DE69614949D1 - Leistungs-Halbleiterbauteil mit isoliertem Graben-Gate - Google Patents
Leistungs-Halbleiterbauteil mit isoliertem Graben-GateInfo
- Publication number
- DE69614949D1 DE69614949D1 DE69614949T DE69614949T DE69614949D1 DE 69614949 D1 DE69614949 D1 DE 69614949D1 DE 69614949 T DE69614949 T DE 69614949T DE 69614949 T DE69614949 T DE 69614949T DE 69614949 D1 DE69614949 D1 DE 69614949D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- power semiconductor
- trench gate
- insulated trench
- insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/66348—Vertical insulated gate bipolar transistors with a recessed gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66356—Gated diodes, e.g. field controlled diodes [FCD], static induction thyristors [SITh], field controlled thyristors [FCTh]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66363—Thyristors
- H01L29/66371—Thyristors structurally associated with another device, e.g. built-in diode
- H01L29/66378—Thyristors structurally associated with another device, e.g. built-in diode the other device being a controlling field-effect device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7391—Gated diode structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
- H01L29/744—Gate-turn-off devices
- H01L29/745—Gate-turn-off devices with turn-off by field effect
- H01L29/7455—Gate-turn-off devices with turn-off by field effect produced by an insulated gate structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
- H01L29/749—Thyristor-type devices, e.g. having four-zone regenerative action with turn-on by field effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/868—PIN diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thyristors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Element Separation (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18310295 | 1995-07-19 | ||
JP23700295 | 1995-09-14 | ||
JP28096195A JP3850054B2 (ja) | 1995-07-19 | 1995-10-27 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69614949D1 true DE69614949D1 (de) | 2001-10-11 |
DE69614949T2 DE69614949T2 (de) | 2002-04-04 |
Family
ID=27325253
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69627215T Expired - Lifetime DE69627215T2 (de) | 1995-07-19 | 1996-06-12 | Verfahren zur Herstellung eines Halbleiterbauelements |
DE69614949T Expired - Lifetime DE69614949T2 (de) | 1995-07-19 | 1996-06-12 | Leistungs-Halbleiterbauteil mit isoliertem Graben-Gate |
DE69634837T Expired - Fee Related DE69634837T2 (de) | 1995-07-19 | 1996-06-12 | Halbleiterbauteil mit pnpn Struktur |
DE69633310T Expired - Lifetime DE69633310T2 (de) | 1995-07-19 | 1996-06-12 | PIN-Diode mit isoliertem Gate. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69627215T Expired - Lifetime DE69627215T2 (de) | 1995-07-19 | 1996-06-12 | Verfahren zur Herstellung eines Halbleiterbauelements |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69634837T Expired - Fee Related DE69634837T2 (de) | 1995-07-19 | 1996-06-12 | Halbleiterbauteil mit pnpn Struktur |
