DE69325216D1 - Flüssigkristallanzeigevorrichtung, Vorrichtung und Verfahren zum Montieren von Halbleiterelementen und elektronisches Druckgerät - Google Patents
Flüssigkristallanzeigevorrichtung, Vorrichtung und Verfahren zum Montieren von Halbleiterelementen und elektronisches DruckgerätInfo
- Publication number
- DE69325216D1 DE69325216D1 DE69325216T DE69325216T DE69325216D1 DE 69325216 D1 DE69325216 D1 DE 69325216D1 DE 69325216 T DE69325216 T DE 69325216T DE 69325216 T DE69325216 T DE 69325216T DE 69325216 D1 DE69325216 D1 DE 69325216D1
- Authority
- DE
- Germany
- Prior art keywords
- liquid crystal
- crystal display
- semiconductor elements
- electronic printing
- assembling semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23969892 | 1992-09-08 | ||
JP15732393 | 1993-06-28 | ||
JP15861193 | 1993-06-29 | ||
JP15861093 | 1993-06-29 | ||
JP15861293 | 1993-06-29 | ||
JP15861393 | 1993-06-29 | ||
JP16364893 | 1993-07-01 | ||
JP16364693 | 1993-07-01 | ||
JP16364593 | 1993-07-01 | ||
JP16364793 | 1993-07-01 | ||
JP18292493 | 1993-07-23 | ||
JP20086593 | 1993-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69325216D1 true DE69325216D1 (de) | 1999-07-15 |
DE69325216T2 DE69325216T2 (de) | 1999-12-09 |
Family
ID=27583467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69325216T Expired - Lifetime DE69325216T2 (de) | 1992-09-08 | 1993-09-08 | Flüssigkristallanzeigevorrichtung, Vorrichtung und Verfahren zum Montieren von Halbleiterelementen und elektronisches Druckgerät |
Country Status (5)
Country | Link |
---|---|
US (3) | US5737272A (de) |
EP (2) | EP0587144B1 (de) |
KR (2) | KR100370698B1 (de) |
DE (1) | DE69325216T2 (de) |
HK (1) | HK1014274A1 (de) |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0680082B1 (de) * | 1993-11-12 | 2003-04-09 | Seiko Epson Corporation | Struktur zur montage eines halbleiters- und eines fluessigkristallanzeigeapparates |
KR100297063B1 (ko) * | 1993-12-03 | 2001-10-22 | 야마자끼 순페이 | 표시장치및그표시장치를가지는전자장치 |
JP3648741B2 (ja) * | 1994-09-16 | 2005-05-18 | セイコーエプソン株式会社 | 液晶表示装置,その実装構造,及び電子機器 |
JP3082129B2 (ja) * | 1995-03-27 | 2000-08-28 | セイコーインスツルメンツ株式会社 | 液晶表示装置 |
KR100338480B1 (ko) * | 1995-08-19 | 2003-01-24 | 엘지.필립스 엘시디 주식회사 | 액정표시장치및그제조방법 |
JP3640675B2 (ja) * | 1995-11-06 | 2005-04-20 | セイコーエプソン株式会社 | 通信装置 |
GB2307598B (en) * | 1995-11-24 | 2000-02-23 | Varintelligent | Combined printed circuit board and integrated circuit driver |
JP3343642B2 (ja) * | 1996-04-26 | 2002-11-11 | シャープ株式会社 | テープキャリアパッケージ及び液晶表示装置 |
JP3980066B2 (ja) * | 1996-09-20 | 2007-09-19 | 株式会社ルネサステクノロジ | 液晶表示装置の製造方法 |
KR100218581B1 (ko) | 1997-04-08 | 1999-09-01 | 구자홍 | 액정표시장치를 가지는 휴대용 컴퓨터 |
US7492421B1 (en) | 1997-07-03 | 2009-02-17 | Lg Display Co., Ltd. | Case for liquid crystal display |
KR100529567B1 (ko) * | 1997-08-08 | 2006-02-08 | 삼성전자주식회사 | 구동집적회로및이를포함하는표시장치 |
