DE69524276D1 - Resurf-laterale-DMOS-Bauelemente mit erweitertem Drain - Google Patents
Resurf-laterale-DMOS-Bauelemente mit erweitertem DrainInfo
- Publication number
- DE69524276D1 DE69524276D1 DE69524276T DE69524276T DE69524276D1 DE 69524276 D1 DE69524276 D1 DE 69524276D1 DE 69524276 T DE69524276 T DE 69524276T DE 69524276 T DE69524276 T DE 69524276T DE 69524276 D1 DE69524276 D1 DE 69524276D1
- Authority
- DE
- Germany
- Prior art keywords
- resurf
- extended drain
- lateral dmos
- dmos devices
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/126—Power FETs
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22491494A | 1994-04-08 | 1994-04-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69524276D1 true DE69524276D1 (de) | 2002-01-17 |
DE69524276T2 DE69524276T2 (de) | 2002-08-08 |
Family
ID=22842748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69524276T Expired - Fee Related DE69524276T2 (de) | 1994-04-08 | 1995-04-10 | Resurf-laterale-DMOS-Bauelemente mit erweitertem Drain |
Country Status (6)
Country | Link |
---|---|
US (1) | US5512495A (de) |
EP (1) | EP0676799B1 (de) |
JP (1) | JPH07297294A (de) |
KR (1) | KR100396170B1 (de) |
DE (1) | DE69524276T2 (de) |
TW (1) | TW305057B (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW366543B (en) * | 1996-12-23 | 1999-08-11 | Nxp Bv | Semiconductor device |
KR100249505B1 (ko) * | 1997-10-28 | 2000-03-15 | 정선종 | 수평형 이중 확산 전력 소자의 제조 방법 |
KR100300069B1 (ko) | 1999-05-10 | 2001-09-26 | 김영환 | 반도체 소자 및 그 제조방법 |
JP2001015741A (ja) * | 1999-06-30 | 2001-01-19 | Toshiba Corp | 電界効果トランジスタ |
EP1115158A1 (de) | 2000-01-05 | 2001-07-11 | Mitsubishi Denki Kabushiki Kaisha | Soi-misfet |
GB2374456A (en) * | 2000-12-09 | 2002-10-16 | Esm Ltd | High-voltage metal oxide semiconductor device and method of forming the device |
US6468870B1 (en) * | 2000-12-26 | 2002-10-22 | Taiwan Semiconductor Manufacturing Company | Method of fabricating a LDMOS transistor |
US6501139B1 (en) * | 2001-03-30 | 2002-12-31 | Matrix Semiconductor, Inc. | High-voltage transistor and fabrication process |
KR100867574B1 (ko) * | 2002-05-09 | 2008-11-10 | 페어차일드코리아반도체 주식회사 | 고전압 디바이스 및 그 제조방법 |
KR100519642B1 (ko) * | 2003-12-31 | 2005-10-07 | 동부아남반도체 주식회사 | 반도체 소자 형성 방법 |
DE102004009521B4 (de) * | 2004-02-27 | 2020-06-10 | Austriamicrosystems Ag | Hochvolt-PMOS-Transistor, Maske zur Herstellung einer Wanne und Verfahren zur Herstellung eines Hochvolt-PMOS-Transistors |
DE102004038369B4 (de) * | 2004-08-06 | 2018-04-05 | Austriamicrosystems Ag | Hochvolt-NMOS-Transistor und Herstellungsverfahren |
JP4959931B2 (ja) * | 2004-09-29 | 2012-06-27 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置の製造方法 |
KR100614806B1 (ko) * | 2004-10-27 | 2006-08-22 | 삼성전자주식회사 | 고내압 트랜지스터 및 이의 제조 방법 |
US7045830B1 (en) * | 2004-12-07 | 2006-05-16 | Fairchild Semiconductor Corporation | High-voltage diodes formed in advanced power integrated circuit devices |
US20060148103A1 (en) * | 2004-12-30 | 2006-07-06 | Yin-Peng Chen | Highly sensitive biological assays |
US20060220170A1 (en) * | 2005-03-31 | 2006-10-05 | Chih-Feng Huang | High-voltage field effect transistor having isolation structure |
US8174071B2 (en) * | 2008-05-02 | 2012-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | High voltage LDMOS transistor |
US20100270614A1 (en) * | 2009-04-22 | 2010-10-28 | Stmicroelectronics S.R.L. | Process for manufacturing devices for power applications in integrated circuits |
EP2402998B1 (de) * | 2010-07-01 | 2020-04-08 | ams AG | Herstellung eines p-Kanal-LDMOS-Transistors |
US8664720B2 (en) | 2010-08-25 | 2014-03-04 | Infineon Technologies Ag | High voltage semiconductor devices |
US8754469B2 (en) * | 2010-10-26 | 2014-06-17 | Texas Instruments Incorporated | Hybrid active-field gap extended drain MOS transistor |
EP2665101B1 (de) | 2012-05-14 | 2018-10-31 | ams AG | Verfahren zur Herstellung eines Hochspannungs-LDMOS-Transistors |
CN104167360B (zh) * | 2013-05-16 | 2017-05-31 | 无锡华润上华半导体有限公司 | 横向扩散金属氧化物半导体器件及其制造方法 |
CN105720099A (zh) * | 2014-12-02 | 2016-06-29 | 无锡华润上华半导体有限公司 | N型横向双扩散金属氧化物半导体场效应管 |
US10566200B2 (en) * | 2018-04-03 | 2020-02-18 | Texas Instruments Incorporated | Method of fabricating transistors, including ambient oxidizing after etchings into barrier layers and anti-reflecting coatings |
