DE69908965D1 - Wärmegetempertes einkristallines silizium mit niedriger fehlerdichte - Google Patents
Wärmegetempertes einkristallines silizium mit niedriger fehlerdichteInfo
- Publication number
- DE69908965D1 DE69908965D1 DE69908965T DE69908965T DE69908965D1 DE 69908965 D1 DE69908965 D1 DE 69908965D1 DE 69908965 T DE69908965 T DE 69908965T DE 69908965 T DE69908965 T DE 69908965T DE 69908965 D1 DE69908965 D1 DE 69908965D1
- Authority
- DE
- Germany
- Prior art keywords
- single crystal
- crystal silicon
- heat temperature
- low error
- temperature single
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/206—Controlling or regulating the thermal history of growing the ingot
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2813—Heat or solvent activated or sealable
- Y10T428/2817—Heat sealable
- Y10T428/2822—Wax containing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10430498P | 1998-10-14 | 1998-10-14 | |
US104304P | 1998-10-14 | ||
PCT/US1999/024068 WO2000022198A1 (en) | 1998-10-14 | 1999-10-13 | Thermally annealed, low defect density single crystal silicon |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69908965D1 true DE69908965D1 (de) | 2003-07-24 |
DE69908965T2 DE69908965T2 (de) | 2004-05-13 |
Family
ID=22299774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69908965T Expired - Lifetime DE69908965T2 (de) | 1998-10-14 | 1999-10-13 | Wärmegetempertes einkristallines silizium mit niedriger fehlerdichte |
Country Status (8)
Country | Link |
---|---|
US (2) | US6416836B1 (de) |
EP (1) | EP1125008B1 (de) |
JP (1) | JP4875800B2 (de) |
KR (1) | KR100622884B1 (de) |
CN (1) | CN1296526C (de) |
DE (1) | DE69908965T2 (de) |
TW (1) | TW467974B (de) |
WO (1) | WO2000022198A1 (de) |
Families Citing this family (24)
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---|---|---|---|---|
US6503594B2 (en) | 1997-02-13 | 2003-01-07 | Samsung Electronics Co., Ltd. | Silicon wafers having controlled distribution of defects and slip |
CN1280455C (zh) * | 1997-04-09 | 2006-10-18 | Memc电子材料有限公司 | 低缺陷浓度的硅 |
KR100378184B1 (ko) * | 1999-11-13 | 2003-03-29 | 삼성전자주식회사 | 제어된 결함 분포를 갖는 실리콘 웨이퍼, 그의 제조공정및 단결정 실리콘 잉곳의 제조를 위한 초크랄스키 풀러 |
CN1312326C (zh) * | 2000-05-08 | 2007-04-25 | Memc电子材料有限公司 | 消除自动掺杂和背面晕圈的外延硅晶片 |
US6444027B1 (en) | 2000-05-08 | 2002-09-03 | Memc Electronic Materials, Inc. | Modified susceptor for use in chemical vapor deposition process |
US7008874B2 (en) * | 2000-12-19 | 2006-03-07 | Memc Electronics Materials, Inc. | Process for reclaiming semiconductor wafers and reclaimed wafers |
EP1287188B1 (de) * | 2000-12-29 | 2007-03-14 | MEMC Electronic Materials, Inc. | Epitaktischer siliziumwafer frei von selbstdotierung und rückseitenhalo |
US6846539B2 (en) | 2001-01-26 | 2005-01-25 | Memc Electronic Materials, Inc. | Low defect density silicon having a vacancy-dominated core substantially free of oxidation induced stacking faults |
JP2004533125A (ja) * | 2001-06-22 | 2004-10-28 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | イオン注入によるイントリンシックゲッタリングを有するシリコン・オン・インシュレータ構造体を製造する方法 |
