DE69207285T2 - Isoliertes Trägerelement für Halbleitervorrichtung und Verfahren zu deren Herstellung - Google Patents
Isoliertes Trägerelement für Halbleitervorrichtung und Verfahren zu deren HerstellungInfo
- Publication number
- DE69207285T2 DE69207285T2 DE69207285T DE69207285T DE69207285T2 DE 69207285 T2 DE69207285 T2 DE 69207285T2 DE 69207285 T DE69207285 T DE 69207285T DE 69207285 T DE69207285 T DE 69207285T DE 69207285 T2 DE69207285 T2 DE 69207285T2
- Authority
- DE
- Germany
- Prior art keywords
- production
- semiconductor device
- carrier element
- insulated carrier
- insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/938—Lattice strain control or utilization
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16067891 | 1991-07-01 | ||
JP1222892 | 1992-01-27 | ||
JP4860292 | 1992-03-05 | ||
JP4099837A JPH05308107A (ja) | 1991-07-01 | 1992-04-20 | 半導体装置及びその製作方法 |
Publications (2)
Publication Number | Publication Date |
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DE69207285D1 DE69207285D1 (de) | 1996-02-15 |
DE69207285T2 true DE69207285T2 (de) | 1996-08-29 |
Family
ID=27455759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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DE69207285T Expired - Fee Related DE69207285T2 (de) | 1991-07-01 | 1992-06-29 | Isoliertes Trägerelement für Halbleitervorrichtung und Verfahren zu deren Herstellung |
Country Status (5)
Country | Link |
---|---|
US (2) | US5455453A (de) |
EP (1) | EP0521441B1 (de) |
JP (1) | JPH05308107A (de) |
CA (1) | CA2072262C (de) |
DE (1) | DE69207285T2 (de) |
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1992
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- 1992-06-29 DE DE69207285T patent/DE69207285T2/de not_active Expired - Fee Related
- 1992-06-29 EP EP92111016A patent/EP0521441B1/de not_active Expired - Lifetime
- 1992-07-01 US US07/907,229 patent/US5455453A/en not_active Expired - Fee Related
-
1995
- 1995-05-25 US US08/450,406 patent/US5643834A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69207285D1 (de) | 1996-02-15 |
US5643834A (en) | 1997-07-01 |
US5455453A (en) | 1995-10-03 |
EP0521441B1 (de) | 1996-01-03 |
CA2072262A1 (en) | 1993-01-02 |
EP0521441A1 (de) | 1993-01-07 |
CA2072262C (en) | 1999-08-10 |
JPH05308107A (ja) | 1993-11-19 |
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