JPH0338084A - Connection of circuit board - Google Patents

Connection of circuit board

Info

Publication number
JPH0338084A
JPH0338084A JP1173658A JP17365889A JPH0338084A JP H0338084 A JPH0338084 A JP H0338084A JP 1173658 A JP1173658 A JP 1173658A JP 17365889 A JP17365889 A JP 17365889A JP H0338084 A JPH0338084 A JP H0338084A
Authority
JP
Japan
Prior art keywords
electrode
board
circuit board
bonding agent
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1173658A
Inventor
Keiji Yamamura
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1173658A priority Critical patent/JPH0338084A/en
Publication of JPH0338084A publication Critical patent/JPH0338084A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

PURPOSE:To make possible the stable connection between electrodes at a fine pitch without inflicting damage on circuit boards by a method wherein the bump electrode is connected by pressing to the electrode to correspond to the bump electrode through conductive particles. CONSTITUTION:A bonding agent 22 is selectively applied on a bump electrode 13 of a first circuit board 11, conductive particles 21 are adhered on the bonding agent 12, then, a second circuit board 12 with an electrode formed at a position, where corresponds to the electrode 13 of the board 11, of the board 12 and the board 11 are made to oppose to each other, are pressed to each other and in this state, the bonding agent 22 is hardened and both boards 11 and 12 are fixed. Accordingly, even if irregularity in height is generated in the electrode 13, the particles 21 are deformed at the time of connection and absorb the irregularity. Thereby, the stable connection between the electrodes 13 and 14 at a fine pitch becomes possible without inflicting damage on the boards 11 and 12.
JP1173658A 1989-07-04 1989-07-04 Connection of circuit board Pending JPH0338084A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1173658A JPH0338084A (en) 1989-07-04 1989-07-04 Connection of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1173658A JPH0338084A (en) 1989-07-04 1989-07-04 Connection of circuit board

Publications (1)

Publication Number Publication Date
JPH0338084A true JPH0338084A (en) 1991-02-19

Family

ID=15964698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1173658A Pending JPH0338084A (en) 1989-07-04 1989-07-04 Connection of circuit board

Country Status (1)

Country Link
JP (1) JPH0338084A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152706A (en) * 1991-11-28 1993-06-18 Matsushita Electric Works Ltd Mounting structure of circuit board
US5561593A (en) * 1994-01-27 1996-10-01 Vicon Enterprises, Inc. Z-interface-board
JP2002170840A (en) * 2000-09-25 2002-06-14 Ibiden Co Ltd Manufacturing method of semiconductor device and multi-layer printed circuit board including the same
JP2002246761A (en) * 2000-12-15 2002-08-30 Ibiden Co Ltd Multilayer printed circuit board containing semiconductor elements
JP2002246758A (en) * 2000-12-15 2002-08-30 Ibiden Co Ltd Printed-wiring board
US7999387B2 (en) 2000-09-25 2011-08-16 Ibiden Co., Ltd. Semiconductor element connected to printed circuit board
US8079142B2 (en) 2000-02-25 2011-12-20 Ibiden Co., Ltd. Printed circuit board manufacturing method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152706A (en) * 1991-11-28 1993-06-18 Matsushita Electric Works Ltd Mounting structure of circuit board
US5561593A (en) * 1994-01-27 1996-10-01 Vicon Enterprises, Inc. Z-interface-board
US8438727B2 (en) 2000-02-25 2013-05-14 Ibiden Co., Ltd. Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US8079142B2 (en) 2000-02-25 2011-12-20 Ibiden Co., Ltd. Printed circuit board manufacturing method
US8186045B2 (en) 2000-02-25 2012-05-29 Ibiden Co., Ltd. Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US7999387B2 (en) 2000-09-25 2011-08-16 Ibiden Co., Ltd. Semiconductor element connected to printed circuit board
JP2002170840A (en) * 2000-09-25 2002-06-14 Ibiden Co Ltd Manufacturing method of semiconductor device and multi-layer printed circuit board including the same
JP2002246761A (en) * 2000-12-15 2002-08-30 Ibiden Co Ltd Multilayer printed circuit board containing semiconductor elements
JP2002246758A (en) * 2000-12-15 2002-08-30 Ibiden Co Ltd Printed-wiring board

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