DE19581894T1 - IC-Transportvorrichtung, Vorrichtung zum Änderung der Ausrichtung von ICs, und Vorrichtung zum Herausnehmen von ICs - Google Patents

IC-Transportvorrichtung, Vorrichtung zum Änderung der Ausrichtung von ICs, und Vorrichtung zum Herausnehmen von ICs

Info

Publication number
DE19581894T1
DE19581894T1 DE19581894T DE19581894T DE19581894T1 DE 19581894 T1 DE19581894 T1 DE 19581894T1 DE 19581894 T DE19581894 T DE 19581894T DE 19581894 T DE19581894 T DE 19581894T DE 19581894 T1 DE19581894 T1 DE 19581894T1
Authority
DE
Germany
Prior art keywords
ics
orientation
changing
transport
transport device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19581894T
Other languages
English (en)
Other versions
DE19581894C2 (de
Inventor
Yutaka Watanabe
Hiroshi Okuda
Kazuyuki Yamashita
Makoto Sagawa
Haruki Nakajima
Shigenori Kawano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE19581894T1 publication Critical patent/DE19581894T1/de
Application granted granted Critical
Publication of DE19581894C2 publication Critical patent/DE19581894C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE19581894T 1995-11-06 1995-11-24 Vorrichtung zum Ändern der Ausrichtung von ICs Expired - Fee Related DE19581894C2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28765595 1995-11-06
PCT/JP1995/002393 WO1997017619A1 (fr) 1995-11-06 1995-11-24 Transporteur, changeur de position et dispositif de prelevement pour circuits integres

Publications (2)

Publication Number Publication Date
DE19581894T1 true DE19581894T1 (de) 1998-01-08
DE19581894C2 DE19581894C2 (de) 1999-12-23

Family

ID=17720023

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19581894T Expired - Fee Related DE19581894C2 (de) 1995-11-06 1995-11-24 Vorrichtung zum Ändern der Ausrichtung von ICs

Country Status (5)

Country Link
US (2) US6074158A (de)
KR (1) KR100230070B1 (de)
DE (1) DE19581894C2 (de)
TW (1) TW350991B (de)
WO (1) WO1997017619A1 (de)

