EP1818975A3 - Multilayer printed circuit board and multilayer printed circuit board manufacturing method - Google Patents

Multilayer printed circuit board and multilayer printed circuit board manufacturing method Download PDF

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Publication number
EP1818975A3
EP1818975A3 EP07108462A EP07108462A EP1818975A3 EP 1818975 A3 EP1818975 A3 EP 1818975A3 EP 07108462 A EP07108462 A EP 07108462A EP 07108462 A EP07108462 A EP 07108462A EP 1818975 A3 EP1818975 A3 EP 1818975A3
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
multilayer printed
pad
ic chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07108462A
Other languages
German (de)
French (fr)
Other versions
EP1818975A2 (en
Inventor
H. c/o Ogaki-kita-kojou Ibiden Co. Ltd. Sakamoto
T. c/o Ogaki-kita-kojou Ibiden Co. Ltd. Sugiyama
D. c/o Ogaki-kita-kojou Ibiden Co. Ltd. Wang
T. c/o Ogaki-kita-kojou Ibiden Co. Ltd. Kariya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000049121 priority Critical
Priority to JP2000073558 priority
Priority to JP2000078206 priority
Priority to JP2000105212 priority
Priority to JP2000152973 priority
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to EP01900747A priority patent/EP1259103B1/en
Publication of EP1818975A2 publication Critical patent/EP1818975A2/en
Publication of EP1818975A3 publication Critical patent/EP1818975A3/en
Application status is Withdrawn legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
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    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
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    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
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    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
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    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/49816Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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    • H01L2223/54486Located on package parts, e.g. encapsulation, leads, package substrate
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    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49156Manufacturing circuit on or in base with selective destruction of conductive paths
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49165Manufacturing circuit on or in base by forming conductive walled aperture in base

Abstract

A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.
EP07108462A 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method Withdrawn EP1818975A3 (en)

Priority Applications (6)

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JP2000049121 2000-02-25
JP2000073558 2000-03-16
JP2000078206 2000-03-21
JP2000105212 2000-04-06
JP2000152973 2000-05-24
EP01900747A EP1259103B1 (en) 2000-02-25 2001-01-12 Multilayer printed wiring board and method for producing multilayer printed wiring board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08161670A EP1990832A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP08161671A EP1990833A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP08161669A EP1990831A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method

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EP01900747A Division EP1259103B1 (en) 2000-02-25 2001-01-12 Multilayer printed wiring board and method for producing multilayer printed wiring board

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EP08161671A Division EP1990833A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP08161670A Division EP1990832A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP08161669A Division EP1990831A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP08161671.6 Division-Into 2008-08-01
EP08161669.0 Division-Into 2008-08-01
EP08161670.8 Division-Into 2008-08-01

Publications (2)

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EP1818975A2 EP1818975A2 (en) 2007-08-15
EP1818975A3 true EP1818975A3 (en) 2010-09-29

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EP08161669A Withdrawn EP1990831A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP07108462A Withdrawn EP1818975A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP08161670A Withdrawn EP1990832A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP01900747A Active EP1259103B1 (en) 2000-02-25 2001-01-12 Multilayer printed wiring board and method for producing multilayer printed wiring board
EP08161671A Withdrawn EP1990833A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP07108465A Withdrawn EP1814154A1 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit manufacturing method

Family Applications Before (1)

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EP08161669A Withdrawn EP1990831A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method

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EP08161670A Withdrawn EP1990832A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP01900747A Active EP1259103B1 (en) 2000-02-25 2001-01-12 Multilayer printed wiring board and method for producing multilayer printed wiring board
EP08161671A Withdrawn EP1990833A3 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP07108465A Withdrawn EP1814154A1 (en) 2000-02-25 2001-01-12 Multilayer printed circuit board and multilayer printed circuit manufacturing method

Country Status (8)

Country Link
US (11) US6909054B2 (en)
EP (6) EP1990831A3 (en)
KR (2) KR20080031522A (en)
CN (1) CN100336426C (en)
DE (1) DE60128656T2 (en)
MY (1) MY128015A (en)
TW (1) TW582192B (en)
WO (1) WO2001063991A1 (en)

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