DE69633310T Expired - Lifetime DE69633310T2 (de) | 1995-07-19 | 1996-06-12 | PIN-Diode mit isoliertem Gate. |
Country Status (7)
Country | Link |
---|---|
US (4) | US5977570A (de) |
EP (5) | EP1030372B1 (de) |
JP (1) | JP3850054B2 (de) |
KR (1) | KR100214207B1 (de) |
CN (2) | CN1236499C (de) |
DE (4) | DE69627215T2 (de) |
TW (1) | TW289156B (de) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3850054B2 (ja) * | 1995-07-19 | 2006-11-29 | 三菱電機株式会社 | 半導体装置 |
DE19705276A1 (de) * | 1996-12-06 | 1998-08-20 | Semikron Elektronik Gmbh | IGBT mit Trench-Gate-Struktur |
DE19727676A1 (de) * | 1997-06-30 | 1999-01-07 | Asea Brown Boveri | MOS gesteuertes Leistungshalbleiterbauelement |
US6259145B1 (en) * | 1998-06-17 | 2001-07-10 | Intel Corporation | Reduced leakage trench isolation |
DE19848596C2 (de) | 1998-10-21 | 2002-01-24 | Roland Sittig | Halbleiterschalter mit gleichmäßig verteilten feinen Steuerstrukturen |
JP3924975B2 (ja) * | 1999-02-05 | 2007-06-06 | 富士電機デバイステクノロジー株式会社 | トレンチ型絶縁ゲートバイポーラトランジスタ |
JP4829003B2 (ja) * | 1999-02-17 | 2011-11-30 | 株式会社日立製作所 | 半導体装置及び電力変換装置 |
US6703707B1 (en) * | 1999-11-24 | 2004-03-09 | Denso Corporation | Semiconductor device having radiation structure |
GB0120595D0 (en) * | 2001-08-24 | 2001-10-17 | Koninkl Philips Electronics Nv | A semiconductor rectifier |
US6750104B2 (en) * | 2001-12-31 | 2004-06-15 | General Semiconductor, Inc. | High voltage power MOSFET having a voltage sustaining region that includes doped columns formed by trench etching using an etchant gas that is also a doping source |
SG124265A1 (en) * | 2002-12-02 | 2006-08-30 | Tadahiro Ohmi | Semiconductor device and method of manufacturing the same |
GB0229217D0 (en) * | 2002-12-14 | 2003-01-22 | Koninkl Philips Electronics Nv | Vertical insulated gate transistor and manufacturing method |
US7173290B2 (en) * | 2003-03-07 | 2007-02-06 | Teledyne Licensing, Llc | Thyristor switch with turn-off current shunt, and operating method |
US6965131B2 (en) * | 2003-03-07 | 2005-11-15 | Rockwell Scientific Licensing, Llc | Thyristor switch with turn-off current shunt, and operating method |
US7279743B2 (en) | 2003-12-02 | 2007-10-09 | Vishay-Siliconix | Closed cell trench metal-oxide-semiconductor field effect transistor |
KR100604527B1 (ko) * | 2003-12-31 | 2006-07-24 | 동부일렉트로닉스 주식회사 | 바이폴라 트랜지스터 제조방법 |
US7183610B2 (en) * | 2004-04-30 | 2007-02-27 | Siliconix Incorporated | Super trench MOSFET including buried source electrode and method of fabricating the same |
US8183629B2 (en) * | 2004-05-13 | 2012-05-22 | Vishay-Siliconix | Stacked trench metal-oxide-semiconductor field effect transistor device |
US6906380B1 (en) | 2004-05-13 | 2005-06-14 | Vishay-Siliconix | Drain side gate trench metal-oxide-semiconductor field effect transistor |
JP2005340626A (ja) * | 2004-05-28 | 2005-12-08 | Toshiba Corp | 半導体装置 |
US6906356B1 (en) * | 2004-09-27 | 2005-06-14 | Rockwell Scientific Licensing, Llc | High voltage switch |
US7341116B2 (en) * | 2005-01-20 | 2008-03-11 | Baker Hughes Incorporated | Drilling efficiency through beneficial management of rock stress levels via controlled oscillations of subterranean cutting elements |
JP2007043123A (ja) * | 2005-07-01 | 2007-02-15 | Toshiba Corp | 半導体装置 |
JP4609656B2 (ja) * | 2005-12-14 | 2011-01-12 | サンケン電気株式会社 | トレンチ構造半導体装置 |
US8471390B2 (en) | 2006-05-12 | 2013-06-25 | Vishay-Siliconix | Power MOSFET contact metallization |
US7748474B2 (en) * | 2006-06-20 | 2010-07-06 | Baker Hughes Incorporated | Active vibration control for subterranean drilling operations |
JP2008124309A (ja) * | 2006-11-14 | 2008-05-29 | Toyota Motor Corp | 半導体装置とその製造方法 |
DE102007018367B4 (de) * | 2007-04-18 | 2013-09-05 | Infineon Technologies Austria Ag | Halbleiterbauelement und Verfahren zu dessen Herstellung |
US8368126B2 (en) | 2007-04-19 | 2013-02-05 | Vishay-Siliconix | Trench metal oxide semiconductor with recessed trench material and remote contacts |
JP5596278B2 (ja) * | 2007-07-10 | 2014-09-24 | 富士電機株式会社 | トレンチ型絶縁ゲートmos半導体装置 |
DE102009005914B4 (de) | 2008-01-28 | 2014-02-13 | Denso Corporation | Halbleitervorrichtung mit Halbleiterelement mit isoliertem Gate und bipolarer Transistor mit isoliertem Gate |
ES2374774B1 (es) * | 2008-03-18 | 2013-01-30 | Consejo Superior De Investigaciones Científicas (Csic) | Método de fabricación de dispositivos rb-igbt. |
US8507945B2 (en) * | 2008-03-31 | 2013-08-13 | Mitsubishi Electric Corporation | Semiconductor device including an insulated gate bipolar transistor (IGBT) |
CN101826551B (zh) * | 2009-03-03 | 2012-12-05 | M-Mos半导体香港有限公司 | 具有低栅电阻的沟槽型半导体功率器件及其制备方法 |
US8629509B2 (en) * | 2009-06-02 | 2014-01-14 | Cree, Inc. | High voltage insulated gate bipolar transistors with minority carrier diverter |
JP2010283132A (ja) | 2009-06-04 | 2010-12-16 | Mitsubishi Electric Corp | 半導体装置 |
US9492063B2 (en) | 2009-06-18 | 2016-11-15 | Endochoice Innovation Center Ltd. | Multi-viewing element endoscope |
US9306056B2 (en) | 2009-10-30 | 2016-04-05 | Vishay-Siliconix | Semiconductor device with trench-like feed-throughs |
US8604525B2 (en) | 2009-11-02 | 2013-12-10 | Vishay-Siliconix | Transistor structure with feed-through source-to-substrate contact |
WO2011111500A1 (ja) | 2010-03-09 | 2011-09-15 | 富士電機システムズ株式会社 | 半導体装置 |
JP5361808B2 (ja) * | 2010-06-23 | 2013-12-04 | 三菱電機株式会社 | 電力用半導体装置 |
JP5865618B2 (ja) | 2010-09-21 | 2016-02-17 | 株式会社東芝 | 半導体装置 |
CN102034715A (zh) * | 2010-10-12 | 2011-04-27 | 上海宏力半导体制造有限公司 | 功率金属氧化物半导体场效应晶体管的制作方法 |
JP2013084904A (ja) * | 2011-09-29 | 2013-05-09 | Toshiba Corp | 半導体装置 |
CN103151251B (zh) * | 2011-12-07 | 2016-06-01 | 无锡华润华晶微电子有限公司 | 沟槽型绝缘栅双极型晶体管及其制备方法 |
US9306047B2 (en) | 2012-10-05 | 2016-04-05 | Hitachi, Ltd. | Semiconductor device and electric power converter in which same is used |
EP2728621A1 (de) * | 2012-11-05 | 2014-05-07 | ABB Technology AG | Leistungshalbleiterbauelement mit isoliertem Gate |
US9293558B2 (en) | 2012-11-26 | 2016-03-22 | Infineon Technologies Austria Ag | Semiconductor device |
US20140167103A1 (en) * | 2012-12-13 | 2014-06-19 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP2014165317A (ja) * | 2013-02-25 | 2014-09-08 | Toshiba Corp | 半導体装置 |
US8710585B1 (en) * | 2013-02-25 | 2014-04-29 | Alpha And Omega Semiconductor Incorporated | High voltage fast recovery trench diode |
JP2015056492A (ja) * | 2013-09-11 | 2015-03-23 | 株式会社東芝 | 半導体装置 |
CN105190900B (zh) * | 2013-09-20 | 2018-01-30 | 三垦电气株式会社 | 半导体装置 |
JP6173987B2 (ja) * | 2013-09-20 | 2017-08-02 | サンケン電気株式会社 | 半導体装置 |
JP6154292B2 (ja) * | 2013-11-06 | 2017-06-28 | トヨタ自動車株式会社 | 半導体装置及び半導体装置の製造方法 |
US9438227B2 (en) * | 2013-12-02 | 2016-09-06 | The Hong Kong University Of Science And Technology | Gate-controlled p-i-n switch with a charge trapping material in the gate dielectric and a self-depleted channel |
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CN103928309B (zh) * | 2014-04-21 | 2017-02-08 | 西安电子科技大学 | N沟道碳化硅绝缘栅双极型晶体管的制备方法 |
US9391184B2 (en) * | 2014-05-27 | 2016-07-12 | Pakal Technologies, Llc | Insulated gate turn-off device with turn-off transistor |
US9425304B2 (en) | 2014-08-21 | 2016-08-23 | Vishay-Siliconix | Transistor structure with improved unclamped inductive switching immunity |
KR101550798B1 (ko) | 2014-08-29 | 2015-09-08 | 파워큐브세미 (주) | 래치업 억제구조를 가지는 전력용 반도체 장치 및 그 제조방법 |
DE112017000063T5 (de) * | 2016-02-15 | 2018-03-22 | Fuji Electric Co., Ltd. | Halbleitervorrichtung |
DE112017000079T5 (de) | 2016-03-10 | 2018-05-17 | Fuji Electric Co., Ltd. | Halbleitervorrichtung |
US9935188B2 (en) * | 2016-07-22 | 2018-04-03 | Pakal Technologies Llc | Insulated gate turn-off device with turn-off Schottky-Barrier MOSFET |
JP6973510B2 (ja) * | 2018-01-17 | 2021-12-01 | 富士電機株式会社 | 半導体装置 |
CN109755130A (zh) * | 2018-11-30 | 2019-05-14 | 中国振华集团永光电子有限公司(国营第八七三厂) | 一种降低输入电容的半导体器件制造方法 |
FR3091021B1 (fr) * | 2018-12-20 | 2021-01-08 | St Microelectronics Tours Sas | Thyristor vertical |
CN111816693A (zh) * | 2019-04-10 | 2020-10-23 | 台湾茂矽电子股份有限公司 | 二极管结构及其制造方法 |
JP7319601B2 (ja) * | 2019-11-01 | 2023-08-02 | 株式会社東芝 | 半導体装置 |
US12068419B2 (en) * | 2019-12-17 | 2024-08-20 | Soreq Nuclear Research Center | High-voltage fast-avalanche diode |
US20230032610A1 (en) * | 2021-07-28 | 2023-02-02 | Pakal Technologies, Llc | Vertical insulated gate power switch with isolated base contact regions |
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JPS5775464A (en) * | 1980-10-28 | 1982-05-12 | Semiconductor Res Found | Semiconductor device controlled by tunnel injection |
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US5381026A (en) * | 1990-09-17 | 1995-01-10 | Kabushiki Kaisha Toshiba | Insulated-gate thyristor |
JP2683302B2 (ja) * | 1991-07-09 | 1997-11-26 | 三菱電機株式会社 | 半導体装置 |
EP1469524A3 (de) * | 1991-08-08 | 2005-07-06 | Kabushiki Kaisha Toshiba | Bipolartransistor mit isoliertem Graben-Gate |
US5448083A (en) * | 1991-08-08 | 1995-09-05 | Kabushiki Kaisha Toshiba | Insulated-gate semiconductor device |
JPH0612559A (ja) * | 1992-02-10 | 1994-01-21 | Shibaura Eng Works Co Ltd | 自動販売機 |
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US5324966A (en) * | 1992-04-07 | 1994-06-28 | Toyo Denki Seizo Kabushiki Kaisha | MOS-controlled thyristor |
JP2983110B2 (ja) * | 1992-06-24 | 1999-11-29 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
US5410170A (en) * | 1993-04-14 | 1995-04-25 | Siliconix Incorporated | DMOS power transistors with reduced number of contacts using integrated body-source connections |
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-
1995
- 1995-10-27 JP JP28096195A patent/JP3850054B2/ja not_active Expired - Lifetime
- 1995-12-15 TW TW084113477A patent/TW289156B/zh not_active IP Right Cessation
-
1996
- 1996-06-12 EP EP00107885A patent/EP1030372B1/de not_active Expired - Lifetime
- 1996-06-12 DE DE69627215T patent/DE69627215T2/de not_active Expired - Lifetime
- 1996-06-12 DE DE69614949T patent/DE69614949T2/de not_active Expired - Lifetime
- 1996-06-12 EP EP01117378A patent/EP1154491B1/de not_active Expired - Lifetime
- 1996-06-12 EP EP00107897A patent/EP1030373A1/de not_active Withdrawn
- 1996-06-12 EP EP96109389A patent/EP0756330B1/de not_active Expired - Lifetime
- 1996-06-12 DE DE69634837T patent/DE69634837T2/de not_active Expired - Fee Related
- 1996-06-12 EP EP01117369A patent/EP1158582B1/de not_active Expired - Lifetime
- 1996-06-12 DE DE69633310T patent/DE69633310T2/de not_active Expired - Lifetime
- 1996-07-11 KR KR1019960027952A patent/KR100214207B1/ko not_active IP Right Cessation
- 1996-07-17 CN CNB981253849A patent/CN1236499C/zh not_active Expired - Fee Related
- 1996-07-17 CN CN96102369A patent/CN1052342C/zh not_active Expired - Fee Related
- 1996-07-18 US US08/683,279 patent/US5977570A/en not_active Expired - Lifetime
-
1998
- 1998-12-30 US US09/222,795 patent/US6265735B1/en not_active Expired - Fee Related
-
2001
- 2001-05-23 US US09/862,619 patent/US6445012B2/en not_active Expired - Fee Related
-
2002
- 2002-08-20 US US10/223,661 patent/US6867437B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69634837D1 (de) | 2005-07-14 |
EP0756330A2 (de) | 1997-01-29 |
KR100214207B1 (ko) | 1999-08-02 |
EP1154491B1 (de) | 2005-06-08 |
EP1154491A1 (de) | 2001-11-14 |
EP1030372A2 (de) | 2000-08-23 |
TW289156B (en) | 1996-10-21 |
US5977570A (en) | 1999-11-02 |
KR970008646A (ko) | 1997-02-24 |
EP1030372A3 (de) | 2000-09-06 |
EP1030373A1 (de) | 2000-08-23 |
DE69634837T2 (de) | 2005-12-22 |
DE69633310D1 (de) | 2004-10-07 |
EP0756330B1 (de) | 2001-09-05 |
US6445012B2 (en) | 2002-09-03 |
EP1158582B1 (de) | 2004-09-01 |
EP0756330A3 (de) | 1999-03-10 |
US6265735B1 (en) | 2001-07-24 |
JPH09139510A (ja) | 1997-05-27 |
DE69614949T2 (de) | 2002-04-04 |
CN1226751A (zh) | 1999-08-25 |
EP1030372B1 (de) | 2003-04-02 |
US20010045566A1 (en) | 2001-11-29 |
DE69627215T2 (de) | 2003-12-18 |
US6867437B2 (en) | 2005-03-15 |
JP3850054B2 (ja) | 2006-11-29 |
CN1142688A (zh) | 1997-02-12 |
EP1158582A1 (de) | 2001-11-28 |
US20030006456A1 (en) | 2003-01-09 |
CN1052342C (zh) | 2000-05-10 |
CN1236499C (zh) | 2006-01-11 |
DE69627215D1 (de) | 2003-05-08 |
DE69633310T2 (de) | 2005-09-15 |
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