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* Cited by examiner, † Cited by third party
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JP4210801B2 (ja) * 1997-05-23 2009-01-21 モレックス インコーポレーテッド コネクタ供給装置
JP3958852B2 (ja) * 1997-12-22 2007-08-15 株式会社日本マイクロニクス 被測定基板の検査装置
JP3430918B2 (ja) * 1998-05-15 2003-07-28 株式会社村田製作所 部品搬送装置
TW490564B (en) * 1999-02-01 2002-06-11 Mirae Corp A carrier handling apparatus for module IC handler, and method thereof
US6264415B1 (en) * 1999-09-30 2001-07-24 Advanced Micro Devices, Inc. Mechanism for accurately transferring a predetermined number of integrated circuit packages from tube to tube
WO2001073458A1 (en) * 2000-03-06 2001-10-04 Vladimir Nikolaevich Davidov Apparatus for processing and sorting semiconductor devices received in trays
US6371715B1 (en) * 2000-07-03 2002-04-16 Advanced Micro Devices, Inc. Automated tube to tube transfer of a predetermined number of IC packages for various types of IC packages
US20030205030A1 (en) * 2001-02-22 2003-11-06 Martin Weiss Taper machine using inertial control of parts
US6734694B2 (en) * 2001-03-19 2004-05-11 Juki Corporation Method and apparatus for automatically testing semiconductor device
US6719518B2 (en) * 2001-10-15 2004-04-13 Anadigics, Inc. Portable tube holder apparatus
US6771060B1 (en) * 2001-10-22 2004-08-03 Electroglas, Inc. Testing circuits on substrates
US6861859B1 (en) 2001-10-22 2005-03-01 Electroglas, Inc. Testing circuits on substrates
US6781394B1 (en) * 2001-10-22 2004-08-24 Electroglas, Inc. Testing circuits on substrate
DE10208757B4 (de) * 2002-02-28 2006-06-29 Infineon Technologies Ag Verfahren und Magazinvorrichtung zur Prüfung von Halbleitereinrichtungen
WO2006116767A1 (en) 2005-04-27 2006-11-02 Aehr Test Systems Apparatus for testing electronic devices
TWI275814B (en) * 2005-07-22 2007-03-11 King Yuan Electronics Co Ltd Electronic component testing apparatus
US7501809B2 (en) * 2005-09-22 2009-03-10 King Yuan Electronics Co., Ltd. Electronic component handling and testing apparatus and method for electronic component handling and testing
US7528617B2 (en) * 2006-03-07 2009-05-05 Testmetrix, Inc. Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
KR100866156B1 (ko) 2007-03-16 2008-10-30 미래산업 주식회사 반도체 소자 테스트용 핸들러 및 테스트방법
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
KR100990886B1 (ko) 2008-11-13 2010-11-01 (주) 에스에스피 자동화 장비의 자재공급장치
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
JP2015184162A (ja) * 2014-03-25 2015-10-22 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2015184165A (ja) * 2014-03-25 2015-10-22 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN105366364A (zh) * 2015-12-02 2016-03-02 苏州索力旺新能源科技有限公司 一种接线盒贴片上料装置
TWI782508B (zh) 2016-01-08 2022-11-01 美商艾爾測試系統 電子測試器中裝置之熱控制的方法與系統
US9975708B2 (en) 2016-03-16 2018-05-22 Texas Instruments Incorporated Transfer track stopper for packaged integrated circuits
TWI583973B (zh) * 2016-03-29 2017-05-21 Bothhand Entpr Inc Electronic component detection device
KR20240146697A (ko) 2017-03-03 2024-10-08 에어 테스트 시스템즈 카트리지, 테스트 피스 및 하나 이상의 전자 디바이스들을 테스팅하는 방법
CN110026346A (zh) * 2019-05-17 2019-07-19 福州派利德电子科技有限公司 集成电路芯片测试分选机送料装置及方法
CN116457670A (zh) 2020-10-07 2023-07-18 雅赫测试系统公司 电子测试器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897900A (ja) * 1981-12-07 1983-06-10 稲畑産業株式会社 ソケットボ−ドへの集積回路片の自動装填装置
EP0382264B1 (de) * 1984-06-29 1994-06-15 Advantest Corporation IC-Testvorrichtung
JPS61217775A (ja) * 1985-03-25 1986-09-27 Hitachi Ltd 物品配列装置
JPS6256874A (ja) * 1985-09-06 1987-03-12 Daitoo:Kk Ｉｃ挿入装置用搬送機構
US4953749A (en) * 1986-05-27 1990-09-04 Nitto Kogyo Kabushiki Kaisha Chip separation and alignment apparatus
JPH01131469A (ja) * 1987-11-17 1989-05-24 Hitachi Electron Eng Co Ltd Ｉｃの加熱方式
US5024978A (en) * 1989-05-30 1991-06-18 Corning Incorporated Compositions and methods for making ceramic matrix composites
JP2989912B2 (ja) * 1991-02-12 1999-12-13 福田金属箔粉工業株式会社 導電塗料
US5190431A (en) * 1991-07-03 1993-03-02 Sym-Tek Systems, Inc. Separation and transfer apparatus
DE4227072A1 (de) * 1992-08-17 1994-02-24 Bayer Ag Verfahren zur Herstellung eines Siliziumnitridpulvers
US5326218A (en) * 1993-03-08 1994-07-05 Fallas David M Robotic arm for handling product
TW287235B (de) * 1994-06-30 1996-10-01 Zenshin Test Co

Also Published As

Publication number Publication date
DE19581894C2 (de) 1999-12-23
TW350991B (en) 1999-01-21
WO1997017619A1 (fr) 1997-05-15
US6135699A (en) 2000-10-24
KR100230070B1 (ko) 1999-11-15
KR970704156A (ko) 1997-08-09
US6074158A (en) 2000-06-13

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: B65G 49/05

8607 Notification of search results after publication
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee