方法、再生玻璃基板及使用其的光掩模坯料和光掩模
US10481488B2 (en) * 2012-12-27 2019-11-19 Hoya Corporation Mask blank substrate processing device, mask blank substrate processing method, mask blank substrate fabrication method, mask blank fabrication method, and transfer mask fabrication method
US9358659B2 (en) 2013-03-04 2016-06-07 Cabot Microelectronics Corporation Composition and method for polishing glass
JP6156207B2 (ja) * 2013-04-02 2017-07-05 信越化学工業株式会社 合成石英ガラス基板の製造方法
EP3099756A4 (de) * 2014-01-31 2017-08-02 Basf Se Chemisch-mechanische polierzusammensetzung mit einer poly(aminosäure)
MY180533A (en) 2014-03-17 2020-12-01 Shinetsu Chemical Co Methods for working synthetic quartz glass substrate having a mirror-like surface and method for sensing synthetic quartz glass substrate
JP5874782B2 (ja) * 2014-06-30 2016-03-02 信越化学工業株式会社 金型用基板及び金型用基板の検査方法
KR101656414B1 (ko) * 2014-10-22 2016-09-12 주식회사 케이씨텍 분산성이 개선된 슬러리 조성물
JP6393231B2 (ja) * 2015-05-08 2018-09-19 信越化学工業株式会社 合成石英ガラス基板用研磨剤及び合成石英ガラス基板の研磨方法
MY186275A (en) * 2016-08-23 2021-07-02 Shinetsu Chemical Co Method for producing substrate
CN107286852A (zh) * 2017-04-14 2017-10-24 浙江晶圣美纳米科技有限公司 一种化学机械抛光液
US10676647B1 (en) * 2018-12-31 2020-06-09 Cabot Microelectronics Corporation Composition for tungsten CMP
KR102427008B1 (ko) * 2019-12-02 2022-08-01 도레이 카부시키가이샤 감광성 조성물, 네거티브형 감광성 조성물, 화소 분할층 및 유기 el 표시 장치
CN112251146B (zh) * 2020-10-20 2021-08-24 德阳展源新材料科技有限公司 一种金刚石抛光液的制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1219568A2 (de) * 2000-12-25 2002-07-03 Nissan Chemical Industries, Ltd. Ceriumoxidsol und Abrasiv
US20040144755A1 (en) * 2000-03-27 2004-07-29 JSR Corporation (50%) Aqueous dispersion for chemical mechanical polishing
GB2403954A (en) * 2003-07-03 2005-01-19 Fujimi Inc Polishing composition
US20060196848A1 (en) * 2003-02-03 2006-09-07 Carter Phillip W Readily deinkable toners
GB2433516A (en) * 2005-12-22 2007-06-27 Kao Corp Polishing composition for glass substrate
US20080003829A1 (en) * 2006-06-30 2008-01-03 Dong Mok Shin Chemical mechanical polishing slurry

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0769271B2 (ja) 1987-02-25 1995-07-26 株式会社ニコン 欠陥検査装置
US4889998A (en) * 1987-01-29 1989-12-26 Nikon Corporation Apparatus with four light detectors for checking surface of mask with pellicle
JPS63200043A (ja) 1987-02-14 1988-08-18 Hamamatsu Photonics Kk シ−ト状被検体の表面欠陥検出装置
JPH0623392B2 (ja) 1987-04-27 1994-03-30 日本モンサント株式会社 ウエハーのファイン研磨用組成物
JPS6440267A (en) 1987-08-07 1989-02-10 Shinetsu Chemical Co Manufacture of precisely polished glass
JP2714411B2 (ja) * 1988-12-12 1998-02-16 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー ウェハーのファイン研摩用組成物
US5352277A (en) * 1988-12-12 1994-10-04 E. I. Du Pont De Nemours & Company Final polishing composition
JP2987171B2 (ja) 1990-06-01 1999-12-06 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー ウエハーのファイン研磨用濃縮組成物
JPH09137155A (ja) 1995-11-16 1997-05-27 Tokyo Ohka Kogyo Co Ltd 研磨用組成物および研磨方法
US6149696A (en) * 1997-11-06 2000-11-21 Komag, Inc. Colloidal silica slurry for NiP plated disk polishing
JP3810588B2 (ja) * 1998-06-22 2006-08-16 株式会社フジミインコーポレーテッド 研磨用組成物
TW455626B (en) * 1998-07-23 2001-09-21 Eternal Chemical Co Ltd Chemical mechanical abrasive composition for use in semiconductor processing
CN1200066C (zh) * 2000-05-12 2005-05-04 日产化学工业株式会社 抛光剂组合物
US6872329B2 (en) * 2000-07-28 2005-03-29 Applied Materials, Inc. Chemical mechanical polishing composition and process
JP2002110596A (ja) * 2000-10-02 2002-04-12 Mitsubishi Electric Corp 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法
JP4885352B2 (ja) 2000-12-12 2012-02-29 昭和電工株式会社 研磨材スラリー及び研磨微粉
US7037352B2 (en) * 2000-12-12 2006-05-02 Showa Denko Kabushiki Kaisha Polishing particle and method for producing polishing particle
JP2002241739A (ja) * 2001-02-20 2002-08-28 Hitachi Chem Co Ltd 研磨剤及び基板の研磨方法
JP4707864B2 (ja) 2001-04-18 2011-06-22 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
JP2003031528A (ja) 2001-07-18 2003-01-31 Toshiba Corp Ｃｍｐ用スラリーおよび半導体装置の製造方法
JP4025960B2 (ja) * 2001-08-08 2007-12-26 信越化学工業株式会社 角形ホトマスク基板の研磨方法、角形ホトマスク基板、ホトマスクブランクス及びホトマスク
JP4187497B2 (ja) * 2002-01-25 2008-11-26 Ｊｓｒ株式会社 半導体基板の化学機械研磨方法
JP3966840B2 (ja) 2002-08-19 2007-08-29 Ｈｏｙａ株式会社 マスクブランクス用ガラス基板の製造方法、マスクブランクスの製造方法、転写マスクの製造方法、及び半導体装置の製造方法、並びにマスクブランクス用ガラス基板、マスクブランクス、転写マスク
KR101004525B1 (ko) * 2002-08-19 2010-12-31 호야 가부시키가이샤 마스크 블랭크용 글래스 기판 제조 방법, 마스크 블랭크제조방법, 전사 마스크 제조 방법, 반도체 디바이스제조방법, 마스크 블랭크용 글래스 기판, 마스크 블랭크,및 전사 마스크
GB2395486B (en) * 2002-10-30 2006-08-16 Kao Corp Polishing composition
JP2004323840A (ja) 2003-04-10 2004-11-18 Sumitomo Chem Co Ltd 研磨洗浄液組成物及び研磨洗浄方法
JP2005103684A (ja) 2003-09-29 2005-04-21 Mimasu Semiconductor Industry Co Ltd コロイド分散型ラッピング剤及びその製造方法
US20050079803A1 (en) * 2003-10-10 2005-04-14 Siddiqui Junaid Ahmed Chemical-mechanical planarization composition having PVNO and associated method for use
JP4291665B2 (ja) 2003-10-15 2009-07-08 日本化学工業株式会社 珪酸質材料用研磨剤組成物およびそれを用いた研磨方法
JP2005217002A (ja) 2004-01-28 2005-08-11 Renesas Technology Corp 研磨装置、研磨方法並びに半導体装置の製造方法
JP2006128552A (ja) * 2004-11-01 2006-05-18 Hitachi Chem Co Ltd Ｃｍｐ用研磨液及び研磨方法
JP2006130638A (ja) 2004-11-09 2006-05-25 Kao Corp 容器入り研磨材粒子分散液
JP2006193695A (ja) 2005-01-17 2006-07-27 Fujimi Inc 研磨用組成物
JP2007088226A (ja) 2005-09-22 2007-04-05 Fujifilm Corp カーボン配線用研磨液、及び、研磨方法
JP2007208219A (ja) 2006-02-06 2007-08-16 Fujifilm Corp 半導体デバイスの研磨方法
US20080220610A1 (en) * 2006-06-29 2008-09-11 Cabot Microelectronics Corporation Silicon oxide polishing method utilizing colloidal silica
KR20090018202A (ko) * 2006-07-04 2009-02-19 히다치 가세고교 가부시끼가이샤 Ｃｍｐ용 연마액
JP4991217B2 (ja) 2006-09-05 2012-08-01 ライオン株式会社 浴室用液体洗浄剤組成物および浴室用液体洗浄剤製品
JP4569779B2 (ja) * 2006-09-07 2010-10-27 信越化学工業株式会社 合成石英ガラスインゴット及び合成石英ガラス部材の製造方法
JP2008074990A (ja) * 2006-09-22 2008-04-03 Nihon Micro Coating Co Ltd 研磨スラリー及び方法
US20080096385A1 (en) * 2006-09-27 2008-04-24 Hynix Semiconductor Inc. Slurry composition for forming tungsten pattern and method for manufacturing semiconductor device using the same
US8574330B2 (en) * 2006-10-06 2013-11-05 Jsr Corporation Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device
JP2008094982A (ja) 2006-10-12 2008-04-24 Kao Corp メモリーハードディスク基板用研磨液組成物
JP2008235481A (ja) * 2007-03-19 2008-10-02 Nippon Chem Ind Co Ltd 半導体ウエハ研磨用組成物、その製造方法、及び研磨加工方法
JP2009158810A (ja) * 2007-12-27 2009-07-16 Toshiba Corp 化学的機械的研磨用スラリーおよび半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040144755A1 (en) * 2000-03-27 2004-07-29 JSR Corporation (50%) Aqueous dispersion for chemical mechanical polishing
EP1219568A2 (de) * 2000-12-25 2002-07-03 Nissan Chemical Industries, Ltd. Ceriumoxidsol und Abrasiv
US20060196848A1 (en) * 2003-02-03 2006-09-07 Carter Phillip W Readily deinkable toners
GB2403954A (en) * 2003-07-03 2005-01-19 Fujimi Inc Polishing composition
GB2433516A (en) * 2005-12-22 2007-06-27 Kao Corp Polishing composition for glass substrate
US20080003829A1 (en) * 2006-06-30 2008-01-03 Dong Mok Shin Chemical mechanical polishing slurry

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009150938A1 *

Also Published As

Publication number Publication date
MY155533A (en) 2015-10-30
US20100243950A1 (en) 2010-09-30
US9919962B2 (en) 2018-03-20
WO2009150938A1 (ja) 2009-12-17
TWI557195B (zh) 2016-11-11
CN101821058A (zh) 2010-09-01
KR101548756B1 (ko) 2015-08-31
KR20110026406A (ko) 2011-03-15
EP2289667A1 (de) 2011-03-02
TW201002795A (en) 2010-01-16
US20150021292A1 (en) 2015-01-22
EP2289667B1 (de) 2019-06-26

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