DE69901115D1 - Verfahren zur herstellung fehlerfreier siliziumkristalle von willkürlichem grossen durchmesser - Google Patents
Verfahren zur herstellung fehlerfreier siliziumkristalle von willkürlichem grossen durchmesserInfo
- Publication number
- DE69901115D1 DE69901115D1 DE69901115T DE69901115T DE69901115D1 DE 69901115 D1 DE69901115 D1 DE 69901115D1 DE 69901115 T DE69901115 T DE 69901115T DE 69901115 T DE69901115 T DE 69901115T DE 69901115 D1 DE69901115 D1 DE 69901115D1
- Authority
- DE
- Germany
- Prior art keywords
- large diameter
- free silicon
- silicon crystals
- producing error
- arbitrary large
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/206—Controlling or regulating the thermal history of growing the ingot
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/106—Seed pulling including sealing means details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1072—Seed pulling including details of means providing product movement [e.g., shaft guides, servo means]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9072398P | 1998-06-26 | 1998-06-26 | |
US10408798P | 1998-10-14 | 1998-10-14 | |
US11762399P | 1999-01-28 | 1999-01-28 | |
PCT/US1999/014285 WO2000000674A2 (en) | 1998-06-26 | 1999-06-25 | Process for growth of defect free silicon crystals of arbitrarily large diameters |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69901115D1 true DE69901115D1 (de) | 2002-05-02 |
DE69901115T2 DE69901115T2 (de) | 2002-12-19 |
Family
ID=27376642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69901115T Expired - Lifetime DE69901115T2 (de) | 1998-06-26 | 1999-06-25 | Verfahren zur herstellung fehlerfreier siliziumkristalle von willkürlichem grossen durchmesser |
Country Status (8)
Country | Link |
---|---|
US (3) | US6328795B2 (de) |
EP (1) | EP1090166B1 (de) |
JP (1) | JP2003517412A (de) |
KR (1) | KR20010041957A (de) |
CN (1) | CN1326518A (de) |
DE (1) | DE69901115T2 (de) |
TW (1) | TW473564B (de) |
WO (1) | WO2000000674A2 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6514335B1 (en) * | 1997-08-26 | 2003-02-04 | Sumitomo Metal Industries, Ltd. | High-quality silicon single crystal and method of producing the same |
DE69901115T2 (de) * | 1998-06-26 | 2002-12-19 | Memc Electronic Materials, Inc. | Verfahren zur herstellung fehlerfreier siliziumkristalle von willkürlichem grossen durchmesser |
EP1133590B1 (de) * | 1998-10-14 | 2003-12-17 | MEMC Electronic Materials, Inc. | Im wesentlichen defektfreie epitaktische siliziumscheiben |
CN100446196C (zh) * | 2001-06-22 | 2008-12-24 | Memc电子材料有限公司 | 通过离子注入产生具有本征吸除的绝缘体衬底硅结构的方法 |
US6866713B2 (en) * | 2001-10-26 | 2005-03-15 | Memc Electronic Materials, Inc. | Seed crystals for pulling single crystal silicon |
KR20030070432A (ko) * | 2002-02-25 | 2003-08-30 | 네오세미테크 주식회사 | 갈륨아세나이드 결정성장 장치 및 방법 |
JP4486889B2 (ja) * | 2002-11-12 | 2010-06-23 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | 単結晶インゴットを成長させる方法及び結晶引上げ装置 |
WO2004044277A1 (en) * | 2002-11-12 | 2004-05-27 | Memc Electronic Materials, Inc. | Process for preparing single crystal silicon using crucible rotation to control temperature gradient |
JP2004172391A (ja) * | 2002-11-20 | 2004-06-17 | Sumitomo Mitsubishi Silicon Corp | シリコンウェーハおよびその製造方法 |
JP5152328B2 (ja) * | 2008-05-20 | 2013-02-27 | 信越半導体株式会社 | 単結晶製造装置 |
US8784559B2 (en) * | 2010-09-09 | 2014-07-22 | Siemens Medical Solutions Usa, Inc. | Method and apparatus for continuous crystal growth |
US8936911B2 (en) | 2010-09-22 | 2015-01-20 | Pacific Biosciences Of California, Inc. | Purified extended polymerase/template complex for sequencing |
US8939957B2 (en) | 2011-04-29 | 2015-01-27 | The Procter & Gamble Company | Absorbent article with leg gasketing cuff |
EP2723292A1 (de) | 2011-06-21 | 2014-04-30 | The Procter and Gamble Company | Saugfähiger artikel mit kontraktionsbund |
CA2840195C (en) | 2011-06-21 | 2017-04-18 | The Procter & Gamble Company | Absorbent article with a waistband and leg cuff having gathers |
EP2849702A1 (de) | 2012-05-15 | 2015-03-25 | The Procter & Gamble Company | Saugfähige wegwerfhöschen mit vorteilhaften dehn- und herstellbarkeitsmerkmalen sowie verfahren zur herstellung davon |
US9610203B2 (en) | 2013-03-22 | 2017-04-04 | The Procter & Gamble Company | Disposable absorbent articles |
WO2015125425A1 (ja) * | 2014-02-24 | 2015-08-27 | 信越半導体株式会社 | シリコン単結晶製造方法及びシリコン単結晶 |
CN107405245B (zh) | 2015-03-18 | 2021-04-09 | 宝洁公司 | 具有腰衬圈元件和腿箍的吸收制品 |
CN107405243B (zh) | 2015-03-18 | 2020-11-27 | 宝洁公司 | 带有腿箍的吸收制品 |
CN107405226B (zh) | 2015-03-18 | 2021-02-05 | 宝洁公司 | 具有腿箍的吸收制品 |
JP2018512212A (ja) | 2015-03-18 | 2018-05-17 | ザ プロクター アンド ギャンブル カンパニー | 腰部ガスケット要素及びレッグカフを備える吸収性物品 |
CN107427403B (zh) | 2015-03-18 | 2020-10-20 | 宝洁公司 | 具有腰衬圈元件和腿箍的吸收制品 |
CA2979841A1 (en) | 2015-03-18 | 2016-09-22 | The Procter & Gamble Company | Absorbent article with leg cuffs |
US10588790B2 (en) | 2015-03-18 | 2020-03-17 | The Procter & Gamble Company | Absorbent article with leg cuffs |
BR112017019861A2 (pt) | 2015-03-18 | 2018-05-29 | The Procter & Gamble Company | artigo absorvente com elemento de vedação na cintura e braçadeiras para pernas |
US10716716B2 (en) | 2015-03-18 | 2020-07-21 | The Procter & Gamble Company | Absorbent article with leg cuffs |
CA2980145A1 (en) | 2015-03-18 | 2016-09-22 | The Procter & Gamble Company | Absorbent article with waist gasketing element and leg cuffs |
JP6287991B2 (ja) * | 2015-07-29 | 2018-03-07 | 信越半導体株式会社 | シリコン単結晶育成装置 |
WO2017069112A1 (ja) * | 2015-10-23 | 2017-04-27 | 株式会社トクヤマ | シリコン単結晶インゴットの引上げ装置およびシリコン単結晶インゴットの製造方法 |
JP6786905B2 (ja) * | 2016-06-27 | 2020-11-18 | 株式会社Sumco | シリコン単結晶の製造方法 |
WO2018008561A1 (ja) * | 2016-07-06 | 2018-01-11 | 株式会社トクヤマ | 単結晶シリコン板状体およびその製造方法 |
JP2018147193A (ja) * | 2017-03-03 | 2018-09-20 | 万明 福岡 | 店舗設備 |
CN113825862A (zh) | 2019-04-11 | 2021-12-21 | 环球晶圆股份有限公司 | 后段主体长度具有减小变形的锭的制备工艺 |