US6190006B1 (en) | 1997-11-06 | 2001-02-20 | Seiko Epson Corporation | Ink-jet recording head |
TWI235272B (en) * | 1997-11-19 | 2005-07-01 | Toshiba Corp | Flat panel display device and manufacturing method thereof |
JP3873478B2 (ja) * | 1997-12-25 | 2007-01-24 | セイコーエプソン株式会社 | 液晶表示装置、電子機器及び液晶表示装置の製造方法 |
CN1179609C (zh) * | 1998-04-09 | 2004-12-08 | 精工爱普生株式会社 | 压接连接衬底、液晶装置及电子设备 |
US6123551A (en) * | 1998-10-06 | 2000-09-26 | Northern Telecom Limited | Electronic circuit interconnection method and apparatus |
US6501641B1 (en) | 1998-10-23 | 2002-12-31 | Lg. Philips Lcd Co. Ltd. | Portable computer having a flat panel display device |
KR100508003B1 (ko) | 1998-11-11 | 2005-11-21 | 엘지.필립스 엘시디 주식회사 | 휴대용컴퓨터와그평판표시장치의결합방법 |
JP3737899B2 (ja) * | 1999-01-29 | 2006-01-25 | 日東電工株式会社 | 半導体素子の検査方法およびそのための異方導電性フィルム |
US7339568B2 (en) * | 1999-04-16 | 2008-03-04 | Samsung Electronics Co., Ltd. | Signal transmission film and a liquid crystal display panel having the same |
KR100304261B1 (ko) * | 1999-04-16 | 2001-09-26 | 윤종용 | 테이프 캐리어 패키지, 그를 포함한 액정표시패널 어셈블리,그를 채용한 액정표시장치 및 이들의 조립 방법 |
JP3543676B2 (ja) * | 1999-06-02 | 2004-07-14 | セイコーエプソン株式会社 | マルチチップの実装構造及びその実装構造の製造方法、ならびに電気光学装置及び電子機器 |
TW507100B (en) * | 1999-06-29 | 2002-10-21 | Advanced Display Kk | Liquid crystal display device |
JP2001142090A (ja) * | 1999-11-11 | 2001-05-25 | Hitachi Ltd | 液晶表示装置 |
SE516936C2 (sv) | 1999-12-10 | 2002-03-26 | Ericsson Telefon Ab L M | Flytande-kristalldisplay, LCD |
KR100323826B1 (ko) * | 2000-03-02 | 2002-02-19 | 구본준, 론 위라하디락사 | 액정표시장치 |
FR2807256B1 (fr) * | 2000-03-29 | 2002-12-06 | Sagem | Appareil electronique muni d'un clavier simplifie notamment un telephone mobile |
US6404043B1 (en) * | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
JP3892650B2 (ja) * | 2000-07-25 | 2007-03-14 | 株式会社日立製作所 | 液晶表示装置 |
US7019808B2 (en) * | 2000-09-21 | 2006-03-28 | Citizen Watch Co., Ltd. | Image device |
US6582980B2 (en) | 2001-01-30 | 2003-06-24 | Eastman Kodak Company | System for integrating digital control with common substrate display devices |
KR100392603B1 (ko) * | 2001-04-09 | 2003-07-28 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 구동 아이씨 연결부 |
US6573660B2 (en) * | 2001-04-30 | 2003-06-03 | Intel Corporation | Driving emissive displays |
KR100799375B1 (ko) * | 2001-10-10 | 2008-01-31 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 |
KR20030055856A (ko) * | 2001-12-27 | 2003-07-04 | 엘지.필립스 엘시디 주식회사 | 필름 타입 터치패널 일체형 액정표시장치의 제조방법 |
JP4008245B2 (ja) * | 2002-01-25 | 2007-11-14 | シャープ株式会社 | 表示装置用駆動装置 |
JP4720069B2 (ja) | 2002-04-18 | 2011-07-13 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
JP2004109969A (ja) * | 2002-07-22 | 2004-04-08 | Fujitsu Display Technologies Corp | 液晶表示装置 |
JP4314084B2 (ja) * | 2002-09-17 | 2009-08-12 | シャープ株式会社 | 表示装置 |
JP2004184797A (ja) * | 2002-12-05 | 2004-07-02 | Seiko Epson Corp | 電子装置及びその製造方法並びに電子機器 |
EP1437683B1 (de) * | 2002-12-27 | 2017-03-08 | Semiconductor Energy Laboratory Co., Ltd. | Chipkarte und Buchhaltungssystem unter Verwendung der Chipkarte |
US7652359B2 (en) * | 2002-12-27 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Article having display device |
US7200050B2 (en) * | 2003-05-26 | 2007-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Memory unit and semiconductor device |
US7566001B2 (en) * | 2003-08-29 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | IC card |
KR101041057B1 (ko) * | 2004-01-09 | 2011-06-13 | 삼성전자주식회사 | 표시장치 |
JP2005300920A (ja) * | 2004-04-12 | 2005-10-27 | Nec Corp | 表示装置及び液晶表示装置 |
JP4938239B2 (ja) * | 2004-04-23 | 2012-05-23 | シャープ株式会社 | 表示装置 |
US7438957B2 (en) * | 2005-07-18 | 2008-10-21 | Akon Polymer Systems | Poly(aryletherimides) for negative birefringent films for LCDs |
KR100723492B1 (ko) * | 2005-07-18 | 2007-06-04 | 삼성전자주식회사 | 디스플레이 드라이버 집적회로 장치와 필름 및 이들을포함하는 모듈 |
EP1764770A3 (de) * | 2005-09-16 | 2012-03-14 | Semiconductor Energy Laboratory Co., Ltd. | Anzeigevorrichtung und Ansteuerverfahren für eine Anzeigevorrichtung |
KR100684726B1 (ko) * | 2005-09-27 | 2007-02-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100742376B1 (ko) * | 2005-09-30 | 2007-07-24 | 삼성에스디아이 주식회사 | 패드부 및 그 제조 방법 |
JP2007139912A (ja) * | 2005-11-15 | 2007-06-07 | Sharp Corp | 駆動素子実装表示装置 |
KR20070106151A (ko) * | 2006-04-28 | 2007-11-01 | 엘지전자 주식회사 | 디스플레이 장치 |
KR101352344B1 (ko) * | 2006-09-13 | 2014-01-15 | 삼성디스플레이 주식회사 | 신호전송 부재 및 이를 갖는 표시장치 |
KR101365176B1 (ko) * | 2007-03-02 | 2014-02-21 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
KR101000707B1 (ko) * | 2007-04-06 | 2010-12-10 | 파나소닉 주식회사 | 플라즈마 디스플레이 장치 |
JPWO2008132941A1 (ja) * | 2007-04-13 | 2010-07-22 | 昭和電工株式会社 | 発光装置、および表示装置 |
KR101385094B1 (ko) | 2007-09-11 | 2014-04-14 | 삼성디스플레이 주식회사 | 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법 |
JP5106341B2 (ja) * | 2008-10-02 | 2012-12-26 | 株式会社ジャパンディスプレイイースト | 表示装置 |
JP2011197515A (ja) * | 2010-03-23 | 2011-10-06 | Seiko Epson Corp | 基板接続構造およびプロジェクター |
US9188819B2 (en) * | 2013-10-29 | 2015-11-17 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Liquid crystal display and apparatus |
TWI557469B (zh) * | 2014-03-07 | 2016-11-11 | 瑞鼎科技股份有限公司 | 顯示器之驅動裝置的封裝結構 |
CN104582263A (zh) * | 2015-01-23 | 2015-04-29 | 京东方科技集团股份有限公司 | 柔性电路板及其组装方法、显示装置 |
KR102504107B1 (ko) * | 2015-10-27 | 2023-02-27 | 삼성전자주식회사 | 멀티미디어 인터페이스 커넥터와 이를 구비한 전자 기기 |
CN105572947A (zh) * | 2016-03-18 | 2016-05-11 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
CN105741678A (zh) * | 2016-04-05 | 2016-07-06 | 深圳市华星光电技术有限公司 | Cof结构、驱动电路及显示装置 |
US20170287380A1 (en) * | 2016-04-05 | 2017-10-05 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Cof structure, driving circuit and display device |
KR20180003365A (ko) * | 2016-06-30 | 2018-01-09 | 엘지디스플레이 주식회사 | 구동칩이 구비된 인쇄 회로부 및 이를 포함하는 표시 장치 |
KR102394796B1 (ko) * | 2016-10-26 | 2022-05-06 | 주식회사 엘엑스세미콘 | 멀티칩 구조의 반도체 장치 및 그를 이용한 반도체 모듈 |
WO2018080185A1 (ko) * | 2016-10-26 | 2018-05-03 | 주식회사 실리콘웍스 | 멀티칩 구조의 반도체 장치 및 그를 이용한 반도체 모듈 |
CN106526926B (zh) * | 2016-12-20 | 2019-05-31 | 深圳市华星光电技术有限公司 | 多层电路结构 |
CN107831610A (zh) * | 2017-10-26 | 2018-03-23 | 惠科股份有限公司 | 信号传输装置及显示装置 |
TWI744575B (zh) * | 2018-05-11 | 2021-11-01 | 瑞鼎科技股份有限公司 | 應用於顯示器之驅動裝置的封裝結構 |
KR102645335B1 (ko) * | 2018-06-27 | 2024-03-11 | 삼성디스플레이 주식회사 | 표시 모듈, 표시 장치 및 표시 모듈 제조 방법 |
US10678104B2 (en) * | 2018-09-27 | 2020-06-09 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Display panel with flexible circuit board regions and display module |
CN110473470B (zh) * | 2019-07-10 | 2023-02-21 | 闻泰通讯股份有限公司 | 柔性屏封装连接件及电子设备 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4142287A (en) * | 1976-12-27 | 1979-03-06 | Amp Incorporated | Electrical devices such as watches and method of construction thereof |
JPS5651846A (en) * | 1979-10-04 | 1981-05-09 | Fujitsu Ltd | Ic package |
US4320438A (en) * | 1980-05-15 | 1982-03-16 | Cts Corporation | Multi-layer ceramic package |
JPS6053993A (ja) * | 1983-09-05 | 1985-03-28 | シャープ株式会社 | 表示体駆動回路 |
JPS60149079A (ja) * | 1984-01-13 | 1985-08-06 | シャープ株式会社 | 表示体ユニツト接続装置 |
US4613855A (en) * | 1984-03-05 | 1986-09-23 | Dale Electronics, Inc. | Direct current dot matrix plasma display having integrated drivers |
JPH0827595B2 (ja) * | 1985-03-12 | 1996-03-21 | シャープ株式会社 | 表示装置 |
US4758896A (en) * | 1985-12-10 | 1988-07-19 | Citizen Watch Co., Ltd. | 3-Dimensional integrated circuit for liquid crystal display TV receiver |
JPS62280889A (ja) * | 1986-05-30 | 1987-12-05 | シャープ株式会社 | 平面形表示装置 |
JP2527766B2 (ja) * | 1986-10-09 | 1996-08-28 | 沖電気工業株式会社 | 液晶表示装置 |
US4764846A (en) * | 1987-01-05 | 1988-08-16 | Irvine Sensors Corporation | High density electronic package comprising stacked sub-modules |
JPS63210914A (ja) * | 1987-02-27 | 1988-09-01 | Citizen Watch Co Ltd | カラ−液晶表示パネル |
DE3731787C2 (de) * | 1987-09-22 | 2000-11-16 | Aeg Ges Moderne Inf Sys Mbh | Anordnung von mehreren IC's auf einem Bandstreifen aus Isoliermaterial |
US4836651A (en) * | 1987-12-03 | 1989-06-06 | Anderson Richard A | Flexible circuit interconnection for a matrix addressed liquid crystal panel |
US5293262A (en) * | 1988-03-15 | 1994-03-08 | Mitsubishi Denki Kabushiki Kaisha | Liquid crystal display device having heat-insulating members and driving circuit boards attached to rear edges of light box |
US5029984A (en) * | 1988-03-15 | 1991-07-09 | Mitsubishi Denki Kabushiki Kaisha | Liquid crystal display device |
JPH0245998A (ja) * | 1988-08-08 | 1990-02-15 | Hitachi Ltd | 薄膜多層配線基板 |
JPH02137822A (ja) * | 1988-11-18 | 1990-05-28 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
US4907128A (en) * | 1988-12-15 | 1990-03-06 | Grumman Aerospace Corporation | Chip to multilevel circuit board bonding |
JPH02213147A (ja) * | 1989-02-13 | 1990-08-24 | Shimadzu Corp | フリップチップ法による実装構造 |
JPH02214826A (ja) * | 1989-02-16 | 1990-08-27 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
JP2737986B2 (ja) * | 1989-02-27 | 1998-04-08 | セイコーエプソン株式会社 | 液晶装置 |
JP3007642B2 (ja) * | 1989-08-28 | 2000-02-07 | 松下電器産業株式会社 | 液晶表示装置 |
JPH03241392A (ja) * | 1990-02-20 | 1991-10-28 | Casio Comput Co Ltd | 表示パネルの実装構造 |
US5200847A (en) * | 1990-05-01 | 1993-04-06 | Casio Computer Co., Ltd. | Liquid crystal display device having driving circuit forming on a heat-resistant sub-substrate |
US4992628A (en) * | 1990-05-07 | 1991-02-12 | Kyocera America, Inc. | Ceramic-glass integrated circuit package with ground plane |
JPH04115227A (ja) * | 1990-09-05 | 1992-04-16 | Ricoh Co Ltd | 液晶表示装置 |
JPH04115228A (ja) * | 1990-09-05 | 1992-04-16 | Ricoh Co Ltd | 液晶表示装置 |
US5166774A (en) * | 1990-10-05 | 1992-11-24 | Motorola, Inc. | Selectively releasing conductive runner and substrate assembly having non-planar areas |
JP2920843B2 (ja) * | 1991-03-13 | 1999-07-19 | 株式会社日立製作所 | 液晶表示装置 |
US5138430A (en) * | 1991-06-06 | 1992-08-11 | International Business Machines Corporation | High performance versatile thermally enhanced IC chip mounting |
US5289824A (en) * | 1991-12-26 | 1994-03-01 | Instromedix, Inc. | Wrist-worn ECG monitor |
TW232065B (de) * | 1992-04-16 | 1994-10-11 | Sharp Kk | |
JPH0629677A (ja) * | 1992-07-10 | 1994-02-04 | Fujitsu Ltd | スイッチ基板ユニット |
US5751556A (en) * | 1996-03-29 | 1998-05-12 | Intel Corporation | Method and apparatus for reducing warpage of an assembly substrate |
-
1993
- 1993-09-08 EP EP93114425A patent/EP0587144B1/de not_active Expired - Lifetime
- 1993-09-08 US US08/117,899 patent/US5737272A/en not_active Expired - Lifetime
- 1993-09-08 KR KR1019930017982A patent/KR100370698B1/ko not_active IP Right Cessation
- 1993-09-08 DE DE69325216T patent/DE69325216T2/de not_active Expired - Lifetime
- 1993-09-08 EP EP98110823A patent/EP0867942B1/de not_active Expired - Lifetime
-
1997
- 1997-06-27 US US08/884,476 patent/US5986342A/en not_active Expired - Fee Related
- 1997-06-27 US US08/884,477 patent/US6128063A/en not_active Expired - Fee Related
-
1998
- 1998-12-24 HK HK98115541A patent/HK1014274A1/xx not_active IP Right Cessation
-
2001
- 2001-07-30 KR KR1020010045864A patent/KR100392154B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0867942B1 (de) | 2002-04-24 |
EP0587144A3 (en) | 1994-06-08 |
US5737272A (en) | 1998-04-07 |
EP0587144B1 (de) | 1999-06-09 |
DE69325216T2 (de) | 1999-12-09 |
KR940007578A (ko) | 1994-04-27 |
EP0867942A2 (de) | 1998-09-30 |
EP0587144A2 (de) | 1994-03-16 |
HK1014274A1 (en) | 1999-09-24 |
US6128063A (en) | 2000-10-03 |
US5986342A (en) | 1999-11-16 |
EP0867942A3 (de) | 1998-12-16 |
KR100392154B1 (ko) | 2003-07-22 |
KR100370698B1 (ko) | 2003-03-31 |
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