JP3778432B2 (ja) * | 2002-01-23 | 2006-05-24 | 東京エレクトロン株式会社 | 基板処理方法および装置、半導体装置の製造装置 |
KR100588425B1 (ko) * | 2003-03-27 | 2006-06-12 | 실트로닉 아게 | 실리콘 단결정, 결정된 결함분포를 가진 실리콘 단결정 및 실리콘 반도체 웨이퍼의 제조방법 |
US7135631B2 (en) * | 2004-01-12 | 2006-11-14 | Cherny Michale N | Quartz drum and method of making |
US7067005B2 (en) * | 2004-08-06 | 2006-06-27 | Sumitomo Mitsubishi Silicon Corporation | Silicon wafer production process and silicon wafer |
DE102005028202B4 (de) | 2005-06-17 | 2010-04-15 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben aus Silizium |
KR101247065B1 (ko) * | 2006-01-30 | 2013-03-25 | 엠이엠씨 일렉트로닉 머티리얼즈, 인크. | 양면 웨이퍼 그라인더 및 가공물 나노토폴로지 평가 방법 |
MY157902A (en) * | 2006-05-19 | 2016-08-15 | Memc Electronic Materials | Controlling agglomerated point defect and oxygen cluster formation induced by the lateral surface of a silicon single crystal during cz growth |
US20070299162A1 (en) * | 2006-06-27 | 2007-12-27 | Gelcore Llc | Optoelectronic device |
JP5311930B2 (ja) * | 2007-08-29 | 2013-10-09 | 住友化学株式会社 | シリコンの製造方法 |
KR100901980B1 (ko) * | 2007-09-04 | 2009-06-08 | 주식회사 실트론 | 플로팅 존 공정을 이용한 웨이퍼 표면 처리방법 및 이를위한 웨이퍼 표면 처리장치 |
EP2309038B1 (de) * | 2009-10-08 | 2013-01-02 | Siltronic AG | Herstellungsverfahren eines Epitaxial-Wafers |
CN103835000A (zh) * | 2012-11-20 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | 一种高温改善多晶硅表面粗糙度的方法 |
CN106206275A (zh) * | 2016-09-20 | 2016-12-07 | 上海华力微电子有限公司 | 一种改善多晶硅表面粗糙度的工艺方法 |
CN108169228A (zh) * | 2017-11-28 | 2018-06-15 | 中国工程物理研究院电子工程研究所 | 一种准确辨别碳化硅单晶位错类型的方法 |
WO2019125810A1 (en) * | 2017-12-21 | 2019-06-27 | Globalwafers Co., Ltd. | Method of treating a single crystal silicon ingot to improve the lls ring/core pattern |
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-
1999
- 1999-10-13 DE DE69908965T patent/DE69908965T2/de not_active Expired - Lifetime
- 1999-10-13 CN CNB99812088XA patent/CN1296526C/zh not_active Expired - Fee Related
- 1999-10-13 WO PCT/US1999/024068 patent/WO2000022198A1/en active IP Right Grant
- 1999-10-13 EP EP99956562A patent/EP1125008B1/de not_active Expired - Lifetime
- 1999-10-13 JP JP2000576083A patent/JP4875800B2/ja not_active Expired - Fee Related
- 1999-10-13 US US09/416,998 patent/US6416836B1/en not_active Expired - Lifetime
- 1999-10-13 KR KR1020017004280A patent/KR100622884B1/ko not_active IP Right Cessation
- 1999-11-22 TW TW088117746A patent/TW467974B/zh not_active IP Right Cessation
-
2002
- 2002-02-11 US US10/073,506 patent/US6743289B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2002527895A (ja) | 2002-08-27 |
US6416836B1 (en) | 2002-07-09 |
CN1296526C (zh) | 2007-01-24 |
CN1323362A (zh) | 2001-11-21 |
EP1125008A1 (de) | 2001-08-22 |
EP1125008B1 (de) | 2003-06-18 |
TW467974B (en) | 2001-12-11 |
US6743289B2 (en) | 2004-06-01 |
KR100622884B1 (ko) | 2006-09-12 |
JP4875800B2 (ja) | 2012-02-15 |
DE69908965T2 (de) | 2004-05-13 |
WO2000022198A9 (en) | 2002-08-22 |
KR20010079992A (ko) | 2001-08-22 |
WO2000022198A1 (en) | 2000-04-20 |
US20020083889A1 (en) | 2002-07-04 |
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