JP2022529451A (ja) | 2019-04-18 | 2022-06-22 | グローバルウェーハズ カンパニー リミテッド | 連続チョクラルスキー法を用いる単結晶シリコンインゴットの成長方法 |
CN111850675A (zh) * | 2019-04-30 | 2020-10-30 | 上海新昇半导体科技有限公司 | 一种半导体晶体生长装置和方法 |
WO2021050176A1 (en) | 2019-09-13 | 2021-03-18 | Globalwafers Co., Ltd. | Methods for growing a nitrogen doped single crystal silicon ingot using continuous czochralski method and a single crystal silicon ingot grown by this method |
CN110904504B (zh) * | 2019-12-03 | 2022-02-08 | 西安奕斯伟材料科技有限公司 | 一种拉晶炉及单晶硅棒的制备方法 |
CN110965118B (zh) * | 2019-12-25 | 2022-04-15 | 西安奕斯伟材料科技有限公司 | 一种导流筒装置和拉晶炉 |
Family Cites Families (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3997368A (en) * | 1975-06-24 | 1976-12-14 | Bell Telephone Laboratories, Incorporated | Elimination of stacking faults in silicon devices: a gettering process |
JPS583374B2 (ja) * | 1977-06-15 | 1983-01-21 | 超エル・エス・アイ技術研究組合 | シリコン単結晶の処理方法 |
JPS589307B2 (ja) | 1978-08-23 | 1983-02-19 | 株式会社日立製作所 | 比例形電磁弁 |
JPS583375B2 (ja) | 1979-01-19 | 1983-01-21 | 超エル・エス・アイ技術研究組合 | シリコン単結晶ウエハ−の製造方法 |
US4350560A (en) * | 1981-08-07 | 1982-09-21 | Ferrofluidics Corporation | Apparatus for and method of handling crystals from crystal-growing furnaces |
JPS59190300A (ja) * | 1983-04-08 | 1984-10-29 | Hitachi Ltd | 半導体製造方法および装置 |
JPS62105998A (ja) | 1985-10-31 | 1987-05-16 | Sony Corp | シリコン基板の製法 |
US4981549A (en) | 1988-02-23 | 1991-01-01 | Mitsubishi Kinzoku Kabushiki Kaisha | Method and apparatus for growing silicon crystals |
US5264189A (en) | 1988-02-23 | 1993-11-23 | Mitsubishi Materials Corporation | Apparatus for growing silicon crystals |
JPH02180789A (ja) | 1989-01-05 | 1990-07-13 | Kawasaki Steel Corp | Si単結晶の製造方法 |
JPH0633235B2 (ja) | 1989-04-05 | 1994-05-02 | 新日本製鐵株式会社 | 酸化膜耐圧特性の優れたシリコン単結晶及びその製造方法 |
JPH0633236B2 (ja) * | 1989-09-04 | 1994-05-02 | 新日本製鐵株式会社 | シリコン単結晶の熱処理方法および装置ならびに製造装置 |
US5246535A (en) * | 1990-04-27 | 1993-09-21 | Nkk Corporation | Method and apparatus for controlling the diameter of a silicon single crystal |
JPH0729878B2 (ja) | 1990-06-07 | 1995-04-05 | 三菱マテリアル株式会社 | シリコンウエーハ |
JPH04108682A (ja) * | 1990-08-30 | 1992-04-09 | Fuji Electric Co Ltd | 化合物半導体単結晶製造装置および製造方法 |
JP2613498B2 (ja) | 1991-03-15 | 1997-05-28 | 信越半導体株式会社 | Si単結晶ウエーハの熱処理方法 |
JP3016897B2 (ja) | 1991-03-20 | 2000-03-06 | 信越半導体株式会社 | シリコン単結晶の製造方法及び装置 |
JP2758093B2 (ja) | 1991-10-07 | 1998-05-25 | 信越半導体株式会社 | 半導体ウェーハの製造方法 |
JPH0684925A (ja) | 1992-07-17 | 1994-03-25 | Toshiba Corp | 半導体基板およびその処理方法 |
KR950703079A (ko) | 1993-01-06 | 1995-08-23 | 다나까 미노루 | 반도체단결정의 결정품질을 예측하는 방법 및 그 장치(method of predicting crystal quality of semiconductor single crystal and apparatus thereof) |
JPH0741383A (ja) | 1993-07-29 | 1995-02-10 | Nippon Steel Corp | 半導体単結晶およびその製造方法 |
JPH07158458A (ja) | 1993-12-10 | 1995-06-20 | Mitsubishi Motors Corp | 多気筒内燃エンジンの吸気制御装置 |
DE4414947C2 (de) | 1993-12-16 | 1998-12-17 | Wacker Siltronic Halbleitermat | Verfahren zum Ziehen eines Einkristalls aus Silicium |
IT1280041B1 (it) | 1993-12-16 | 1997-12-29 | Wacker Chemitronic | Procedimento per il tiraggio di un monocristallo di silicio |
JP3276500B2 (ja) | 1994-01-14 | 2002-04-22 | ワッカー・エヌエスシーイー株式会社 | シリコンウェーハとその製造方法 |
US5474020A (en) | 1994-05-06 | 1995-12-12 | Texas Instruments Incorporated | Oxygen precipitation control in czochralski-grown silicon cyrstals |
JP3552278B2 (ja) | 1994-06-30 | 2004-08-11 | 三菱住友シリコン株式会社 | シリコン単結晶の製造方法 |
JP3285111B2 (ja) | 1994-12-05 | 2002-05-27 | 信越半導体株式会社 | 結晶欠陥の少ないシリコン単結晶の製造方法 |
JPH08208374A (ja) | 1995-01-25 | 1996-08-13 | Nippon Steel Corp | シリコン単結晶およびその製造方法 |
US5593494A (en) | 1995-03-14 | 1997-01-14 | Memc Electronic Materials, Inc. | Precision controlled precipitation of oxygen in silicon |
JP2826589B2 (ja) | 1995-03-30 | 1998-11-18 | 住友シチックス株式会社 | 単結晶シリコン育成方法 |
JP3085146B2 (ja) * | 1995-05-31 | 2000-09-04 | 住友金属工業株式会社 | シリコン単結晶ウェーハおよびその製造方法 |
JPH08337490A (ja) | 1995-06-09 | 1996-12-24 | Shin Etsu Handotai Co Ltd | 結晶欠陥の少ないシリコン単結晶及びその製造方法 |
JP3006669B2 (ja) | 1995-06-20 | 2000-02-07 | 信越半導体株式会社 | 結晶欠陥の均一なシリコン単結晶の製造方法およびその製造装置 |
JP4020987B2 (ja) | 1996-01-19 | 2007-12-12 | 信越半導体株式会社 | ウエーハ周辺部に結晶欠陥がないシリコン単結晶およびその製造方法 |
US5958133A (en) * | 1996-01-29 | 1999-09-28 | General Signal Corporation | Material handling system for growing high-purity crystals |
DE19613282A1 (de) | 1996-04-03 | 1997-10-09 | Leybold Ag | Vorrichtung zum Ziehen von Einkristallen |
DE19637182A1 (de) | 1996-09-12 | 1998-03-19 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung von Halbleiterscheiben aus Silicium mit geringer Defektdichte |
JPH10152395A (ja) | 1996-11-21 | 1998-06-09 | Komatsu Electron Metals Co Ltd | シリコン単結晶の製造方法 |
US5789309A (en) | 1996-12-30 | 1998-08-04 | Memc Electronic Materials, Inc. | Method and system for monocrystalline epitaxial deposition |
US6045610A (en) | 1997-02-13 | 2000-04-04 | Samsung Electronics Co., Ltd. | Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnance |
SG64470A1 (en) | 1997-02-13 | 1999-04-27 | Samsung Electronics Co Ltd | Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnace and ingots and wafers manufactured thereby |
DE19711922A1 (de) | 1997-03-21 | 1998-09-24 | Wacker Siltronic Halbleitermat | Vorrichtung und Verfahren zum Ziehen eines Einkristalls |
KR20040065306A (ko) | 1997-04-09 | 2004-07-21 | 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 | 저결함 밀도의 베이컨시가 지배적인 실리콘의 제조 방법 |
CN1316072C (zh) * | 1997-04-09 | 2007-05-16 | Memc电子材料有限公司 | 低缺陷密度、理想氧沉淀的硅 |
JPH1179889A (ja) | 1997-07-09 | 1999-03-23 | Shin Etsu Handotai Co Ltd | 結晶欠陥が少ないシリコン単結晶の製造方法、製造装置並びにこの方法、装置で製造されたシリコン単結晶とシリコンウエーハ |
US5942032A (en) | 1997-08-01 | 1999-08-24 | Memc Electronic Materials, Inc. | Heat shield assembly and method of growing vacancy rich single crystal silicon |
US5922127A (en) | 1997-09-30 | 1999-07-13 | Memc Electronic Materials, Inc. | Heat shield for crystal puller |
JP3919308B2 (ja) | 1997-10-17 | 2007-05-23 | 信越半導体株式会社 | 結晶欠陥の少ないシリコン単結晶の製造方法ならびにこの方法で製造されたシリコン単結晶およびシリコンウエーハ |
JP3596257B2 (ja) | 1997-11-19 | 2004-12-02 | 三菱住友シリコン株式会社 | シリコン単結晶ウェーハの製造方法 |
JP3634133B2 (ja) | 1997-12-17 | 2005-03-30 | 信越半導体株式会社 | 結晶欠陥の少ないシリコン単結晶の製造方法及びシリコン単結晶ウエーハ |
JP4147599B2 (ja) | 1997-12-26 | 2008-09-10 | 株式会社Sumco | シリコン単結晶及びその製造方法 |
JP3627498B2 (ja) | 1998-01-19 | 2005-03-09 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
JP3955375B2 (ja) | 1998-01-19 | 2007-08-08 | 信越半導体株式会社 | シリコン単結晶の製造方法およびシリコン単結晶ウエーハ |
DE19823962A1 (de) | 1998-05-28 | 1999-12-02 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung eines Einkristalls |
JPH11349393A (ja) | 1998-06-03 | 1999-12-21 | Shin Etsu Handotai Co Ltd | シリコン単結晶ウエーハおよびシリコン単結晶ウエーハの製造方法 |
US6077343A (en) | 1998-06-04 | 2000-06-20 | Shin-Etsu Handotai Co., Ltd. | Silicon single crystal wafer having few defects wherein nitrogen is doped and a method for producing it |
US6093913A (en) | 1998-06-05 | 2000-07-25 | Memc Electronic Materials, Inc | Electrical heater for crystal growth apparatus with upper sections producing increased heating power compared to lower sections |
DE69901115T2 (de) * | 1998-06-26 | 2002-12-19 | Memc Electronic Materials, Inc. | Verfahren zur herstellung fehlerfreier siliziumkristalle von willkürlichem grossen durchmesser |
CN1155074C (zh) | 1998-09-02 | 2004-06-23 | Memc电子材料有限公司 | 从低缺陷密度的单晶硅上制备硅-绝缘体结构 |
-
1999
- 1999-06-25 DE DE69901115T patent/DE69901115T2/de not_active Expired - Lifetime
- 1999-06-25 US US09/344,709 patent/US6328795B2/en not_active Expired - Lifetime
- 1999-06-25 EP EP99930652A patent/EP1090166B1/de not_active Expired - Lifetime
- 1999-06-25 CN CN99805555A patent/CN1326518A/zh active Pending
- 1999-06-25 WO PCT/US1999/014285 patent/WO2000000674A2/en not_active Application Discontinuation
- 1999-06-25 KR KR1020007010278A patent/KR20010041957A/ko not_active Application Discontinuation
- 1999-06-25 JP JP2000557021A patent/JP2003517412A/ja not_active Ceased
- 1999-07-23 TW TW088110876A patent/TW473564B/zh not_active IP Right Cessation
-
2001
- 2001-10-23 US US10/035,540 patent/US6562123B2/en not_active Expired - Fee Related
-
2003
- 2003-05-13 US US10/437,141 patent/US6913647B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1326518A (zh) | 2001-12-12 |
US6913647B2 (en) | 2005-07-05 |
WO2000000674A2 (en) | 2000-01-06 |
US20020092460A1 (en) | 2002-07-18 |
US20040003770A1 (en) | 2004-01-08 |
US6562123B2 (en) | 2003-05-13 |
WO2000000674A3 (en) | 2002-10-10 |
KR20010041957A (ko) | 2001-05-25 |
DE69901115T2 (de) | 2002-12-19 |
US20010008114A1 (en) | 2001-07-19 |
JP2003517412A (ja) | 2003-05-27 |
US6328795B2 (en) | 2001-12-11 |
TW473564B (en) | 2002-01-21 |
EP1090166B1 (de) | 2002-03-27 |
EP1090166A1 (de) | 2001-04-11 |
WO2000000674A9 (en) | 2000-03-30 |
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