TWI656642B (zh) * | 2018-05-08 | 2019-04-11 | 立錡科技股份有限公司 | 橫向雙擴散金屬氧化物半導體元件及其製造方法 |
CN113380787B (zh) * | 2021-08-13 | 2022-02-25 | 上海维安半导体有限公司 | 一种双向瞬态电压抑制器件及其制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8203870A (nl) * | 1982-10-06 | 1984-05-01 | Philips Nv | Halfgeleiderinrichting. |
JPH07105434B2 (ja) * | 1985-08-12 | 1995-11-13 | 松下電子工業株式会社 | 半導体装置の製造方法 |
JPH077795B2 (ja) * | 1985-12-03 | 1995-01-30 | 株式会社東芝 | 半導体装置の製造方法 |
US5264719A (en) * | 1986-01-07 | 1993-11-23 | Harris Corporation | High voltage lateral semiconductor device |
US4987093A (en) * | 1987-04-15 | 1991-01-22 | Texas Instruments Incorporated | Through-field implant isolated devices and method |
US4984196A (en) * | 1988-05-25 | 1991-01-08 | Texas Instruments, Incorporated | High performance bipolar differential sense amplifier in a BiCMOS SRAM |
US5156989A (en) * | 1988-11-08 | 1992-10-20 | Siliconix, Incorporated | Complementary, isolated DMOS IC technology |
JPH02226743A (ja) * | 1989-02-28 | 1990-09-10 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US5047358A (en) * | 1989-03-17 | 1991-09-10 | Delco Electronics Corporation | Process for forming high and low voltage CMOS transistors on a single integrated circuit chip |
JP2504573B2 (ja) * | 1989-08-08 | 1996-06-05 | 株式会社東芝 | 半導体装置及びその製造方法 |
US5013671A (en) * | 1990-06-20 | 1991-05-07 | Texas Instruments Incorporated | Process for reduced emitter-base capacitance in bipolar transistor |
DE69225552T2 (de) * | 1991-10-15 | 1999-01-07 | Texas Instruments Inc | Lateraler doppel-diffundierter MOS-Transistor und Verfahren zu seiner Herstellung |
US5306652A (en) * | 1991-12-30 | 1994-04-26 | Texas Instruments Incorporated | Lateral double diffused insulated gate field effect transistor fabrication process |
US5322804A (en) * | 1992-05-12 | 1994-06-21 | Harris Corporation | Integration of high voltage lateral MOS devices in low voltage CMOS architecture using CMOS-compatible process steps |
US5346835A (en) * | 1992-07-06 | 1994-09-13 | Texas Instruments Incorporated | Triple diffused lateral resurf insulated gate field effect transistor compatible with process and method |
US5422508A (en) * | 1992-09-21 | 1995-06-06 | Siliconix Incorporated | BiCDMOS structure |
US5328859A (en) * | 1993-01-04 | 1994-07-12 | Xerox Corporation | Method of making high voltage PNP bipolar transistor in CMOS |
-
1995
- 1995-02-16 US US08/390,269 patent/US5512495A/en not_active Expired - Lifetime
- 1995-04-08 KR KR1019950008215A patent/KR100396170B1/ko not_active IP Right Cessation
- 1995-04-10 JP JP7120339A patent/JPH07297294A/ja active Pending
- 1995-04-10 EP EP95105403A patent/EP0676799B1/de not_active Expired - Lifetime
- 1995-04-10 DE DE69524276T patent/DE69524276T2/de not_active Expired - Fee Related
- 1995-06-09 TW TW084105846A patent/TW305057B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH07297294A (ja) | 1995-11-10 |
US5512495A (en) | 1996-04-30 |
KR100396170B1 (ko) | 2003-11-14 |
TW305057B (de) | 1997-05-11 |
EP0676799B1 (de) | 2001-12-05 |
KR950034761A (ko) | 1995-12-28 |
EP0676799A2 (de) | 1995-10-11 |
EP0676799A3 (de) | 1996-06-12 |
DE69524276T2 (de) | 2002-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69524276D1 (de) | Resurf-laterale-DMOS-Bauelemente mit erweitertem Drain | |
DE59711755D1 (de) | IGBT mit Trench-Gate-Struktur | |
DE69511217T2 (de) | Abflusspumpe | |
DE69528203D1 (de) | Transistor | |
FI945113A (fi) | Viemärikaivo | |
DK0948683T3 (da) | Aflöbsanordning | |
DE9405483U1 (de) | Sektionaltor | |
DE9407477U1 (de) | Ablaufvorrichtung | |
DE59500137D1 (de) | Sektionaltor | |
DE9406924U1 (de) | Abfluß | |
DE9422260U1 (de) | Entwässerungsrinne | |
DE9410255U1 (de) | Straßenablaufaufsatz | |
ATA101396A (de) | Tor | |
DE9316947U1 (de) | Straßenablauf | |
DE9421755U1 (de) | Selektionaltor | |
KR960008209U (ko) | 배수판 | |
KR950030550U (ko) | 수로용 문비기 | |
DE9417821U1 (de) | Drainbeton | |
DE9419516U1 (de) | Torbeschlag | |
DE9422220U1 (de) | Entwässerungsrinne | |
KR950027665U (ko) | 배수관 | |
KR950027667U (ko) | 배수관 | |
DE29520036U1 (de) | Hochaster mit Ablaßvorrichtung | |
SE9303776D0 (sv) | Avloppsanordning | |
KR960005244U (ko) | 지중 배수관 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |